Switching device, switch and dimming equipment

Abstract

The utility model relates to a switching device, a switch and dimming equipment, the switching device comprises a first circuit board, a second circuit board, a first component and a second component, the first component is arranged on the first circuit board, the second component is arranged on the second circuit board, and the first circuit board is vertically inserted into the second circuit board. The switching device provided by the utility model has a better heat dissipation effect on the first component.

Description

Technical Field

[0001] The present application relates to the field of circuit technology, and in particular to a switch device, a switch and a dimming device. Background Art

[0002] During the operation of equipment containing metal-oxide-semiconductor field-effect transistors, or MOS tubes, or thyristors, the field-effect transistors or thyristors generate severe heat and require special heat dissipation treatment.

[0003] In the conventional technology, heat is dissipated by means of structural heat conduction, that is, a structural component is covered on a circuit board provided with a MOS tube or a thyristor, and heat is dissipated from the MOS tube or the thyristor through the structural component.

[0004] However, the heat dissipation effect through structural parts is poor and the structural cost is high. Utility Model Content

[0005] Based on this, it is necessary to provide a switching device, a switch and a dimming device to address the above technical problems.

[0006] On the one hand, an embodiment of the present application provides a switch device, including a first circuit board, a second circuit board, a first component and a second component, the first component is arranged on the first circuit board, the second component is arranged on the second circuit board, and the first circuit board is vertically inserted into the second circuit board.

[0007] In one embodiment, the first conductive layer of the first circuit board is exposed.

[0008] In one embodiment, the thickness of the first conductive layer is greater than or equal to 2 ounces.

[0009] In one embodiment, a second conductive layer is stacked on the first conductive layer.

[0010] In one embodiment, the area of ​​the pins connecting the first circuit board and the second circuit board is larger than the first preset area.

[0011] In one embodiment, the first circuit board includes a via hole, and the size of the via hole is 0.5 mm.

[0012] In one embodiment, the switch device further comprises: a shell; the shell is covered on the second circuit board, a vent is formed on the shell, and a horizontal direction of the first circuit board is consistent with a direction of the vent.

[0013] In one of the embodiments, the first component is a surface mount device, and the area of ​​the heat sink of the surface mount device is larger than the second preset area.

[0014] In a second aspect, an embodiment of the present application provides a switch, comprising a switch device, a third circuit board, a third component and a control panel as provided in the first aspect above; the third component is arranged on the third circuit board, and the third circuit board is arranged on one side of the control panel, and the second circuit board in the switch device is arranged on a side of the third circuit board away from the control panel, and the second circuit board is electrically connected to the third circuit board.

[0015] In a third aspect, an embodiment of the present application further provides a dimming device, comprising a switch device as provided in the first aspect above.

[0016] The embodiments of the present application provide a switch device, a switch and a dimming device. The switch device includes a first circuit board, a second circuit board, a first component and a second component. The first component is arranged on the first circuit board, the second component is arranged on the second circuit board, and the first circuit board is vertically inserted on the second circuit board. In this embodiment, the first component is arranged on the first circuit board, the second component is arranged on the second circuit board, and the first circuit board is vertically inserted on the second circuit board. In this way, only the first component is arranged on the first circuit board, and there are no other components blocking it around, so that a better gas convection heat conduction effect can be obtained, thereby improving the heat dissipation effect of the first component. In addition, in this embodiment, the components included in the switch transposition are easy to obtain and low in cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For different technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram of a structural heat conduction method provided in one embodiment of the present application;

[0019] Figure 2 A schematic diagram of the structure of a switch device provided in one embodiment of the present application;

[0020] Figure 3 A schematic diagram of the structure of a first circuit board provided in one embodiment of the present application;

[0021] Figure 4 A schematic structural diagram of a first circuit board provided in another embodiment of the present application;

[0022] Figure 5 A schematic diagram of the structure of a switch device provided in another embodiment of the present application;

[0023] Figure 6 A schematic diagram of the structure of a switch provided in another embodiment of the present application.

[0024] Description of reference numerals:

[0025] 1. Heat sink; 2. Structural parts; 3. Pins of MOS tube or thyristor; 10. Switch device; 100. First circuit board; 110. First conductive layer; 120. Second conductive layer; 130. Pins; 140. Through hole; 200. Second circuit board; 300. First component; 400. Second component; 500. Housing; 600. Third circuit board; 610. Third component; 620. Control panel. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0028] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] First of all, before specifically introducing the technical solutions of the embodiments disclosed in the present application, the background technology or technical evolution context on which the embodiments of the present application are based is introduced. In the field of electronic devices, products containing metal-oxide-semiconductor field effect transistors, i.e., MOS tubes, or thyristors (silicon controlled rectifiers) are usually used. For example, high-voltage dimming products that use MOS tubes or thyristors to chopper dim the mains. However, such products cannot avoid an industry technical problem, that is, MOS tubes or thyristors generate severe heat during operation, and special heat dissipation treatment is required in the design.

[0030] In the conventional technology, the heat dissipation of MOS tubes or thyristors is carried out by means of structural heat conduction, that is, by covering the circuit board with the MOS tubes or thyristors, such as Figure 1 As shown, the heat sink 1 of the MOS tube or thyristor is arranged on the structural member 2 through a thermally conductive adhesive, and the pins 3 of the MOS tube or thyristor are welded on a circuit board (not shown in the figure), and the MOS tube or thyristor is cooled by the structural member 2. However, the conventional technology uses the following disadvantages in the heat dissipation method of structural parts: 1. The MOS tube or thyristor is welded on the circuit board, and other devices are welded on the circuit board, that is, the MOS tube or thyristor is surrounded by devices, which does not utilize the convection heat conduction of the gas, resulting in poor heat dissipation effect; 2. When designing the MOS tube or thyristor, the cost of structural mold opening is high, and the processes such as pasting thermal conductive glue and locking increase the product cost; 3. When adding structural parts, the MOS tube or thyristor needs to be set on the structural parts first, so that the device is too heavy, and the MOS tube or thyristor with the structural parts needs to be manually welded on the circuit board, which has low production efficiency, and the post-welding is prone to produce residual foreign matter such as tin beads, which reduces the reliability of the equipment; 4. The structural parts are covered on the circuit board, and the structural parts will block the devices on the circuit board. When the MOS tube or thyristor or other devices on the circuit board are damaged, it is difficult to repair and takes a long time. In this regard, the present application provides a switch device.

[0031] The technical solution provided by the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments.

[0032] See also Figure 2 An embodiment of the present application provides a switch device 10, which includes a first circuit board 100, a second circuit board 200, a first component 300 and a second component 400. The first component 300 is arranged on the first circuit board 100, the second component 400 is arranged on the second circuit board 200, and the first circuit board 100 is vertically inserted into the second circuit board 200.

[0033] The first circuit board 100 may be a printed circuit board (PCB), and the number of circuit board layers included in the first circuit board 100 is at least two. The material of the first circuit board 100 may be a high temperature resistant board material FR4. This embodiment does not limit the type and material of the first circuit board 100, as long as its function can be achieved. The type and material of the second circuit board 200 may be the same as or different from the type and material of the first circuit board 100, and this embodiment does not limit this, as long as its function can be achieved.

[0034] The first component 300 refers to a component with a large amount of heat in the switch device 10. This embodiment does not limit the type and structure of the first component 300, as long as its function can be achieved. Optionally, the first component 300 can be a switch component. The second component 400 refers to other components other than the first component 300 of the switch device 10 in order to achieve the switching function, that is, the second component 400 can include multiple components. The second component 400 may include a capacitor component, an inductor component or a resistor component for protecting the first component 300, an indicator light component for providing an indication, a control chip for controlling the operation of the first component 300, etc. This embodiment does not limit the type of the second component 400, as long as its function can be achieved.

[0035] The first component 300 is arranged on the first circuit board 100, the second component 400 is arranged on the second circuit board 200, and the first circuit board 100 is vertically inserted on the boundary of the second circuit board 200. In other words, the second circuit board 200 includes four boundaries, and when the second circuit board 200 is placed horizontally, the first circuit board 100 is perpendicular to any one of the four boundaries of the second circuit board 200. In this embodiment, the components in the switch device 10, the first component 300 and the second component 400 are arranged separately.

[0036] The first component 300 is arranged on the first circuit board 100 in different ways depending on the type of the first component 300. If the first component 300 is a patch component, the first component 300 is directly attached to the first circuit board 100. If the first component 300 is a pin component, the first component 300 is inserted into the first circuit board 100. The first circuit board 100 includes a first surface and a second surface facing away from the first surface. The first surface of the first circuit board 100 faces other auxiliary components 400. The first component 300 can be arranged on the first surface of the first circuit board 100 or on the second surface of the first circuit board 100.

[0037] The switch device 10 provided in the embodiment of the present application includes a first circuit board 100, a second circuit board 200, a first component 300 and a second component 400, wherein the first component 300 is arranged on the first circuit board 100, the second component 400 is arranged on the second circuit board 200, and the first circuit board 100 is vertically inserted on the second circuit board 200. In this embodiment, the first component 300 is arranged on the first circuit board 100, the second component 400 is arranged on the second circuit board 200, and the first circuit board 100 is vertically inserted on the second circuit board 200, so that only the first component 300 is arranged on the first circuit board 100, and there is no other device blocking it around, so that a good gas convection heat conduction effect can be obtained, thereby improving the heat dissipation effect of the first component 300. In addition, in this embodiment, the devices included in the switch device 10 are easy to obtain and low in cost. In addition, the first circuit board 100 is vertically inserted into the second circuit board 200 and will not block the second component 400 on the second circuit board 200, so that when the first component 300 or the second component 400 is damaged, it is easy to repair.

[0038] In one embodiment, Figure 3 As shown, the first conductive layer 110 of the first circuit board 100 is exposed.

[0039] The structure of the first circuit board 100 includes a circuit and a drawing, a dielectric layer, a via and solder mask ink. The circuit is a tool for conducting the first component 300 arranged on the first circuit board 100. The dielectric layer (substrate) is used to maintain the insulation between the circuit and each layer. The via can make the circuits of two or more layers conduct to each other. The circuit is the first conductive layer 110, and the solder mask ink is arranged on the first conductive layer 110. In this embodiment, the solder mask ink on the first conductive layer 110 is subjected to a windowing treatment, that is, the solder mask ink on the first conductive layer 110 is removed, so that the first conductive layer 110 is exposed. The first circuit board 100 includes a first surface and a second surface, and the solder mask ink on the first surface and the second surface can be subjected to a windowing treatment, so that the first conductive layer 110 on the first surface and the first conductive layer 110 on the second surface are both exposed.

[0040] In an optional embodiment, the conductive material of the first conductive layer 110 is copper, that is, the copper sheet in the first circuit board 100 is exposed.

[0041] In this embodiment, the first conductive layer 110 of the first circuit board 100 is exposed, which can increase the heat dissipation effect of the first circuit board 100 on the first component 300 , thereby improving the practicality and reliability of the switch device 10 .

[0042] In one embodiment, the thickness of the first conductive layer 110 is greater than or equal to 2 ounces.

[0043] The thickness of the first conductive layer 110 is set to 2 ounces or thicker. In the case where the thickness of the original first conductive layer 110 in the first circuit board 100 is less than 2 ounces, the thickness of the first conductive layer 110 can be increased. Specifically, a conductive layer made of the same material as the first conductive layer 110 can be added on the first conductive layer 110 so that the total thickness is greater than or equal to 2 ounces.

[0044] In this embodiment, the thickness of the first conductive layer 110 is set to be greater than or equal to 2 ounces, which can increase the thickness of the first circuit board 100, thereby increasing the cross-sectional area of ​​the first circuit board 100 and improving the heat dissipation effect of the first circuit board 100 on the first component 300.

[0045] Please continue to see Figure 3 In one embodiment, a second conductive layer 120 is stacked on the first conductive layer 110 .

[0046] The second conductive layer 120 is stacked on the exposed first conductive layer 110 of the first circuit board 100 to increase the thickness of the conductive layer.

[0047] In an optional embodiment, the conductive material of the second conductive layer 120 is tin, that is, a layer of tin is sprayed on the first conductive layer 110. Tin has a low melting point and can be quickly melted and fixed on the first conductive layer 110. In addition, tin can maintain good stability at high temperatures, which can improve the reliability of the first circuit board 100 in dissipating heat for the first component 300.

[0048] In this embodiment, a second conductive layer 120 is stacked on the first conductive layer 110 of the first circuit board 100, which can increase the thickness of the conductive layer on the first circuit board 100, thereby increasing the thermal conductive cross-sectional area, enhancing the heat dissipation effect, and further improving the practicality and reliability of the switch device 10.

[0049] In one embodiment, Figure 4 As shown, the area of ​​the pins 130 connecting the first circuit board 100 and the second circuit board 200 is larger than the first preset area.

[0050] The pins 130 connected between the first circuit board 100 and the second circuit board 200 include a current main loop pin, through which current is provided to the first component 300 on the first circuit board 100, so that the first component 300 can work. The area of ​​the pins 130 connected between the first circuit board 100 and the second circuit board 200 is greater than the first preset area. The first preset area refers to the area of ​​the pins 130 between the first circuit board 100 and the second circuit board 200 designed under normal circumstances. In this embodiment, the area of ​​the pins 130 connected between the first circuit board 100 and the second circuit board 200 is increased to be greater than the first preset area. Figure 4 The area with a circle (conducting hole) is the area where the first conductive layer 110 of the first circuit board 100 is located, and the area of ​​the pin 130 connected to the first conductive layer 110 (the pin 130 connected between the first circuit board 100 and the second circuit board 200) is larger than Figure 4 area of ​​another pin in the .

[0051] In this embodiment, the area of ​​the current main loop pin connecting the first circuit board 100 and the second circuit board 200 is set to be larger than the first preset area, which can increase the current flow rate, thereby reducing the heat generated by the first component 300, so that the switching device 10 has higher practicality and reliability.

[0052] In an optional embodiment, the pin 130 connecting the first circuit board 100 and the second circuit board 200 is rectangular in shape, so that a wave soldering process boiler can be used, which can improve production efficiency and enhance the reliability of mounting between the first circuit board 100 and the second circuit board 200.

[0053] Please continue to see Figure 4 In one embodiment, the first circuit board 100 includes a via hole 140 , and the size of the via hole 140 is 0.5 mm.

[0054] A via hole 140 is provided on the first circuit board 100 , and the size of the via hole 140 is set to 0.5 mm.

[0055] In this embodiment, the size of the conductive hole 140 is set to 0.5 mm. Such a conductive hole 140 has good thermal conductivity, will not leak tin, has higher reliability, and can improve the heat dissipation effect of the first circuit board 100 on the first component 300.

[0056] In an optional embodiment, the via holes 140 in the first circuit board 100 are sprayed with tin but not covered with solder mask ink, which can improve the heat dissipation effect of the first circuit board 100 on the first component 300 .

[0057] In one embodiment, Figure 5As shown, the switch device 10 further includes a housing 500 , which is covered on the second circuit board 200 , and a vent (not shown in the figure) is opened on the housing 500 , and the horizontal direction of the first circuit board 100 is consistent with the direction of the vent.

[0058] The housing 500 is covered on the second circuit board 200, and the first circuit board 100, the second circuit board 200, the first component 300 and the second component 400 are all within the housing range of the housing 500. The shape of the housing 500 can be a cube, a cuboid, or other irregular three-dimensional structures. This embodiment does not limit the shape and material of the housing 500, and the user can set it according to the structure of the first circuit board 100, the second circuit board 200, the first component 300 and the second component 400 covered in the housing 500.

[0059] A vent is provided on the housing 500, and the horizontal direction of the first circuit board 100 refers to a direction in which the first circuit board 100 is parallel to the second circuit board 200. The horizontal direction of the first circuit board 100 is consistent with the direction of the vent.

[0060] In this embodiment, a housing 500 is provided on the second circuit board 200, and the first circuit board 100, the second circuit board 200, the first component 300, and the second component 400 are all within the housing range of the housing 500. The housing 500 can protect the first circuit board 100, the second circuit board 200, the first component 300, and the second component 400, thereby improving the practicality of the switch device 10. In addition, a vent is provided on the housing 500, and the direction of the vent is consistent with the horizontal direction of the first circuit board 100, thereby improving the heat dissipation effect of the first circuit board 100 on the first component 300.

[0061] In an optional embodiment, the ventilation opening may be provided on the housing 500 close to the first circuit board 100 .

[0062] In one embodiment, the first component 300 includes a thyristor or a field effect transistor.

[0063] The first component 300 provided in the switch device 10 may be a thyristor or a field effect transistor, namely, a MOS tube.

[0064] In this embodiment, two types of first components 300 are provided, and users can choose one according to actual application scenarios.

[0065] In one embodiment, the first component 300 is a surface mount device, and the area of ​​the heat sink of the surface mount device is larger than the second preset area.

[0066] The first component 300 is a SMD component, that is, the first component 300 is mounted on the first circuit board 100. The second preset area is the area of ​​the heat sink of the SMD component under normal circumstances. The area of ​​the heat sink of the SMD component is larger than the second preset area.

[0067] In this embodiment, the first component 300 is a surface mount component, and the area of ​​the heat sink of the surface mount component is set to be larger than the second preset area, which can increase the heat dissipation area of ​​the first component 300 and thus improve the heat dissipation effect of the first component 300.

[0068] See also Figure 6 An embodiment of the present application provides a switch, including a switch device 10, a third circuit board 600, a third component 610 and a control panel 620 as provided in the above embodiment, the third component 610 is arranged on the third circuit board 600, the third circuit board 600 is arranged on one side of the control panel 620, the second circuit board 200 in the switch device 10 is arranged on a side of the third circuit board 600 away from the control panel 620, and the second circuit board 200 is electrically connected to the third circuit board 600.

[0069] The type and material of the third circuit board 600 and the first circuit board 100 may be the same or different, and this embodiment does not limit this, as long as its function can be achieved. The third component 610 refers to other components included in the switch in order to achieve the switch function. The third component 610 may include multiple components, and the third component 610 may include a touch chip when the user touches the switch, a voice processing and control chip when the user voice controls the switch, etc. This embodiment does not limit the type of the third component 610, as long as it can achieve its function.

[0070] The control panel 620 includes two sides, the third circuit board 600 is arranged on one side of the control panel 620, and the other side of the control panel 620 is a user operation panel, that is, the user controls the switch by performing a trigger operation on the operation panel, wherein the user operation panel includes but is not limited to at least one touch area of ​​a touch area, a physical button, a voice acquisition module, an image acquisition module, etc. The third component 610 is arranged on the third circuit board 600. The third circuit board 600 includes a side close to the control panel 620 and a side away from the control panel 620. The third component 610 can be arranged on the side of the third circuit board 600 close to the control panel 620, and can also be arranged on the side of the third circuit board 600 away from the control panel 620, which is not limited in this embodiment.

[0071] The second circuit board 200 in the switch device 10 is electrically connected to the third circuit board 600 , and the second circuit board 200 is disposed on a side of the third circuit board 600 away from the control panel 620 .

[0072] The switch provided in the embodiment of the present application includes the switch device 10 provided in the above embodiment, the third circuit board 600, the third component 610 and the control panel 620, the third component 610 is arranged on the third circuit board 600, the third circuit board 600 is arranged on one side of the control panel 620, the second circuit board 200 in the switch device 10 is arranged on the side of the third circuit board 600 away from the control panel 620, and the second circuit board 200 is electrically connected to the third circuit board 600. The switch provided in this embodiment includes the switch device 10 provided in the above embodiment, and the switch has all the beneficial effects of the switch device 10, which will not be repeated here. In addition, the second component 400 and the third component 610 other than the first component 300 for realizing the switch function are respectively arranged on different circuit boards, so that the horizontal area of ​​the switch can be reduced, thereby making the switch more practical.

[0073] An embodiment of the present application provides a dimming device, which includes a switch device 10 or a switch as provided in the above embodiment.

[0074] The dimming device provided in the present application includes a switch device 10 or a switch, and the dimming device also has all the beneficial effects of the switch device 10 or the switch, which will not be repeated here.

[0075] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A switch device, characterized in that: The invention comprises a first circuit board (100), a second circuit board (200), a first component (300) and a second component (400), wherein the first component (300) is arranged on the first circuit board (100), the second component (400) is arranged on the second circuit board (200), and the first circuit board (100) is vertically inserted into the second circuit board (200).

2. The switch device according to claim 1, characterized in that: The first conductive layer (110) of the first circuit board (100) is exposed.

3. The switch device according to claim 2, characterized in that: The thickness of the first conductive layer (110) is greater than or equal to 2 ounces.

4. The switch device according to claim 2, characterized in that: A second conductive layer (120) is stacked on the first conductive layer (110).

5. The switch device according to any one of claims 1 to 4, characterized in that: The area of ​​the pins (130) connecting the first circuit board (100) and the second circuit board (200) is greater than a first preset area.

6. The switch device according to any one of claims 1 to 4, characterized in that: The first circuit board (100) comprises a via hole (140), and the size of the via hole (140) is 0.5 mm.

7. The switch device according to any one of claims 1 to 4, characterized in that: The switch device (10) further comprises: a housing (500); the housing (500) is mounted on the second circuit board (200); a vent is provided on the housing (500); and the horizontal direction of the first circuit board (100) is consistent with the direction of the vent.

8. The switch device according to any one of claims 1 to 4, characterized in that: The first component (300) is a surface mount device, and the area of ​​the heat dissipation plate of the surface mount device is larger than the second preset area.

9. A switch, characterized in that: The switch device (10) comprises a switch device (10) as claimed in any one of claims 1 to 8, a third circuit board (600), a third component (610) and a control panel (620); the third component (610) is arranged on the third circuit board (600), the third circuit board (600) is arranged on one side of the control panel (620), the second circuit board (200) in the switch device (10) is arranged on a side of the third circuit board (600) away from the control panel (620), and the second circuit board (200) is electrically connected to the third circuit board (600).

10. A dimming device, characterized in that: Comprising a switch device (10) as claimed in any one of claims 1 to 8.

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