Ultrasonic cleaning machine

Abstract

The utility model discloses an ultrasonic cleaning machine, and aims to provide an ultrasonic cleaning machine which is efficient in cleaning, safe, environment-friendly and high in automation degree. The ultrasonic cleaning device comprises a cleaning assembly, the cleaning assembly comprises a cleaning tank and an ultrasonic generator, an ultrasonic vibration plate is arranged at the bottom and / or on the inner wall of the cleaning tank and connected with the ultrasonic generator, and a crystal support conveying line is arranged on the cleaning tank. The crystal support cleaning device is applied to the technical field of crystal support cleaning.

Description

Technical Field

[0001] The utility model relates to crystal tray cleaning, in particular to an ultrasonic cleaning machine. Background Art

[0002] Before slicing the silicon wafer, it is necessary to bond the silicon wafer to the wafer tray for wafer bonding pretreatment, and an epoxy resin plate is bonded between the wafer tray and the silicon wafer for wafer bonding. After the cutting process is completed, the metal wafer tray needs to be cleaned. The existing technology cleans the metal wafer tray manually, including high-temperature mechanical cleaning, chemical cleaning, high-pressure water jet cleaning and laser cleaning. However, the above cleaning methods have the problems of slow cleaning efficiency, high cleaning cost, poor cleaning effect and insufficient environmental protection. Therefore, it is currently necessary to develop an ultrasonic cleaning machine with high efficiency, safety, environmental protection and high degree of automation. Utility Model Content

[0003] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an ultrasonic cleaning machine with high cleaning efficiency, safety, environmental protection and high automation.

[0004] The technical solution adopted by the utility model is: the utility model includes a cleaning component, the cleaning component includes a cleaning tank and an ultrasonic generator, an ultrasonic vibration plate is arranged on the bottom and / or inner wall of the cleaning tank, the ultrasonic vibration plate is connected to the ultrasonic generator, and a crystal support transport line is arranged on the cleaning tank.

[0005] Furthermore, the number of the cleaning components is two, and the side end of one of the cleaning components is connected to the side end of another cleaning component.

[0006] Furthermore, each cleaning component has two ultrasonic vibration plates, one of which is located between the bottom of the cleaning tank and the crystal tray transport line, and the other is located on the inner wall of the cleaning tank and at the initial end of the crystal tray transport line.

[0007] Furthermore, the crystal tray transport line includes a moving chain assembly and a driving motor, and the driving motor is driven by the moving chain assembly through a transmission belt.

[0008] Furthermore, the moving chain assembly includes two opposite conveying chains, and the ultrasonic vibration plate is located between the two conveying chains.

[0009] Furthermore, an in-place sensing mechanism is provided on the inner wall of the cleaning tank, and the in-place sensing mechanism is located at the initial end of the crystal tray transport line.

[0010] Furthermore, the in-position sensing mechanism includes a first mounting seat, on which a first sensor and a first telescopic component are provided, one end of the first telescopic component is connected to a position block, the position block is located at the initial end of the crystal support transport line, and the other end of the first telescopic component is connected to a first sensing sheet, which corresponds to the first sensor.

[0011] Furthermore, a material presence sensing mechanism is provided on the inner wall of the cleaning tank, and the material presence sensing mechanism is located at the end of the crystal tray transport line.

[0012] Furthermore, the material sensing mechanism includes a second mounting seat, on which a second sensor and a second telescopic component are provided, one end of the second telescopic component is connected to a sensing block, the sensing block is located at the end of the crystal support transport line, and the other end of the second telescopic component is connected to a second sensing sheet, and the second sensing sheet corresponds to the second sensor.

[0013] Furthermore, the ultrasonic cleaning machine also includes a machine platform, a cavity is arranged in the machine platform, a partition is arranged in the middle of the cavity, the cavity is divided into two cleaning tanks by the partition, and the ultrasonic generator is located on the machine platform and below the cleaning component.

[0014] The beneficial effects of the utility model are:

[0015] Compared with the shortcomings of the prior art, the utility model can improve the cleaning effect of the metal crystal support without using any chemical reagents. It is suitable for the field of large-scale photovoltaic intelligent automation production, can avoid the situation of empty crystal bonding, can effectively ensure the effect of crystal bonding, and thus reduce the risk of slicing and stick falling, and improve the production capacity and yield of single crystal silicon wafer products, so that the utility model has the advantages of efficient cleaning, safety, environmental protection and high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0018] Figure 2 It is a schematic diagram of the plane structure of the utility model;

[0019] Figure 3 yes Figure 1A partial enlarged schematic diagram of part A;

[0020] Figure 4 yes Figure 1 A partial enlarged schematic diagram of part B.

[0021] The reference numerals are as follows:

[0022] 1. Cleaning component; 2. Cleaning tank; 5. Ultrasonic vibration plate; 6. Crystal tray transport line; 7. Moving chain component; 8. Driving motor; 9. Transmission belt; 10. In-position sensing mechanism; 11. First mounting seat; 12. First sensor; 13. First telescopic component; 15. In-position block; 16. First sensor sheet; 17. Material sensing mechanism; 18. Second mounting seat; 20. Second telescopic component; 21. Sensor block; 23. Machine table; 25. Partition.

[0023] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] It should be noted that all directional indications in the embodiments of the present invention, such as up, down, left, right, front, back, clockwise, counterclockwise, etc., are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0026] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0027] like Figure 1 to Figure 2As shown, in this embodiment, the utility model includes a cleaning component 1, the cleaning component 1 includes a cleaning tank 2 and an ultrasonic generator, an ultrasonic vibration plate 5 is arranged on the bottom and / or inner wall of the cleaning tank 2, the ultrasonic vibration plate 5 is connected to the ultrasonic generator, and a crystal tray conveying line 6 is arranged on the cleaning tank 2. Among them, the ultrasonic generator can generate high-frequency ultrasonic waves, usually in the frequency range of 20kHz to 400kHz, and these high-frequency ultrasonic waves are transmitted to the cleaning tank 2 filled with cleaning liquid through the ultrasonic vibration plate 5; when the ultrasonic waves are transmitted to the cleaning liquid, a series of pressure waves are generated. In the liquid, these pressure waves will form tiny bubbles, and these tiny bubbles are constantly formed and broken in the cleaning liquid, forming a process called "cavitation" phenomenon; when these bubbles break, the shock waves and liquid flows generated will produce a high-intensity cleaning effect on the surface of the object, and these shock waves and liquid flows have a cleaning effect on the residual glue and silicon powder on the surface of the crystal tray attached to the surface of the object, and can effectively clean them.

[0028] Compared with the deficiencies of the prior art, in the present invention, during cleaning, the crystal tray is transported to the cleaning tank 2 and is located on the crystal tray transport line 6, and is connected to the ultrasonic generator through the ultrasonic vibration plate 5, so that the ultrasonic vibration plate 5 generates tiny bubbles through ultrasonic vibration to impact and peel off the surface of the crystal tray (metal Cr) at high speed, which can quickly remove industrial residual glue and silicon powder, greatly improving the cleaning efficiency; moreover, since ultrasonic cleaning adopts a physical cleaning method, no chemical substances are required, which is harmless to the environment and human body, and can also avoid scratches and damages that may be caused by mechanical cleaning methods; in addition, compared with traditional cleaning methods, ultrasonic cleaning technology has lower energy consumption, reduces energy consumption and environmental pollution, therefore, the present invention can improve the cleaning effect of the metal crystal tray, and does not use any chemical reagents, is suitable for the field of large-scale photovoltaic intelligent automation production, can avoid the situation of empty glue in crystal bonding, can effectively ensure the effect of crystal bonding, thereby reducing the risk of slicing and stick falling, and improving the production capacity and yield of single crystal silicon wafer products, so that the present invention has the advantages of efficient cleaning, safety, environmental protection and high degree of automation.

[0029] In some embodiments, the number of the cleaning components 1 is two, and the side end of one of the cleaning components 1 is connected to the side end of another cleaning component 1. Specifically, by setting the two cleaning components 1, one of the cleaning components 1 first performs a cleaning stage on the crystal tray, and then the other cleaning component 1 performs a rinsing stage on the crystal tray. Therefore, by cleaning the crystal tray twice, the cleaning effect of the metal crystal tray can be improved.

[0030] In some embodiments, the number of the ultrasonic vibration plates 5 of each cleaning assembly 1 is two, one of the ultrasonic vibration plates 5 is located between the bottom of the cleaning tank 2 and the wafer tray transport line 6, and the other ultrasonic vibration plate 5 is located on the inner wall of the cleaning tank 2 and at the initial end of the wafer tray transport line 6. Specifically, by cleaning the wafer trays on the wafer tray transport line 6 with two ultrasonic vibration plates 5, a better cleaning effect can be ensured for the metal wafer trays.

[0031] In some embodiments, the crystal tray transport line 6 includes a moving chain assembly 7 and a driving motor 8, and the driving motor 8 is driven by the moving chain assembly 7 through a driving belt 9; the moving chain assembly 7 includes two opposite conveying chains, and the ultrasonic vibration plate 5 is located between the two conveying chains. Specifically, the crystal tray is placed on the two conveying chains, and the conveying chains are driven by the driving motor 8 to realize the transportation of the crystal tray. In this process, the ultrasonic vibration plate 5 located between the two conveying chains can well perform ultrasonic cleaning on the crystal tray.

[0032] like Figure 3 As shown, in some embodiments, an in-position sensing mechanism 10 is provided on the inner wall of the cleaning tank 2, and the in-position sensing mechanism 10 is located at the initial end of the crystal tray transport line 6; the in-position sensing mechanism 10 includes a first mounting seat 11, and a first sensor 12 and a first telescopic component 13 are provided on the first mounting seat 11, and one end of the first telescopic component 13 is connected to an in-position block 15, and the in-position block 15 is located at the initial end of the crystal tray transport line 6, and the other end of the first telescopic component 13 is connected to a first sensing sheet 16, and the first sensing sheet 16 corresponds to the first sensor 12. Specifically, when the crystal tray is placed at the initial end of the crystal tray transport line 6, the crystal tray contacts the in-position block 15, causing the first telescopic component 13 to be compressed, so that the first sensing sheet 16 is sensed by the first sensor 12 when the first telescopic component 13 is compressed, thereby detecting that the crystal tray is in position.

[0033] like Figure 4As shown, in some embodiments, a material sensing mechanism 17 is provided on the inner wall of the cleaning tank 2, and the material sensing mechanism 17 is located at the end of the crystal tray transport line 6; the material sensing mechanism 17 includes a second mounting seat 18, and a second sensor and a second telescopic component 20 are provided on the second mounting seat 18, and one end of the second telescopic component 20 is connected to a sensing block 21, and the sensing block 21 is located at the end of the crystal tray transport line 6, and the other end of the second telescopic component 20 is connected to a second sensing sheet, and the second sensing sheet corresponds to the second sensor. Specifically, when the crystal tray is transported to the end of the crystal tray transport line 6, the crystal tray contacts the sensing block 21, causing the second telescopic component 20 to be compressed, so that the second sensing sheet is sensed by the second sensor when the second telescopic component 20 is compressed, thereby detecting that the crystal tray is in place.

[0034] In some embodiments, the ultrasonic cleaning machine also includes a machine table 23, a cavity is provided in the machine table 23, a partition 25 is provided in the middle of the cavity, the cavity is divided into two cleaning tanks 2 by the partition 25, and the ultrasonic generator is located on the machine table 23 and below the cleaning component 1.

[0035] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An ultrasonic cleaning machine, characterized in that: It comprises a cleaning component (1), the cleaning component (1) comprises a cleaning tank (2) and an ultrasonic generator, an ultrasonic vibration plate (5) is arranged on the bottom and / or inner wall of the cleaning tank (2), the ultrasonic vibration plate (5) is connected to the ultrasonic generator, and a crystal support transport line (6) is arranged on the cleaning tank (2).

2. An ultrasonic cleaning machine according to claim 1, characterized in that: The number of the cleaning components (1) is two, and the side end of one of the cleaning components (1) is connected to the side end of another of the cleaning components (1).

3. An ultrasonic cleaning machine according to claim 2, characterized in that: Each cleaning component (1) has two ultrasonic vibration plates (5), one of which is located between the bottom of the cleaning tank (2) and the crystal tray transport line (6), and the other ultrasonic vibration plate (5) is located on the inner wall of the cleaning tank (2) and at the initial end of the crystal tray transport line (6).

4. An ultrasonic cleaning machine according to claim 1, characterized in that: The crystal tray transport line (6) comprises a moving chain assembly (7) and a driving motor (8), and the driving motor (8) is driven by the moving chain assembly (7) via a transmission belt (9).

5. An ultrasonic cleaning machine according to claim 4, characterized in that: The moving chain assembly (7) comprises two opposite conveying chains, and the ultrasonic vibration plate (5) is located between the two conveying chains.

6. The ultrasonic cleaning machine according to claim 1, characterized in that: An in-place sensing mechanism (10) is provided on the inner wall of the cleaning tank (2), and the in-place sensing mechanism (10) is located at the initial end of the crystal tray transport line (6).

7. An ultrasonic cleaning machine according to claim 6, characterized in that: The in-position sensing mechanism (10) comprises a first mounting seat (11), on which a first sensor (12) and a first telescopic component (13) are arranged, one end of the first telescopic component (13) is connected to an in-position block (15), the in-position block (15) is located at the initial end of the crystal support transport line (6), and the other end of the first telescopic component (13) is connected to a first sensing sheet (16), and the first sensing sheet (16) corresponds to the first sensor (12).

8. The ultrasonic cleaning machine according to claim 1, characterized in that: A material presence sensing mechanism (17) is provided on the inner wall of the cleaning tank (2), and the material presence sensing mechanism (17) is located at the end of the crystal tray transport line (6).

9. An ultrasonic cleaning machine according to claim 8, characterized in that: The material presence sensing mechanism (17) comprises a second mounting seat (18), on which a second sensor and a second telescopic assembly (20) are arranged, one end of the second telescopic assembly (20) is connected to a sensing block (21), the sensing block (21) is located at the end of the crystal support transport line (6), and the other end of the second telescopic assembly (20) is connected to a second sensing sheet, and the second sensing sheet corresponds to the second sensor.

10. The ultrasonic cleaning machine according to claim 2, characterized in that: The ultrasonic cleaning machine further comprises a machine platform (23), a cavity is arranged in the machine platform (23), a partition (25) is arranged in the middle of the cavity, the cavity is divided into two cleaning tanks (2) by the partition (25), and the ultrasonic generator is located on the machine platform (23) and below the cleaning component (1).

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