Silicon wafer cleaning equipment and silicon wafer processing system

Abstract

The utility model discloses silicon wafer cleaning equipment and a silicon wafer processing system, and relates to the field of photovoltaic technology, and the silicon wafer cleaning equipment comprises a cleaning tank which contains cleaning fluid; the heating pipe is arranged in the cleaning tank and is used for heating the cleaning liquid; the cooling device comprises a cooling pipe arranged in the cleaning tank, the cooling pipe is provided with a hollow cavity, cooling liquid circulates in the hollow cavity, and the temperature of the cooling liquid is lower than that of the cleaning liquid. The silicon wafer cleaning device is used for improving the silicon wafer quality while ensuring the silicon wafer cleaning effect.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic technology, and more specifically, to a silicon wafer cleaning device and a silicon wafer processing system. Background Art

[0002] The production and processing of silicon wafers is an important link in the photovoltaic industry chain. During the silicon wafer processing, the cut silicon wafers need to be cleaned before entering the next stage.

[0003] An ultrasonic cleaner is required for cleaning silicon wafers. Long-term cleaning will increase the temperature in the cleaning tank. The current ultrasonic cleaning tank needs to be heated to a certain temperature to soften the contaminants on the silicon wafer, which further increases the temperature in the ultrasonic cleaning tank. Excessive temperature may damage the quality of the silicon wafer. Utility Model Content

[0004] In view of this, the present application provides a silicon wafer cleaning device and a silicon wafer processing system, which are used to improve the quality of silicon wafers while ensuring the cleaning effect of silicon wafers.

[0005] In a first aspect, the present application provides a silicon wafer cleaning device, comprising:

[0006] a cleaning tank containing a cleaning liquid;

[0007] A heating tube disposed in the cleaning tank, the heating tube being used to heat the cleaning liquid;

[0008] The cooling device comprises a cooling pipe arranged in the cleaning tank, the cooling pipe has a hollow cavity, a cooling liquid flows in the hollow cavity, and the temperature of the cooling liquid is lower than the temperature of the cleaning liquid.

[0009] Optionally, where:

[0010] The cooling device also includes a liquid inlet pipe and a liquid discharge pipe. The cooling pipe has a liquid inlet and a liquid discharge port. One end of the liquid inlet pipe is connected to the liquid inlet, and one end of the liquid discharge pipe is connected to the liquid discharge port.

[0011] Optionally, where:

[0012] The cooling pipe is located at the bottom of the cleaning tank, and / or the cooling pipe is close to the side wall of the cleaning tank.

[0013] Optionally, where:

[0014] The cleaning tank includes at least three side walls connected end to end; two first openings are opened on any side wall and penetrate the side wall along the thickness direction of the side wall, the liquid inlet pipe is connected to the liquid inlet through one of the first openings, and the liquid discharge pipe is connected to the liquid discharge through the other first opening.

[0015] Optionally, where:

[0016] The projection of the cooling tube on the bottom of the cleaning tank at least partially overlaps with the projection of the heating tube on the bottom of the cleaning tank, or the projection of the cooling tube on the bottom of the cleaning tank does not overlap with the projection of the heating tube on the bottom of the cleaning tank.

[0017] Optionally, where:

[0018] A flow control valve is installed at the liquid inlet pipe or the liquid inlet, and the flow control valve is used to adjust the flow of the coolant flowing into the cooling pipe.

[0019] Optionally, where:

[0020] The flow rate of the coolant ranges from 0 to 5 L / min.

[0021] Optionally, where:

[0022] A temperature detection element is also provided in the cleaning tank, and the temperature detection element is used to detect the temperature of the cleaning liquid.

[0023] Optionally, where:

[0024] The silicon wafer cleaning device also includes a liquid storage tank, and one end of the liquid discharge pipe away from the liquid discharge port is connected to the liquid storage tank.

[0025] In a second aspect, the present application further provides a silicon wafer processing system, which includes the silicon wafer cleaning device described in the first aspect.

[0026] Compared with the prior art, the silicon wafer cleaning device and silicon wafer processing system provided by the present application achieve at least the following beneficial effects:

[0027] In order to avoid the high temperature in the cleaning tank affecting the quality and cleaning effect of the silicon wafer, the present application adds a cooling device to the silicon wafer cleaning equipment. The cooling device includes a cooling pipe installed in the cleaning tank, and the cooling pipe has a hollow cavity for circulating the cooling liquid. The temperature of the cooling liquid is lower than the temperature of the cleaning liquid. When the temperature of the cleaning liquid in the cleaning tank is too high, as the cooling liquid continues to flow in the cooling pipe, the excess heat in the cleaning liquid will also be continuously taken away, thereby cooling the cleaning liquid. It can be seen that the cooling pipe can cool the cleaning liquid in the cleaning tank by directly contacting the cleaning liquid, achieving good cooling efficiency, improving the quality of the silicon wafer while ensuring the cleaning effect, and effectively avoiding the abnormal quality of the silicon wafer caused by the high temperature in the cleaning tank.

[0028] Of course, any product implementing this application does not necessarily need to achieve all of the technical effects described above at the same time.

[0029] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0031] Figure 1 The figure shows a side structural schematic diagram of a silicon wafer cleaning device provided in an embodiment of the present application near a cleaning tank;

[0032] Figure 2 The figure shows a schematic diagram of a top view of the cleaning tank provided in an embodiment of the present application;

[0033] Figure 3 Shown is a top view structural schematic diagram of the silicon wafer cleaning equipment provided in an embodiment of the present application. DETAILED DESCRIPTION

[0034] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0035] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0036] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0037] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0038] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0039] Monocrystalline silicon is a single crystal of silicon. It has a basically complete lattice structure and different properties in different directions. It is a good semiconductor material. It is used to manufacture semiconductor devices, solar cells, etc. In the process of processing single crystal silicon wafers, the cut silicon wafers need to be cleaned to remove contaminants on the single crystal silicon wafers, so an ultrasonic cleaning tank is required.

[0040] Ultrasonic cleaning is mainly a high-frequency oscillation signal emitted by an ultrasonic generator, which is converted into high-frequency mechanical oscillation by a transducer and propagated to the medium, that is, the cleaning solvent. Long-term cleaning will cause high temperature in the cleaning tank. In addition, the current ultrasonic cleaning tank needs to be heated to a certain temperature to soften the pollutants on the silicon wafer, improve the efficiency and cleaning performance of ultrasonic cleaning, and further increase the temperature in the ultrasonic cleaning tank. However, the quality of silicon wafers is damaged when the temperature is too high. At present, there are technologies to add an over-temperature alarm function to the ultrasonic cleaning tank and install multiple fans inside the ultrasonic cleaning machine, but the temperature inside the cleaning tank cannot be well controlled. After long-term operation, the frequency of over-temperature alarm shutdown of the cleaning tank increases, which affects production.

[0041] In order to solve the above technical problems, the present application proposes a silicon wafer cleaning device and a silicon wafer processing system, which are used to improve the quality of silicon wafers while ensuring the cleaning effect of silicon wafers.

[0042] The following is a detailed description with reference to the accompanying drawings and specific embodiments.

[0043] Figure 1 The figure shows a side structural schematic diagram of a silicon wafer cleaning device provided in an embodiment of the present application near a cleaning tank; Figure 2 The figure shows a schematic diagram of a top view of the cleaning tank provided in an embodiment of the present application; Figure 3 Shown is a top view structural schematic diagram of the silicon wafer cleaning equipment provided in an embodiment of the present application.

[0044] like Figure 1 and Figure 2 As shown, the embodiment of the present application provides a silicon wafer cleaning device, comprising:

[0045] A cleaning tank 10, wherein the cleaning tank 10 contains a cleaning liquid;

[0046] A heating tube 11 is disposed in the cleaning tank 10, and the heating tube 11 is used to heat the cleaning liquid;

[0047] The cooling device includes a cooling pipe 12 disposed in the cleaning tank 10. The cooling pipe 12 has a hollow cavity. A cooling liquid flows in the hollow cavity. The temperature of the cooling liquid is lower than the temperature of the cleaning liquid.

[0048] When implementing it, Figure 1 and Figure 2 As shown, in the silicon wafer cleaning device, a basket 22 carrying silicon wafers 21 is placed in a cleaning tank 10 filled with cleaning liquid to clean the silicon wafers. When the cleaning liquid temperature is too low, the cleaning liquid is heated by a heating tube 11; when the cleaning liquid temperature is too high, the cleaning liquid is cooled by a cooling device.

[0049] Through the composition structure and specific implementation process of the above silicon wafer cleaning equipment, it can be known that Figure 1 and Figure 2 As shown, the silicon wafer cleaning equipment uses a cleaning tank 10 as a container for cleaning silicon wafers, which is filled with cleaning liquid. After loading, the flower basket 22 carrying the silicon wafer 21 is placed in the cleaning tank 10 for cleaning. A heating tube 11 is installed in the cleaning tank 10. The heating tube 11 can increase the process temperature by directly heating the cleaning liquid, thereby ensuring the cleaning effect of the silicon wafer 21. In order to avoid the high temperature in the cleaning tank 10 affecting the quality and cleaning effect of the silicon wafer, the embodiment of the present application adds a cooling device to the silicon wafer cleaning equipment. The cooling device includes a cooling tube 12 installed in the cleaning tank 10, and the cooling tube 12 has a hollow cavity for circulating the cooling liquid. The temperature of the cooling liquid passed into the cooling tube 12 is lower than the temperature of the cleaning liquid. When the temperature of the cleaning liquid in the cleaning tank 10 is too high, the cooling tube 12 with a hollow cavity can be used as a partition heat exchanger to cool the cleaning liquid. Furthermore, the excess heat in the cleaning liquid can be conducted to the coolant through the wall of the cooling tube 12. As the coolant continues to flow in the cooling tube 12, the excess heat in the cleaning liquid will also be continuously taken away, thereby cooling the cleaning liquid. It can be seen that the cooling tube 12 can cool the cleaning liquid in the cleaning tank 10 by directly contacting the cleaning liquid, thereby achieving good cooling efficiency, improving the quality of the silicon wafer while ensuring the cleaning effect, and effectively avoiding the abnormal quality of the silicon wafer caused by the excessive temperature in the cleaning tank 10. In addition, the cooling tube 12 can be directly cooled during the cleaning process without stopping the machine, thereby ensuring the cleaning efficiency.

[0050] In some examples, the silicon wafer cleaning equipment may be an ultrasonic cleaning machine, and the cleaning tank may be an ultrasonic cleaning tank. However, for other silicon wafer cleaning equipment with high temperature risks, such as immersion wet cleaning tanks, etc., the solution provided in the embodiments of the present application may also be used to improve the temperature. This is only an example and is not specifically limited.

[0051] For example, Figure 1 As shown, when the silicon wafer cleaning equipment is an ultrasonic cleaning machine, the silicon wafer cleaning equipment also includes an ultrasonic generator and an ultrasonic transducer 13 located below the cleaning tank 10, wherein the ultrasonic generator can convert electrical energy into a high-frequency alternating current signal matching the ultrasonic transducer 13, and the ultrasonic transducer 13 can convert the high-frequency electrical energy generated by the ultrasonic generator into high-frequency mechanical vibrations (i.e., ultrasonic vibrations). The ultrasonic cleaning machine utilizes the ultrasonic vibrations generated by the ultrasonic transducer 13 to cause countless high-pressure cavitation bubbles to explode in the water due to the cavitation effect. The energy of the instantaneous explosion peels off the dirt on the surface of the object to be cleaned (the silicon wafer in the embodiment of the present application) to achieve a cleaning effect.

[0052] In addition, if Figure 3As shown, the silicon wafer cleaning equipment may include more than one cleaning tank 10, and a heating tube 11 and a cooling device may be installed in each cleaning tank 10 according to the embodiment of the present application.

[0053] For example, the cleaning liquid may be water with a certain temperature to meet the process temperature required for cleaning the silicon wafer; the coolant may be water with a temperature lower than that of the cleaning liquid. Water has good thermal conductivity and can accelerate the cooling of the cleaning liquid.

[0054] As a possible implementation, Figure 1 and Figure 2 As shown, the cooling device further includes a liquid inlet pipe 14 and a liquid discharge pipe 15 . The cooling pipe 12 has a liquid inlet port 121 and a liquid discharge port 122 . One end of the liquid inlet pipe 14 is connected to the liquid inlet port 121 , and one end of the liquid discharge pipe 15 is connected to the liquid discharge port 122 .

[0055] Based on this, Figure 1 and Figure 2 As shown, the coolant can flow from the liquid inlet pipe 14 to the cooling pipe 12, and enter the cooling pipe 12 from the liquid inlet 121, circulate in the cooling pipe 12 for one cycle, absorb and take away the excess heat in the cleaning liquid, and then flow out of the cooling pipe 12 from the liquid discharge port 122, and finally enter the liquid discharge pipe 15, thereby achieving effective cooling of the cleaning liquid in the cleaning tank 10, improving the quality of the silicon wafer while ensuring the cleaning effect, and ensuring the cleaning efficiency.

[0056] Figure 1 The liquid inlet 121 and the liquid outlet 122 shown in the figure are only examples, and their positions can also be exchanged. This is not limited here.

[0057] In some examples, the cooling tube may be a tubular heat exchanger, such as a shell-and-tube heat exchanger, a sleeve-and-tube heat exchanger, etc., or a plate heat exchanger, such as a spiral plate heat exchanger, a fin heat exchanger, etc. When the cooling tube is a tubular heat exchanger, it may be a U-tube heat exchanger, a spiral tube heat exchanger, etc., which is only used as an example and is not specifically limited.

[0058] In some examples, the heating tube may be an electric heating tube, which is only used as an example and is not specifically limited.

[0059] As a possible implementation, Figure 1 and Figure 2As shown, the cooling pipe 12 is located at the bottom of the cleaning tank 10, and / or the cooling pipe 12 is close to the side wall of the cleaning tank 10. Since the silicon wafer 21 enters the cleaning tank 10 for cleaning in the form of being inserted in the flower basket 22, when installing the cooling pipe 12, it is necessary to reserve a suitable space for the flower basket 22. When the cooling pipe 12 is installed at the bottom of the cleaning tank 10 and / or close to the side wall of the cleaning tank 10, while achieving a good cooling effect, the middle part of the cleaning tank 10 has enough space to accommodate the flower basket 22, so that the flower basket 22 carrying the silicon wafer 21 is placed in the cleaning tank 10 for silicon wafer cleaning.

[0060] In some examples, such as Figure 1 and Figure 2 As shown, the cooling pipe 12 can be laid at the bottom of the cleaning tank 10, or at a position close to the side wall of the cleaning tank 10; alternatively, the cooling pipe 12 can be set at a position located at the bottom of the cleaning tank 10 and close to the side wall of the cleaning tank 10; alternatively, more than one cooling pipe 12 can be installed in the cleaning tank 10, and cooling pipes 12 are installed at the bottom of the cleaning tank 10 and at a position close to the side wall of the cleaning tank 10. This is only an example and is not specifically limited.

[0061] In some examples, such as Figure 1 and Figure 2 As shown, only one heating tube 11 may be installed in the cleaning tank 10, and the heating tube 11 may be installed at the bottom of the cleaning tank 10 or near the side wall of the cleaning tank 10; or, the heating tube 11 may be set at the bottom of the cleaning tank 10 and near the side wall of the cleaning tank 10; or, more than one heating tube 11 may be installed in the cleaning tank 10, and the heating tube 11 may be installed at the bottom of the cleaning tank 10 and near the side wall of the cleaning tank 10. This is only an example and is not specifically limited.

[0062] As a possible implementation, Figure 1 and Figure 2 As shown, the cleaning tank 10 includes at least three side walls connected end to end; two first openings are opened on any side wall and penetrate the side wall along the thickness direction of the side wall, the liquid inlet pipe is connected to the liquid inlet 121 through one of the first openings, and the liquid discharge pipe is connected to the liquid discharge port 122 through the other first opening.

[0063] At this time, if Figure 1 and Figure 2As shown, the liquid inlet 121 and the liquid discharge port 122 of the cooling tube 12 can be set on any side wall of the cleaning tank 10. Compared with setting the liquid inlet 121 and the liquid discharge port 122 of the cooling tube 12 at the bottom of the cleaning tank 10, setting them on the side wall is more convenient for the installation and subsequent maintenance of the cooling device. In specific implementation, a hole can be opened at any side wall of the cleaning tank 10 to form a first opening that penetrates the corresponding side wall along the thickness direction of the corresponding side wall. The first opening can connect the liquid inlet pipe 14 with the liquid inlet 121 of the cooling tube 12, and connect the liquid discharge pipe 15 with the liquid discharge port 122 of the cooling tube 12, so that the cooling device can cool down the cleaning liquid in the cleaning tank 10.

[0064] In addition, two first openings can be respectively opened on different side walls of the cleaning tank and penetrate the corresponding side walls along the thickness direction of the corresponding side walls. The two first openings respectively connect the liquid inlet of the liquid inlet pipe and the cooling pipe, and the liquid outlet of the liquid outlet pipe and the cooling pipe.

[0065] In some examples, the cleaning tank also includes a bottom plate located at the bottom of the cleaning tank, and a second opening can be opened on the bottom plate of the cleaning tank and penetrates the bottom plate along the thickness direction of the bottom plate to install a heating tube on the bottom plate of the cleaning tank; or, a third opening can be opened on any side wall of the cleaning tank and penetrates the corresponding side wall along the thickness direction of the side wall to install a heating tube at the side wall position of the cleaning tank; or, holes can be opened in both the bottom plate and the side wall of the cleaning tank to install more than one heating tube in the cleaning tank. This is only an example and is not specifically limited.

[0066] For example, Figure 1 and Figure 2 As shown, only one cooling tube 12 and one heating tube 11 may be provided in the cleaning tank 10 .

[0067] As a possible implementation, the projection of the cooling tube at the bottom of the cleaning tank at least partially overlaps with the projection of the heating tube at the bottom of the cleaning tank, or the projection of the cooling tube at the bottom of the cleaning tank does not overlap with the projection of the heating tube at the bottom of the cleaning tank.

[0068] When cleaning silicon wafers, the cleaning liquid in the cleaning tank needs to be maintained within the temperature range required by the process. When the temperature of the cleaning liquid is lower than the minimum temperature required by the process, the cleaning liquid is heated by the heating tube; when the temperature of the cleaning liquid is higher than the maximum temperature required by the process, the cleaning liquid is cooled by the cooling device. It can be seen that the cooling tube and the heating tube in the cleaning tank do not work at the same time, so the projections of the cooling tube and the heating tube at the bottom of the cleaning tank can at least partially overlap or not overlap, that is, when the cooling tube and the heating tube are installed in the cleaning tank, the cooling tube and the heating tube can be staggered in space or can be independent of each other, which will not have an adverse effect on the temperature control of the cleaning liquid in the cleaning tank and the cleaning effect of the silicon wafer.

[0069] In some examples, when installing the cooling device, the previously used silicon wafer cleaning equipment can be modified. For example, for a cleaning tank that was originally equipped with dual heating tubes, where the two heating tubes are fixed parallel to the same side wall in a direction perpendicular to the side wall, one of the heating tubes can be removed and a cooling tube can be installed in its place. There is no need to make additional holes in the side wall of the cleaning tank. The holes left by the original heating tubes can be used to install the connecting flange, and the cooling tube can be installed in the cleaning tank, which reduces the difficulty and cost of modification. In this case, Figure 1 and Figure 2 As shown, the cooling pipe 12 and the heating pipe 11 are laid in parallel in the cleaning tank 10, and are fixedly installed on the side wall of the cleaning tank 10 in a direction perpendicular to the side wall, and the projections of the cooling pipe 12 and the heating pipe 11 at the bottom of the cleaning tank 10 do not overlap.

[0070] In addition, if Figure 3 As shown, for the whole silicon wafer cleaning equipment, in addition to the cleaning tank 10, other structures are also included, such as a pre-cleaning tank 32, a rinsing tank 33, a drying tank 34, a loading end 31, a unloading end 35, a return line 36, etc. Taking the cleaning tank 10 as a cubic shape with four end-to-end side walls as an example, the loading end 31, the pre-cleaning tank 32, the cleaning tank 10, the rinsing tank 33, the drying tank 34 and the unloading end 35 are arranged in sequence; wherein the loading end 31 and the unloading end 35 are respectively used for docking with other silicon wafer processing equipment; the pre-cleaning tank 32 is also called the overflow tank, which is used for pre-cleaning the silicon wafer 21; different reagents can be added to the cleaning tank 10 according to the process requirements to clean the silicon wafer 21; the rinsing tank 33 is used to rinse the silicon wafer 21, and each tank body is equipped with a heating tube; the drying tank 34 is used to dry the moisture on the surface of the silicon wafer 21, and each tank body is equipped with a heating tube and a fan; the return line 36 is used to transport the empty flower basket 22, and is arranged at the rear side of the pre-cleaning tank 32, the rinsing tank 33, the cleaning tank 10, the drying tank 34, the loading end 31 and the unloading end 35. The original cleaning tank was installed with dual heating pipes, and both heating pipes were fixed on the side wall on the front side of the cleaning tank. After the original cleaning tank was modified, the original heating pipe was removed and the cooling pipe 12 was installed, the cooling pipe 12 and the heating pipe 11 were installed on the side wall on the front side of the cleaning tank; the silicon wafer cleaning equipment is provided with doors and windows on the front side of the cleaning tank 10. Therefore, installing the cooling pipe 12 and the heating pipe 11 on the side wall on the front side of the cleaning tank 10 can not only further reduce the modification cost and modification difficulty, but also the maintenance work can be carried out by opening the doors and windows later, which reduces the maintenance difficulty.

[0071] In some examples, the heating tube may be a U-shaped electric heating tube, a flange electric heating tube, a W-shaped electric heating tube, a special-shaped electric heating tube, etc. These are examples only and are not specifically limited. The heating tube may also select other types of electric heating elements.

[0072] For example, the cooling tube may be a U-tube heat exchanger, and the heating tube may be a flange electric heating tube.

[0073] For example, Figure 1 and Figure 2 As shown, the cooling tube 12 can be a U-shaped tube heat exchanger, and the heating tube 11 can be a U-shaped electric heating tube. At this time, the cooling tube 12 and the heating tube 11 can be laid in parallel in the cleaning tank 10 along a direction perpendicular to the side wall of the cleaning tank 10, the liquid inlet 121 and the liquid outlet 122 of the cooling tube 12 are installed on the side wall of the cleaning tank 10, and the end of the heating tube 11 is also installed on the side wall of the cleaning tank 10, and the heating cable 16 is connected to the terminal 111 at the end of the heating tube 11 to realize the electric heating function of the heating tube 11.

[0074] It should be noted that Figure 1 , Figure 2 and Figure 3 All of them represent simplified structures and do not represent actual structures; for example, when the heating tube 11 is a flange electric heating tube, the heating tube 11 has a plurality of terminals 111 that need to be connected to the heating cable 16. Figure 1 and Figure 2 In the figure, the heating tube 11 is simplified to have only two connection terminals 111 as an illustration. Figure 3 The silicon wafer cleaning equipment shown may also include an exhaust fan disposed on the top of the machine platform, and a robot arm inside the equipment for grabbing and placing the flower basket 22, etc.

[0075] For example, a layer of thermal conductive coating may be applied on the outer surface of the cooling pipe, or heat dissipation components such as fins may be added to the cooling pipe to increase the cooling efficiency of the cooling pipe.

[0076] As a possible implementation manner, a flow control valve is installed at the liquid inlet pipe or the liquid inlet, and the flow control valve is used to adjust the flow of the coolant flowing into the cooling pipe.

[0077] Based on this, by adjusting the flow control valve to adjust the flow of coolant flowing into the cooling pipe, the cooling effect of the cooling pipe can be controlled, thereby achieving precise adjustment of the temperature of the cleaning liquid. While achieving a good cooling effect, the temperature of the cleaning liquid is made more accurately controllable, which is beneficial to improving the cleaning effect and further improving the quality of silicon wafers.

[0078] Exemplarily, the flow control valve may be a stop valve, a butterfly valve, a ball valve, a needle valve, etc. These are merely examples and are not specifically limited.

[0079] In some examples, the flow rate of the coolant ranges from 0 to 5 L / min.

[0080] Based on this, under the control of the flow control valve, the flow control range of the coolant in the cooling pipe can be between 0 and 5L / min. The flow of the coolant is controlled within this flow range, so that when the cooling device cools the cleaning liquid, the temperature control of the cleaning liquid is relatively gentle, and the abnormal temperature fluctuation is small. While achieving a good cooling effect, it is beneficial to further improve the cleaning effect and silicon wafer quality. If the flow of the coolant is too large, it will not only cause the temperature fluctuation of the cleaning liquid in the cleaning tank to be too large, but also cause a waste of water resources.

[0081] Exemplarily, the flow rate range of the coolant can be 0-1.5L / min, 1.5L / min-3.5L / min or 3.5L / min-5L / min, etc. For example, the flow rate of the coolant can be 0, 1L / min, 1.5L / min, 2L / min, 3.5L / min, 4L / min or 5L / min, etc. This is only an example and is not specifically limited.

[0082] As a possible implementation, a temperature detection element is further provided in the cleaning tank, and the temperature detection element is used to detect the temperature of the cleaning liquid.

[0083] Based on this, a temperature detection device can be installed in the cleaning tank to monitor the temperature of the cleaning liquid in real time and realize real-time control of the temperature of the cleaning liquid. When the temperature of the cleaning liquid exceeds the temperature required by the process, the heating tube can be activated in time to heat the cleaning liquid, or the cooling device can be activated to cool the cleaning liquid, so that the temperature of the cleaning liquid can be controlled in time, which is conducive to further improving the cleaning effect and silicon wafer quality. In addition, the temperature change of the cleaning liquid during heating or cooling can be monitored in real time based on the temperature detection device to ensure that the temperature of the cleaning liquid does not exceed the upper or lower limit of the temperature required by the process.

[0084] Exemplarily, the temperature detection element may be a temperature sensor disposed in the cleaning tank, which is merely an example and is not specifically limited.

[0085] In some examples, when cooling the cleaning fluid, the flow control valve can be adjusted according to the real-time temperature of the cleaning fluid detected by the temperature detection component to control the flow of the coolant in the cooling pipe, so that the temperature of the cleaning fluid can be controlled within a certain range.

[0086] For example, in silicon wafer cleaning equipment, the process requirement of a certain cleaning tank is 50°C to 60°C. If the temperature of the cleaning liquid is lower than 50°C or higher than 60°C, the heating tube is started for heating or the cooling device is started for cooling. This is just an example and is not specifically limited.

[0087] Exemplarily, an initial temperature can be set for the cleaning liquid when it enters the cleaning tank. The initial temperature can be the same as the lower limit of the process required temperature. For example, when the process required temperature is 50°C to 60°C, the initial temperature of the cleaning liquid can be set to 50°C. At this time, the cleaning liquid hardly needs to be heated after entering the cleaning tank, and only needs to be heated when the temperature deviates.

[0088] As a possible implementation, Figure 3 As shown, the silicon wafer cleaning device further includes a liquid storage tank 37 , and one end of the liquid discharge pipe away from the liquid discharge port is connected to the liquid storage tank 37 .

[0089] Based on this, Figure 3 As shown, the liquid storage tank 37 can collect the coolant discharged from the cooling pipe 12. When the coolant flows in the cooling pipe 12, it can absorb the excess heat of the cleaning liquid. After the coolant that has absorbed the heat is collected in the liquid storage tank 37, it can be reused, reducing resource loss and reducing production costs.

[0090] In some examples, when the coolant is water, the water that has absorbed heat and is discharged from the cooling pipe can be collected in a liquid storage tank and then supplied to other devices, such as some devices that require a large amount of water during operation. In addition, after the water used as the coolant absorbs heat, it is equivalent to being heated in advance, which can reduce heat consumption when it is reused later, and the heat absorbed by the coolant is exactly the excess heat of the silicon wafer cleaning equipment, further reducing energy loss.

[0091] For example, Figure 3 As shown, the liquid storage tank can also be arranged at the rear side of the loading end 31, the pre-cleaning tank 32, the cleaning tank 10, the rinsing tank 33, the drying tank 34 and the unloading end 35.

[0092] In addition, if Figure 3 As shown, when the silicon wafer cleaning equipment further includes a rinsing tank 33 , the liquid storage tank 37 can also be used to collect overflow water in the rinsing tank 33 .

[0093] Based on the same inventive concept, the present application also provides a silicon wafer processing system, which includes the silicon wafer cleaning equipment described in the above embodiment.

[0094] Compared with the prior art, the beneficial effects of the silicon wafer processing system are the same as the beneficial effects of the silicon wafer cleaning equipment described in the above embodiment, and will not be repeated here.

[0095] In some examples, such as Figure 3As shown, the silicon wafer processing system also includes a wafer sorting machine connected to the loading end 31 of the silicon wafer cleaning equipment. The wafer sorting and sorting are performed before cleaning. Since the wafer sorting machine requires a large amount of water, the water collected in the liquid storage tank 37 can be supplied to the wafer sorting machine for use; in addition, the water that has absorbed heat is beneficial to the wafer sorting when it is given to the wafer sorting machine for use.

[0096] In some examples, such as Figure 3 As shown, the silicon wafer processing system may further include a sorting machine, and the unloading end 35 of the silicon wafer cleaning device is connected to the sorting machine.

[0097] In summary, the silicon wafer cleaning device and silicon wafer processing system provided by the present application achieve at least the following beneficial effects:

[0098] In order to avoid the high temperature in the cleaning tank affecting the quality and cleaning effect of the silicon wafer, the present application adds a cooling device to the silicon wafer cleaning equipment. The cooling device includes a cooling pipe installed in the cleaning tank, and the cooling pipe has a hollow cavity for circulating the cooling liquid. The temperature of the cooling liquid is lower than the temperature of the cleaning liquid. When the temperature of the cleaning liquid in the cleaning tank is too high, as the cooling liquid continues to flow in the cooling pipe, the excess heat in the cleaning liquid will also be continuously taken away, thereby cooling the cleaning liquid. It can be seen that the cooling pipe can cool the cleaning liquid in the cleaning tank by directly contacting the cleaning liquid, achieving good cooling efficiency, improving the quality of the silicon wafer while ensuring the cleaning effect, and effectively avoiding the abnormal quality of the silicon wafer caused by the high temperature in the cleaning tank.

[0099] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A silicon wafer cleaning device, characterized in that: include: A cleaning tank containing a cleaning liquid; A heating tube disposed in the cleaning tank, the heating tube being used to heat the cleaning liquid; The cooling device comprises a cooling pipe arranged in the cleaning tank, the cooling pipe has a hollow cavity, a cooling liquid flows in the hollow cavity, and the temperature of the cooling liquid is lower than the temperature of the cleaning liquid.

2. The silicon wafer cleaning equipment according to claim 1, characterized in that: The cooling device further comprises a liquid inlet pipe and a liquid discharge pipe, wherein the cooling pipe has a liquid inlet and a liquid discharge port, one end of the liquid inlet pipe is connected to the liquid inlet, and one end of the liquid discharge pipe is connected to the liquid discharge port.

3. The silicon wafer cleaning equipment according to claim 1, characterized in that: The cooling pipe is located at the bottom of the cleaning tank, and / or the cooling pipe is close to the side wall of the cleaning tank.

4. The silicon wafer cleaning equipment according to claim 2, characterized in that: The cleaning tank includes at least three side walls connected end to end; any of the side walls is provided with two first openings penetrating the side wall along the thickness direction of the side wall, the liquid inlet pipe is connected to the liquid inlet through one of the first openings, and the liquid discharge pipe is connected to the liquid discharge through the other first opening.

5. The silicon wafer cleaning equipment according to claim 1, characterized in that: The projection of the cooling tube on the bottom of the cleaning tank at least partially overlaps with the projection of the heating tube on the bottom of the cleaning tank, or the projection of the cooling tube on the bottom of the cleaning tank does not overlap with the projection of the heating tube on the bottom of the cleaning tank.

6. The silicon wafer cleaning equipment according to claim 2, characterized in that: A flow control valve is installed at the liquid inlet pipe or the liquid inlet, and the flow control valve is used to adjust the flow of the coolant flowing into the cooling pipe.

7. The silicon wafer cleaning equipment according to claim 1, characterized in that: The flow rate of the cooling liquid is in the range of 0 to 5 L / min.

8. The silicon wafer cleaning equipment according to claim 1, characterized in that: A temperature detection element is also provided in the cleaning tank, and the temperature detection element is used to detect the temperature of the cleaning liquid.

9. The silicon wafer cleaning equipment according to claim 2, characterized in that: The silicon wafer cleaning equipment further comprises a liquid storage tank, and one end of the liquid discharge pipe away from the liquid discharge port is connected to the liquid storage tank.

10. A silicon wafer processing system, characterized in that: The silicon wafer processing system comprises the silicon wafer cleaning equipment according to any one of claims 1 to 9.

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