Mechanical connection type semiconductor laser unit stack array
By providing transverse and longitudinal connection components on the side and outer surfaces of the semiconductor laser unit, the problem of excessive force being subjected to the connection in the prior art is solved, and the stable connection and long-term stability effect of the semiconductor laser unit is achieved.
Patent Information
- Application Number
- CN202421450681.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-24
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-06-24
AI Technical Summary
The mechanical connection structure of the existing semiconductor laser unit can easily cause excessive force to bear at the connection, resulting in failure of the connection effect and difficulty in long-term stability.
Using a mechanically connected semiconductor laser unit stacking array, stable connection and superposition are achieved by providing lateral and longitudinal connection components on the side and outer surfaces of the semiconductor laser unit, including wedge blocks, alignment columns, double-headed studs, special-shaped clips and spring columns.
Through the alignment connection between the double-headed stud and the alignment column and the movable plugging of the spring column to the side plate, the force at the connection is slowed down, and the connection failure is reduced, and the stable connection and long-term stability of the semiconductor laser unit are achieved.
Smart Images
Figure CN222673593U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor laser units, and in particular relates to a mechanically connected semiconductor laser unit stack array. Background Art
[0002] After multiple laser chips and multiple heat-dissipating conductive substrates are bonded into a bar group, the whole is bonded to an insulating structure, and then the module is bonded to a heat sink; or the laser chip is bonded to a conductive substrate to form a light-emitting unit, and multiple light-emitting units are bonded to an insulating substrate and a heat sink in turn. This method is called the superposition of semiconductor laser units.
[0003] After the semiconductor laser unit is packaged, a mechanical structure is needed to assist in assembly. However, the connection structure is generally an interference fit between the bump and the groove. This fixing method without any margin will cause the connection to be subjected to excessive force, which will in turn render the connection ineffective. For this reason, a limit support component is required to reduce the excessive support force at the connection so that the connection effect can be maintained stably for a long time. Utility Model Content
[0004] The utility model aims to provide a mechanically connected semiconductor laser unit stack array, aiming to solve the problems raised in the above background technology.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A mechanically connected semiconductor laser unit stack array, comprising:
[0007] A semiconductor laser unit, wherein a lateral connection component is provided on the side of the semiconductor laser unit;
[0008] Furthermore, a longitudinal connection component is provided on the outer surface of the semiconductor laser unit.
[0009] As a preferred solution of the utility model, the transverse connection assembly includes a wedge block fixed to the side of the semiconductor laser unit, the end face of the wedge block is fixedly connected to an alignment column, the outer wall of the alignment column is fixedly sleeved with a ring, and the outer surface of the ring is fixedly connected to a side plate.
[0010] As a preferred solution of the utility model, the outer end of the alignment column is threadedly connected with a stud, the outer surface of the stud is fixedly connected with a support rod, the inner cavity of the support rod is movably connected with a spring column, and the through end of the spring column is movably connected with the side panel.
[0011] As a preferred solution of the utility model, the outer side of the stud is threadedly connected with a threaded sleeve, the outer surface of the threaded sleeve is fixedly connected with a special-shaped clip, the special-shaped clip is an integrally formed elastic metal sheet, and the special-shaped clip is adaptively connected to the wedge block.
[0012] As a preferred solution of the utility model, a plurality of holes are formed on the surface of the side plate, and the holes are adaptively connected to the end surface of the spring column.
[0013] As a preferred solution of the utility model, the longitudinal connection assembly includes an insert block and a positioning groove fixedly connected to the surface of the semiconductor laser unit, and the insert block and the positioning groove are movably plugged.
[0014] As a preferred solution of the utility model, the spiral directions of the threads at both ends of the stud are opposite, and the center of the stud is kept coincident with the center of the alignment post.
[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) through the alignment connection of the stud and the alignment column, the semiconductor laser units can be aligned and stacked, and the active plug-in connection between the spring column and the side plate is conducive to reducing the force borne by the connection, reducing the possibility of connection failure, and helping the semiconductor laser unit to be stably connected, so that the connection is more permanent and stable;
[0016] (2) By clamping the special-shaped clips and the wedge blocks and increasing the number of them, the connection stability of the semiconductor laser unit is greatly improved, meeting the requirements for stable superposition of the laser units. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:
[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0019] Figure 2 It is a schematic diagram of the stable connection effect of the transverse connection component in the utility model;
[0020] Figure 3 It is a structural schematic diagram of the counter-positioning effect component of the double-headed stud in the utility model;
[0021] Figure 4 For this utility model Figure 3 A local enlarged schematic diagram of the middle A;
[0022] Figure 5 It is a schematic diagram of the connection structure of the longitudinal connection component in the utility model.
[0023] In the figure: 100, semiconductor laser unit; 200, longitudinal connection assembly; 201, plug block; 202, positioning groove; 300, transverse connection assembly; 301, wedge block; 302, alignment column; 303, collar; 304, stud; 305, threaded sleeve; 306, special-shaped clip; 307, ring; 308, support rod; 309, spring column; 310, side plate. DETAILED DESCRIPTION
[0024] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.
[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0026] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.
[0027] Example 1
[0028] Reference Figure 1-2 , is the first embodiment of the utility model, which provides a mechanically connected semiconductor laser unit stack array, including:
[0029] A semiconductor laser unit 100, wherein a lateral connection component 300 is provided on the side of the semiconductor laser unit 100;
[0030] Furthermore, a longitudinal connection component 200 is provided on the outer surface of the semiconductor laser unit 100 .
[0031] Specifically, the semiconductor laser unit 100 is arranged in coordination with the transverse connection component 300 and the longitudinal connection component 200 so that the semiconductor laser unit 100 can be stably connected, thereby helping the semiconductor laser unit 100 to be stably stacked.
[0032] The transverse connection assembly 300 includes a wedge block 301 fixed to the side of the semiconductor laser unit 100, the end face of the wedge block 301 is fixedly connected to a positioning column 302, the outer wall of the positioning column 302 is fixedly sleeved with a ring 303, and the outer surface of the ring 303 is fixedly connected to a side plate 310.
[0033] Preferably, the fixing of the collar 303 to the side plate 310 makes the insertion of the side plate 310 and the spring column 309 more stable, the stud 304 is adjusted during displacement, and the displacement is more precise, and the fixing of the wedge block 301 to the alignment column 302 makes the installation of the collar 303 more stable.
[0034] When in use, firstly, the semiconductor laser unit 100 is matched and connected with the transverse connection component 300, then the stud 304 in the transverse component 300 is aligned with the center of the alignment column 302, and then the spring column 309 is inserted into the side of the support rod 308, and the side rod 310 is fixedly connected with the collar 303. Then, the hole groove opened in the side rod 310 is movably connected with the support rod 308, so that the stud 304 is evenly slid into the inner cavity of the alignment column 302, and at the same time, the special-shaped clip 306 is aligned and clamped with the wedge block 301 to complete the transverse connection of the semiconductor laser unit 100.
[0035] Example 2
[0036] Reference Figure 2-3 , which is the second embodiment of the utility model. Different from the previous embodiment, this embodiment provides relevant components for achieving a stable alignment effect.
[0037] Specifically, the outer end of the alignment column 302 is threadedly connected to the stud 304, the outer surface of the stud 304 is fixedly connected to the support rod 308, the inner cavity of the support rod 308 is movably connected to the spring column 309, and the through end of the spring column 309 is movably connected to the side plate 310.
[0038] Furthermore, the threaded connection between the stud 304 and the alignment column 302 makes the displacement of the stud 304 more stable, avoiding the shaking and trembling of the semiconductor laser unit 100, so that the semiconductor laser unit 100 can be stably stacked. The movable connection between the spring column 309 and the support rod 308 facilitates the timely replacement of the spring column 309 and avoids the failure of the stud 304.
[0039] The outer side of the stud 304 is threadedly connected to a threaded sleeve 305, and the outer surface of the threaded sleeve 305 is fixedly connected to a special-shaped clip 306. The special-shaped clip 306 is an integrally formed elastic metal sheet, and the special-shaped clip 306 is adaptably connected to the wedge block 301. The spiral directions of the threads at both ends of the stud 304 are opposite, and the center of the stud 304 remains coincident with the center of the alignment column 302.
[0040] Among them, through the clamping connection between the special-shaped clip 306 and the wedge block 301, different semiconductor laser units 100 can be stably combined. The special-shaped clip 306 made of metal spring material can ensure that it will not break or bend when clamped with the wedge block 301, effectively improving the clamping efficiency.
[0041] When in use, the spring column 309 is axially displaced on the side rod 310, and then the hole grooves provided on the side rod 310 help the side rod 310 to intermittently align. At the same time, the different end surface threads of the stud 304 allow different semiconductor laser units 100 to be connected in the same direction.
[0042] Example 3
[0043] Reference Figure 3-5 , which is the third embodiment of the utility model. Different from the previous embodiment, this embodiment provides relevant components for achieving a long-term stable effect at the connection.
[0044] Specifically, the longitudinal connection assembly 200 includes an insert block 201 and a positioning groove 202 fixedly connected to the surface of the semiconductor laser unit 100 , and the insert block 201 and the positioning groove 202 are movably plugged.
[0045] Preferably, the insertion of the insert block 201 and the positioning groove 202 enables the longitudinal connection of the laser unit to be realized, while also meeting the requirements for the stacking combination of the semiconductor laser unit 100 .
[0046] A plurality of holes are formed on the surface of the side plate 310 , and the holes are adapted to be connected with the end surfaces of the spring columns 309 .
[0047] Furthermore, the adaption connection between the hole groove and the spring column 309 restricts the plugging movement of the spring column 309 on the side plate 310 , while facilitating the precise docking of the stud 304 and the alignment column 302 .
[0048] When in use, firstly, the plug block 201 is plugged into the positioning groove 202, and then different semiconductor laser units 100 are combined and stacked. At the same time, when the spring column 309 is moved, the side plate 310 and the spring column 309 are placed vertically. The hole groove opened in the side plate 310 further limits the spring column 309, helps the alignment column 302 and the center of the stud 304 to align different semiconductor laser units 100. Stacked array.
[0049] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and ratio of various elements, and parameter values (e.g., temperature, pressure, etc.), installation arrangements, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present utility model. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to a specific embodiment, but extends to various modifications that still fall within the scope of the appended claims.
[0050] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.
[0051] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.
[0052] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.
Claims
1. A mechanically connected semiconductor laser unit stack, characterized in that: include, A semiconductor laser unit (100), wherein a lateral connection component (300) is provided on a side of the semiconductor laser unit (100); Furthermore, a longitudinal connection component (200) is provided on the outer surface of the semiconductor laser unit (100).
2. A mechanically connected semiconductor laser unit stack according to claim 1, characterized in that: The transverse connection assembly (300) comprises a wedge block (301) fixed to the side of the semiconductor laser unit (100), the end surface of the wedge block (301) is fixedly connected to an alignment column (302), the outer wall of the alignment column (302) is fixedly sleeved with a collar (303), and the outer surface of the collar (303) is fixedly connected to a side plate (310).
3. A mechanically connected semiconductor laser unit stack according to claim 2, characterized in that: The outer end of the alignment column (302) is threadedly connected to a stud (304), the outer surface of the stud (304) is fixedly connected to a support rod (308), the inner cavity of the support rod (308) is movably connected to a spring column (309), and the through end of the spring column (309) is movably connected to the side plate (310).
4. The mechanically connected semiconductor laser unit stack according to claim 3, characterized in that: The outer side of the stud bolt (304) is threadedly connected to a threaded sleeve (305), and the outer surface of the threaded sleeve (305) is fixedly connected to a special-shaped clip (306), the special-shaped clip (306) is an integrally formed elastic metal sheet, and the special-shaped clip (306) is adaptively connected to the wedge block (301).
5. The mechanically connected semiconductor laser unit stack according to claim 4, characterized in that: A plurality of holes are formed on the surface of the side plate (310), and the holes are adapted to be connected with the end surface of the spring column (309).
6. The mechanically connected semiconductor laser unit stack according to claim 5, characterized in that: The longitudinal connection component (200) comprises an insert block (201) and a positioning groove (202) fixedly connected to the surface of the semiconductor laser unit (100), and the insert block (201) and the positioning groove (202) are movably plugged.
7. The mechanically connected semiconductor laser unit stack according to claim 6, characterized in that: The screw threads at both ends of the stud bolt (304) have opposite spiral directions, and the center of the stud bolt (304) and the center of the alignment column (302) remain coincident.