An explosion-proof thermal imager capable of rapid cooling

Abstract

The utility model discloses an explosion-proof thermal imager capable of rapid cooling, and relates to the field of thermal imagers, including a thermal imager, a protective cover fixedly installed on the surface of the thermal imager, a certain gap between the protective cover and the thermal imager, and two water pipes fixedly installed on the surface of the protective cover. The explosion-proof thermal imager capable of rapid cooling described in the utility model is provided with a semiconductor refrigeration sheet, a heat-conducting rod and a water-through hole, and the circulating water will take away a part of the heat on the surface of the thermal imager. At this time, the temperature of the circulating water rises. When the circulating water passes through the heat-conducting rod, the semiconductor refrigeration sheet opens to take away the heat of the heat-conducting rod. Since the specific heat capacity of the circulating water is relatively large, a relatively long time is required in the process of heat transfer. The water flow is divided into more and smaller parts through a plurality of water-through holes, thereby reducing the mass of the water flow, thereby achieving faster heat transfer, ensuring that the temperature of the circulating water coming out is lower, and the cooling effect is better.

Description

Technical Field

[0001] The utility model relates to the field of thermal imagers, in particular to an explosion-proof thermal imager capable of rapid cooling. Background Art

[0002] A thermal imager is a device that uses infrared thermal imaging technology to detect the infrared radiation of an object and convert the image of the temperature distribution of the object into a visible image through signal processing, photoelectric conversion and other means. It is mainly used in research and development or industrial inspection and equipment maintenance. It is also widely used in fire prevention, night vision and security. However, when a thermal imager is used for a long time, its internal electronic components will generate heat, which will shorten the life of the thermal imager.

[0003] In order to solve the heat dissipation problem, a heat dissipation structure or device is usually installed on the outside of the thermal imager. Especially in an environment with high temperature and poor ventilation, it is difficult to solve the heat dissipation problem quickly and efficiently. In order to improve the heat dissipation of the thermal imager in an environment with high temperature and poor ventilation, if the installation position of the thermal imager is not very high, water cooling is a common heat dissipation method. A protective cover is set on the surface of the thermal imager, and circulating water flows inside the protective cover, thereby indirectly taking away the heat on the surface of the thermal imager to cool the thermal imager. However, due to the large specific heat capacity of water, the heat absorption rate is slow during the water flow process, and the heat dissipation effect will be relatively poor. Utility Model Content

[0004] The main purpose of the utility model is to provide an explosion-proof thermal imager that can quickly cool down, which can effectively solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an explosion-proof thermal imager that can quickly cool down, including a thermal imager, a protective cover is fixedly installed on the surface of the thermal imager, a certain gap is set between the protective cover and the thermal imager, two water pipes are fixedly installed on the surface of the protective cover, respectively close to the two ends of the protective cover, a heat conducting plate is installed inside the protective cover, the heat conducting plate is sleeved on the surface of the thermal imager, water holes are opened on the surface of the heat conducting plate, a heat conducting rod is fixedly installed on the surface of the heat conducting plate, the heat conducting rod is fixedly passed through the protective cover, and a semiconductor refrigeration plate is fixedly installed on the top of the heat conducting rod.

[0006] There are a plurality of water holes arranged in an annular array on the surface of the heat conducting plate.

[0007] The heat conducting plate and the heat conducting rod are fixed by welding, and both the heat conducting plate and the heat conducting rod are made of metallic silver.

[0008] A temperature detector is fixedly installed inside the water pipe for discharging water, and a controller is fixedly installed on the surface of the protective cover. The controller is used to control the start and stop of the semiconductor refrigeration plate.

[0009] The heat conducting plate is installed at the middle position of the protective cover.

[0010] The protective cover and the thermal imager housing are both made of aluminum alloy metal, and the protective cover and the thermal imager are fixed by welding.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] 1. In the utility model, by arranging semiconductor refrigeration sheets, heat-conducting rods and water holes, the circulating water will take away part of the heat on the surface of the thermal imager. At this time, the temperature of the circulating water rises. When the circulating water passes through the heat-conducting rod, the semiconductor refrigeration sheets open to take away the heat of the heat-conducting rod. Since the specific heat capacity of the circulating water is relatively large, a relatively long time is required in the process of heat transfer. The water flow is divided into more and smaller parts through multiple water holes, thereby reducing the mass of the water flow, thereby achieving faster heat transfer, ensuring that the circulating water temperature is lower and the cooling effect is better.

[0013] 2. In the utility model, by setting a temperature detector, a controller and a semiconductor refrigeration sheet, the heat dissipation of the semiconductor refrigeration sheet is greatly affected in the working environment with a relatively high temperature. Therefore, only when the temperature detector detects that the temperature of the circulating water used for cooling is higher than the set value, it proves that the heat dissipation capacity of the circulating water is insufficient, and the controller receives an electrical signal, will it energize the semiconductor refrigeration sheet to increase the cooling speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of an explosion-proof thermal imager capable of rapid cooling according to the utility model;

[0015] Figure 2 This is a schematic diagram of the controller position of a rapid cooling explosion-proof thermal imager of the utility model;

[0016] Figure 3 This is a schematic diagram of the structure of the water hole position of an explosion-proof thermal imager capable of rapid cooling in the utility model;

[0017] Figure 4 The utility model is a control schematic block diagram of a controller of an explosion-proof thermal imager capable of rapid cooling.

[0018] In the figure: 1. Thermal imager; 2. Protective cover; 3. Water pipe; 4. Heat conduction plate; 5. Water hole; 6. Heat conduction rod; 7. Semiconductor cooling plate; 8. Temperature detector; 9. Controller. DETAILED DESCRIPTION

[0019] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0020] like Figure 1-4 As shown, an explosion-proof thermal imager capable of rapid cooling comprises a thermal imager 1, wherein the thermal imager 1 comprises an internal imaging element and a housing for installation, wherein a protective cover 2 is fixedly mounted on the surface of the thermal imager 1, wherein the protective cover 2 is configured to be barrel-shaped, wherein a certain gap is provided between the protective cover 2 and the thermal imager 1, and the gap is a closed space, wherein two water pipes 3 are fixedly mounted on the surface of the protective cover 2, respectively close to the two ends of the protective cover 2, and the two water pipes 3 are oriented in completely opposite directions, wherein a heat conducting plate 4 is installed inside the protective cover 2, wherein the heat conducting plate 4 is configured to be annular, wherein the heat conducting plate 4 is sleeved on the surface of the thermal imager 1, wherein a water through hole 5 is provided on the surface of the heat conducting plate 4, such that the gaps on both sides of the heat conducting plate 4 are connected, wherein a heat conducting rod 6 is fixedly mounted on the surface of the heat conducting plate 4, wherein the heat conducting rod 6 is fixedly penetrated through the protective cover 2, wherein a semiconductor refrigeration plate 7 is fixedly mounted on the top of the heat conducting rod 6, wherein the cooling surface of the semiconductor refrigeration plate 7 is closely attached to the top of the heat conducting rod 6, and wherein a plurality of heat dissipation fins are provided on the heat conducting surface.

[0021] When in use, circulating water is introduced into one of the water pipes 3. When the circulating water enters between the protective cover 2 and the thermal imager 1, the circulating water will take away part of the heat on the surface of the thermal imager 1. However, the temperature of the circulating water will rise in the process of heat transfer. At this time, the semiconductor refrigeration sheet 7 is turned on. When the circulating water with rising temperature passes through the heat conducting plate 4, part of the heat is taken away by the heat conducting plate 4, the heat conducting rod 6 and the semiconductor refrigeration sheet 7. Then the circulating water with lowered water temperature is cooled again and finally discharged through another water pipe 3, which can ensure better heat dissipation effect.

[0022] There are multiple water holes 5 in a circular array on the surface of the heat conducting plate 4. Since the specific heat capacity of the circulating water is relatively large, a relatively long time is required during the heat transfer process. At this time, the water flow is divided into more and smaller parts through multiple water holes 5 to reduce the mass of the water flow, thereby achieving faster heat transfer and ensuring that when the water flows through the heat conducting plate 4, the temperature of the circulating water coming out is lower and the cooling effect is better.

[0023] The heat conducting plate 4 and the heat conducting rod 6 are fixed by welding. Both the heat conducting plate 4 and the heat conducting rod 6 are made of metallic silver. The metallic silver has excellent thermal conductivity, so it can extend the time during the heat transfer process.

[0024] A temperature detector 8 is fixedly installed inside the water pipe 3 for discharging water, and the temperature detector 8 is electrically connected to a controller 9. A controller 9 is fixedly installed on the surface of the protective cover 2, and the controller 9 is used to control the start and stop of the semiconductor refrigeration sheet 7. The controller 9 is electrically connected to the semiconductor refrigeration sheet 7.

[0025] Since the semiconductor refrigeration sheet 7 generates a large amount of heat during use, it requires more cooling fins to ensure its normal operation. It is easy to be damaged during use. Therefore, it is not recommended to use a large number of semiconductor refrigeration sheets 7 for direct cooling. The cost is relatively high, and for a higher temperature working environment, it also greatly affects the heat dissipation of the semiconductor refrigeration sheet 7. Therefore, only when the temperature detector 8 detects that the temperature of the circulating water used for cooling is higher than the set value, it proves that the heat dissipation capacity of the circulating water is insufficient. The controller 9 receives an electrical signal and then powers on the semiconductor refrigeration sheet 7 to increase the cooling speed.

[0026] The heat conducting plate 4 is installed in the middle of the protective cover 2 to ensure sufficient heat dissipation effect of the circulating water.

[0027] The housings of the protective cover 2 and the thermal imager 1 are both made of aluminum alloy metal, which has strong explosion-proof capability. The protective cover 2 and the thermal imager 1 are fixed by welding.

[0028] It should be noted that the utility model is an explosion-proof thermal imager that can quickly cool down. When in use, circulating water is introduced into one of the water pipes 3. When the circulating water enters between the protective cover 2 and the thermal imager 1, it will finally be discharged from the other water pipe 3. At this time, the temperature detector 8 detects the temperature of the circulating water. When the temperature is detected to be higher than the set value, it proves that the heat dissipation capacity of the circulating water is insufficient. The controller 9 receives an electrical signal and then energizes the semiconductor refrigeration plate 7. When the circulating water with rising temperature passes through the heat conducting plate 4, part of the heat is taken away by the heat conducting plate 4, the heat conducting rod 6 and the semiconductor refrigeration plate 7. Since the specific heat capacity of the circulating water is relatively large, a relatively long time is required in the process of heat transfer. At this time, the water flow is divided into more and smaller parts through multiple water holes 5, so as to reduce the mass of the water flow, thereby achieving faster heat transfer, ensuring that when the water flows through the heat conducting plate 4, the temperature of the circulating water coming out is lower, and the cooling effect is better.

[0029] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. An explosion-proof thermal imager capable of rapid cooling, comprising a thermal imager (1), a protective cover (2) being fixedly mounted on the surface of the thermal imager (1), a certain gap being provided between the protective cover (2) and the thermal imager (1), two water pipes (3) being fixedly mounted on the surface of the protective cover (2), respectively close to the two ends of the protective cover (2), characterized in that: A heat conducting plate (4) is installed inside the protective cover (2), the heat conducting plate (4) is sleeved on the surface of the thermal imager (1), a water through hole (5) is opened on the surface of the heat conducting plate (4), a heat conducting rod (6) is fixedly installed on the surface of the heat conducting plate (4), the heat conducting rod (6) is fixedly passed through the protective cover (2), and a semiconductor cooling plate (7) is fixedly installed on the top of the heat conducting rod (6).

2. The explosion-proof thermal imager capable of rapid cooling according to claim 1, characterized in that: The water through holes (5) are provided in a plurality and arranged in an annular array on the surface of the heat conducting plate (4).

3. The explosion-proof thermal imager capable of rapid cooling according to claim 1, characterized in that: The heat conducting plate (4) and the heat conducting rod (6) are fixed by welding, and the heat conducting plate (4) and the heat conducting rod (6) are both made of metallic silver.

4. The explosion-proof thermal imager capable of rapid cooling according to claim 1, characterized in that: A temperature detector (8) is fixedly installed inside the water pipe (3) for discharging water, and a controller (9) is fixedly installed on the surface of the protective cover (2). The controller (9) is used to control the start and stop of the semiconductor refrigeration plate (7).

5. The explosion-proof thermal imager capable of rapid cooling according to claim 1, characterized in that: The heat conducting plate (4) is installed in the middle of the protective cover (2).

6. The explosion-proof thermal imager capable of rapid cooling according to claim 1, characterized in that: The protective cover (2) and the thermal imager (1) are both made of aluminum alloy metal, and the protective cover (2) and the thermal imager (1) are fixed by welding.

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