Novel combined via hole applied to PCB

Abstract

The utility model is applicable to the technical field of printed circuit boards, and provides a novel combined via hole applied to a PCB, which comprises a PCB, the combined via hole is arranged on the PCB and comprises a non-metallized via hole and at least two metallized via holes, the non-metallized via hole is a hollow area, and the metallized via holes are arranged in the non-metallized via hole. A hollowed-out area is arranged on the substrate, a copper coating prohibition area is arranged on the outer periphery of the hollowed-out area, a scraping brightening area is arranged on the outer periphery of the copper coating prohibition area, a copper coating plane is arranged on the outer periphery of the scraping brightening area, and the metalized via holes are uniformly distributed on the periphery of the scraping brightening area. Therefore, according to the novel combined via hole applied to the PCB, the problem of solder skips is solved, the efficiency is improved, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit boards, in particular to a novel combined via hole applied to a PCB. Background Art

[0002] In the daily circuit board mounting process, plug-in components are often not easy to automatically mount, so in most cases they are manually soldered. Since it is a manual operation, problems are inevitable, such as pin leaks. In mass-produced equipment, if there is a pin leak, the performance of the equipment will not be good, and it will be time-consuming and labor-intensive to troubleshoot, resulting in cost waste.

[0003] In the past, the via design for plug-in devices was to make the inside of the via and the edge pads metallized as a whole. The defect of this type of via is that the pin of the plug-in device only slightly touches the via wall when it is not soldered, and the signal link on the circuit board will be turned on, but in fact it is not completely in contact, which buries hidden dangers in the later stage. If the via is simply changed to non-metallized and only soldered on the peripheral pad, the stability of the device pin will be at risk, and the tin penetration rate of the via cannot be guaranteed.

[0004] In summary, the existing technology obviously has inconveniences and defects in practical use, so it is necessary to improve it. Utility Model Content

[0005] In view of the above-mentioned defects, the purpose of the utility model is to provide a new type of combined vias applied to PCB to solve the problem of solder leaks, improve efficiency and reduce costs.

[0006] In order to achieve the above-mentioned purpose, the utility model provides a new type of combined via applied to a PCB, including a PCB circuit board, wherein the combined via is arranged on the PCB circuit board, including a non-metallized via and at least two metallized vias, wherein the non-metallized via is a hollowed-out area, a prohibited copper-cladding area is arranged on the outer periphery of the hollowed-out area, a scraped-out area is arranged on the outer periphery of the prohibited copper-cladding area, a copper-clad plane is arranged on the outer periphery of the scraped-out area, and the metallized vias are evenly distributed around the scraped-out area.

[0007] According to the novel combined via hole applied to PCB described in the utility model, the non-metallized via hole is a circular through hole.

[0008] According to the novel combined via applied to a PCB described in the utility model, the diameter of the non-metallized via is 0.25 mm larger than the diameter of the plug-in pin on the PCB circuit board.

[0009] According to the novel combined via applied to a PCB described in the utility model, the width of the prohibited copper-cladding area is at least 0.2 mm.

[0010] According to the novel combined via hole applied to PCB described in the utility model, the diameter of the scraped bright area is twice the diameter of the non-metallized via hole.

[0011] According to the novel combined via hole applied to PCB described in the utility model, the metallized via hole is a circular through hole.

[0012] According to the novel combined via applied to PCB described in the utility model, the minimum distance between the outer periphery of the metallized via and the outer periphery of the scraped area is 0.3 mm.

[0013] According to the novel combined via hole applied to PCB described in the utility model, the scraped bright area is a soldering pad.

[0014] According to the novel combined via applied to PCB described in the utility model, the scraped bright area is a plane without copper covering.

[0015] According to the novel combined via applied to PCB described in the utility model, the material of the metallized via is copper, iron or aluminum.

[0016] The utility model provides a novel combination via applied on a PCB, including a PCB circuit board, wherein the combination via is arranged on the PCB circuit board, including a non-metallized via and at least two metallized vias, wherein the non-metallized via is a hollowed-out area, and a prohibited copper-cladding area, a scraped-bright area and a copper-clad plane are sequentially arranged on the outer periphery of the hollowed-out area, wherein the prohibited copper-cladding area prevents the pins of the plug-in on the PCB circuit board from being connected to the electrical signals of the non-metallized via, and the metallized vias are evenly distributed around the scraped-bright area, wherein the diameter of the metallized via is smaller than the width of the scraped-bright area, and the pins of the plug-in on the PCB circuit board are connected to the metallized vias, and the plug-in is connected to the signals of the PCB circuit board. It is ensured that when the plug-in is placed in the non-metallized via and the pins of the plug-in are leaked to the metallized via, the plug-in and the PCB circuit board are not conductive, thereby solving the problem of leaked soldering, improving efficiency and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The utility model is a schematic structural diagram of a novel combined via provided by the utility model and applied to a combined via on a PCB. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0019] like Figure 1 As shown, the utility model provides a novel combination via 100 applied to a PCB, including a PCB circuit board, the combination via 100 is arranged on the PCB circuit board, including a non-metallized via 1 and at least two metallized vias 2, the non-metallized via 1 is a hollow area 1, the pins of the plug-in on the PCB circuit board are plugged into the hollow area 1, the outer periphery of the hollow area 1 is provided with a prohibited copper coating area 3, the outer periphery of the prohibited copper coating area 3 is provided with a scraped bright area 4, the prohibited copper coating area 3 forms an avoidance area between the scraped bright area 4 and the non-metallized via 1, to avoid the insertion The pin of the component is connected to the electrical signal of the non-metallized via 1, and the outer periphery of the scraped area 4 is provided with a copper-clad plane 5. The metallized vias 2 are evenly distributed around the scraped area 4. The number of metallized vias 2 can be two, three or any number. The number of metallized vias 2 is set according to the scraped area 4. When the plug-in on the PCB circuit board is placed in the non-metallized via 1, the pin of the plug-in is welded to the metallized via 2 to ensure that the tin can penetrate into the metallized via 2, ensuring the reliability of welding. When the pin of the plug-in is leaked from the metallized via 2, the plug-in and the PCB circuit board are not conductive. When the pin of the plug-in is leaked, the circuit is not conductive, and accurate identification is achieved. It is suitable for any PCB circuit board with a plug-in.

[0020] Preferably, the non-metallized via hole 1 is a circular through hole, and the circular through hole non-metallized via hole 1 matches the pin of the plug-in on the PCB circuit board and has good applicability.

[0021] Preferably, the diameter of the non-metallized via hole 1 is 0.25 mm larger than the diameter of the plug-in pin on the PCB circuit board, so as to ensure that the pin of the plug-in is plugged into the PCB circuit board.

[0022] Preferably, the width of the prohibited copper-clad area 3 is at least 0.2 mm, and the prohibited copper-clad area 3 forms an avoidance zone between the scratched area 4 and the non-metallized via 1 to avoid electrical signal connection between the pins of the plug-in and the non-metallized via 1.

[0023] Preferably, the diameter of the scraped bright area 4 is twice the diameter of the non-metallized via 1 .

[0024] Preferably, the metallized via hole 2 is a circular through hole, and the circular through hole metallized via hole 2 matches the non-metallized via hole 1 and has good applicability.

[0025] Preferably, the minimum distance between the outer periphery of the metallized via 2 and the outer periphery of the scraped area 4 is 0.3 mm, and the diameter of the metallized via 2 does not exceed the width of the scraped area 4, ensuring that the entire metallized via 2 is located in the scraped area 4.

[0026] Preferably, the scraped bright area 4 is a pad, and after the pins of the plug-in on the PCB circuit board are plugged into the PCB circuit board through the non-metallized via 1, the pins of the plug-in are welded to the metallized via 2 on the pad to achieve electrical signal connection.

[0027] Preferably, the scraped bright area 4 is a flat surface without copper coating.

[0028] Preferably, the material of the metallized via 2 is copper, iron or aluminum, and the metallized via 2 is welded to the pin of the plug-in, ensuring that tin can penetrate into the metallized via 2, thereby ensuring the reliability of welding.

[0029] Specifically, in one embodiment provided by the utility model, a non-metallized via 1 and a metallized via 2 are included, the non-metallized via 1 is a hollowed-out area 1, the pins of the plug-in on the PCB circuit board are plugged into the hollowed-out area 1, the pins of the plug-in on the PCB circuit board are 1 mm, the diameter of the non-metallized via 1 is set to 1.25 mm, the diameter of the hollowed-out area 1 is 1.25 mm, the outer periphery of the hollowed-out area 1 is provided with a prohibited copper cladding area 3, the diameter of the prohibited copper cladding area 3 is set to 1.35 mm, the outer periphery of the prohibited copper cladding area 3 is provided with a scraped-out area 4, the diameter of the scraped-out area 4 is set to 3.95 mm, and the prohibited copper cladding area 3 is given An avoidance zone is formed between the scraped area 4 and the non-metallized via 1 to avoid electrical signal connection between the pin of the plug-in and the non-metallized via 1. A copper-clad plane 5 is provided on the outer periphery of the scraped area 4. The metallized vias 2 are evenly distributed around the scraped area 4. The diameter of the metallized via 2 is set to 0.7 mm. The scraped area 4 is a pad for the non-metallized via. After the pin of the plug-in is inserted into the non-metallized via 1, the pin of the plug-in is welded to the metallized via 2 to ensure that tin can penetrate into the metallized via 2, thereby ensuring the reliability of welding. When the pin of the plug-in is leaked from the metallized via 2, the plug-in and the PCB circuit board are not conductive, thereby achieving accurate identification.

[0030] In summary, the utility model provides a new type of combined via applied to PCB, including a PCB circuit board, wherein the combined via is arranged on the PCB circuit board, including a non-metallized via and at least two metallized vias, wherein the non-metallized via is a hollowed-out area, and a prohibited copper-cladding area, a scraped-bright area and a copper-clad plane are sequentially arranged on the outer periphery of the hollowed-out area, wherein the prohibited copper-cladding area prevents the pins of the plug-in on the PCB circuit board from being connected to the electrical signals of the non-metallized via, and the metallized vias are evenly distributed around the scraped-bright area, wherein the diameter of the metallized via is smaller than the width of the scraped-bright area, and the pins of the plug-in on the PCB circuit board are connected to the metallized vias, and the plug-in is connected to the signals of the PCB circuit board. It is ensured that when the plug-in is placed in the non-metallized via and the pins of the plug-in are leaked to the metallized via, the plug-in and the PCB circuit board are not conductive, thereby, the utility model provides a new type of combined via applied to PCB, which solves the problem of leaked soldering, improves efficiency and reduces costs.

[0031] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field can make various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A novel combined via applied to a PCB, comprising a PCB circuit board, wherein the combined via is arranged on the PCB circuit board, and characterized in that: It includes a non-metallized via and at least two metallized vias, wherein the non-metallized via is a hollowed-out area, a prohibited copper-cladding area is arranged on the outer periphery of the hollowed-out area, a scraped-bright area is arranged on the outer periphery of the prohibited copper-cladding area, a copper-clad plane is arranged on the outer periphery of the scraped-bright area, and the metallized vias are evenly distributed around the scraped-bright area.

2. The novel combined via applied to PCB according to claim 1 is characterized in that: The non-metallized via hole is a circular through hole.

3. The novel combined via applied to PCB according to claim 2 is characterized in that: The diameter of the non-metallized via hole is 0.25 mm larger than the diameter of the plug-in pin on the PCB circuit board.

4. The novel combined via applied to PCB according to claim 1 is characterized in that: The width of the prohibited copper coating area is at least 0.2 mm.

5. The novel combined via applied to PCB according to claim 1 is characterized in that: The diameter of the scraped area is twice the diameter of the non-metallized via hole.

6. The novel combined via applied to PCB according to claim 1 is characterized in that: The metallized via hole is a circular through hole.

7. The novel combined via applied to PCB according to claim 6 is characterized in that: The minimum distance between the outer periphery of the metallized via hole and the outer periphery of the scraped area is 0.3 mm.

8. The novel combined via applied to PCB according to claim 1 is characterized in that: The scraped bright area is a soldering pad.

9. The novel combined via applied to PCB according to claim 1 is characterized in that: The scraped bright area is a non-copper-covered plane.

10. The novel combined via used on PCB according to any one of claims 1 to 9, characterized in that: The material of the metallized via is copper, iron or aluminum.

Images