Steel frame shed collapse monitoring device

Abstract

The utility model discloses a steel frame shed collapse monitoring device which comprises a main control module, a power supply module, an alarm module, a plurality of stress monitoring modules and a plurality of inertia measurement modules, and the power supply module is connected with the stress monitoring modules, the inertia measurement modules, the main control module and the alarm module. The stress monitoring module, the alarm module and the inertial measurement module are all connected with the main control module; the stress monitoring module and the inertia measurement module are arranged on a bearing column and a bearing beam of the steel frame shed, the stress monitoring module is used for monitoring the deformation quantity of the bearing column and the bearing beam, and the inertia measurement module is used for monitoring the vibration frequency of the bearing column and the bearing beam; and the main control module detects the received electric signal and controls the alarm module to start and stop according to the detection result. The device is not only suitable for monitoring the collapse of the newly assembled steel frame shed, but also suitable for monitoring the collapse of the steel frame shed which is assembled and put into use, so that the property and personal safety are prevented from being damaged by the collapse.

Description

Technical Field

[0001] The utility model belongs to the technical field of steel frame shed monitoring, and in particular relates to a steel frame shed collapse monitoring device. Background Art

[0002] Steel frame sheds are widely used in agriculture, industry and even household due to their simple structure and convenient assembly, low construction cost and short construction period. Common steel frame sheds include greenhouses, steel frame bicycle sheds, steel frame courtyards, steel frame warehouses and steel frame factories. Steel frame sheds are widely used in various regions. However, this type of steel frame shed is obviously incapable of resisting wind and snow disasters. In recent years, there have always been a large number of reports on the collapse of steel frame sheds during the wind and snow season. The collapse of a large number of steel frame sheds will bring huge economic and property losses to the country and the people and even endanger personal safety. Monitoring the collapse of steel frame sheds can effectively reduce economic losses and avoid personal injuries.

[0003] At present, in order to reduce the collapse risk of steel frame sheds, displacement meters are usually designed in the steel frame shed structure to warn of the collapse risk, or the wind and snow resistance test is carried out after the steel frame shed is built. By designing displacement meters in the steel frame shed structure, the collapse warning can only be achieved by introducing displacement meters during the design and assembly stage of the steel frame shed, and there are certain technical requirements for the construction personnel, and it is not applicable to the steel frame shed that has been assembled and put into use; and the wind and snow resistance test after the steel frame shed is completed is a dynamic and static stress test on the steel frame shed, which can only realize the detection of the upper limit of the wind and snow resistance of the steel frame shed, and cannot monitor the stress condition of the steel frame shed in real time, so it is impossible to monitor the collapse of the steel frame shed in real time. Utility Model Content

[0004] In view of the above problems, the utility model proposes a steel frame shed collapse monitoring device. In order to solve the above technical problems, the technical solutions adopted by the utility model are as follows:

[0005] A steel frame shed collapse monitoring device comprises a main control module, a power module, an alarm module and a plurality of stress monitoring modules and inertial measurement modules, wherein the power module is connected to the stress monitoring module, the inertial measurement module, the main control module and the alarm module, and the stress monitoring module, the alarm module and the inertial measurement module are all connected to the main control module; the stress monitoring module and the inertial measurement module are both arranged on the load-bearing columns and the load-bearing beams of the steel frame shed, the stress monitoring module is used for monitoring the deformation of the load-bearing columns and the load-bearing beams, and the inertial measurement module is used for monitoring the vibration frequency of the load-bearing columns and the load-bearing beams; the main control module detects the received electrical signal and controls the opening and closing of the alarm module according to the detection result.

[0006] The power module includes a transformer T1, wherein the first pin of the transformer T1 is connected to one end of a fuse F1, the other end of the fuse F1 and the second pin of the transformer T1 are connected to an external power supply, the third pin of the transformer T1 is connected to the cathode of a diode D1 and the anode of a diode D2, the fourth pin of the transformer T1 is connected to the cathode of a diode D4 and the anode of a diode D3, the cathode of the diode D2 is connected to the cathode of the diode D3, one end of a capacitor C12, one end of a capacitor C13, the anode of a light-emitting diode D5, and the first pin of a first voltage-stabilizing chip U4, the cathode of the light-emitting diode D5 is connected to one end of a resistor R30, the cathode of the first voltage-stabilizing chip U4 is connected to the cathode of the diode D4 and the anode of a diode D3. Pin 3 is connected to one end of capacitor C14 and pin 1 of the second voltage stabilizing chip U5, and pin 3 of the second voltage stabilizing chip U5 is connected to one end of capacitor C15, the stress monitoring module, the inertial measurement module, the main control module and the alarm module; the other end of the capacitor C15, the positive electrode of the diode D1, the positive electrode of the diode D4, the other end of the capacitor C12, the other end of the capacitor C13, the other end of the resistor R30, the second pin of the first voltage stabilizing chip U4, the second pin of the second voltage stabilizing chip U5, and the other end of the capacitor C14 are all grounded; the model of the first voltage stabilizing chip U4 is LM7812, and the model of the second voltage stabilizing chip U5 is LM7805.

[0007] The stress monitoring module includes a strain gauge full bridge for monitoring the deformation of the load-bearing column and the load-bearing beam, and the strain gauge full bridge includes strain gauges R5, strain gauges R6, strain gauges R7 and strain gauges R8. One end of the strain gauge R5 is connected to one end of the strain gauge R6 and the output end of the operational amplifier A1, the positive phase input end of the operational amplifier A1 is connected to one end of the resistor R1 and the negative electrode of the reference diode VR, the other end of the resistor R1 is connected to one end of the capacitor C1 and the output end of the power module, the inverting input end of the operational amplifier A1 is connected to the upper end of the sliding rheostat R3, one end of the strain gauge R7 and one end of the strain gauge R8, the lower end of the sliding rheostat R3 is connected to the adjustment end of the sliding rheostat R3 and one end of the resistor R4, the other end of the strain gauge R5 is connected to the other end of the strain gauge R8 and the positive phase input end of the operational amplifier A2, the inverting input end of the operational amplifier A2 is connected to one end of the resistor R9, and the inverting input end of the operational amplifier A2 is connected to one end of the resistor R1. The first terminal of the circuit is connected to the first end of the circuit and the second end of the circuit. The first terminal of the circuit is connected to the first end of the circuit and the second end of the circuit. The second terminal of the circuit is connected to the first end of the circuit and the second end of the circuit. The first terminal of the circuit is connected to the first end of the circuit and the second end of the circuit. The second terminal of the circuit is connected to the first end of the circuit and the second end of the circuit. The first terminal of the circuit is connected to the first end of the circuit and the second end of the circuit.

[0008] It also includes a collection module for converting the output of the stress monitoring module into a digital signal, and the output end of the collection module is connected to the main control module.

[0009] The acquisition module includes an ADC acquisition chip U1, wherein the first pin of the ADC acquisition chip U1 is connected to one end of the capacitor C7 and the second pin of the reference voltage source chip U2, the third pin of the ADC acquisition chip U1, the fourth pin of the ADC acquisition chip U1, the fifth pin of the ADC acquisition chip U1, the ninth pin of the ADC acquisition chip U1, the tenth pin of the ADC acquisition chip U1, the eleventh pin of the ADC acquisition chip U1, the twelfth pin of the ADC acquisition chip U1, the thirteenth pin of the ADC acquisition chip U1, and the twenty-fourth pin of the ADC acquisition chip U1 are all connected to the main control module, the sixth pin of the ADC acquisition chip U1 is connected to one end of the resistor R20, one end of the resistor R19, and one end of the resistor R18, and one end of the resistor R18 is grounded; the other end of the resistor R19 is connected to the eighth pin of the ADC acquisition chip U1, the twenty-third pin of the ADC acquisition chip U1, the other end of the resistor R20, one end of the resistor R21, the other end of the resistor R18, and the thirty-fourth pin of the ADC acquisition chip U1, the other end of the resistor R21 is connected to the seventh pin of the ADC acquisition chip U1, and the ADC The 42nd pin of the acquisition chip U1 is connected to one end of the capacitor C3 and one end of the resistor R17. The other end of the resistor R17 is connected to one end of the capacitor C2 and the 6th pin of the reference voltage source chip U2. The 45th pin of the ADC acquisition chip U1 is connected to the 44th pin of the ADC acquisition chip U1 and one end of the capacitor C4. The 39th pin of the ADC acquisition chip U1 is connected to one end of the capacitor C5. The 36th pin of the ADC acquisition chip U1 is connected to one end of the capacitor C6. The 49th pin of the ADC acquisition chip U1 is connected to one end of the capacitor C8 and the resistor R23. one end of the resistor R23 is connected to the output end of the stress monitoring module; the other end of the capacitor C8 is connected to one end of the resistor R22 and the 50th pin of the ADC acquisition chip U1; the other end of the resistor R22, the other end of the capacitor C7, the 4th pin of the reference voltage source chip U2, the other end of the capacitor C3, the other end of the capacitor C2, the other end of the capacitor C4, the other end of the capacitor C5, and the other end of the capacitor C6 are all grounded; the model of the ADC acquisition chip U1 is AD7606, and the model of the reference voltage source chip U2 is ADR421.

[0010] The inertial measurement module includes an inertial measurement chip U3 and a third voltage stabilizing chip U6, wherein the first pin of the third voltage stabilizing chip U6 is connected to one end of a capacitor C14, one end of a capacitor C15, and an output end of a power module, the third pin of the third voltage stabilizing chip U6 is connected to one end of a capacitor C12, one end of a capacitor C13, the first pin of an inertial measurement chip U3, the eighth pin of an inertial measurement chip U3, the thirteenth pin of an inertial measurement chip U3, one end of a resistor R27, one end of a capacitor C10, one end of a capacitor C11, one end of a resistor R28, and one end of a resistor R29, the other end of the resistor R27 is connected to the 22nd pin of the inertial measurement chip U3, the other end of the resistor R28 is connected to the 24th pin of the inertial measurement chip U3, the other end of the resistor R29 is connected to the 23rd pin of the inertial measurement chip U3, and the resistor R The other end of 28 and the other end of resistor R29 are both connected to the main control module; the 9th pin of the inertial measurement chip U3 is connected to one end of the resistor R26, the 11th pin of the inertial measurement chip U3 is connected to one end of the resistor R25, and the 10th pin of the inertial measurement chip U3 is connected to one end of the capacitor C9; the 20th pin of the inertial measurement chip U3, the 18th pin of the inertial measurement chip U3, the other end of the capacitor C9, the other end of the resistor R25, the other end of the resistor R26, the 2nd pin of the third voltage stabilizing chip U6, the other end of the capacitor C10, the other end of the capacitor C11, the other end of the capacitor C14, the other end of the capacitor C15, the other end of the capacitor C12, and the other end of the capacitor C13 are all grounded; the model of the inertial measurement chip U3 is MPU9250, and the model of the third voltage stabilizing chip U6 is LM1117.

[0011] It also includes a mobile communication module, one side of which is connected to the main control module, and the other side of which is connected to the mobile terminal.

[0012] The mobile communication module includes a SIM card holder U6, wherein the first pin of the SIM card holder U6 is connected to one end of a capacitor C18 and the 14th pin of a mobile communication chip U7, the second pin of the SIM card holder U6 is connected to one end of a capacitor C16 and one end of a resistor R31, the third pin of the SIM card holder U6 is connected to one end of a capacitor C17 and one end of a resistor R32, the fourth pin of the SIM card holder U6 is connected to one end of a capacitor C19 and one end of a resistor R33; the other end of the resistor R33 is connected to the 15th pin of the mobile communication chip U7, and the other end of the resistor R31 is connected to the mobile communication chip The 17th pin of U7 is connected, the other end of the resistor R32 is connected to the 16th pin of the mobile communication chip U7, the 68th pin of the mobile communication chip U7 is connected to the 1st pin of the level conversion chip U8, the 67th pin of the mobile communication chip U7 is connected to the 3rd pin of the level conversion chip U8, the 64th pin of the mobile communication chip U7 is connected to the 4th pin of the level conversion chip U8, the 63rd pin of the mobile communication chip U7 is connected to the 5th pin of the level conversion chip U8, the 62nd pin of the mobile communication chip U7 is connected to the 6th pin of the level conversion chip U8, the The 2nd pin of the level conversion chip U7 is connected to the 7th pin of the level conversion chip U8; the 10th pin of the level conversion chip U8 is connected to the 2nd pin of the level conversion chip U8, one end of the capacitor C20, and the 3rd pin of the fourth voltage stabilizing chip U9, the 14th pin of the level conversion chip U8 is connected to one end of the resistor R34, the 15th pin of the level conversion chip U8 is connected to one end of the resistor R35, the 19th pin of the level conversion chip U8 is connected to one end of the capacitor C21 and the inertial measurement module, the 20th pin of the level conversion chip U8, the 18th pin of the level conversion chip U8, the level conversion chip U The 17th pin of 8, the 16th pin of the level conversion chip U8, the other end of the resistor R34, and the other end of the resistor R35 are all connected to the main control module, and the 1st pin of the fourth voltage stabilizing chip U9 is connected to one end of the capacitor C22 and the output end of the power supply module; the other end of the capacitor C22, the other end of the capacitor C21, one end of the capacitor C20, the 2nd pin of the fourth voltage stabilizing chip U9, one end of the capacitor C16, the other end of the capacitor C17, the 6th pin of the SIM card holder U6, the other end of the capacitor C18, the other end of the capacitor C19, and the 11th pin of the level conversion chip U8 are all grounded.

[0013] The alarm module includes a resistor R37, one end of which is connected to the main control module, the other end of which is connected to one end of a resistor R36, one end of a capacitor C24, and a base of a transistor Q1, the other end of which is connected to the other end of the capacitor C24 and an emitter of the transistor Q1, the collector of the transistor Q1 is connected to one end of a buzzer LS1, the other end of the buzzer LS1 is connected to one end of a capacitor C23 and an output end of a power supply module, and the other end of the capacitor C23 is grounded.

[0014] Beneficial effects of the utility model:

[0015] 1. By sticking the stress monitoring module and the inertial measurement module on the load-bearing beams and columns of the steel frame shed to monitor the stress condition of the steel frame shed, there is no need to introduce a displacement meter during the design and assembly stage of the steel frame shed to achieve collapse warning. It is not only suitable for collapse monitoring of newly assembled steel frame sheds, but also for collapse monitoring of steel frame sheds that have been assembled and put into use. The installation only requires sticking the device on the load-bearing beams and columns, and the technical requirements for construction personnel are low;

[0016] 2. It has both a stress monitoring module and an inertial measurement module. The stress monitoring module can monitor the external static force on the bending deformation of the load-bearing beams and columns, and the inertial measurement module can monitor the dynamic acceleration of the shaking of the load-bearing beams and columns of the steel frame shed under strong winds. Therefore, it can monitor the static force and dynamic force of the steel frame shed at the same time, and can monitor the stress of the steel frame shed in real time from multiple directions. It can also monitor the collapse caused by dynamic forces such as strong winds and static forces such as heavy snow at the same time;

[0017] 3. It can monitor the collapse of the steel frame shed in real time, and when there is a risk of collapse of the steel frame shed, it can ring the alarm to notify the personnel in the steel frame shed to evacuate urgently. At the same time, it can send the early warning information to the security room through the mobile communication module, and send a distress message to the outside world in the first time, so as to buy precious time for the rescue of materials and personnel in the steel frame shed to reduce casualties and property losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a structural schematic diagram of the utility model.

[0020] Figure 2 This is a schematic diagram of module connection of the utility model;

[0021] Figure 3 This is a circuit connection diagram of the power module;

[0022] Figure 4 It is a circuit connection diagram of the stress monitoring module;

[0023] Figure 5 This is a circuit connection diagram of the acquisition module;

[0024] Figure 6 This is a circuit connection diagram of the inertial measurement module;

[0025] Figure 7 It is a circuit connection diagram of a mobile communication module;

[0026] Figure 8 This is a circuit connection diagram of the alarm module. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] A steel frame shed collapse monitoring device, such as Figure 2 As shown, it includes a main control module, a power module, an alarm module, and several stress monitoring modules and inertial measurement modules. The power module is connected to the stress monitoring module, the inertial measurement module, the main control module and the alarm module, and the stress monitoring module, the inertial measurement module, and the alarm module are all connected to the main control module; the main control module is used to detect the received signal and control the opening and closing of the alarm module according to the detection result. Preferably, it can also include a mobile communication module and an acquisition module, and the mobile communication module and the acquisition module are both connected to the power module. The acquisition module can convert the analog signal output by the stress monitoring module into a digital signal to facilitate the processing of the main control module. The mobile communication module is connected to the mobile terminal of the manager responsible for managing the steel frame shed, or it can also be connected to the abnormal alarm device set in the security room to notify the manager in time when an abnormal situation occurs. The power module provides power for each chip in the device. The power module is connected to the civilian 220V AC through wires, and converts the 220V AC into 15V DC through a transformer and a ballast bridge. After voltage stabilization, it provides 5V power for other circuits.

[0029] like Figure 1As shown, in this embodiment, the stress monitoring module 110 and the inertial measurement module 210 can be designed in an integrated manner. The integrated modules can be pasted on the surface of the load-bearing columns and / or load-bearing beams of the steel frame shed. The stress monitoring module is used to monitor the deformation of the load-bearing columns and load-bearing beams, that is, the static stress bending of the two. The inertial measurement module is used to monitor the vibration frequency of the load-bearing columns and load-bearing beams, that is, the dynamic force they are subjected to when they are vibrated by external forces such as strong winds. The main control module, power module, alarm module, mobile communication module and acquisition module can also be designed in an integrated manner, and they are integrated on the host 310 for easy management. The stress monitoring module 110 and the inertial measurement module 210 are both connected to the host 310 via a data cable. The length of the data cable can be determined according to the placement of the host on site. The host can be set inside or outside the steel frame shed.

[0030] In this embodiment, the main control module can use the STM32F103 chip based on the ARM Cortex-M3 core to run the corresponding data on it. The STM32F103 chip reads the measurement data of the stress monitoring module and the inertial measurement module in real time through the SPI interface driver and the IIC interface and adds a timestamp to the measurement data to monitor the static pressure and dynamic vibration force of the load-bearing beams and load-bearing columns of the steel frame shed in real time; at the same time, the stress data and the inertial data are aligned according to the timestamp, and the static pressure and dynamic vibration force are normalized according to the weighted model, and then the processed data are compared with the set threshold value (this is the prior art, not the focus of this application, and this embodiment will not be described in detail). When the value exceeds the threshold, the main control module controls the trigger alarm module to sound the alarm, notifies the personnel in the steel frame shed to evacuate, and sends the AT command to the module chip of the mobile communication module through the serial port driver to send the warning information to the security room to play the role of collapse warning.

[0031] like Figure 3As shown, the power module includes a transformer T1, the first pin of the transformer T1 is connected to one end of the fuse F1, the other end of the fuse F1 and the second pin of the transformer T1 are connected to an external power supply, that is, a 220VAC power supply, the third pin of the transformer T1 is connected to the cathode of the diode D1 and the anode of the diode D2, the fourth pin of the transformer T1 is connected to the cathode of the diode D4 and the anode of the diode D3, the cathode of the diode D2 is connected to the cathode of the diode D3, one end of the capacitor C12, one end of the capacitor C13, the anode of the light-emitting diode D5, and the first pin of the first voltage stabilizing chip U4, the cathode of the light-emitting diode D5 is connected to one end of the resistor R30, the third pin of the first voltage stabilizing chip U4 is connected to one end of the capacitor C14, the anode of the second voltage stabilizing chip U 5, the 3rd pin of the second voltage stabilizing chip U5 outputs 5V power, and the 3rd pin of the second voltage stabilizing chip U5 is connected to one end of the capacitor C15, the stress monitoring module, the inertial measurement module, the main control module and the alarm module to provide corresponding power supply for each module; the other end of the capacitor C15, the positive electrode of the diode D1, the positive electrode of the diode D4, the other end of the capacitor C12, the other end of the capacitor C13, the other end of the resistor R30, the 2nd pin of the first voltage stabilizing chip U4, the 2nd pin of the second voltage stabilizing chip U5, and the other end of the capacitor C14 are all grounded; the first voltage stabilizing chip U4 adopts a 12V voltage stabilizing chip model LM7812, and the second voltage stabilizing chip U5 adopts a 5V voltage stabilizing chip model LM7805. In this embodiment, the transformer T1 adopts a single-phase 220V to 15V AC transformer.

[0032] like Figure 4As shown, the stress monitoring module includes a strain gauge full bridge for monitoring the deformation of the load-bearing column and / or the load-bearing beam, the strain gauge full bridge includes strain gauges R5, strain gauges R6, strain gauges R7 and strain gauges R8, the strain gauge full bridge is composed of four resistive strain gauges R5, R6, R7 and R8 connected end to end, one end of the strain gauge R5 is connected to one end of the strain gauge R6 and the output end of the operational amplifier A1, the positive phase input end of the operational amplifier A1 is connected to one end of the resistor R1 and the negative electrode of the reference diode VR, the other end of the resistor R1 is connected to one end of the capacitor C1, the output end of the power module, that is, the third pin of the second voltage stabilizing chip U5, the inverting input end of the operational amplifier A1 is connected to the upper end of the sliding rheostat R3, one end of the strain gauge R7 and one end of the strain gauge R8, the lower end of the sliding rheostat R3 is connected to the adjustment end of the sliding rheostat R3 and one end of the resistor R4, the other end of the strain gauge R5 is connected to the other end of the strain gauge R8 and the positive phase input end of the operational amplifier A2. The input end is connected, the inverting input end of the operational amplifier A2 is connected to one end of the resistor R9 and one end of the resistor R10, and the other end of the resistor R10 is connected to one end of the resistor R13 and the output end of the operational amplifier A2; the other end of the resistor R9 is connected to one end of the resistor R11 and the inverting input end of the operational amplifier A3, the other end of the resistor R11 is connected to the output end of the operational amplifier A3 and one end of the resistor R14, and the positive input end of the operational amplifier A3 is connected to the other end of the strain gauge R6 and the other end of the strain gauge R7; the other end of the resistor R13 is connected to one end of the resistor R15 and the inverting input end of the operational amplifier A4, the other end of the resistor R15 is connected to the output end of the operational amplifier A4 and the input end of the acquisition module, and the positive input end of the operational amplifier A4 is connected to the other end of the resistor R14 and one end of the resistor R16; the other end of the resistor R16, the other end of the capacitor C1, the other end of the resistor R4, and the positive electrode of the reference diode VR are all grounded. In this embodiment, operational amplifier A1 adopts LT1490 chip, operational amplifier A3 adopts OP227 chip with zeroing terminal, two zeroing pins are respectively connected to the upper and lower ends of sliding rheostat R12, the adjustment end of sliding rheostat R12 is grounded, and operational amplifier A2 adopts LT1013 chip.

[0033] like Figure 5As shown, the acquisition module includes an ADC acquisition chip U1, the first pin of the ADC acquisition chip U1 is connected to one end of the capacitor C7 and the second pin of the reference voltage source chip U2, the third pin of the ADC acquisition chip U1 is connected to the PE2 pin of the STM32F103 chip of the main control module, the fourth pin of the ADC acquisition chip U1 is connected to the PE3 pin of the STM32F103 chip of the main control module, the fifth pin of the ADC acquisition chip U1 is connected to the PE4 pin of the STM32F103 chip of the main control module, the ninth pin of the ADC acquisition chip U1 is connected to the PE5 pin of the STM32F103 chip The 10th pin of the ADC acquisition chip U1 is connected to the PE6 pin of the STM32F103 chip, the 11th pin of the ADC acquisition chip U1 is connected to the PE7 pin of the STM32F103 chip, and the 13th pin of the ADC acquisition chip U1 is connected to the PE8 pin of the STM32F103 chip, so that the main control module can control the operation of the ADC acquisition chip U1, the 12th pin of the ADC acquisition chip U1 is connected to the SPI_SCLK pin of the STM32F103 chip, and the 24th pin of the ADC acquisition chip U1 is connected to the SPI_MISO pin of the STM32F103 chip. The 6th pin of the ADC acquisition chip U1 is connected to one end of the resistor R20, one end of the resistor R19, and one end of the resistor R18, and one end of the resistor R18 is grounded; the other end of the resistor R19 is connected to the 8th pin of the ADC acquisition chip U1, the 23rd pin of the ADC acquisition chip U1, the other end of the resistor R20, one end of the resistor R21, the other end of the resistor R18, and the 34th pin of the ADC acquisition chip U1, the other end of the resistor R21 is connected to the 7th pin of the ADC acquisition chip U1, the 42nd pin of the ADC acquisition chip U1 is connected to one end of the capacitor C3 and one end of the resistor R17, the other end of the resistor R17 is connected to one end of the capacitor C2 and the 6th pin of the reference voltage source chip U2, the 45th pin of the ADC acquisition chip U1 is connected to the ADC acquisition chip The 44th pin of the ADC acquisition chip U1 is connected to one end of the capacitor C4, the 39th pin of the ADC acquisition chip U1 is connected to one end of the capacitor C5, the 36th pin of the ADC acquisition chip U1 is connected to one end of the capacitor C6, the 49th pin of the ADC acquisition chip U1 is connected to one end of the capacitor C8 and one end of the resistor R23, and the other end of the resistor R23 is connected to the output end of the stress monitoring module, that is, the output end of the operational amplifier A4; the other end of the capacitor C8 is connected to one end of the resistor R22 and the 50th pin of the ADC acquisition chip U1; the other end of the resistor R22, the other end of the capacitor C7, the 4th pin of the reference voltage source chip U2, the other end of the capacitor C3, the other end of the capacitor C2, the other end of the capacitor C4, the other end of the capacitor C5, and the other end of the capacitor C6 are all grounded.In this embodiment, the ADC acquisition chip U1 adopts a 16-bit 8-channel high-precision analog-to-digital acquisition chip AD7606, and the reference voltage source chip U2 adopts an ultra-precision, second-generation external ion implantation field effect transistor (XFET) reference voltage source chip ADR421.

[0034] like Figure 6 As shown, the inertial measurement module includes an inertial measurement chip U3 and a third voltage stabilizing chip U6. The inertial measurement chip U3 adopts a 9-axis inertial sensor chip MPU9250 with a gyroscope, an accelerometer and a digital output magnetometer with a 16-bit resolution. The third voltage stabilizing chip U6 adopts a 3.3V voltage stabilizing chip LM1117. The first pin of the third voltage stabilizing chip U6 is connected to one end of the capacitor C14, one end of the capacitor C15, and the output end of the power module. The third pin of the third voltage stabilizing chip U6 is connected to one end of the capacitor C12, one end of the capacitor C13, the first pin of the inertial measurement chip U3, the 8th pin of the inertial measurement chip U3, the 13th pin of the inertial measurement chip U3, one end of the resistor R27, one end of the capacitor C10, one end of the capacitor C11, one end of the resistor R28, and one end of the resistor R29. The third pin of the third voltage stabilizing chip U6 outputs a 3.3V power supply; the other end of the resistor R27 is connected to the 22nd pin of the inertial measurement chip U3. , the other end of the resistor R28 is connected to the 24th pin of the inertial measurement chip U3, the other end of the resistor R29 is connected to the 23rd pin of the inertial measurement chip U3, and the other end of the resistor R28 is connected to the I2C_SDA pin of the STM32F103 chip, and the other end of the resistor R29 is connected to the I2C_SCL pin of the STM32F103 chip; the 9th pin of the inertial measurement chip U3 is connected to one end of the resistor R26, the 11th pin of the inertial measurement chip U3 is connected to one end of the resistor R25, and the 10th pin of the inertial measurement chip U3 is connected to one end of the capacitor C9; the 20th pin of the inertial measurement chip U3, the 18th pin of the inertial measurement chip U3, the other end of the capacitor C9, the other end of the resistor R25, the other end of the resistor R26, the 2nd pin of the third voltage stabilizing chip U6, the other end of the capacitor C10, the other end of the capacitor C11, the other end of the capacitor C14, the other end of the capacitor C15, the other end of the capacitor C12, and the other end of the capacitor C13 are all grounded.

[0035] like Figure 7As shown, the mobile communication module includes a SIM card holder U6, the first pin of the SIM card holder U6 is connected to one end of the capacitor C18 and the 14th pin of the mobile communication chip U7, the second pin of the SIM card holder U6 is connected to one end of the capacitor C16 and one end of the resistor R31, the third pin of the SIM card holder U6 is connected to one end of the capacitor C17 and one end of the resistor R32, the fourth pin of the SIM card holder U6 is connected to one end of the capacitor C19 and one end of the resistor R33; the other end of the resistor R33 is connected to the 15th pin of the mobile communication chip U7, the other end of the resistor R31 is connected to the 17th pin of the mobile communication chip U7, and the other end of the resistor R32 is connected to The 16th pin of the mobile communication chip U7 is connected, the 68th pin of the mobile communication chip U7 is connected to the 1st pin of the level conversion chip U8, the 67th pin of the mobile communication chip U7 is connected to the 3rd pin of the level conversion chip U8, the 64th pin of the mobile communication chip U7 is connected to the 4th pin of the level conversion chip U8, the 63rd pin of the mobile communication chip U7 is connected to the 5th pin of the level conversion chip U8, the 62nd pin of the mobile communication chip U7 is connected to the 6th pin of the level conversion chip U8, the 2nd pin of the mobile communication chip U7 is connected to the 7th pin of the level conversion chip U8; the 10th pin of the level conversion chip U8 is connected to the The second pin of U8, one end of capacitor C20, and the third pin of the fourth voltage regulator chip U9 are connected, the 14th pin of the level conversion chip U8 is connected to one end of the resistor R34, the 15th pin of the level conversion chip U8 is connected to one end of the resistor R35, the 19th pin of the level conversion chip U8 is connected to one end of the capacitor C21, and the third pin of the third voltage regulator chip U6 of the inertial measurement module, the 20th pin of the level conversion chip U8, the 18th pin of the level conversion chip U8, the 17th pin of the level conversion chip U8, and the 16th pin of the level conversion chip U8 are respectively connected to the GPIO interface pins PE11 and PE12 of the STM32F103 chip , PE13, and PE14 are connected to control the execution of AT instructions, the other end of the resistor R34 and the other end of the resistor R35 are respectively connected to the TXD and RXD pins of the serial interface of the STM32F103 chip, and the first pin of the fourth voltage stabilizing chip U9 is connected to one end of the capacitor C22 and the output end of the power module; the other end of the capacitor C22, the other end of the capacitor C21, one end of the capacitor C20, the second pin of the fourth voltage stabilizing chip U9, one end of the capacitor C16, the other end of the capacitor C17, the sixth pin of the SIM card holder U6, the other end of the capacitor C18, the other end of the capacitor C19, and the 11th pin of the level conversion chip U8 are all grounded.In this embodiment, the mobile communication chip U7 adopts the 4G communication module EC20_CEHC, the level conversion chip U8 adopts the 8-channel TTL level conversion chip TXS0108EPWR, the serial port interface of the mobile communication chip U7 is connected to the main control chip after TTL level conversion, and communication control is realized through AT instructions, the voltage regulator chip U9 adopts the 1.8V voltage regulator chip AMS1117-1.8, and the SIM card holder U6 adopts Micro SIM, model SMO-1511B-P6.

[0036] like Figure 8 As shown, the alarm module includes a resistor R37, one end of the resistor R37 is connected to the GPIO interface pin PE15 of the main control module, the other end of the resistor R37 is connected to one end of the resistor R36, one end of the capacitor C24, and the base of the transistor Q1, the other end of the resistor R36 is connected to the other end of the capacitor C24, the emitter of the transistor Q1, the collector of the transistor Q1 is connected to one end of the buzzer LS1, the other end of the buzzer LS1 is connected to one end of the capacitor C23, the output end of the power module, and the other end of the capacitor C23 is grounded. When the STM32F103 chip outputs a high level, the transistor Q1 is turned on, and the buzzer LS1 alarms.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A steel frame shed collapse monitoring device, characterized in that: It includes a main control module, a power module, an alarm module and several stress monitoring modules and inertial measurement modules. The power module is connected to the stress monitoring module, the inertial measurement module, the main control module and the alarm module, and the stress monitoring module, the alarm module and the inertial measurement module are all connected to the main control module; the stress monitoring module and the inertial measurement module are both arranged on the load-bearing columns and load-bearing beams of the steel frame shed, the stress monitoring module is used to monitor the deformation of the load-bearing columns and the load-bearing beams, and the inertial measurement module is used to monitor the vibration frequency of the load-bearing columns and the load-bearing beams; the main control module detects the received electrical signal and controls the opening and closing of the alarm module according to the detection result.

2. The steel frame shed collapse monitoring device according to claim 1, characterized in that: The power module includes a transformer T1, wherein the first pin of the transformer T1 is connected to one end of a fuse F1, the other end of the fuse F1 and the second pin of the transformer T1 are connected to an external power supply, the third pin of the transformer T1 is connected to the cathode of a diode D1 and the anode of a diode D2, the fourth pin of the transformer T1 is connected to the cathode of a diode D4 and the anode of a diode D3, the cathode of the diode D2 is connected to the cathode of the diode D3, one end of a capacitor C12, one end of a capacitor C13, the anode of a light-emitting diode D5, and the first pin of a first voltage-stabilizing chip U4, the cathode of the light-emitting diode D5 is connected to one end of a resistor R30, the cathode of the first voltage-stabilizing chip U4 is connected to the cathode of the diode D4 and the anode of a diode D3. Pin 3 is connected to one end of capacitor C14 and pin 1 of the second voltage stabilizing chip U5, and pin 3 of the second voltage stabilizing chip U5 is connected to one end of capacitor C15, the stress monitoring module, the inertial measurement module, the main control module and the alarm module; the other end of the capacitor C15, the positive electrode of the diode D1, the positive electrode of the diode D4, the other end of the capacitor C12, the other end of the capacitor C13, the other end of the resistor R30, the second pin of the first voltage stabilizing chip U4, the second pin of the second voltage stabilizing chip U5, and the other end of the capacitor C14 are all grounded; the model of the first voltage stabilizing chip U4 is LM7812, and the model of the second voltage stabilizing chip U5 is LM7805.

3. The steel frame shed collapse monitoring device according to claim 1, characterized in that: The stress monitoring module includes a strain gauge full bridge for monitoring the deformation of the load-bearing column and the load-bearing beam, and the strain gauge full bridge includes strain gauges R5, strain gauges R6, strain gauges R7 and strain gauges R8. One end of the strain gauge R5 is connected to one end of the strain gauge R6 and the output end of the operational amplifier A1, the positive phase input end of the operational amplifier A1 is connected to one end of the resistor R1 and the negative electrode of the reference diode VR, the other end of the resistor R1 is connected to one end of the capacitor C1 and the output end of the power module, the inverting input end of the operational amplifier A1 is connected to the upper end of the sliding rheostat R3, one end of the strain gauge R7 and one end of the strain gauge R8, the lower end of the sliding rheostat R3 is connected to the adjustment end of the sliding rheostat R3 and one end of the resistor R4, the other end of the strain gauge R5 is connected to the other end of the strain gauge R8 and the positive phase input end of the operational amplifier A2, the inverting input end of the operational amplifier A2 is connected to one end of the resistor R9, and the inverting input end of the operational amplifier A2 is connected to one end of the resistor R1. The first terminal of the circuit is connected to the first end of the circuit and the second end of the circuit. The first terminal of the circuit is connected to the first end of the circuit and the second end of the circuit. The second terminal of the circuit is connected to the first end of the circuit and the second end of the circuit. The first terminal of the circuit is connected to the first end of the circuit and the second end of the circuit. The second terminal of the circuit is connected to the first end of the circuit and the second end of the circuit. The first terminal of the circuit is connected to the first end of the circuit and the second end of the circuit.

4. The steel frame shed collapse monitoring device according to claim 1, characterized in that: It also includes a collection module for converting the output of the stress monitoring module into a digital signal, and the output end of the collection module is connected to the main control module.

5. The steel frame shed collapse monitoring device according to claim 4, characterized in that: The acquisition module includes an ADC acquisition chip U1, wherein the first pin of the ADC acquisition chip U1 is connected to one end of the capacitor C7 and the second pin of the reference voltage source chip U2, the third pin of the ADC acquisition chip U1, the fourth pin of the ADC acquisition chip U1, the fifth pin of the ADC acquisition chip U1, the ninth pin of the ADC acquisition chip U1, the tenth pin of the ADC acquisition chip U1, the eleventh pin of the ADC acquisition chip U1, the twelfth pin of the ADC acquisition chip U1, the thirteenth pin of the ADC acquisition chip U1, and the twenty-fourth pin of the ADC acquisition chip U1 are all connected to the main control module, the sixth pin of the ADC acquisition chip U1 is connected to one end of the resistor R20, one end of the resistor R19, and one end of the resistor R18, and one end of the resistor R18 is grounded; the other end of the resistor R19 is connected to the eighth pin of the ADC acquisition chip U1, the twenty-third pin of the ADC acquisition chip U1, the other end of the resistor R20, one end of the resistor R21, the other end of the resistor R18, and the thirty-fourth pin of the ADC acquisition chip U1, the other end of the resistor R21 is connected to the seventh pin of the ADC acquisition chip U1, and the ADC The 42nd pin of the acquisition chip U1 is connected to one end of the capacitor C3 and one end of the resistor R17. The other end of the resistor R17 is connected to one end of the capacitor C2 and the 6th pin of the reference voltage source chip U2. The 45th pin of the ADC acquisition chip U1 is connected to the 44th pin of the ADC acquisition chip U1 and one end of the capacitor C4. The 39th pin of the ADC acquisition chip U1 is connected to one end of the capacitor C5. The 36th pin of the ADC acquisition chip U1 is connected to one end of the capacitor C6. The 49th pin of the ADC acquisition chip U1 is connected to one end of the capacitor C8 and the resistor R23. one end of the resistor R23 is connected to the output end of the stress monitoring module; the other end of the capacitor C8 is connected to one end of the resistor R22 and the 50th pin of the ADC acquisition chip U1; the other end of the resistor R22, the other end of the capacitor C7, the 4th pin of the reference voltage source chip U2, the other end of the capacitor C3, the other end of the capacitor C2, the other end of the capacitor C4, the other end of the capacitor C5, and the other end of the capacitor C6 are all grounded; the model of the ADC acquisition chip U1 is AD7606, and the model of the reference voltage source chip U2 is ADR421.

6. The steel frame shed collapse monitoring device according to claim 1, characterized in that: The inertial measurement module includes an inertial measurement chip U3 and a third voltage stabilizing chip U6, wherein the first pin of the third voltage stabilizing chip U6 is connected to one end of a capacitor C14, one end of a capacitor C15, and an output end of a power module, the third pin of the third voltage stabilizing chip U6 is connected to one end of a capacitor C12, one end of a capacitor C13, the first pin of an inertial measurement chip U3, the eighth pin of an inertial measurement chip U3, the thirteenth pin of an inertial measurement chip U3, one end of a resistor R27, one end of a capacitor C10, one end of a capacitor C11, one end of a resistor R28, and one end of a resistor R29, the other end of the resistor R27 is connected to the 22nd pin of the inertial measurement chip U3, the other end of the resistor R28 is connected to the 24th pin of the inertial measurement chip U3, the other end of the resistor R29 is connected to the 23rd pin of the inertial measurement chip U3, and the resistor R The other end of 28 and the other end of resistor R29 are both connected to the main control module; the 9th pin of the inertial measurement chip U3 is connected to one end of the resistor R26, the 11th pin of the inertial measurement chip U3 is connected to one end of the resistor R25, and the 10th pin of the inertial measurement chip U3 is connected to one end of the capacitor C9; the 20th pin of the inertial measurement chip U3, the 18th pin of the inertial measurement chip U3, the other end of the capacitor C9, the other end of the resistor R25, the other end of the resistor R26, the 2nd pin of the third voltage stabilizing chip U6, the other end of the capacitor C10, the other end of the capacitor C11, the other end of the capacitor C14, the other end of the capacitor C15, the other end of the capacitor C12, and the other end of the capacitor C13 are all grounded; the model of the inertial measurement chip U3 is MPU9250, and the model of the third voltage stabilizing chip U6 is LM1117.

7. The steel frame shed collapse monitoring device according to claim 1, characterized in that: It also includes a mobile communication module, one side of which is connected to the main control module, and the other side of which is connected to the mobile terminal.

8. The steel frame shed collapse monitoring device according to claim 7, characterized in that: The mobile communication module includes a SIM card holder U6, wherein the first pin of the SIM card holder U6 is connected to one end of a capacitor C18 and the 14th pin of a mobile communication chip U7, the second pin of the SIM card holder U6 is connected to one end of a capacitor C16 and one end of a resistor R31, the third pin of the SIM card holder U6 is connected to one end of a capacitor C17 and one end of a resistor R32, the fourth pin of the SIM card holder U6 is connected to one end of a capacitor C19 and one end of a resistor R33; the other end of the resistor R33 is connected to the 15th pin of the mobile communication chip U7, the other end of the resistor R31 is connected to the 17th pin of the mobile communication chip U7, and the other end of the resistor R32 is connected to the mobile communication chip U7. The 16th pin of the mobile communication chip U7 is connected, the 68th pin of the mobile communication chip U7 is connected to the 1st pin of the level conversion chip U8, the 67th pin of the mobile communication chip U7 is connected to the 3rd pin of the level conversion chip U8, the 64th pin of the mobile communication chip U7 is connected to the 4th pin of the level conversion chip U8, the 63rd pin of the mobile communication chip U7 is connected to the 5th pin of the level conversion chip U8, the 62nd pin of the mobile communication chip U7 is connected to the 6th pin of the level conversion chip U8, the 2nd pin of the mobile communication chip U7 is connected to the 7th pin of the level conversion chip U8; the 10th pin of the level conversion chip U8 is connected to the The second pin of the level conversion chip U8, one end of the capacitor C20, and the third pin of the fourth voltage stabilizing chip U9 are connected, the 14th pin of the level conversion chip U8 is connected to one end of the resistor R34, the 15th pin of the level conversion chip U8 is connected to one end of the resistor R35, the 19th pin of the level conversion chip U8 is connected to one end of the capacitor C21 and the inertial measurement module, the 20th pin of the level conversion chip U8, the 18th pin of the level conversion chip U8, the 17th pin of the level conversion chip U8, the 16th pin of the level conversion chip U8, the other end of the resistor R34, and the other end of the resistor R35 are all connected to the main control module, the 1st pin of the fourth voltage stabilizing chip U9 is connected to the One end is connected to the output end of the power module; the other end of the capacitor C22, the other end of the capacitor C21, one end of the capacitor C20, the second pin of the fourth voltage stabilizing chip U9, one end of the capacitor C16, the other end of the capacitor C17, the sixth pin of the SIM card holder U6, the other end of the capacitor C18, the other end of the capacitor C19, and the 11th pin of the level conversion chip U8 are all grounded; the model of the SIM card holder U6 is SMO-1511B-P6, the model of the mobile communication chip U7 is EC20_CEHC, the model of the fourth voltage stabilizing chip U9 is AMS1117-1.8, and the model of the level conversion chip U8 is TXS0108EPWR.

9. The steel frame shed collapse monitoring device according to claim 1, characterized in that: The alarm module includes a resistor R37, one end of which is connected to the main control module, the other end of which is connected to one end of a resistor R36, one end of a capacitor C24, and a base of a transistor Q1, the other end of which is connected to the other end of the capacitor C24 and an emitter of the transistor Q1, the collector of the transistor Q1 is connected to one end of a buzzer LS1, the other end of the buzzer LS1 is connected to one end of a capacitor C23 and an output end of a power supply module, and the other end of the capacitor C23 is grounded.

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