Test bench for semiconductor wafer detection

Abstract

The utility model relates to the field of semiconductor production testing, and discloses a testing seat for semiconductor wafer detection, which comprises a limiting table for limiting and placing a semiconductor wafer to be detected, and a fixed limiting structure for limiting two adjacent side edges of the semiconductor wafer is arranged on the limiting table. A movable limiting mechanism for elastically limiting the other two side edges of the semiconductor wafer is arranged on the outer side of the limiting table, an adsorption detection structure for adsorbing the semiconductor wafer and detecting the flatness is arranged on the limiting table, and a positioning detection mechanism for detecting the movable limiting position of the movable limiting mechanism is arranged on the limiting table. The limiting and fixing position accuracy of the semiconductor wafer is judged by detecting the movement limiting position of the movable limiting mechanism, and the situation that the accuracy of a test result is affected and a test circuit board is damaged due to inaccurate chip positioning and limiting is avoided.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor production testing, in particular to a test seat for semiconductor wafer detection. Background Art

[0002] In the manufacturing process of integrated circuits, each produced wafer is cut into small pieces, called dies (semiconductor chips). Each die (semiconductor chip) is an independent electronic component with its own circuits and functions.

[0003] Existing finished chips are all packaged through a single or several dies (semiconductor chips). In order to ensure the quality and performance of the chips, batches of dies (semiconductor chips) cut from round wafers need to be tested to detect and eliminate possible defects or faults. In the batch testing process, automated or semi-automated testing equipment is usually used. The testing equipment is equipped with a test socket that automatically positions and limits semiconductor chips. When the test seat is limiting, generally after the semiconductor wafer is placed on the test seat by the robot, the test seat adsorbs the semiconductor wafer and accurately limits it through a limiting mechanism on one or more sides. After the limiting positioning is completed, the test circuit board with the test needle is moved to the corresponding position and pressed down, and the test needle is pressed into the test position on the limited semiconductor wafer for conduction and testing. Since the semiconductor wafer is very small, the test needle is also very small. When there is a slight difference in the fixed position of the semiconductor wafer, accurate measurement cannot be completed; when the test side of the semiconductor wafer is placed on the upper edge of the external limiting structure of the test position, and the adsorption mechanism on the test seat cannot determine the negative pressure abnormality due to the small gap, the normally operating test circuit board is pressed down, and the extremely tiny needles on the test circuit board will be damaged by one or more conditions such as bending and breaking, thereby damaging the more valuable test circuit board. Utility Model Content

[0004] The utility model provides a test seat for semiconductor wafer detection, which solves the technical problem that the test result accuracy is affected and the test circuit board is damaged when the test seat of automated or semi-automated detection equipment cannot accurately limit and position the semiconductor wafer.

[0005] The technical solution adopted by the utility model to solve its technical problems is: a test seat for semiconductor wafer detection, including a limit table for limiting the placement of the semiconductor wafer to be detected, the limit table is provided with a fixed limit structure for limiting the two adjacent sides of the semiconductor wafer, the outer side of the limit table is provided with a movable limit mechanism for elastically limiting the other two sides of the semiconductor wafer, the limit table is provided with an adsorption detection structure for adsorbing the semiconductor wafer and detecting the flatness, and the limit table is provided with a positioning detection mechanism for detecting the moving limit position of the movable limit mechanism. By detecting the moving limit position of the movable limit mechanism, the accuracy of the limit fixed position of the semiconductor wafer is judged to avoid the situation where the chip positioning limit is inaccurate, affecting the accuracy of the test result and damaging the test circuit board.

[0006] Furthermore, the upper surface of the limiting platform is horizontally arranged and the adjacent two sides of the limiting platform are arranged horizontally and vertically. The fixed limiting structure is detachably fixedly arranged on the limiting platform and the upper end is higher than the upper surface of the limiting platform. The fixed limiting structure is used to limit the side wall of the side of the semiconductor wafer to be perpendicular to the horizontal limiting surface of the upper surface of the limiting platform. The fixed limiting structure is detachably arranged, which is convenient for regular cleaning of the position of the semiconductor wafer on the upper surface of the limiting platform, reducing the difficulty of maintenance and improving the efficiency of maintenance.

[0007] Furthermore, at least three non-linear limiting columns are vertically arranged on the limiting sink, and limiting holes corresponding to the limiting columns are arranged on the fixed limiting structure, and the upper end of the limiting column is a smooth arc-shaped guide surface. The accuracy of the fixed limiting structure when it is fixed horizontally is ensured, and the horizontal limiting direction and vertical angle of the two limiting side walls of the fixed limiting structure are prevented from shifting during long-term use, thereby ensuring the accuracy of semiconductor wafer detection.

[0008] Furthermore, the movable limiting mechanism includes a vertical driving mechanism, a moving base block, a first slider, a first connecting block, a first limiting block, a second slider, a second connecting block, a second limiting block and two limiting seats, the moving base block is fixed on the vertical driving mechanism and is driven by the vertical driving mechanism to move up and down, the moving base block is horizontally penetrated by a first sliding limiting cavity and a second sliding limiting cavity which are perpendicular to each other, the first sliding limiting cavity is located below the second sliding limiting cavity, one end of the first sliding block is horizontally slidably arranged in the first sliding limiting cavity and is limited to horizontal movement by the first sliding limiting cavity, one end of the second sliding block is horizontally slidably arranged in the second sliding limiting cavity and is limited to horizontal movement by the second sliding limiting cavity The first and second limit blocks are configured to move in a direction, the first connecting block is vertically arranged at one end of the first sliding block located outside the first sliding limit cavity, the first connecting block is provided with a first clamping groove at the upper end, the first limiting block is horizontally arranged in the first clamping groove, the first connecting block is provided with a first bolt structure for adjusting the tightness of the first clamping groove, the second connecting block is vertically arranged at one end of the second sliding block located outside the second sliding limit cavity, the second connecting block is provided with a second clamping groove at the upper end, the second limiting block is horizontally arranged in the second clamping groove, the second connecting block is provided with a second bolt structure for adjusting the tightness of the second clamping groove, the two limiting seats are respectively arranged on the first sliding block and on the side of the second sliding block away from the moving base block, and the upper ends of the two limiting seats are provided with bosses. The upper ends of the two bosses are provided with a connected smooth guide surface and an inclined surface on one side away from the moving base block, the first slider is provided with a first bracket, the first bracket is provided with a first roller that can roll on the side of the corresponding boss away from the moving base block and on the smooth guide surface and the inclined surface, the second slider is provided with a second bracket, the second bracket is provided with a second roller that can roll on the side of the corresponding boss away from the moving base block and on the smooth guide surface and the inclined surface, the first sliding limit cavity is provided with a first tension spring connected to the end of the first slider, the first tension spring is in a stretched state when the first roller rolls on the side of the corresponding boss away from the moving base block and on the smooth guide surface and the inclined surface, and the second sliding limit cavity is provided with a The cam is an angularly-spaced unit that is configured to move the first and second wheels horizontally and to move the second wheel back and forth relative to the moving base block when the cam is in a state of rotation and to move the first and second wheels horizontally relative to the moving base block when the cam is in a state of rotation.The first limit block and the second limit block independently and elastically contact the adjacent two sides of the semiconductor wafer, and the limited range can be adjusted by adjusting the horizontal positions of the first limit block and the second limit block in the first clamping groove and the second clamping groove to adapt to the fixed limit detection of semiconductor wafers of different specifications.

[0009] Furthermore, the first clamping groove is provided with a relatively protruding first clamping tooth, the first limiting block is provided with a first fixing groove corresponding to and matching the first clamping tooth, the second clamping groove is provided with a relatively protruding second clamping tooth, and the second limiting block is provided with a second fixing groove corresponding to and matching the second clamping tooth. The first limiting block and the second limiting block are clamped and limited more stably, and are not prone to vertical rotation deviation, thereby reducing the influence of the inclination of the resistance surface caused by the vertical rotation deviation on the limitation of the semiconductor wafer.

[0010] Furthermore, the upper end surfaces of the first connection block, the first limiting block, the second connection block and the second limiting block are flush. When the first limiting block and the second limiting block are offset, it can be easily observed visually, which is convenient for timely maintenance and adjustment.

[0011] Furthermore, the adsorption detection structure includes a plurality of detection holes arranged on the upper end surface of the limit platform and a conduction block arranged on the lower end surface of the limit platform, the lower end surface of the limit platform is provided with a docking cavity, the plurality of detection holes vertically penetrate and extend to the docking cavity, the conduction block is provided with an air guide hole inside, the upper end of the conduction block is provided with a docking joint sealed with the docking cavity, the docking joint is provided with a connecting hole connecting the air guide hole and the docking cavity, one side of the conduction block is provided with an external connection hole connected with the air guide hole, the external connection hole is connected with a negative pressure mechanism and a negative pressure detection mechanism, and the upper end of the detection hole close to the semiconductor wafer test side among the plurality of detection holes is provided with an adsorption sink. Providing an adsorption sink at the upper end of the detection hole close to the semiconductor wafer test side makes the adsorption of the detection part more stable, and also improves the flatness detection sensitivity of the semiconductor wafer test side.

[0012] Furthermore, the positioning detection mechanism includes two displacement sensors, and mounting grooves are provided on the outer side wall of the limiting platform at positions corresponding to the first movable limiting groove and the second movable limiting groove, and the two displacement sensors are respectively provided in the two mounting grooves, and the two mounting grooves are provided with first displacement detection holes and second displacement detection holes corresponding to the first limiting block and the second limiting block in the horizontal direction and connecting the first movable limiting groove and the second movable limiting groove. The position where the semiconductor wafer is fixed can be known by the positions of the first limiting block and the second limiting block after the semiconductor wafer is positioned and limited, which greatly reduces the situation of inaccurate testing and damage to the detection needle plate of the test equipment when the semiconductor wafer overlaps. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a main schematic diagram of the utility model;

[0014] Figure 2 It is a main view schematic diagram of the limit;

[0015] Figure 3 It is a schematic diagram of the main view of the movable limiting mechanism;

[0016] Figure 4 The main view of the movable limit mechanism after removing the vertical driving mechanism part

[0017] Figure 5 It is a schematic diagram of the main view of the limit platform, the conductive block, the first slider, the second limit block and the displacement sensor;

[0018] Figure 6 It is a schematic diagram of the upper rear portion of the limit table, the conduction block, the first slider, the second limit block and the displacement sensor;

[0019] The markings in the figure are: a limit table 100, a limit sink 101, a limit column 102, a first movable limit groove 103, a second movable limit groove 104, a first displacement detection hole 105, a second displacement detection hole 106, a fixed limit structure 200, a limit hole 201, a movable limit mechanism 300, a vertical direction driving mechanism 310, a movable base block 320, a first sliding limit cavity 321, a second sliding limit cavity 322, a first slider 330, and a first bracket 33 1. The first roller 332, the first connecting block 340, the first clamping groove 341, the first limit block 350, the second slider 360, the second bracket 361, the second roller 362, the second connecting block 370, the second clamping groove 371, the second limit block 380, the limit seat 390, the boss 391, the adsorption detection structure 400, the detection hole 410, the adsorption sink 411, the conduction block 420, the external hole 421, the positioning detection mechanism 500, and the displacement sensor 510. DETAILED DESCRIPTION

[0020] The utility model is further described below in conjunction with the accompanying drawings and specific implementation methods.

[0021] like Figure 1A test seat for semiconductor wafer detection shown in the figure includes a limit platform 100 for limiting the position of the semiconductor wafer to be detected, the limit platform 100 is provided with a fixed limit structure 200 for limiting two adjacent side edges of the semiconductor wafer, the outer side of the limit platform 100 is provided with a movable limit mechanism 300 for elastically limiting the other two side edges of the semiconductor wafer respectively, the limit platform 100 is provided with an adsorption detection structure 400 for adsorbing the semiconductor wafer and detecting the flatness, and the limit platform 100 is provided with a positioning detection mechanism 500 for detecting the movable limit position of the movable limit mechanism 300. In the specific implementation, the transplantation mechanism of the detection equipment transplants the semiconductor wafer to the preset position range on the limit table 100, the movable limit mechanism 300 elastically presses the two adjacent edges of the semiconductor wafer to the edges on the opposite side and is blocked by the fixed limit structure 200, the adsorption detection structure 400 adsorbs the semiconductor wafer to prevent it from detaching and detects the flatness of the semiconductor wafer in this process, and issues an alarm and stops the next operation when the flatness does not meet the standard, the positioning detection mechanism 500 detects the limit movement stop position of the movable limit mechanism 300 after the movable limit mechanism 300 completes the positioning, and combines it with the fixed position of the fixed limit structure 200 to determine whether the length and width of the limit after the semiconductor wafer is fixed and fixed meets the preset value. After the semiconductor wafer is horizontally placed, its four horizontal edges are positioned and fixed and the flatness is detected, and the accuracy of the limit fixing position of the semiconductor wafer is determined by detecting the movable limit position of the movable limit mechanism, so as to avoid the situation where the chip positioning limit is inaccurate, affecting the accuracy of the test results and damaging the test circuit board.

[0022] On the basis of the above, if Figure 1 and Figure 2 As shown, the upper surface of the limiting platform 100 is horizontally arranged and the limiting sinks 101 are arranged on the adjacent two sides of the horizontal and vertical directions. The fixed limiting structure 200 is detachably fixedly arranged on the limiting sink 101 and the upper end is higher than the upper surface of the limiting platform 100. The fixed limiting structure 200 is used to limit the side wall of the side of the semiconductor chip perpendicular to the horizontal limiting surface of the upper surface of the limiting platform 100. In this specific embodiment, the fixed limiting structure 200 is a fixed plate fixed to the limiting sink 101 by a bolt structure. In the specific implementation, the fixed limiting structure 200 can also be designed as two plates with straight edges corresponding to the two adjacent edges of the limiting semiconductor chip. The fixed limiting structure 200 is detachably arranged, which is convenient for regular cleaning of the position of the semiconductor chip limited on the upper surface of the limiting platform 100, reducing the difficulty of maintenance and improving the efficiency of maintenance.

[0023] On the basis of the above, if Figure 1 and Figure 2As shown, at least three non-linear limiting columns 102 are vertically arranged on the limiting sink 101, and the limiting holes 201 corresponding to the limiting columns 102 are arranged on the fixed limiting structure 200, and the upper ends of the limiting columns 102 are smooth arc-shaped guide surfaces. In this specific embodiment, three limiting columns 102 are arranged in a triangle. The accuracy of the fixed limiting structure 200 when it is fixed horizontally is ensured, and the horizontal limiting direction and vertical angle of the two limiting side walls of the fixed limiting structure 200 are prevented from shifting during long-term use, thereby ensuring the accuracy of semiconductor wafer detection.

[0024] On the basis of the above, if Figures 1 to 4As shown, the movable limiting mechanism 300 includes a vertical direction driving mechanism 310, a moving base block 320, a first slider 330, a first connecting block 340, a first limiting block 350, a second slider 360, a second connecting block 370, a second limiting block 380 and two limiting seats 390. The moving base block 320 is fixed on the vertical direction driving mechanism 310 and is driven by the vertical direction driving mechanism 310 to move up and down. A first sliding limiting cavity 321 and a second sliding limiting cavity 322 perpendicular to each other are horizontally penetrated in the moving base block 320. The first sliding limiting cavity 321 is located below the second sliding limiting cavity 322. One end of the first sliding slider 330 is horizontally slidably arranged in the first sliding limiting cavity 321 and is moved by the first sliding The limiting cavity 321 limits horizontal movement, one end of the second sliding slider 360 is horizontally slidably set in the second sliding limiting cavity 322 and is limited by the second sliding limiting cavity 322 to move in the horizontal direction, the first connecting block 340 is vertically set at one end of the first sliding slider 330 located outside the first sliding limiting cavity 321, the first connecting block 340 is provided with a first clamping groove 341 at the upper end, the first limiting block 350 is horizontally set in the first clamping groove 341, the first connecting block 340 is provided with a first bolt structure for adjusting the tightness of the first clamping groove 341, the second connecting block 370 is vertically set at one end of the second sliding slider 360 located outside the second sliding limiting cavity 322, and the second connecting block 370 is provided with a second clamping groove 371 at the upper end The second limit block 380 is horizontally arranged in the second clamping groove 371, and the second connecting block 370 is provided with a second bolt structure for adjusting the tightness of the second clamping groove 371. The two limit seats 390 are respectively arranged on the first slider 330 and on the side of the second slider 360 away from the moving base block 320. The upper ends of the two limit seats 390 are provided with bosses 391, and the upper ends of the two bosses 391 are provided with connected smooth guide surfaces and inclined surfaces on the side away from the moving base block 320. The first slider 330 is provided with a first bracket 331, and the first bracket 331 is provided with a first roller 332 that can roll on the side of the corresponding boss 391 away from the moving base block 320 and on the smooth guide surface and the inclined surface. The second slider A second bracket 361 is provided on 360, and a second roller 362 is provided on the second bracket 361, which can roll on the side of the corresponding boss 391 away from the moving base block 320 and the smooth guide surface and the inclined surface. A first tension spring connected to the end of the first slider 330 is provided in the first sliding limit cavity 321. When the first roller 332 rolls on the side of the corresponding boss 391 away from the moving base block 320 and the smooth guide surface and the inclined surface, the first tension spring is in a stretched state. A second tension spring connected to the end of the second slider 360 is provided in the second sliding limit cavity 322. When the second roller 362 rolls on the side of the corresponding boss 391 away from the moving base block 320 and the smooth guide surface and the inclined surface, the second tension spring is in a stretched state.The limiting platform 100 is provided with a first moving limiting groove 103 and a second moving limiting groove 104 for horizontal movement of the first limiting block 350 and the second limiting block 380, respectively. The upper end surfaces of the first limiting block 350 and the second limiting block 380 are higher than the upper end surface of the limiting platform 100. When the vertical direction driving mechanism 310 drives the moving base block 320 to move downward to the preset position, the first roller 332 and the second roller 362 are located at the lower end vertical surface of the corresponding boss 391 away from the moving base block 320. When the vertical direction driving mechanism 310 drives the moving base block 320 to move upward to the preset position, the distance between the first roller 332 and the second roller 362 and the moving base block 320 is greater than the distance between the corresponding boss 391 and the moving base block 320.

[0025] In this specific embodiment, the vertical driving mechanism 310 is a linear motor; when the vertical driving mechanism 310 drives the movable base block 320 to move downward, the first roller 332 is transferred from the upper side of the corresponding boss 391, the smooth guide surface and the inclined surface to the lower end vertical surface away from the movable base block 320 in sequence. During this process, the first bracket 331 drives the first slider 330 to move toward the side away from the movable base block 320, that is, drives the first limit block 350 away from the semiconductor wafer on the limit table 100; the second roller 362 is transferred from the upper side of the corresponding boss 391, the smooth guide surface and the inclined surface to the lower end vertical surface away from the movable base block 320 in sequence. During this process, the second bracket 361 drives the second slider 360 to move toward the side away from the movable base block 320, that is, drives the second limit block 380 away from the semiconductor wafer on the limit table 100; that is, during this process, the movable limit mechanism 300 releases the elastic resistance limit to the semiconductor wafer;

[0026] When the vertical driving mechanism 310 drives the movable base block 320 to move upward, the first roller 332 rolls and transfers from the lower end vertical surface, inclined surface and smooth guide surface of the corresponding boss 391 away from the movable base block 320 to the upper side of the corresponding boss 391 in sequence. During this process, the first bracket 331 drives the first slider 330 to move toward the side close to the movable base block 320, that is, drives the first limit block 350 to approach the semiconductor wafer on the limit platform 100; the second roller 362 rolls and transfers from the lower end vertical surface, inclined surface and smooth guide surface of the corresponding boss 391 away from the movable base block 320 in sequence to the upper side of the corresponding boss 391. During this process, the second bracket 361 drives the second slider 360 to move toward the side close to the movable base block 320, that is, drives the second limit block 380 to approach the semiconductor wafer on the limit platform 100; that is, in this process, the movable limit mechanism 300 completes the elastic resistance limit of the semiconductor wafer;

[0027] The first limit block 350 and the second limit block 380 independently and elastically contact and limit the two adjacent sides of the semiconductor chip, and the limited range can be adjusted by adjusting the horizontal positions of the first limit block 350 and the second limit block 380 in the first clamping groove 341 and the second clamping groove 371 to adapt to the fixed limit detection of semiconductor chips of different specifications.

[0028] On the basis of the above, if Figure 1 , Figure 3 and Figure 4 As shown, the first clamping groove 341 is provided with a relatively protruding first clamping tooth, the first limiting block 350 is provided with a first fixing groove corresponding to the first clamping tooth, the second clamping groove 371 is provided with a relatively protruding second clamping tooth, and the second limiting block 380 is provided with a second fixing groove corresponding to the second clamping tooth. In a specific implementation, the first limiting block 350 and the second limiting block 380 are clamped and limited more stably, and are not prone to vertical rotation deviation, thereby reducing the influence of the inclination of the resistance surface caused by the vertical rotation deviation on the semiconductor wafer limitation.

[0029] On the basis of the above, if Figure 1 , Figure 3 and Figure 4 As shown, the upper end surfaces of the first connection block 340, the first limiting block 350, the second connection block 370 and the second limiting block 380 are flush. In a specific implementation, when the first limiting block 350 and the second limiting block 380 are offset, it can be simply observed visually, which is convenient for timely maintenance and adjustment.

[0030] On the basis of the above, if Figure 1 , Figure 5 and Figure 6 As shown, the adsorption detection structure 400 includes a plurality of detection holes 410 arranged on the upper end surface of the limit platform 100 and a conduction block 420 arranged on the lower end surface of the limit platform 100, the lower end surface of the limit platform 100 is provided with a docking cavity, the plurality of detection holes 410 vertically penetrate and extend to the docking cavity, an air guide hole is arranged inside the conduction block 420, a docking joint sealedly connected to the docking cavity is arranged at the upper end of the conduction block 420, a connecting hole connecting the air guide hole and the docking cavity is arranged in the docking joint, an external connection hole 421 connected to the air guide hole is arranged on one side of the conduction block 420, the external connection hole is connected with a negative pressure mechanism and a negative pressure detection mechanism, and an adsorption sink 411 is arranged at the upper end of the detection hole 410 close to the semiconductor wafer test side among the plurality of detection holes 410.

[0031] In this specific embodiment, there are eight detection holes 410 arranged in two rows, and there are four detection holes 410 near the semiconductor wafer test side, and the upper end is provided with a waist-shaped adsorption sink 411; the negative pressure mechanism is a vacuum generator purchased on the market to provide negative pressure to the working area, and the vacuum generator is provided with a pressure regulating mechanism and a negative pressure detection mechanism purchased on the market, which are connected to the external hole through a sealed air pipe. The negative pressure mechanism can provide negative pressure to multiple detection holes 410 to adsorb the semiconductor wafer on the upper end surface of the limit table 100. The negative pressure loss of multiple detection holes 410 can be known through the negative pressure detection mechanism. When the semiconductor wafer is warped or the position is not correct and there is no shielding, the negative pressure loss is large. The flatness of the semiconductor wafer can be judged by controlling the size of the negative pressure and cooperating with the negative pressure loss tested by the negative pressure detection mechanism. The adsorption sink 411 is set at the upper end of the detection hole 410 near the semiconductor wafer test side, which makes the adsorption of the detection part more stable and also improves the flatness detection sensitivity of the semiconductor wafer test side.

[0032] On the basis of the above, if Figure 1 , Figure 5 and Figure 6 As shown, the positioning detection mechanism 500 includes two displacement sensors 510, and installation grooves are arranged on the outer wall of the limit platform 100 at positions corresponding to the first movable limit groove 103 and the second movable limit groove 104. The two displacement sensors 510 are respectively arranged in the two installation grooves, and the two installation grooves are provided with a first displacement detection hole 105 and a second displacement detection hole 106 which pass through the first movable limit groove 103 and the second movable limit groove 104 in the horizontal direction corresponding to the first limit block 350 and the second limit block 380 respectively.

[0033] In this specific example, the displacement sensor 510 is a miniature high-precision laser displacement sensor purchased on the market, which can detect the displacement of the first limit block 350 and the second limit block 380 through the first displacement detection hole 105 and the second displacement detection hole 106. After positioning, the first limit block 350 and the second limit block 380 elastically press the semiconductor wafer to the corresponding fixed limit structure 200. The fixed position of the semiconductor wafer can be known by the position of the first limit block 350 and the second limit block 380 after positioning and limiting the semiconductor wafer. After the semiconductor wafer is fixed and limited, when the distance between the first limit block 350 and the second limit block 380 and the fixed limit structure 200 is greater than or less than the normal range of the width of the two corresponding sides of the semiconductor wafer, the semiconductor wafer limit position is incorrect, and the system alarm does not perform the next test operation, which greatly reduces the situation of inaccurate testing and damage to the test needle plate of the test equipment when the semiconductor wafer overlaps.

[0034] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A test seat for semiconductor wafer inspection, comprising a limiting platform (100) for limiting the placement of a semiconductor wafer to be inspected, characterized in that: The limiting platform (100) is provided with a fixed limiting structure (200) for limiting two adjacent side edges of a semiconductor wafer, the outer side of the limiting platform (100) is provided with a movable limiting mechanism (300) for elastically limiting the other two side edges of the semiconductor wafer respectively, the limiting platform (100) is provided with an adsorption detection structure (400) for adsorbing the semiconductor wafer and detecting the flatness, and the limiting platform (100) is provided with a positioning detection mechanism (500) for detecting the movable limiting position of the movable limiting mechanism (300).

2. A test socket for semiconductor wafer inspection according to claim 1, characterized in that: The upper surface of the limiting platform (100) is horizontally arranged and the limiting sinks (101) are arranged on two adjacent horizontal and vertical sides; the fixed limiting structure (200) is detachably fixedly arranged on the limiting sink (101) and the upper end is higher than the upper surface of the limiting platform (100); the fixed limiting structure (200) is used to limit the side wall of the side edge of the semiconductor wafer to be perpendicular to the horizontal limiting surface of the upper surface of the limiting platform (100).

3. A test socket for semiconductor wafer inspection according to claim 2, characterized in that: At least three non-linearly arranged limiting columns (102) are vertically arranged on the limiting sink (101), and limiting holes (201) corresponding to the limiting columns (102) are arranged on the fixed limiting structure (200), and the upper ends of the limiting columns (102) are smooth arc-shaped guide surfaces.

4. A test socket for semiconductor wafer inspection according to claim 1, characterized in that: The movable limiting mechanism (300) comprises a vertical direction driving mechanism (310), a moving base block (320), a first sliding block (330), a first connecting block (340), a first limiting block (350), a second sliding block (360), a second connecting block (370), a second limiting block (380) and two limiting seats (390); the moving base block (320) is fixed on the vertical direction driving mechanism (310) and is driven by the vertical direction driving mechanism (310) to move up and down; a first sliding limiting cavity (321) and a second sliding limiting cavity (322) which are perpendicular to each other are horizontally penetrated in the moving base block (320); the first sliding limiting cavity (321) is located below the second sliding limiting cavity (322); One end of the first sliding block (330) is horizontally slidably disposed in the first sliding limit cavity (321) and is limited by the first sliding limit cavity (321) to move in the horizontal direction; one end of the second sliding block (360) is horizontally slidably disposed in the second sliding limit cavity (322) and is limited by the second sliding limit cavity (322) to move in the horizontal direction; the first connecting block (340) is vertically disposed at one end of the first sliding block (330) located outside the first sliding limit cavity (321); a first clamping groove (341) is disposed at the upper end of the first connecting block (340); the first limiting block (350) is horizontally disposed in the first clamping groove (341); and the first connecting block (340) is provided with a first clamping groove (341) for adjusting the first clamping groove (341). The second connecting block (370) is vertically arranged at one end of the second sliding block (360) located outside the second sliding limit cavity (322), the second connecting block (370) is provided with a second clamping groove (371) at the upper end, the second limit block (380) is horizontally arranged in the second clamping groove (371), the second connecting block (370) is provided with a second bolt structure for adjusting the tightness of the second clamping groove (371), the two limit seats (390) are respectively arranged on the first sliding block (330) and on the side of the second sliding block (360) away from the moving base block (320), the upper ends of the two limit seats (390) are provided with bosses (391), and the upper ends of the two bosses (391) are away from the moving base block (320). A connected smooth guide surface and an inclined surface are provided on one side of the base block (320); a first bracket (331) is provided on the first slider (330); a first roller (332) is provided on the first bracket (331) and can roll on the side of the corresponding boss (391) away from the movable base block (320) and on the smooth guide surface and the inclined surface; a second bracket (361) is provided on the second slider (360); a second roller (362) is provided on the second bracket (361) and can roll on the side of the corresponding boss (391) away from the movable base block (320) and on the smooth guide surface and the inclined surface; a first tension spring connected to the end of the first slider (330) is provided in the first sliding limit cavity (321);When the first roller (332) rolls on the side of the corresponding boss (391) away from the moving base block (320) and the smooth guide surface and the inclined surface, the first tension spring is in a stretched state; a second tension spring connected to the end of the second sliding block (360) is arranged in the second sliding limit cavity (322); when the second roller (362) rolls on the side of the corresponding boss (391) away from the moving base block (320) and the smooth guide surface and the inclined surface, the second tension spring is in a stretched state; the limit platform (100) is provided with a first movable limit groove (103) and a second movable limit groove for horizontally moving the first limit block (350) and the second limit block (380), respectively. (104), the upper end surfaces of the first limit block (350) and the second limit block (380) are higher than the upper end surface of the limit platform (100), when the vertical direction driving mechanism (310) drives the movable base block (320) to move downward to a preset position, the first roller (332) and the second roller (362) are located on the lower end vertical surface of the corresponding boss (391) away from the movable base block (320), when the vertical direction driving mechanism (310) drives the movable base block (320) to move upward to the preset position, the distance between the first roller (332) and the second roller (362) and the movable base block (320) is greater than the distance between the corresponding boss (391) and the movable base block (320).

5. A test socket for semiconductor wafer inspection according to claim 4, characterized in that: A relatively protruding first clamping tooth is arranged in the first clamping groove (341), a first fixing groove corresponding to and matching the first clamping tooth is arranged on the first limiting block (350), a relatively protruding second clamping tooth is arranged in the second clamping groove (371), and a second fixing groove corresponding to and matching the second clamping tooth is arranged on the second limiting block (380).

6. A test socket for semiconductor wafer inspection according to claim 4, characterized in that: The upper end surfaces of the first connecting block (340), the first limiting block (350), the second connecting block (370) and the second limiting block (380) are flush.

7. The semiconductor wafer testing socket according to claim 1, characterized in that: The adsorption detection structure (400) comprises a plurality of detection holes (410) arranged on the upper end surface of the limit platform (100) and a conduction block (420) arranged on the lower end surface of the limit platform (100); the lower end surface of the limit platform (100) is provided with a docking cavity; the plurality of detection holes (410) vertically penetrate and extend to the docking cavity; an air guide hole is arranged inside the conduction block (420); a docking joint sealedly connected to the docking cavity is arranged at the upper end of the conduction block (420); a connecting hole connecting the air guide hole and the docking cavity is arranged inside the docking joint; an external connection hole (421) connected to the air guide hole is arranged on one side of the conduction block (420); the external connection hole is connected to a negative pressure mechanism and a negative pressure detection mechanism; and an adsorption sink (411) is arranged at the upper end of the detection hole (410) close to the semiconductor wafer test side among the plurality of detection holes (410).

8. The semiconductor wafer testing socket according to claim 4, characterized in that: The positioning detection mechanism (500) comprises two displacement sensors (510); mounting grooves are arranged on the outer side wall of the limiting platform (100) at positions corresponding to the first movable limiting groove (103) and the second movable limiting groove (104); the two displacement sensors (510) are arranged in the two mounting grooves respectively; the two mounting grooves are provided with a first displacement detection hole (105) and a second displacement detection hole (106) which respectively correspond to the first limiting block (350) and the second limiting block (380) and penetrate and connect the first movable limiting groove (103) and the second movable limiting groove (104) in the horizontal direction.

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