An optical module
By designing a avoidance groove and welding structure in the optical module and combining thermally conductive materials, the problems of low heat dissipation performance and difficulty in miniaturization of existing optical modules are solved, and more efficient heat dissipation and smaller volume are achieved.
Patent Information
- Application Number
- CN202420662876.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-03-29
AI Technical Summary
The existing optical modules have low heat dissipation performance and are difficult to achieve miniaturization, which cannot meet the needs of optical communication equipment for miniaturization and efficient heat dissipation.
An optical module is designed, which includes an optical device, a circuit board and a base. A avoidance groove is provided on the circuit board. The optical device is fixed to the base through the avoidance groove, and electrically connected to the pad by welding the pins of the optical device. A thermally conductive solder or a thermally conductive adhesive layer can be used as a heat dissipation member.
By reducing the structural level and increasing the heat dissipation effect, the optical module is miniaturized and efficiently dissipated, and the stability and service life of the optical device are improved.
Smart Images
Figure CN222704766U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical communication, in particular to an optical module. Background Art
[0002] In the field of optical communications, optical devices need to be packaged into optical modules. As optical communication equipment and communication systems become increasingly miniaturized, the requirements for miniaturization and integration of optical modules are becoming increasingly higher. In addition, the assembly firmness and heat dissipation of optical devices directly determine whether the optical devices can exert their own optimal performance, making the structural design and assembly design of optical modules particularly critical. Existing optical modules generally mount optical devices on the copper plate area of the circuit board, and then use the upper shell and the lower shell to package the optical device and the circuit board. On the one hand, the copper plate is embedded on the circuit board for heat dissipation, which increases the cost of the circuit board. On the other hand, the large number of structural coverage levels leads to a larger volume for the optical module package, making it difficult to achieve miniaturization.
[0003] Therefore, it is very important for those skilled in the art to design an optical module with good heat dissipation and miniaturization. Utility Model Content
[0004] The technical problem to be solved by the embodiments of the utility model is to provide a miniaturized optical module with good heat dissipation performance, so as to solve the problem that the heat dissipation performance of the optical module in the prior art is low and it is difficult to achieve miniaturization.
[0005] The utility model discloses an optical module, which comprises: an optical device, a circuit board and a base; the circuit board is arranged on the base, a avoidance groove is arranged on the circuit board, the optical device passes through the avoidance groove and is fixed to the base, wherein soldering pads are arranged on both sides of the avoidance groove, pins are arranged on both sides of the optical device, and the pins are welded on the soldering pads to realize electrical connection between the optical device and the circuit board.
[0006] Optionally, a heat sink is further included, and the heat sink is arranged between the optical device and the base.
[0007] Optionally, a groove is provided on the base, and the heat sink is arranged in the groove.
[0008] Optionally, the heat sink is a thermally conductive solder, and the optical device is soldered to the base via the thermally conductive solder.
[0009] Optionally, the heat sink is a thermally conductive adhesive layer.
[0010] Optionally, a fixing plate is further included, wherein the fixing plate covers the optical device and is fixed to the base to fix the optical device on the base.
[0011] Optionally, the fixing plate is in an inverted U shape to avoid the optical device.
[0012] Optionally, both ends of the fixing plate are provided with mounting plates for fixing to the base.
[0013] Optionally, a screw is further included, a first fixing hole is arranged on the mounting plate, a second fixing hole is arranged on the base corresponding to the position of the first fixing hole, and the screw passes through the first fixing hole and the second fixing hole in sequence and is fixed.
[0014] Optionally, a third fixing hole is provided on the circuit board at a position corresponding to the first fixing hole, and the screw passes through the first fixing hole, the third fixing hole and the second fixing hole in sequence and is fixed.
[0015] Compared with the prior art, the beneficial effect of the optical module provided by the embodiment of the utility model is that: by designing an optical module, including an optical device, a circuit board and a base; the circuit board is arranged on the base, and a avoidance groove is arranged on the circuit board, and the optical device is fixed to the base through the avoidance groove, wherein soldering pads are arranged on both sides of the avoidance groove, and pins are arranged on both sides of the optical device, and the pins are welded on the soldering pads; by arranging the avoidance groove on the circuit board, the optical device is directly fixed to the base, which effectively reduces the structural level, not only makes the structure more miniaturized, but also makes the heat dissipation effect of the optical device better; further, by arranging the pins of the optical device on both sides thereof and arranging the soldering pads on both sides of the avoidance groove, on the one hand, the connection stability of the optical device in the horizontal direction can be better, and on the other hand, the space occupied by the two in height can be reduced, making the optical module more stable and more miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The technical solution of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments, in which:
[0017] Figure 1 This is a schematic diagram of the structure of the optical module provided by the embodiment of the utility model Figure 1 ;
[0018] Figure 2 This is a schematic diagram of the structure of the optical module provided by the embodiment of the utility model Figure 2 ;
[0019] Figure 3 This is a schematic diagram of the structure of the optical module provided by the embodiment of the utility model Figure 3 ;
[0020] Figure 4 It is a structural schematic diagram of a fixing plate provided in an embodiment of the utility model.
[0021] The reference numerals in the figures are:
[0022] 1. Optical device; 2. Circuit board; 3. Base; 4. Heat sink; 5. Fixing plate; 11. Pin; 21. Avoidance groove; 22. Third fixing hole; 31. Groove; 32. Second fixing hole; 51. Mounting plate; 511. First fixing hole. DETAILED DESCRIPTION
[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, a preferred embodiment of the present utility model is described in detail.
[0024] like Figures 1 to 4 As shown, the utility model provides a specific embodiment of an optical module.
[0025] An optical module, reference Figure 1 and Figure 2 The optical module includes: an optical device 1, a circuit board 2 and a base 3; the circuit board 2 is arranged on the base 3, and an avoidance groove 21 is arranged on the circuit board 2. The optical device 1 passes through the avoidance groove 21 and is fixed to the base 3, wherein soldering pads are arranged on both sides of the avoidance groove 21, and pins 11 are arranged on both sides of the optical device 1, and the pins 11 are welded on the soldering pads to realize the electrical connection between the optical device 1 and the circuit board 2.
[0026] Specifically, refer to Figure 1 and Figure 2 The optical module is a modular optical component that integrates an optical device 1, which is generally used in optical communication systems, data center interconnection and other optical applications. The optical device 1 in this embodiment can be a laser for converting electrical signals into optical signals or a receiver for converting optical signals into electrical signals, etc.
[0027] Further, refer to Figure 1 and Figure 2 The base 3 is used to install the circuit board 2 and the optical device 1. The circuit board 2 is fitted on the base 3 with the electronic components (such as control chips, resistors, capacitors, etc.) facing upward. The circuit board 2 is provided with an avoidance groove 21. On the one hand, the avoidance groove 21 can be used to avoid the optical device 1 so that the optical device 1 is directly connected and fixed to the base 3, thereby reducing the structural level of the entire optical module to reduce the overall size of the optical module to adapt to the miniaturization development of the optical module. On the other hand, when the optical module is placed in the avoidance groove 21, the avoidance groove 21 can limit the optical module in a horizontal position, wherein the avoidance groove 21 can be a rectangular groove adapted to the size of the optical device 1, or it can be a U-shaped groove adapted to the width of the optical device 1.
[0028] Further, refer to Figure 1 and Figure 2The pins 11 of the optical device 1 are arranged on both sides of the optical device 1 to facilitate connection with the circuit board 2. Solder pads are arranged on both sides of the avoidance groove 21 corresponding to the positions of the pins 11 of the optical device 1 for welding the optical device 1. By arranging the pins 11 of the optical device 1 on both sides for welding, on the one hand, the connection stability of the optical device 1 in the horizontal direction can be better, and on the other hand, the space occupied by the welding of the two in height can be reduced, making the optical module more stable and more miniaturized.
[0029] In one embodiment, reference Figure 2 The optical module further includes a heat sink 4 , which is disposed between the optical device 1 and the base 3 .
[0030] Specifically, refer to Figure 2 The optical device 1 is prone to generate heat during operation, and excessively high temperature will affect the operating performance and stability of the device, and even cause damage to the device. By arranging a heat sink 4 between the optical device 1 and the base 3, the heat on the optical device 1 can be transferred to the base 3 more quickly and dissipated to the outside, so that the optical device 1 is always within a suitable operating temperature range, thereby improving the operating performance of the optical module and increasing the service life of the optical device 1.
[0031] In one embodiment, reference Figure 2 A groove 31 is provided on the base 3 , and the heat sink 4 is arranged in the groove 31 .
[0032] Specifically, refer to Figure 2 By setting a groove 31 on the base 3, the heat sink 4 can be placed in the groove 31. On the one hand, the groove 31 can limit the heat sink 4 to control the coverage of the heat sink 4, thereby preventing the heat sink 4 from overflowing to the periphery without rules and restrictions. On the other hand, by setting the heat sink 4 in the groove 31 formed by the concave of the base 3, the overall structural level of the optical module can be effectively reduced, making the optical module thinner and more suitable for its miniaturization development.
[0033] Solution 1
[0034] refer to Figure 2 The heat sink 4 is a thermally conductive solder, and the optical device 1 is soldered to the base 3 by the thermally conductive solder.
[0035] Specifically, refer to Figure 2 Thermal conductive solder is a solder with good thermal conductivity, which contains components that can effectively transfer heat, such as silver-containing solder, copper-containing solder, aluminum-containing solder or other alloy solders. Since the metal in the solder has good thermal conductivity, the heat of the optical device 1 can be transferred to the base 3, and then dissipated from the base 3 to the external environment to ensure that the optical device 1 is in a suitable working temperature environment.
[0036] refer to Figure 2 When soldering, the thermal conductive solder can be placed in the groove 31 on the base 3 first, and then the optical device 1 and the thermal conductive solder can be eutectic soldered by using eutectic soldering equipment to fix the optical device 1 on the base 3.
[0037] Since the thermally conductive solder has a strong adhesive force after eutectic welding, the optical device 1 can be firmly welded to the base 3, so there is no need to perform additional fixation on the optical device 1.
[0038] Solution 2
[0039] refer to Figure 3 , the heat sink 4 is a thermal conductive adhesive layer.
[0040] Specifically, refer to Figure 3 Thermal conductive adhesive is a kind of gel material with good thermal conductivity, such as thermal conductive silicone grease. When installing the optical device 1 and the base 3, the thermal conductive adhesive layer can be filled into the groove 31 of the base 3 first, and then the optical device 1 is bonded to the thermal conductive adhesive layer; the heat generated by the optical device 1 can be transferred to the base 3 through the thermal conductive adhesive layer, and dissipated from the base 3 to the external environment, so as to ensure that the optical device 1 is in a suitable working temperature environment.
[0041] It should be noted that, in this solution, a soft thermally conductive gasket can be used instead of the thermally conductive adhesive layer to dissipate heat.
[0042] In this scheme, reference Figure 3 The optical module also includes a fixing plate 5 , which covers the optical device 1 and is fixed to the base 3 to fix the optical device 1 on the base 3 .
[0043] Specifically, refer to Figure 3 Since the bonding strength of the thermal conductive adhesive layer is not enough, in order to make the optical device 1 installed more firmly on the base 3, a fixing plate 5 is also provided. The fixing plate 5 is an inverted U-shape, so as to form an escape space under the fixing plate 5 for evading the optical device 1. When the fixing plate 5 covers the optical device 1, the top surface and the end surfaces at both ends of the optical device 1 can be wrapped and fixed to achieve further positioning of the optical device 1.
[0044] Further, refer to Figure 3 and Figure 4 Both ends of the fixing plate 5 are provided with mounting plates 51 for fixing to the base 3 .
[0045] Specifically, refer to Figure 3 and Figure 4A first fixing hole 511 is provided on the mounting plates 51 at both ends of the fixing plate 5, and a second fixing hole 32 is provided on the base 3 at a position corresponding to the first fixing hole 511. Screws can be passed through the first fixing hole 511 and the second fixing hole 32 in sequence and tightened to fix the fixing plate 5 and the base 3, thereby fixing the optical device 1 on the base 3.
[0046] In one embodiment, reference Figure 3 and Figure 4 A third fixing hole 22 is provided on the circuit board 2 at a position corresponding to the first fixing hole 511. Screws can be passed through the first fixing hole 511, the third fixing hole 22 and the second fixing hole 32 in sequence and tightened to fix the fixing plate 5, the circuit board 2 and the base 3 together, and then the optical device 1 is also fixed on the base 3.
[0047] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present utility model.
Claims
1. An optical module, characterized in that: include: An optical device, a circuit board and a base; the circuit board is arranged on the base, a avoidance groove is arranged on the circuit board, the optical device passes through the avoidance groove and is fixed to the base, wherein soldering pads are arranged on both sides of the avoidance groove, pins are arranged on both sides of the optical device, and the pins are welded on the soldering pads to realize electrical connection between the optical device and the circuit board.
2. The optical module according to claim 1, characterized in that: A heat sink is also included, and the heat sink is arranged between the optical device and the base.
3. The optical module according to claim 2, characterized in that: The base is provided with a groove, and the heat sink is arranged in the groove.
4. The optical module according to claim 2, characterized in that: The heat sink is a thermally conductive solder, and the optical device is soldered on the base via the thermally conductive solder.
5. The optical module according to claim 2, characterized in that: The heat sink is a thermally conductive adhesive layer.
6. The optical module according to claim 5, characterized in that: It also includes a fixing plate, which covers the optical device and is fixed to the base to fix the optical device on the base.
7. The optical module according to claim 6, characterized in that: The fixing plate is in an inverted U shape so as to avoid the optical device.
8. The optical module according to claim 7, characterized in that: Both ends of the fixing plate are provided with mounting plates for fixing to the base.
9. The optical module according to claim 8, characterized in that: It also includes a screw. The mounting plate is provided with a first fixing hole. The base is provided with a second fixing hole at a position corresponding to the first fixing hole. The screw passes through the first fixing hole and the second fixing hole in sequence and is fixed.
10. The optical module according to claim 9, characterized in that: A third fixing hole is arranged on the circuit board at a position corresponding to the first fixing hole, and the screw passes through the first fixing hole, the third fixing hole and the second fixing hole in sequence and is fixed.