RGB lamp bead based on separated support design
By adopting separation bracket design and transparent material separation technology in RGB lamp beads, combining BT conductive substrate and flip chip, the problems of internal stress and luminous angle limitations are solved, and high reliability and 360-degree uniform luminescence effect are achieved.
Patent Information
- Application Number
- CN202420898325.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-04-28
AI Technical Summary
The internal stress of the existing RGB lamp beads is too high, which leads to the separation of the chip and the metal bracket, causing dead lamp problems. At the same time, the luminous angle is limited, and 360-degree luminescence cannot be achieved.
The RGB lamp beads designed based on the separation bracket are adopted, and the RGB functional area is separated by the separation design of transparent material and the RGB functional area, using BT conductive substrate and flip chip, combined with the package of transparent colloids, reducing the internal stress of the material, and achieving 360-degree luminescence through optical design.
It solves the internal stress problem of the material, improves the reliability and luminous angle of the lamp beads, and achieves uniform luminescence of 360 degrees.
Smart Images
Figure CN222674881U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of RGB lamp beads, in particular to an RGB lamp bead based on a separation bracket design. Background Art
[0002] There are many types of LEDs at present. Generally, different applications will have different types of lamp beads. In fact, different types of LEDs are formed by different types of LED brackets. The specific classifications are: direct plug-in brackets, patch brackets, high-power brackets, flat brackets and COB brackets. Since the brackets of LEDs need to be conductive and heat-conductive, metals are used as conductive connection materials. At the same time, some areas need to be insulated, which requires engineering plastics. Therefore, general LED brackets are formed by metal stamping and then injection molding. Different bracket materials are used for LEDs of different powers. Low-power generally uses PPA, medium-power generally uses PCT, and some high-power ones are currently made of EMC or ceramic substrate materials.
[0003] The existing brackets of RGB lamp beads are generally formed by electroplating copper materials into the required size and then injection molding. The RGB chip is fixedly soldered in the bracket bowl to make RGB lamp beads. The current brackets of RGB lamp beads are all obtained by synthetic injection molding of opaque engineering plastics and stamped metal frames. The RGB chip can only be fixed in the bowl that has been stamped and injection molded, and its light-emitting angle cannot be changed; the existing transparent material injection metal bracket 5050RGB, if transparent material is used for injection molding, the internal stress generated in the transparent material cannot be resolved. The chip is fixed on the stamped metal bracket injected with transparent material. Due to the excessive internal stress of the transparent material, the chip and the metal bracket will be separated during reflow soldering, causing a dead light. However, since transparent materials are prone to internal stress during reflow soldering, they can only be injected into the raw materials by doping, so that the bowl becomes white, black, beige, etc., but transparent materials cannot be used directly, and the functional area and the protection area cannot be separated independently, and the damage caused by stress cannot be eliminated. In addition, existing SMD RGB lamp beads cannot be fully transparent, and the luminous angle is limited to 135 degrees. The luminous surface is small and the light spot is uneven. In some application scenarios, the problem of too small luminous angle cannot be solved. For example, 360-degree luminous light strips and light tubes can only use two light strips pasted back to back to achieve 360-degree luminescence.
[0004] Therefore, there is an urgent need for an LED lamp bead that can achieve 360-degree luminescence and solve the problem of internal stress in the material. Utility Model Content
[0005] The purpose of the utility model is to provide an RGB lamp bead based on a separated bracket design, which can solve the problem of internal stress of the material through the separation design of transparent material and RGB functional area, and realize 360-degree luminescence with uniform light spot.
[0006] To achieve the above purpose, the utility model provides the following solutions:
[0007] An RGB lamp bead based on a separated bracket design comprises a transparent bracket substrate, a functional area carrier, a plurality of pad pins and a packaging transparent colloid, wherein the functional area carrier comprises a BT conductive substrate and an RGB chip, and the RGB chip is die-bonded on the BT conductive substrate; the functional area carrier is arranged at the center of the transparent bracket substrate, a plurality of the pad pins are arranged on the transparent bracket substrate around the functional area carrier, and the plurality of the pad pins are electrically connected to the BT conductive substrate; the packaging transparent colloid packages the functional area carrier and the plurality of pad pins on the transparent bracket substrate.
[0008] Furthermore, the RGB chip includes a red light flip chip, a blue light flip chip, and a green light flip chip, and the multiple pad pins include positive pad pins of the RGB chip, negative pad pins of the green light flip chip, negative pad pins of the blue light flip chip, and negative pad pins of the red light flip chip. A three-crystal common positive circuit is provided on the BT conductive substrate, and the multiple pad pins are respectively connected to the red light flip chip, the blue light flip chip, and the green light flip chip through the three-crystal common positive circuit.
[0009] Furthermore, the positive electrode pad pin of the RGB chip, the negative electrode pad pin of the green light flip chip, the negative electrode pad pin of the blue light flip chip, and the negative electrode pad pin of the red light flip chip are arranged on the four corners of the functional area carrier.
[0010] Furthermore, the encapsulated transparent colloid is epoxy resin or silicone resin.
[0011] According to the specific embodiments provided by the utility model, the utility model discloses the following technical effects: the RGB lamp beads based on the separate bracket design provided by the utility model have good physical properties of the BT substrate welded for the first time. During the second packaging welding, the internal stress generated by the high temperature will not act on the chip circuit of the first packaging, thereby ensuring the firmness of the first chip welding and the firmness of the carrier circuit, and there is no stress in the RGB functional area, thereby ensuring the reliability of the functional area.
[0012] Since the main stress of the lamp bead comes from the transparent colloid in the second packaging, the utility model increases the welding force by designing the second welding area to make the second welding force greater than the stress of the packaging colloid, thereby ensuring the firmness of the second welding packaging.
[0013] By separating the encapsulated transparent colloid from the RGB functional area, the problem of internal stress in the material is solved and the overall reliability of the lamp bead is improved.
[0014] The functional area carrier is placed in the middle of the transparent support substrate, and through optical design, when it is lit, it uses the principles of light refraction and reflection to produce diffuse reflection near the transparent material and the functional area, thereby achieving full-body luminescence of the device. At the bottom of the functional area, the light intensity is still 40%, achieving 360-degree luminescence. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0016] Figure 1 The RGB functional area of the RGB lamp beads designed based on the separated bracket according to the embodiment of the present invention;
[0017] Figure 2 It is a protection area of RGB lamp beads designed based on a separate bracket in an embodiment of the present invention;
[0018] Figure 3 This is a planar structural diagram of an RGB lamp bead designed based on a separate bracket according to an embodiment of the present invention, wherein: Figure 3-1 This is the front structure diagram of the RGB lamp beads based on the separated bracket design. Figure 3-2 This is the back view of the RGB lamp beads based on the separated bracket design. Figure 3-3 This is a side view of the RGB lamp beads based on the separated bracket design. Figure 3-4 It is a three-crystal common positive circuit on a BT conductive substrate, a represents the length of the transparent support substrate is 3.2 mm, b represents the width of the transparent support substrate is 2.7 mm, c represents the distance between the two pads close to the long side of the transparent support substrate is 1.25 mm, d represents the distance between the two pads close to the short side of the transparent support substrate is 0.4 mm, e represents the length of the pad is 1 mm, f represents the thickness of the RGB lamp bead based on the separated support design is 1.1 mm, and g represents the width of the pad is 0.875 mm;
[0019] Figure 4 A 3D image of an RGB lamp bead designed based on a separate bracket for 360-degree light emission in an embodiment of the present invention;
[0020] Figure 5 This is an enlarged design drawing of the secondary packaging welding pad of the embodiment of the present invention;
[0021] Explanation of the accompanying drawings: 1 is the positive pad pin of the RGB chip; 2 is the negative pad pin of the green light chip; 3 is the negative pad pin of the blue light chip; 4 is the negative pad pin of the red light chip; 5 is the red light flip chip; 6 is the blue light flip chip; 7 is the green light flip chip; 8 is the BT conductive substrate; 9 is the transparent bracket substrate; 10 is the encapsulated transparent colloid. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] The purpose of the utility model is to provide an RGB lamp bead based on a separated bracket design, which can solve the problem of internal stress of the material through the separation design of the transparent material and the RGB functional area, and at the same time, realize 360-degree luminescence with uniform light spot.
[0024] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0025] Example 1
[0026] like Figure 1-5 As shown, an RGB lamp bead based on a separated bracket design provided by an embodiment of the utility model includes a transparent bracket substrate 9, a functional area carrier, a plurality of pad pins and a packaging transparent colloid 10, wherein the functional area carrier includes a BT conductive substrate 8 and an RGB chip, and the RGB chip is solid-die-bonded on the BT conductive substrate 8; the functional area carrier is arranged at the center position of the transparent bracket substrate 9, and a plurality of the pad pins are arranged on the transparent bracket substrate 9 around the functional area carrier, and the plurality of the pad pins are electrically connected to the BT conductive substrate 8; the packaging transparent colloid 10 encapsulates the functional area carrier and the plurality of pad pins on the transparent bracket substrate.
[0027] The BT conductive substrate 8 used in this embodiment is called BT resin substrate material, or BT board for short. It is a resin chemical product made by synthesizing bismaleimide and cyanate resin. It has a very high glass transition temperature and excellent dielectric properties, making it widely used in the currently popular high-density interconnected multi-layer printed circuit board flat packaging substrates.
[0028] In this embodiment, the RGB chip includes a red flip chip 5, a blue flip chip 6, and a green flip chip 7; each pad has a corresponding pin, that is, Figure 4 As shown in the figure, multiple pad pins include RGB chip positive pad pin 1, green light flip chip negative pad pin 2, blue light flip chip negative pad pin 3, and red light flip chip negative pad pin 4. A three-crystal common positive circuit is provided on the BT conductive substrate 8, and multiple pad pins are respectively connected to the red light flip chip 5, the blue light flip chip 6, and the green light flip chip 7 through the three-crystal common positive circuit.
[0029] It should be noted that the PN junction pads of the regular chips on the market are connected by wire bonding on the front side, which requires bonding and wire bonding, so the internal leads are detached, and the chip and the bracket cannot be separated; while the PN junction of the flip chip is connected at the bottom of the chip through the SMT soldering process, which does not require wire bonding, so the reliability is enhanced. Therefore, this application adopts a flip chip, which has a pad at the bottom and only needs to be fixed to the substrate by a die bonding machine through solder paste, which has achieved its conductive function and does not require a wire bonding process.
[0030] In this embodiment, the RGB chip positive pad pin 1, the green light flip chip negative pad pin 2, the blue light flip chip negative pad pin 3, and the red light flip chip negative pad pin 4 are arranged on the four corners of the functional area carrier.
[0031] In this embodiment, the encapsulating transparent colloid is epoxy resin or silicone resin.
[0032] In this embodiment, the BT conductive substrate 8 is welded on the secondary packaging transparent support substrate 9 (such as Figure 5 As shown), the transparent material 10 is then die-cast into the required device size by plastic encapsulation die-casting, and the transparent material 10 is used to protect the RGB chip from damage by external objects to form a protection zone.
[0033] In this embodiment, the transparent colloid 10 is encapsulated and separated from the RGB functional area to solve the problem of dead light caused by the internal stress of the material combination during reflow soldering. The RGB functional area is physically separated from the transparent material area. The RGB functional area is first made and then soldered to the metal connecting pad of the transparent bracket substrate 9 with solder paste to avoid the internal stress of the transparent material pulling and breaking the connecting line of the RGB functional area during reflow soldering during the back-end processing and application.
[0034] The RGB functional area is made into an integrated package and placed in the center of the package transparent colloid 10, so that when it is lit, through optical design, the refraction and reflection of light are used to produce diffuse reflection near the package transparent colloid 10 and the RGB functional area, thereby realizing the whole body illumination of the device. At the bottom of the RGB functional area, the light intensity is still 40% of the light intensity, realizing the design requirement of 360-degree illumination, increasing the luminous angle, and making the light spot uniform. The luminous angle is expanded to nearly 230 degrees on the original basis, which can save costs and can be directly used to make 360-degree luminous light strips, light tubes or round lamps.
[0035] Example 2
[0036] The utility model also provides a method for manufacturing RGB lamp beads based on a separated bracket design, which is applied to the RGB lamp beads based on a separated bracket design, and comprises the following steps:
[0037] S1. Divide the RGB lamp beads into an RGB functional area and a protection area, wherein the protection area is a packaging area for encapsulating a transparent colloid, and the RGB functional area is located at the center of the protection area for installing a functional area carrier board;
[0038] S2, using a die bonding machine to bond the RGB chip onto the BT conductive substrate in the functional area carrier, and after wire bonding by a wire bonding machine, the RGB chip and the circuit on the BT conductive substrate are connected, and the RGB chip and the electrode are encapsulated by an encapsulating transparent colloid;
[0039] S3, disposing a plurality of the pad pins around the functional area carrier on the transparent support substrate, and electrically connecting the plurality of the pad pins to the BT conductive substrate;
[0040] S4, soldering the BT conductive substrate in the functional area carrier board with solid crystal to the transparent bracket substrate of the secondary packaging by soldering with solder paste, and then die-casting the encapsulated transparent colloid into the required size by plastic encapsulation die-casting;
[0041] S5. By using the principle of light refraction and reflection, diffuse reflection is generated near the encapsulated transparent colloid and the RGB functional area when the RGB chip is lit.
[0042] In this embodiment, a plurality of pad pins are respectively connected to the red light flip chip, the blue light flip chip, and the green light flip chip in the RGB chip through a three-crystal common positive circuit.
[0043] In this embodiment, the functional area carrier is welded to the transparent bracket substrate by a solder paste reflow process, pressed by molding and filling a transparent colloid, and cut into single pieces to become transparent bracket RGB lamp beads.
[0044] In summary, the RGB lamp beads based on the separated bracket design provided by the utility model, through the transparent bracket pad design and the white BT substrate secondary welding packaging method, the separated design solves the problem that the internal stress generated by high temperature during the secondary welding cannot directly act on the bonding circuit of the RGB chip, thereby ensuring the reliability of the functional area. By increasing the contact area of the second packaging pad design, the welding force is greater than the internal stress generated by high temperature, thereby ensuring the firmness of the second welding and improving the reliability of the overall lamp beads. The carrier board of the functional area is placed in the middle of the transparent material, and through optical design, when it is lit, it uses the refraction and reflection principles of light to generate diffuse reflection near the transparent material and the functional area, thereby realizing the whole body luminescence of the device. At the bottom of the functional area, the light intensity is still 40% of the light intensity, realizing 360-degree luminescence.
[0045] The remaining technical features in this embodiment can be flexibly selected by those skilled in the art according to actual conditions to meet different specific practical needs. However, it is obvious to those skilled in the art that it is not necessary to adopt these specific details to implement the utility model. In other examples, in order to avoid confusing the utility model, the well-known components, structures or parts are not described in detail, which are all within the technical protection scope defined by the technical solution claimed in the claims of the utility model.
[0046] In the description of the present utility model, unless otherwise clearly specified and limited, the terms "set", "install", "connect", "connection", etc. are all broadly defined and should be understood by those skilled in the art in a broad sense. For example, it can be a fixed connection, a movable connection, or an integral connection, or a partial connection, a mechanical connection, or an electrical connection, a direct connection, or an indirect connection through an intermediate medium, or a connection between two components, etc. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances, that is, the expression of the text language and the implementation of the actual technology can correspond flexibly, and the expression of the text language (including the drawings) of the specification of the present utility model does not constitute any single restrictive interpretation of the claims.
[0047] Modifications and changes made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the scope of protection of the claims attached to the present invention. In the above description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is obvious to those of ordinary skill in the art that these specific details are not necessary to implement the present invention. In other examples, in order to avoid confusing the present invention, well-known technologies, such as specific construction details, operating conditions and other technical conditions, are not described in detail.
[0048] This article uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core ideas of the utility model. At the same time, for those skilled in the art, according to the ideas of the utility model, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the utility model.
Claims
1. An RGB lamp bead based on a separate bracket design, characterized in that: It includes a transparent support substrate, a functional area carrier, a plurality of pad pins and a packaging transparent colloid, wherein the functional area carrier includes a BT conductive substrate and an RGB chip, and the RGB chip is die-bonded on the BT conductive substrate; the functional area carrier is arranged at the center of the transparent support substrate, and a plurality of pad pins are arranged on the transparent support substrate around the functional area carrier, and the plurality of pad pins are electrically connected to the BT conductive substrate; the packaging transparent colloid packages the functional area carrier and the plurality of pad pins on the transparent support substrate.
2. The RGB lamp bead based on the separated bracket design according to claim 1 is characterized in that: The RGB chip includes a red light flip chip, a blue light flip chip, and a green light flip chip. The multiple pad pins include positive pad pins of the RGB chip, negative pad pins of the green light flip chip, negative pad pins of the blue light flip chip, and negative pad pins of the red light flip chip. A three-crystal common positive circuit is provided on the BT conductive substrate, and the multiple pad pins are respectively connected to the red light flip chip, the blue light flip chip, and the green light flip chip through the three-crystal common positive circuit.
3. The RGB lamp bead based on the separated bracket design according to claim 1 is characterized in that: The positive electrode pad pins of the RGB chip, the negative electrode pad pins of the green light flip chip, the negative electrode pad pins of the blue light flip chip, and the negative electrode pad pins of the red light flip chip are arranged on the four corners of the functional area carrier.
4. The RGB lamp bead based on the separated bracket design according to claim 1 is characterized in that: The encapsulating transparent colloid is epoxy resin or silicone resin.