A thick copper plate soldering resistance structure

Abstract

The utility model is applicable to the technical field of thick copper plate structure, and provides a thick copper plate solder mask structure, adopts secondary solder mask operation, and the first solder mask blocking point mesh is 3 mil smaller than the second solder mask blocking point mesh on one side, and the first solder mask exposure film is 1 mil larger than the second solder mask exposure film window size. The utility model reduces the single solder mask pre-baking time, does not produce incomplete solder mask development; reduces solder mask side erosion, reduces the risk of bridge drop and bridge swing; prevents uneven ink, resulting in insufficient oil thickness on isolated lines.

Description

Technical Field

[0001] The utility model belongs to the technical field of thick copper plate structures, in particular to a thick copper plate anti-welding structure. Background Art

[0002] The existing thick copper PCB board will have uneven solder mask ink and solder mask bridge. The existing technical solution is: pre-treatment--hole plugging--48T double-sided printing--laying and standing for 1H--pre-baking for 15 minutes--36T double-sided printing--laying and standing for 1H--pre-baking for 45 minutes--exposure--development--post-curing.

[0003] The existing problems are: the pre-baking time is long, there is a risk of incomplete development; the IC bridge oil thickness is thick, there is a risk of excessive side erosion and bridge shedding. Therefore, in view of the above situation, it is urgent to develop a thick copper plate solder mask structure to overcome the shortcomings in current practical applications. Utility Model Content

[0004] The purpose of the embodiment of the utility model is to provide a thick copper plate solder resistance structure, aiming to solve the problems mentioned in the above background technology.

[0005] The embodiment of the utility model is implemented as follows: a thick copper plate solder mask structure adopts a secondary solder mask operation, and the first solder mask blocking point mesh is 3 mil smaller on one side than the second solder mask blocking point mesh, and the first solder mask exposure film is 1 mil larger than the second solder mask exposure film in terms of window size.

[0006] The embodiment of the utility model provides a thick copper plate solder mask structure, which improves the problems of uneven solder mask ink and solder mask bridging on the thick copper plate from the design perspective. Specifically: the single solder mask pre-baking time is reduced, and incomplete solder mask development will not occur; the solder mask side erosion is reduced, reducing the risk of bridging bridging and dropping; and the uneven ink is prevented, which leads to insufficient oil thickness on isolated lines and surfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 A schematic diagram of a thick copper plate solder mask structure provided by an embodiment of the utility model;

[0008] Figure 2 A schematic diagram of solder blocking points of a thick copper plate solder blocking structure provided by an embodiment of the utility model;

[0009] Figure 3 A schematic diagram of a soldering-proof window for a thick copper plate soldering-proof structure provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0010] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0011] The specific implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0012] like Figure 1-3 As shown, a thick copper plate soldering resistance structure is provided for an embodiment of the utility model, which is suitable for the process design of 4OZ thick copper plate soldering resistance. 4OZ thick copper plate is a circuit board made of 4 layers of thick copper foil, which has high conductivity and stability. 4OZ thick copper plate can meet the needs of some special high-power electronic equipment to provide higher current carrying capacity and heat dissipation performance.

[0013] like Figure 1 As shown, the thick copper plate anti-welding structure provided by the utility model adopts the following scheme:

[0014] The first solder mask process: pre-treatment--plugging--double-sided silk screen 1 (line mask screen 48T)--standing (1H)--pre-bake (45min)--exposure 1 (line mask film)--development--post-curing.

[0015] Second solder mask process: pre-treatment--double-sided silk screen 2 (36T)--standing (1H)--pre-bake (45min)--exposure 2--development--post-curing.

[0016] like Figure 2 As shown, the first solder mask line mask is 3 mil smaller on one side than the second solder mask line mask. The second solder mask line mask is made according to normal compensation.

[0017] Note: Figure 2 The middle gray area is the first solder mask stop point data, and the outline of the gray area is the second solder mask stop point.

[0018] like Figure 3 As shown, the first solder mask exposure film (line mask film) is 1 mil larger than the second solder mask exposure film window size, and the second solder mask exposure film window is produced according to normal compensation.

[0019] Note: Figure 3 The middle gray area is the first solder mask window material, and the outline of the gray area is the second solder mask window material.

[0020] The above-mentioned embodiment of the utility model provides a thick copper plate solder mask structure, which improves the problems of uneven solder mask ink and solder mask bridging on the thick copper plate from the design perspective. Specifically: the single solder mask pre-baking time is reduced, and incomplete solder mask development will not occur; the solder mask side erosion is reduced, reducing the risk of bridging bridging and dropping; and the uneven ink is prevented, which leads to insufficient oil thickness on the isolated line surface.

[0021] The circuits, electronic components and modules involved are all existing technologies and can be fully implemented by those skilled in the art. Needless to say, the content protected by this utility model does not involve improvements to software and methods.

[0022] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0023] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A thick copper plate solder mask structure, characterized in that: A secondary solder mask operation is adopted, and the first solder mask blocking point mesh is 3 mil smaller on one side than the second solder mask blocking point mesh, and the first solder mask exposure film has an overall window size 1 mil larger than the second solder mask exposure film.

Images