Novel back-mounted LED (light-emitting diode) structure

Abstract

The utility model discloses a novel back-mounted LED structure, which comprises an insulating bracket, a metal bracket and an LED light-emitting chip, the insulating bracket is provided with a concave cavity; the metal support is embedded, molded and fixed on the insulating support, and the metal support comprises a positive electrode pin and a negative electrode pin which are separated from each other; the LED light-emitting chip is embedded and fixed in the concave cavity, and one end of the LED light-emitting chip is welded and conducted with the positive electrode pin through a first gold wire; the boss is designed to be matched and embedded with the mounting hole of the circuit board, and the negative electrode welding surface and the positive electrode welding surface are respectively exposed out of the surfaces of the two ends of the base, so that the product can be mounted on the back surface of the circuit board in an attached manner, the front space of the circuit board is saved, the height of the circuit board is greatly reduced, and a panel shell with lower height can be adopted; therefore, when the control panel is assembled, a spring is not needed to realize touch induction, and copper only needs to be laid on a touched area on the circuit board at most, so that convenience is brought to production and manufacturing of the control panel.

Description

Technical Field

[0001] The utility model relates to the technology of LED lamp field, in particular to a novel back-stick type LED structure. Background Art

[0002] LED (Light Emitting Diode), a light emitting diode, is a solid-state semiconductor device that can convert electrical energy into visible light. It can directly convert electricity into light. The heart of LED is a semiconductor light-emitting LED chip, which is set on an LED bracket. The LED bracket includes an insulating bracket and a metal bracket; the insulating bracket has a concave cavity; the metal bracket is fixed on the insulating bracket by inlay molding, and the metal bracket includes a positive pin and a negative pin that are set separately from each other; the LED light-emitting chip is embedded in the concave cavity and fixed and encapsulated by epoxy resin, one end of the LED light-emitting chip is welded to the positive pin through the first gold wire, and the other end of the LED light-emitting chip is welded to the negative pin through the second gold wire.

[0003] At present, a plurality of LEDs need to be arranged on the circuit board of a control panel with a touch function. In the prior art, these LEDs are generally arranged on the front of the circuit board, which increases the height of the circuit board and requires a higher panel housing. In addition, a spring needs to be used to realize touch sensing when the control panel is assembled, which brings inconvenience to the production of the control panel. Therefore, it is necessary to study a solution to solve the above problems. Utility Model Content

[0004] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a new back-mounted LED structure, which can effectively solve the problem that the existing LEDs are generally arranged on the front side of the circuit board, resulting in an increase in the height of the circuit board.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A novel back-mounted LED structure comprises an insulating support, a metal support and an LED light-emitting chip; the insulating support is provided with a concave cavity; the metal support is inlay-molded and fixed on the insulating support, and the metal support comprises a positive electrode pin and a negative electrode pin which are separately arranged; the LED light-emitting chip is embedded and fixed in the concave cavity, one end of the LED light-emitting chip is welded and connected to the positive electrode pin through a first gold wire, and the other end of the LED light-emitting chip is welded and connected to the negative electrode pin through a second gold wire; the insulating support comprises a base and a boss extending from the middle of the base surface for fitting and fitting with the mounting hole on an external circuit board, and the concave cavity is formed by concavely forming the surface of the boss; the positive electrode pin and the negative electrode pin are respectively arranged at two ends of the base, the positive electrode pin has a positive electrode welding surface which is welded and connected to the back of the external circuit board, and the negative electrode pin has a negative electrode welding surface which is welded and connected to the back of the external circuit board, and the negative electrode welding surface and the positive electrode welding surface are respectively exposed from the two end surfaces of the base.

[0007] As a preferred solution, the positive electrode pin is a metal flat plate structure, the inner end of the positive electrode pin is provided with a first notch, the first notch is buried in the base and the boss, the bottom surface of the positive electrode pin is provided with a first recessed hole, the first recessed hole is buried in the base, so that the positive electrode pin is more firmly combined with the insulating bracket and is not easy to separate.

[0008] As a preferred solution, one end of the first gold wire is embedded in the first concave hole and is welded and fixed to the bottom surface of the first concave hole to achieve conductive connection, so that the connection is more stable and reliable.

[0009] As a preferred solution, the negative electrode pin is a metal flat plate structure, a second notch is opened at the inner end of the negative electrode pin, the second notch is buried in the base and the boss, a second recessed hole is recessed on the bottom surface of the negative electrode pin, the second recessed hole is buried in the base, so that the negative electrode pin is more firmly combined with the insulating bracket and is not easy to separate.

[0010] As a preferred solution, one end of the second gold wire is embedded in the second concave hole and is welded and fixed to the bottom surface of the second concave hole to achieve conductive connection, so that the connection is more stable and reliable.

[0011] As a preferred solution, the inner wall of the cavity is coated with a reflective coating, and the cavity is filled with packaging resin. The LED light-emitting chip is buried under the packaging resin, so that the LED light-emitting chip is installed more stably and the outward light-emitting effect is better.

[0012] As a preferred solution, a positive pole marking structure and a negative pole marking structure are respectively provided at the bottom of both ends of the base, and the positive pole marking structure and the negative pole marking structure are respectively located below the positive pole pin and the negative pole pin, so as to distinguish the positive and negative poles and facilitate subsequent welding and installation on an external circuit board.

[0013] As a preferred solution, the positive electrode marking structure is a circular concave position, and the negative electrode marking structure is a semicircular notch, which has a simple structure and is easy to form.

[0014] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0015] By designing the boss to fit in with the mounting hole of the circuit board, and exposing the two end surfaces of the base with the negative electrode welding surface and the positive electrode welding surface respectively, the product can be installed on the back of the circuit board, saving the front space of the circuit board and greatly reducing the height of the circuit board. A lower panel shell can be used, and then there is no need to use springs to achieve touch sensing when assembling the control panel. At most, copper needs to be laid on the touch area of ​​the circuit board, which brings convenience to the production of the control panel.

[0016] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of an assembly perspective view of a preferred embodiment of the utility model;

[0018] Figure 2 It is a three-dimensional schematic diagram of the assembly of the preferred embodiment of the utility model from another angle;

[0019] Figure 3 It is an exploded view of a preferred embodiment of the utility model;

[0020] Figure 4 It is a cross-sectional view of a preferred embodiment of the utility model.

[0021] Description of the accompanying drawings:

[0022] 10. Insulation bracket 11. Base

[0023] 12. Boss 101, cavity

[0024] 102. Positive electrode marking structure 103. Negative electrode marking structure

[0025] 20. Metal bracket 21. Positive pin

[0026] 211, positive electrode welding surface 212, first notch

[0027] 213, first concave hole 22, negative electrode pin

[0028] 221, negative electrode welding surface 222, second notch

[0029] 223, second concave hole 30, LED light emitting chip

[0030] 41. First gold line 42. Second gold line

[0031] 43. Reflective coating 44. Encapsulation resin. DETAILED DESCRIPTION

[0032] Please refer to Figures 1 to 4 As shown, it shows the specific structure of a preferred embodiment of the utility model, including an insulating bracket 10, a metal bracket 20 and an LED light-emitting chip 30.

[0033] The insulating support 10 has a cavity 101; specifically, the insulating support 10 includes a base 11 and a boss 12, the boss 12 extends from the middle of the surface of the base 11, the boss 12 is used to fit with the mounting hole (not shown) on the external circuit board, and the cavity 101 is formed concavely on the surface of the boss 12. And, the insulating support 10 is made of plastic or ceramic, and has a long strip structure.

[0034] The metal bracket 20 is inlay-molded and fixed on the insulating bracket 10, and the metal bracket 20 includes a positive electrode pin 21 and a negative electrode pin 22 which are separately arranged from each other; the positive electrode pin 21 and the negative electrode pin 22 are respectively arranged at two ends of the base 11, and the positive electrode pin 21 has a positive electrode welding surface 211 which is welded and connected to the back side of the external circuit board, and the negative electrode pin 22 has a negative electrode welding surface 221 which is welded and connected to the back side of the external circuit board, and the negative electrode welding surface 221 and the positive electrode welding surface 211 are respectively exposed from the two end surfaces of the base 11.

[0035] The positive electrode pin 21 is a metal flat plate structure, and a first notch 212 is provided at the inner end of the positive electrode pin 21, and the first notch 212 is buried in the base 11 and the boss 12. A first concave hole 213 is recessed on the bottom surface of the positive electrode pin 21, and the first concave hole 213 is buried in the base 11, so that the positive electrode pin 21 and the insulating bracket 10 are more firmly combined and not easily separated. In addition, one end of the first gold wire 41 is embedded in the first concave hole 213 and is welded and fixed to the bottom surface of the first concave hole 213 to conduct and connect, and the connection is more stable and reliable.

[0036] The negative electrode pin 22 is a metal flat plate structure, and a second notch 222 is provided at the inner end of the negative electrode pin 22, and the second notch 222 is buried in the base 11 and the boss 12. A second recessed hole 223 is recessed at the bottom surface of the negative electrode pin 22, and the second recessed hole 223 is buried in the base 11, so that the negative electrode pin 22 and the insulating bracket 10 are more firmly combined and not easily separated. In addition, one end of the second gold wire 42 is embedded in the second recessed hole 223 and is welded and fixed to the bottom surface of the second recessed hole 223 to conduct and connect, and the connection is more stable and reliable.

[0037] The LED light emitting chip 30 is embedded and fixed in the cavity 101, one end of the LED light emitting chip 30 is welded and connected to the positive electrode pin 21 through the first gold wire 41, and the other end of the LED light emitting chip 30 is welded and connected to the negative electrode pin 22 through the second gold wire 42. In this embodiment, the inner wall of the cavity 101 is coated with a reflective coating 43, and the cavity 101 is filled with a packaging resin 44, and the LED light emitting chip 30 is buried under the packaging resin 44, so that the LED light emitting chip 30 is installed more stably and the outward light emitting effect is better.

[0038] Furthermore, the bottom of both ends of the base 11 are respectively provided with a positive electrode marking structure 102 and a negative electrode marking structure 103, which are respectively located below the positive electrode pin 21 and the negative electrode pin 22, so as to distinguish the positive and negative electrodes and facilitate subsequent welding and installation on the external circuit board. In addition, the positive electrode marking structure 102 is a circular concave position, and the negative electrode marking structure 103 is a semicircular notch, which has a simple structure and is easy to form.

[0039] The production process and use method of this embodiment are described in detail as follows:

[0040] During production, first, one end of the LED light-emitting chip 30 is welded to the positive pin 21 through the first gold wire 41, and the other end of the LED light-emitting chip 30 is welded to the negative pin 22 through the second gold wire 42. Then, the connected LED light-emitting chip 30, the positive pin 21 and the negative pin 22 are placed in a molding mold to form an insulating bracket 10, so that the positive pin 21 and the negative pin 22 are both embedded and fixed on the insulating bracket 10. Then, reflective paint is applied to the inner wall of the cavity 101 to form a reflective coating 43. Finally, the cavity 101 is filled with packaging resin 44.

[0041] When in use, this product is applied to a control panel with a touch function, and the control panel has a circuit board. The boss 12 is embedded in the mounting hole on the circuit board, and the mounting hole runs through the front and back of the circuit board. After being embedded in place, the negative electrode welding surface 221 and the positive electrode welding surface 211 are respectively fitted with the circuit corresponding to the back of the circuit board. Then, the negative electrode welding surface 221 and the positive electrode welding surface 211 are respectively welded and fixed with the circuit corresponding to the back of the circuit board and turned on. When the circuit board is powered on, the LED light-emitting chip 30 lights up, and the generated light is emitted from the front of the circuit board.

[0042] The design focus of the utility model is that by designing the boss to fit in with the mounting hole of the circuit board, and cooperating with the negative electrode welding surface and the positive electrode welding surface to expose the two end surfaces of the base respectively, the product can be installed on the back of the circuit board, saving the front space of the circuit board and greatly reducing the height of the circuit board. A panel shell with a lower height can be used, and then there is no need to use springs to achieve touch sensing when assembling the control panel. At most, copper needs to be laid on the touch area of ​​the circuit board, which brings convenience to the production of the control panel.

[0043] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A new back-mounted LED structure, comprising an insulating bracket, a metal bracket and an LED light-emitting chip; the insulating bracket has a concave cavity; the metal bracket is fixed on the insulating bracket by inlay molding, and the metal bracket comprises a positive electrode pin and a negative electrode pin which are separately arranged; the LED light-emitting chip is embedded in the concave cavity and fixed, one end of the LED light-emitting chip is welded and connected to the positive electrode pin through a first gold wire, and the other end of the LED light-emitting chip is welded and connected to the negative electrode pin through a second gold wire; the characteristics are: The insulating bracket includes a base and a boss extending from the middle of the base surface for fitting and engaging with the mounting hole on the external circuit board, and the concave cavity is formed by being recessed on the surface of the boss; the positive electrode pin and the negative electrode pin are respectively arranged at two ends of the base, the positive electrode pin has a positive electrode welding surface that is welded and connected to the back side of the external circuit board, and the negative electrode pin has a negative electrode welding surface that is welded and connected to the back side of the external circuit board, and the negative electrode welding surface and the positive electrode welding surface are respectively exposed from the two end surfaces of the base.

2. The novel back-mounted LED structure according to claim 1, characterized in that: The positive electrode pin is a metal flat plate structure, the inner end of the positive electrode pin is provided with a first notch, the first notch is buried in the base and the boss, the bottom surface of the positive electrode pin is provided with a first concave hole, the first concave hole is buried in the base.

3. The novel back-mounted LED structure according to claim 2 is characterized in that: One end of the first gold wire is embedded in the first concave hole and is fixed to the bottom surface of the first concave hole by welding to be conductively connected.

4. The novel back-mounted LED structure according to claim 1 is characterized in that: The negative electrode pin is a metal flat plate structure, the inner end of the negative electrode pin is provided with a second notch, the second notch is buried in the base and the boss, the bottom surface of the negative electrode pin is provided with a second concave hole, the second concave hole is buried in the base.

5. The novel back-mounted LED structure according to claim 4 is characterized in that: One end of the second gold wire is embedded in the second concave hole and is fixed to the bottom surface of the second concave hole by welding to be conductively connected.

6. The novel back-mounted LED structure according to claim 1 is characterized in that: The inner side wall of the cavity is coated with a reflective coating, and the cavity is filled with packaging resin, and the LED light-emitting chip is buried under the packaging resin.

7. The novel back-mounted LED structure according to claim 1 is characterized in that: A positive electrode marking structure and a negative electrode marking structure are respectively arranged at the bottom of both ends of the base, and the positive electrode marking structure and the negative electrode marking structure are respectively located below the positive electrode pin and the negative electrode pin.

8. The novel back-mounted LED structure according to claim 7, characterized in that: The positive electrode marking structure is a circular concave position, and the negative electrode marking structure is a semicircular notch.

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