Integrated circuit element with composite heat dissipation package

Abstract

An integrated circuit element with composite heat dissipation packaging comprises a circuit substrate, a wafer and a three-dimensional vapor cavity element, the circuit substrate is provided with an upper substrate surface, the wafer is arranged on the upper substrate surface of the circuit substrate, the wafer is provided with a wafer surface, the three-dimensional vapor cavity element comprises an upper cover, a lower plate and a plurality of flow channel fins, the upper cover is provided with an upper surface, and the lower plate is provided with a lower surface. The lower plate is opposite to the upper cover and is provided with a lower plate upper surface, a lower plate groove and a lower plate groove lower surface, a closed air cavity is formed when the upper cover is coupled to the lower plate, the lower plate groove is used for accommodating the wafer, and the wafer surface of the wafer is in contact with the lower plate groove lower surface of the lower plate groove; the plurality of flow channel fins are arranged on the upper surface of the upper cover at intervals to form a plurality of micro flow channels, an opening is formed in a surrounding mode, and the opening is communicated with the micro flow channels.

Description

Technical Field

[0001] The utility model relates to an integrated circuit element with a heat dissipation package, and more particularly to an integrated circuit element with a composite heat dissipation package that integrates a chip and a circuit substrate with a heat dissipation element, and the heat dissipation element further integrates a jet flow heat dissipation technology, a three-dimensional vapor chamber two-phase flow circulation heat equalization technology, and a shovel-tooth microchannel heat dissipation technology. Background Art

[0002] As the thermal design power (TDP) and power density of high-computing chips and communication chips in servers and communication switches gradually increase, the temperature of the chips also gradually increases. The 3D stacked IC packaging also makes it more difficult to dissipate the heat generated by the bottom chip.

[0003] The conventional air cooling technology has faced a bottleneck, and liquid cooling technology has emerged. Among them, cold plate liquid cooling technology has gradually become the mainstream. The conventional cold plate cooling technology can be roughly divided into shovel-tooth microchannel cold plates, jet-flow cold plates and two-phase flow cold plates. However, as the power of integrated circuit components such as chips exceeds 1,000W, the power density exceeds 100W / cm2, and it is a 3D stacked packaging structure, the conventional cold plate cooling technology also faces the bottleneck of heat dissipation and heat dissipation. Although the general pure jet-type cold plate can effectively reduce the chip temperature in the coolant impact area, it will also cause the problem of excessive temperature difference of the entire chip; the shovel-tooth microchannel cold plate that generally relies on heat dissipation fins for heat dissipation also faces the difficulty of reducing thermal resistance and the problem of temperature uniformity; and the two-phase flow cold plate also faces the problem of complex and expensive two-phase coolant circulation system and insufficient heat dissipation area.

[0004] In addition, in the conventional technology, the packaged integrated circuit element and the heat sink are two independent components. When heat is conducted between the two components, there are usually layers of interface thermal resistance. Once the IC power is very high, even a slight increase in thermal resistance will cause a large temperature rise in the chip.

[0005] Therefore, in order to solve the heat dissipation and heat dissipation challenges brought about by the current gradual increase in chip power and power density, it is necessary to provide a more efficient chip heat dissipation and heat distribution solution. Utility Model Content

[0006] In view of this, the purpose of the present invention is to provide an integrated circuit element with a composite heat dissipation package, which has a simple structure and is easy to operate and maintain, and can solve the heat dissipation and heat dissipation challenges brought about by the current gradual increase in chip power and power density, and provide a more efficient chip heat dissipation and heat distribution solution.

[0007] To achieve the above object, the utility model discloses an integrated circuit element with a composite heat dissipation package, which is characterized by comprising:

[0008] A circuit substrate having an upper substrate surface;

[0009] a chip disposed on the upper substrate surface of the circuit substrate, the chip having a chip surface; and

[0010] A three-dimensional vapor chamber element, comprising:

[0011] An upper cover having an upper surface;

[0012] A lower plate is arranged relative to the upper cover, has an upper surface of the lower plate, a lower plate groove and a lower surface of the lower plate groove, and a closed air cavity is formed when the upper cover is coupled to the lower plate, the lower plate groove accommodates the wafer, and the wafer surface of the wafer contacts the lower surface of the lower plate groove of the lower plate groove; and

[0013] A plurality of flow channel fins are arranged at intervals on the upper surface of the upper cover to form a plurality of micro flow channels. At the same time, the flow channel fins are arranged on the upper surface of the upper cover to form an opening, and the opening and the micro flow channels are interconnected.

[0014] The upper surface of the upper cover has an opening surface opposite to the opening for receiving a cooling liquid splash.

[0015] Among them, it also includes:

[0016] A semi-open shell is coupled to the lower plate of the three-dimensional vapor chamber element to form a heat exchange chamber. The semi-open shell includes a spray head and has an input port for inputting the cooling liquid and an output port. The spray head is connected to the input port to spray the cooling liquid on the opening surface through the opening first, then flow through the microchannels on the upper surface of the upper cover and the heat exchange chamber, and output the cooling liquid through the output port.

[0017] Wherein, the lower surface of the lower plate groove of the lower plate relative to the opening contacts the wafer surface.

[0018] Wherein, the channel width of the microchannels is less than or equal to 1 mm.

[0019] A plurality of heat dissipation structures are arranged on the opening surface, and the opening surface is located at a hot spot of the chip.

[0020] The three-dimensional steam chamber element further comprises a continuous multi-porous capillary structure, and the multi-porous capillary structure is arranged on the upper cover and the lower plate in the closed air cavity.

[0021] The three-dimensional steam chamber element further comprises a plurality of support columns with porous capillary structures, and the support columns are respectively arranged between the upper cover and the lower plate in the closed air cavity.

[0022] The flow channel fins are additionally surrounded by a micro-channel buffer area, and the micro-channel buffer area is formed between the upper surface of the upper cover and the micro-channels.

[0023] The flow channel fins are integrally formed and spaced apart on the upper surface of the upper cover to form the micro flow channels.

[0024] In summary, the utility model provides an integrated circuit element with a composite heat dissipation package that integrates a chip and a circuit substrate with a heat dissipation element. The chip surface of the chip contacts the lower surface of the lower plate groove of the lower plate of the three-dimensional vapor chamber element, and the condensation area of ​​the three-dimensional vapor chamber element with two-phase flow circulation directly contacts the cooling liquid in the heat exchange cavity for heat exchange, thereby reducing the layer-by-layer thermal resistance of heat conduction between the chip and the heat sink of the conventional IC packaging technology, thereby improving the heat dissipation efficiency of the integrated circuit element with a composite heat dissipation package of the utility model. In addition, the integrated circuit element with a composite heat dissipation package of the utility model can be fixed to the surface of the lower shell of the semi-open shell by screws, and the screws can increase the contact pressure between the chip and the lower surface of the lower plate groove of the three-dimensional vapor chamber element, thereby reducing the contact thermal resistance to improve the heat dissipation efficiency of the integrated circuit element. Furthermore, through the spray head on the semi-open shell, the cooling liquid can be directly splashed along the spray head and impact the opening surface corresponding to the hot spot with the highest temperature of the chip to force heat exchange.

[0025] Furthermore, the three-dimensional vapor chamber element of the integrated circuit element with a composite heat dissipation package of the utility model is further provided with a flow channel fin on the upper surface of the upper cover, and the middle of the flow channel fin is further provided with an opening. When the integrated circuit element with a composite heat dissipation package of the utility model is used for liquid cooling, this opening can be used to accommodate a shower head, so that the coolant can be directly splashed along the shower head and impact the opening surface of the upper cover corresponding to the hot spot of the chip to perform forced heat exchange. The coolant can also be diverted and flow through the large area of ​​the flow channel fin along the direction of the microchannel setting and further perform forced heat exchange, so that the coolant can take the heat energy away from the radiator. In addition, the integrated circuit element with a composite heat dissipation package of the utility model also provides a variety of forms, which can be used for contacting multiple chip heat sources or the same chip heat source and dissipating heat in the same heat exchanger, thereby improving the overall heat dissipation efficiency of the utility model.

[0026] Compared with the conventional technology, the integrated circuit element with a composite heat dissipation package of the utility model integrates the chip and the circuit substrate with the heat dissipation element to reduce the unnecessary interface and thermal resistance between the integrated circuit element and the heat sink, thereby improving the heat dissipation efficiency of the integrated circuit element with the composite heat dissipation package as a whole, and further through the innovative three-dimensional vapor chamber element and the heat exchange chamber shell of the liquid cooling cycle to form a heat sink with phase change function and jet flow and microchannel heat dissipation function at the same time, the three-dimensional vapor chamber element of the utility model can simultaneously perform internal two-phase flow heat dissipation and liquid cooling heat dissipation by the coolant to achieve double-effect heat dissipation, thereby effectively dissipating the heat energy generated by the circuit substrate and the chip, and the overall heat dissipation efficiency can be greatly increased by the double-effect heat dissipation to solve the shortcomings of various conventional liquid cooling heat sinks. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A cross-sectional view of an integrated circuit element with a composite heat dissipation package according to a specific embodiment of the present invention is shown.

[0028] Figure 2 Shows the Figure 1 Exploded view of the 3D vapor chamber component.

[0029] Figure 3 A cross-sectional view of an integrated circuit element with a composite heat dissipation package according to another specific embodiment of the present invention is shown.

[0030] Figure 4 A cross-sectional view of an integrated circuit element with a composite heat dissipation package according to another specific embodiment of the present invention is shown.

[0031] Figure 5 A cross-sectional view of an integrated circuit element with a composite heat dissipation package according to another specific embodiment of the present invention is shown.

[0032] Figure 6 A cross-sectional view of an integrated circuit element with a composite heat dissipation package according to another specific embodiment of the present invention is shown.

[0033] Figure 7 A cross-sectional view of an integrated circuit element with a composite heat dissipation package according to another specific embodiment of the present invention is shown.

[0034] Figure 8 A cross-sectional view of an integrated circuit element with a composite heat dissipation package according to another specific embodiment of the present invention is shown.

[0035] Fig. 9 A cross-sectional view of an integrated circuit element with a composite heat dissipation package according to another specific embodiment of the present invention is shown. DETAILED DESCRIPTION

[0036] In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with reference to the attached drawings and specific embodiments. It should be noted that these specific embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, the components in the figure are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present invention are only used to separate different steps and do not represent the order of the steps, so it is necessary to explain them first.

[0037] Please also read Figure 1 as well as Figure 2 , Figure 1 A cross-sectional view of an integrated circuit element 1 with a composite heat dissipation package according to a specific embodiment of the present invention is shown. Figure 2 Shows the Figure 1 An exploded view of a three-dimensional vapor chamber element 30 is shown. Figure 1 as well as Figure 2 As shown, the integrated circuit element 1 with a composite heat dissipation package of the present embodiment includes a circuit substrate 10, a chip 20 and a three-dimensional vapor chamber element 30. The circuit substrate 10 has an upper substrate surface 101, the chip 20 is disposed on the upper substrate surface 101 of the circuit substrate 10, and the chip 20 has a chip surface 201. The three-dimensional vapor chamber element 30 contacts the chip 20, and the three-dimensional vapor chamber element 30 includes an upper cover 301, a lower plate 302 and a plurality of flow channel fins 304. The upper cover 301 has an upper surface 3011; the lower plate 302 is disposed relative to the upper cover 301, and has a lower plate upper surface 3021, a lower plate groove 3022, and a lower plate groove lower surface 3023. The flow channel fins 304 are arranged at intervals on the upper surface 3011 of the upper cover 301, and the gaps between each flow channel fin 304 form a plurality of micro-channels 305. At the same time, the plurality of flow channel fins 304 are arranged on the upper surface 3011 of the upper cover 301 to form an opening 306, and the opening 306 is mutually connected with each micro-channel 305. When the upper cover 301 is coupled to the lower plate 302, a closed air cavity 303 is formed inside the upper cover 301 and the lower plate 302. The lower plate groove 3022 of the lower plate 302 is used to accommodate the wafer 20, that is, the wafer 20 is completely embedded in the lower plate groove 3022, and the wafer surface 201 of the wafer 20 is in contact with the lower plate groove lower surface 3023 of the lower plate groove 3022.

[0038] like Figure 2As shown, in this specific embodiment, the three-dimensional vapor chamber element 30 further includes a continuous porous capillary structure (not shown) and a plurality of support columns 307 having the porous capillary structure, and the upper cover 301 is provided with a nozzle sealing structure 308. In practice, the porous capillary structure is disposed on the lower surface of the upper cover 301 and the upper surface of the lower plate 302, and the support columns 307 are disposed between the upper cover 301 and the lower plate 302. When the upper cover 301 and the lower plate 302 are coupled, the plurality of support columns 307 having the porous capillary structure are located between the upper cover 301 and the lower plate 302, and further, the plurality of support columns 307 having the porous capillary structure form a continuous capillary structure with the porous capillary structure on the lower surface of the upper cover 301 and the upper surface of the lower plate 302. Next, the working fluid is injected into the cavity between the upper cover 301 and the lower plate 302 from the pre-set liquid injection port (not shown) in the lower plate 302, and vacuum is evacuated and the liquid injection port is sealed to form the injection port sealing structure 308, and the vacuumed internal cavity forms a closed air cavity 303. In practice, the working fluid can be water; or a mixture of water and ethylene glycol or propylene glycol, or a two-phase coolant, such as R134a.

[0039] Please continue reading Figure 1 as well as Figure 2 The structure of the flow channel fin 304 of the three-dimensional vapor chamber element 30 of the integrated circuit element 1 with a composite heat dissipation package of this specific embodiment is a quadrilateral as a whole. In practice, the metal material can be first milled out of the specific outline of the overall structure and the opening 306 in the middle of the upper cover 301 by a tooth-cutting process, and then the flow channel fin 304 is cut and processed in sequence, and the gap between each flow channel fin 304 forms a microchannel 305 so that the coolant can flow more evenly, and then the flow channel fin 304 is coupled to the upper surface 3011 of the upper cover 301 by welding. In another embodiment, the metal material can also be directly reserved for the thickness of the upper cover and the opening and the structural features of the flow channel fin can be milled directly on the upper surface of the material, so that the flow channel fin is integrally formed on the upper cover. When the integrally formed upper cover is coupled to the lower cover, a three-dimensional vapor chamber element is formed. Due to the integral molding, the thermal resistance between the flow channel fin and the upper cover can be reduced, thereby further improving the heat dissipation efficiency.

[0040] Please continue to read Figure 1 as well as Figure 2, the lower plate groove 3022 of the lower plate 302 of the three-dimensional vapor chamber element 30 is used to accommodate the chip 20 and the circuit substrate 10. That is, the upper substrate surface 101 of the circuit substrate 10 is provided with the chip 20, and the chip 20 and the circuit substrate 10 are coupled in the lower plate groove 3022 of the lower plate 302. In actual application, the circuit substrate 10 further has a plurality of locking holes (not shown in the figure), and the circuit substrate 10 provided with the chip 20 is locked in the lower plate groove 3022 of the lower plate 302 by a plurality of screws (not shown in the figure), so that the circuit substrate 10 can be fixed in the lower plate 302 through the corresponding plurality of screws. Furthermore, the locked screws can increase the contact pressure between the chip surface 201 of the chip 20 and the lower surface 3023 of the lower plate groove of the lower plate 302 of the three-dimensional vapor chamber element 30, thereby reducing the contact thermal resistance to improve the heat dissipation efficiency of the integrated circuit element 1 with a composite heat dissipation package of the entire utility model. In practice, when the circuit substrate 10 fails to fit completely and tightly in the lower plate groove 3022 of the lower plate 302, thermal conductive adhesive can be further used to fill the gap between the circuit substrate 10 and the lower plate groove 3022 to make the circuit substrate 10 and the lower plate groove 3022 fit more tightly, thereby reducing the heat conduction efficiency affected by contact thermal resistance.

[0041] In practical applications, the integrated circuit element with a composite heat dissipation package of the present invention can be used in air cooling. The lower plate 302 of the three-dimensional vapor chamber element 30 serves as a heat absorption zone to preferentially absorb the heat energy of the chip 20. At this time, the working fluid in the closed air cavity 303 of the three-dimensional vapor chamber element 30 absorbs the heat energy and undergoes a phase change from a liquid working fluid to a gaseous working fluid. Through the flow channel fins 304 disposed on the upper surface 3011 of the upper cover 301, the heat energy on the flow channel fins 304 serving as a condensation zone can be further removed by air cooling. As the temperature decreases, the cooled working fluid will undergo a phase change again to become a liquid working fluid, and finally flow back to the heat absorption zone along the porous capillary structure and the support column 307, thereby repeating the two-phase flow cycle inside the three-dimensional vapor chamber element 30.

[0042] In another embodiment, a plurality of heat dissipation structures (not shown) are further provided on the opening surface of the upper cover of the three-dimensional vapor chamber element. The heat dissipation structures may be small cylinders extending upward from the opening surface or recessed downward therein, and the heat dissipation structures correspond to the hot spots of the wafer, thereby increasing the heat dissipation efficiency of the three-dimensional vapor chamber element. However, the shape, quantity, and arrangement of the heat dissipation structures may be optimized and designed according to actual needs.

[0043] Furthermore, the present invention provides other aspects that can be applied to liquid cooling, thereby effectively solving the problem of insufficient heat dissipation efficiency of high-power chips currently on the market. Figure 3 , Figure 3FIG. 2 shows a cross-sectional view of an integrated circuit element 2 with a composite heat dissipation package according to another embodiment of the present invention. Figure 3 As shown, the integrated circuit element 2 with a composite heat dissipation package of this specific embodiment further includes a semi-open shell 309. The semi-open shell 309 includes a spray head 3092 and has an input port 3093 and an output port 3094. The spray head 3092, the input port 3093 and the output port 3094 are used to transport cooling liquid. In practice, after the three-dimensional steam chamber element 30 is manufactured, the joint holes of the semi-open shell 309 can be joined to the lower plate upper surface 3021 of the lower plate 302 of the three-dimensional steam chamber element 30, and the hole joint ends on the semi-open shell 309 are fastened and fixed to the lower plate 302 by screws. In another embodiment, the semi-open shell is coupled to the three-dimensional steam chamber element by stir friction welding, but the joining method of the semi-open shell and the three-dimensional steam chamber element is not limited to this. For further information, please continue to refer to Figure 3 When the semi-open shell 309 is coupled to the three-dimensional vapor chamber element 30, the space formed by the interior of the semi-open shell 309 and the lower plate 302 is the heat exchange chamber 3091, and the microchannel 305 structure of the three-dimensional vapor chamber element 30 is also accommodated in the heat exchange chamber 3091, and the shower head 3092 is located in the opening 306 of the upper cover 301. In other words, when the semi-open shell 309 is coupled to the three-dimensional vapor chamber element 30, the shower head 3092 is completely accommodated in the opening 306. In practice, the shower head 3092 is connected to the input port 3093, and the coolant is input into the heat exchange chamber 3091 through the input port 3093, and the coolant is discharged from the output port 3094.

[0044] Since the chip of the integrated circuit element 2 with a composite heat dissipation package of this specific embodiment generates heat energy during the operation process, the integrated circuit element 2 with a composite heat dissipation package can be cooled by the two-phase flow inside the three-dimensional vapor chamber element 30 first, and can also be further cooled by liquid cooling. Please continue to refer to Figure 3 , Figure 3 The arrow direction shown in the figure is the coolant flow direction F. After the coolant flows in from the input port 3093 of the semi-open shell 309, the coolant can directly spray downward from the spray port of the spray head 3092 above the three-dimensional vapor chamber element 30 to the opening surface 3012 at the opening 306 of the three-dimensional vapor chamber element 30. The coolant passes through the opening surface 3012 of the upper cover 301, and then flows along the flow direction of the microchannel 305 and further performs forced heat exchange with the large-area flow channel fins 304. Finally, the coolant is discharged from the output port of the semi-open shell 309, completing a heat exchange liquid cooling cycle.

[0045] It is worth noting that the opening of the integrated circuit element 2 with the composite heat dissipation package of this specific embodiment is set at a position corresponding to the position of the hot spot 202 of the chip 20. In other words, the opening and the hot spot 202 of the chip 20 are at the shortest vertical distance. Therefore, after the coolant flows in from the input port 3093 of the semi-open shell 309, the coolant can directly flow out from the spray port of the spray head 3092 above the three-dimensional vapor chamber element 30 and directly splash onto the opening surface 3012 of the upper cover 301 that is the shortest distance from the chip 20, so that the coolant can directly perform forced heat exchange and heat dissipation at the place with the highest temperature, thereby greatly increasing the overall heat dissipation efficiency.

[0046] In addition, after the coolant hits the surface of the recessed opening, the coolant can also be guided and flow through the large-area fins along the direction of the microchannel and further forced to exchange heat, allowing the coolant to take the heat away from the radiator. In practice, the coolant can be one of water, acetone, ammonia, methanol, tetrachloroethane and hydrofluorocarbon chemical refrigerants, but is not limited to this. The coolant can also be other fluids that absorb heat and take away heat. Please note that considering the heat exchange area of ​​the microchannel and the flow rate of the coolant, Figure 2 The flow channel width d of the microchannel shown in the figure is less than or equal to 1 mm, and a microchannel buffer area 3041 is further provided between the upper surface of the upper cover and the microchannel, so that the flow rate of the coolant can be adjusted when flowing through the microchannel buffer area 3041. In actual applications, the flow channel width of the microchannel, the thickness of the flow channel fins, the drainage structure and the microchannel buffer area are not limited to this and can be adjusted according to the design.

[0047] In summary, the integrated circuit element with a composite heat dissipation package of the utility model can be used in air cooling, and the heat is dissipated by the two-phase flow circulation inside the three-dimensional vapor chamber element and the air cooling and the heat dissipation fins on the upper cover. In addition, the integrated circuit element with a composite heat dissipation package of the utility model can also be used in liquid cooling, and can simultaneously perform double-effect heat dissipation by the two-phase flow heat dissipation inside the three-dimensional vapor chamber element of the integrated circuit element with a composite heat dissipation package of the utility model and liquid cooling heat dissipation by the coolant, thereby effectively dissipating the heat energy generated by the circuit substrate and the chip, and the overall heat dissipation efficiency can be greatly increased by the double-effect heat dissipation.

[0048] The integrated circuit element with composite heat dissipation package of the present invention further provides other types of three-dimensional vapor chamber elements. Figure 4 , Figure 4 FIG. 2 shows a cross-sectional view of an integrated circuit element 3 with a composite heat dissipation package according to another embodiment of the present invention. Figure 4As shown, the upper cover 301 of the three-dimensional vapor chamber element 31 of the integrated circuit element 3 with a composite heat dissipation package of this specific embodiment is provided with a recessed opening 3013, and the recessed opening 3013 can be milled or processed by a mold during the pre-processing. When the coolant flows out from the spray port, the coolant can directly splash the opening surface of the recessed opening 3013, thereby increasing the heat dissipation efficiency. The other devices of this specific embodiment are substantially the same as the corresponding devices of the above-mentioned specific embodiment, so they are not repeated here.

[0049] See also Figure 5 , Figure 5 FIG. 4 is a cross-sectional view of an integrated circuit element 4 with a composite heat dissipation package according to another embodiment of the present invention. Figure 5 As shown, the difference between the integrated circuit element 4 with a composite heat dissipation package of the present embodiment and the aforementioned embodiment (i.e., the integrated circuit element 3 with a composite heat dissipation package) is that the length of the circuit substrate 11 in the present embodiment can be equal to or slightly greater than the length of the lower plate 302 of the three-dimensional vapor chamber element 32. Furthermore, in actual applications, the circuit substrate 11 can be a ball grid array (BGA) substrate, and a plurality of solder balls (not shown) are disposed on the lower substrate surface 102 of the circuit substrate 11; the circuit substrate 11 can also be a pin grid array (PGA) substrate, and a plurality of solder pins (not shown) are disposed on the lower substrate surface 102 of the circuit substrate 11; and a chip 20 is disposed on the upper substrate surface 101 of the circuit substrate 11. Please note that the structure and function of the integrated circuit element 4 with a composite heat dissipation package of the present embodiment are substantially the same as those of the corresponding elements of the aforementioned embodiment, so it will not be described in detail here. In actual applications, the length and type of the circuit substrate can be adjusted according to user needs. Therefore, the integrated circuit element with the composite heat dissipation package of the present invention can be applied to circuit substrates of various sizes.

[0050] Furthermore, if the space where the integrated circuit element is used has height restrictions, such as when it is used in a 1U server or a smaller electronic product, the input port cannot be directly placed at the top of the semi-open housing due to the height restriction. Therefore, the present invention further provides other embodiments. Figure 6 , Figure 6 FIG. 4 is a cross-sectional view of an integrated circuit element 5 with a composite heat dissipation package according to another embodiment of the present invention. Figure 6As shown, the semi-open housing 310 of the integrated circuit element 5 with a composite heat dissipation package of this specific embodiment further includes a top plate 3101 and a side plate 3103, and the top plate 3101 is provided with a top plate flow channel 3102. The input port 3093 is provided on the side end of the top plate 3101 and connected to the top plate flow channel 3102. The cooling liquid flows in from the input port 3093 on the side end of the top plate 3101 and flows along the top plate flow channel 3102 to the shower head 3092. The cooling liquid is further directly splashed and impacts the opening surface 3012 of the opening 306, and absorbs the heat energy of the chip therefrom. Then, the cooling liquid further performs heat exchange along the microchannel 305 structure, takes away the remaining heat energy again and flows through the heat exchange cavity 3091, and finally flows out from the output port 3094 of the side plate 3103 to complete a heat exchange liquid cooling cycle. Figure 6 The input port is shown to be disposed on the right side of the side end of the top plate, but the location is not limited thereto, and the output port may also be disposed in the top plate. Other devices of this embodiment are substantially the same as those corresponding to the aforementioned embodiments, and are therefore not described in detail here.

[0051] Next, the number of the spray ports of the above-mentioned spray head is not limited to one set, and the present invention also provides other embodiments. Figure 7 , Figure 7 FIG. 2 shows a cross-sectional view of an integrated circuit element 6 with a composite heat dissipation package according to another embodiment of the present invention. Figure 7 As shown, the spray head 3104 of the semi-open shell 311 of the integrated circuit element 6 with a composite heat dissipation package of the specific embodiment of this specific embodiment is further provided with a plurality of spray ports (not shown in the figure). In practice, the spray port can be drilled into the semi-open shell by a computer numerical control (CNC) processing machine, and the number of spray ports in this specific embodiment is 4, but the number and aperture can be designed according to actual needs. In actual application, after the coolant flows in from the input port, the coolant is splashed from the plurality of spray ports and impacts the opening surface of the recessed opening. At this time, the recessed opening can be further provided with a plurality of cylindrical concave heat dissipation structures and each heat dissipation structure corresponds to a spray port directly above. At this time, the heat dissipation degree of heat exchange can be further improved without reducing the structural strength of the three-dimensional vapor chamber element. Please note that the integrated circuit element 6 with a composite heat dissipation package of this specific embodiment is substantially the same as the device corresponding to the aforementioned specific embodiment, so it will not be repeated here.

[0052] Furthermore, in view of the specifications of multiple chips currently on the market, the present invention further provides applicable embodiments. Figure 8 , Figure 8 FIG. 1 shows a cross-sectional view of an integrated circuit element 7 with a composite heat dissipation package according to another embodiment of the present invention. Figure 8 As shown, the integrated circuit element 7 with a composite heat dissipation package of this specific embodiment includes a circuit substrate 12, a plurality of chips 20, a three-dimensional vapor chamber element 33, and a semi-open shell 312. Among them, three chips 20 are disposed on the upper substrate surface 101 of the circuit substrate 12, and each chip 20 has a chip surface for the three-dimensional vapor chamber element 33 to be disposed thereon. The three-dimensional vapor chamber element 33 of the integrated circuit element 7 with a composite heat dissipation package of this specific embodiment also includes three groups of micro-channel 305 structures, and each has an opening 306 at a position corresponding to each chip 20. Further, the semi-open shell 312 includes three groups of shower heads 3104, and each shower head 3104 is provided with a corresponding shower port 3.

[0053] like Figure 8 As shown, the difference between the integrated circuit element 7 with a composite heat dissipation package of the present embodiment and the aforementioned embodiment is that the integrated circuit element 7 with a composite heat dissipation package of the present embodiment is coupled to the same lower plate 302 through three sets of upper covers 301 at the same time. That is, the three sets of upper covers 301 can be respectively arranged at the position corresponding to each chip 20 on the circuit substrate 12, and heat exchange is performed in the same heat exchange cavity 3091. In actual application, the coolant flows in from the three sets of input ports 3093 of the semi-open shell 312 at the same time, and the coolant can be simultaneously sprayed downward from the three sets of spray heads 3092 to the opening surface of each opening 306, thereby dissipating the heat energy emitted by the three sets of chips 20. In detail, when the chips 20 of the integrated circuit element 7 with a composite heat dissipation package of the present embodiment are actually operating and emitting heat energy, the two-phase flow circulation heat dissipation can be performed through the working fluid in the corresponding closed air cavity, and the opening corresponding to each chip 20 can also be forced to exchange heat through the coolant at the same time, and finally the coolant is output from the output port 3094. In practice, the number and arrangement of the chips on the circuit substrate are not limited to this; the three-dimensional vapor chamber element can be designed according to the number of chips; the positions of the input port and output port of the semi-open shell are not limited to this. In practice, the semi-open shell can be joined to the lower plate, and then the joint of the semi-open shell and the lower plate are fastened and fixed by screws. The semi-open shell can also be coupled to the three-dimensional vapor chamber element to form a heat exchange cavity by welding, bonding and stir friction welding, but any method that can join the semi-open shell and the lower plate is one of the means that can be adopted by the utility model. Please note that the integrated circuit element 7 with a composite heat dissipation package in this specific embodiment is substantially the same in structure and function as the corresponding element in the aforementioned specific embodiment, so it will not be repeated here.

[0054] In another specific embodiment (not shown), multiple upper covers in the three-dimensional vapor chamber element may be coupled to the same lower plate, respectively contacting multiple heat sources or the same heat source and dissipating heat in the same heat exchanger, thereby improving the overall heat dissipation efficiency of the integrated circuit element with the composite heat dissipation package. Furthermore, in another embodiment (not shown), the integrated circuit element with the composite heat dissipation package may not include a semi-open housing, an input port, an output port, and a coolant. In actual applications, this specific embodiment may use air cooling technology to dissipate heat.

[0055] Furthermore, in response to the specification requirements of multiple chips, the present invention further provides other embodiments. Fig. 9 , Fig. 9 FIG. 8 is a cross-sectional view of an integrated circuit element 8 with a composite heat dissipation package according to another embodiment of the present invention. Fig. 9 As shown, the difference between the integrated circuit element 8 with a composite heat dissipation package of the present embodiment and the integrated circuit element 7 with a composite heat dissipation package of the above-mentioned embodiment is that the lower plate 302 of the three-dimensional vapor chamber element 34 of the integrated circuit element 8 with a composite heat dissipation package of the present embodiment further includes a lower plate groove 3024, and the lower plate groove 3024 can be used to accommodate multiple chips 20. In practice, when the circuit substrate cannot be completely and tightly fitted in the lower plate groove of the lower plate, a thermal conductive glue can be used to fill the gap between the circuit substrate and the lower plate groove, so that the circuit substrate and the lower groove are more tightly fitted to reduce the heat conduction efficiency affected by the contact thermal resistance. In another embodiment (not shown), the length of the circuit substrate can be equal to or slightly greater than the length of the lower plate of the three-dimensional vapor chamber element, but the length and type of the circuit substrate can be adjusted according to user needs. Therefore, the integrated circuit element with a composite heat dissipation package of the present invention can be applied to circuit substrates of various sizes. Please note that the structure and function of the integrated circuit element 8 with the composite heat dissipation package of this embodiment are substantially the same as those of the corresponding element of the aforementioned embodiment, and thus will not be described in detail here.

[0056] In summary, the utility model provides an integrated circuit element with a composite heat dissipation package that integrates a chip and a circuit substrate with a heat dissipation element. The chip surface of the chip contacts the lower surface of the lower plate groove of the lower plate of the three-dimensional vapor chamber element, and the condensation area of ​​the three-dimensional vapor chamber element with two-phase flow circulation directly contacts the cooling liquid in the heat exchange cavity for heat exchange, thereby reducing the layer-by-layer thermal resistance of heat conduction between the chip and the heat sink of the conventional IC packaging technology, thereby improving the heat dissipation efficiency of the integrated circuit element with a composite heat dissipation package of the utility model. In addition, the integrated circuit element with a composite heat dissipation package of the utility model can be fixed to the surface of the lower shell of the semi-open shell by screws, and the screws can increase the contact pressure between the chip and the lower surface of the lower plate groove of the three-dimensional vapor chamber element, thereby reducing the contact thermal resistance to improve the heat dissipation efficiency of the integrated circuit element. Furthermore, through the spray head on the semi-open shell, the cooling liquid can be directly splashed along the spray head and impact the opening surface corresponding to the hot spot with the highest temperature of the chip to force heat exchange.

[0057] Furthermore, the three-dimensional vapor chamber element of the integrated circuit element with a composite heat dissipation package of the utility model is further provided with a flow channel fin on the upper surface of the upper cover, and the middle of the flow channel fin is further provided with an opening. When the integrated circuit element with a composite heat dissipation package of the utility model is used for liquid cooling, this opening can be used to accommodate a shower head, so that the coolant can be directly splashed along the shower head and impact the opening surface of the upper cover corresponding to the hot spot of the chip to perform forced heat exchange. The coolant can also be diverted and flow through the large area of ​​the flow channel fin along the direction of the microchannel setting and further perform forced heat exchange, so that the coolant can take the heat energy away from the radiator. In addition, the integrated circuit element with a composite heat dissipation package of the utility model also provides a variety of forms, which can be used for contacting multiple chip heat sources or the same chip heat source and dissipating heat in the same heat exchanger, thereby improving the overall heat dissipation efficiency of the utility model.

[0058] Compared with the conventional technology, the integrated circuit element with a composite heat dissipation package of the utility model integrates the chip and the circuit substrate with the heat dissipation element to reduce the unnecessary interface and thermal resistance between the integrated circuit element and the heat sink, thereby improving the heat dissipation efficiency of the integrated circuit element with the composite heat dissipation package as a whole, and further through the innovative three-dimensional vapor chamber element and the heat exchange chamber shell of the liquid cooling cycle to form a heat sink with phase change function and jet flow and microchannel heat dissipation function at the same time, the three-dimensional vapor chamber element of the utility model can simultaneously perform internal two-phase flow heat dissipation and liquid cooling heat dissipation by the coolant to achieve double-effect heat dissipation, thereby effectively dissipating the heat energy generated by the circuit substrate and the chip, and the overall heat dissipation efficiency can be greatly increased by the double-effect heat dissipation to solve the shortcomings of various conventional liquid cooling heat sinks.

[0059] The above detailed description of the preferred embodiments is intended to more clearly describe the features and spirit of the present invention, but is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent scope to be applied for by the present invention. Therefore, the scope of the patent scope applied for by the present invention should be interpreted in the broadest sense based on the above description, so as to cover all possible changes and arrangements with equivalents.

Claims

1. An integrated circuit element with a composite heat dissipation package, characterized in that Contains: A circuit substrate having an upper substrate surface; a chip disposed on the upper substrate surface of the circuit substrate, the chip having a chip surface; and A three-dimensional vapor chamber element, comprising: An upper cover having an upper surface; A lower plate is arranged relative to the upper cover, has an upper surface of the lower plate, a lower plate groove and a lower surface of the lower plate groove, and a closed air cavity is formed when the upper cover is coupled to the lower plate, the lower plate groove accommodates the wafer, and the wafer surface of the wafer contacts the lower surface of the lower plate groove of the lower plate groove; and A plurality of flow channel fins are arranged at intervals on the upper surface of the upper cover to form a plurality of micro flow channels. At the same time, the flow channel fins are arranged on the upper surface of the upper cover to form an opening, and the opening and the micro flow channels are interconnected.

2. The integrated circuit device with composite heat dissipation package as claimed in claim 1, characterized in that: The upper surface of the upper cover has an opening surface opposite to the opening for receiving a cooling liquid splash.

3. The integrated circuit device with composite heat dissipation package as claimed in claim 2, characterized in that: Also included: A semi-open shell is coupled to the lower plate of the three-dimensional vapor chamber element to form a heat exchange chamber. The semi-open shell includes a spray head and has an input port for inputting the cooling liquid and an output port. The spray head is connected to the input port to spray the cooling liquid on the opening surface through the opening first, then flow through the microchannels on the upper surface of the upper cover and the heat exchange chamber, and output the cooling liquid through the output port.

4. The integrated circuit device with a composite heat dissipation package as claimed in claim 1, wherein: The lower surface of the lower plate groove of the lower plate relative to the opening contacts the wafer surface.

5. The integrated circuit device with composite heat dissipation package as claimed in claim 1, wherein: The channel width of the micro channels is less than or equal to 1 mm.

6. The integrated circuit device with composite heat dissipation package as claimed in claim 2, wherein: A plurality of heat dissipation structures are arranged on the opening surface, and the opening surface is located at a hot spot of the chip.

7. The integrated circuit device with composite heat dissipation package as claimed in claim 1, wherein: The three-dimensional steam chamber element further comprises a continuous multi-porous capillary structure, and the multi-porous capillary structure is arranged on the upper cover and the lower plate in the closed air cavity.

8. The integrated circuit device with composite heat dissipation package as claimed in claim 1, wherein: The three-dimensional steam chamber element further comprises a plurality of support columns with multi-porous capillary structures, and the support columns are respectively arranged between the upper cover and the lower plate in the closed air chamber.

9. The integrated circuit device with composite heat dissipation package as claimed in claim 1, wherein: The flow channel fins are additionally surrounded by a micro-flow channel buffer area, and the micro-flow channel buffer area is formed between the upper surface of the upper cover and the micro-flow channels.

10. The integrated circuit device with composite heat dissipation package as claimed in claim 1, wherein: The flow channel fins are integrally formed and arranged at intervals on the upper surface of the upper cover to form the micro flow channels.

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