Multilayer circuit board pressing device

Abstract

The present application discloses a multi-layer circuit board pressing device, which belongs to the technical field of circuit boards. It mainly includes a workbench; a pressing assembly, which is arranged on the workbench, and the pressing assembly includes a cover shell, a cylinder is arranged on the top of the cover shell, and a pressing plate is arranged at the bottom of the cylinder; a feeding assembly, which is arranged at the bottom of the pressing assembly, and the feeding assembly includes a slide rail, which is arranged on the top of the workbench; a placement plate, which is slidably mounted on the slide rail, and a mounting cavity is arranged in the placement plate; a connecting groove, which is arranged inside the placement plate, and a spring is fixedly installed in the connecting groove, and a card is fixedly installed on the side of the spring away from the connecting groove, and the size of the card is adapted to the size of the connecting groove. The multi-layer circuit board pressing device of the present application, by setting the placement plate, allows the material to be quickly taken out of the mounting cavity after the pressing is completed, and at the same time, by setting the baffle, the working area can be shielded during pressing.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a multi-layer circuit board pressing device. Background Art

[0002] In the electronics industry, multi-layer circuit boards are usually stacked with multiple layers of thin sheet materials (such as glass fiber reinforced resin) with a copper foil layer in the middle. They are pressed together through a high temperature and high pressure process to form a complete multi-layer circuit board structure. During the processing of multi-layer circuit boards, the inner layer board needs to be pressed with the prepreg and copper foil. Currently, a pressing device is often used to complete this task.

[0003] For example, the patent with publication number CN218603740U specifically discloses a multi-layer circuit board pressing device. Through the buffer component design, when the pressure value exceeds the preset pressure value, the pressure sensor sends a signal, and the piston rod and the second spring will drive the bottom plate to drop away from the pressure block, thereby avoiding damage to the circuit board due to excessive pressure and reducing the scrap rate of the circuit board.

[0004] In the above patent, the device prevents the circuit board from being damaged due to excessive pressure by setting a buffer component. However, in the device, after the circuit board is pressed, the multi-layer circuit board will be attached to the plane on the top of the support table, which is not easy to pick up. At this time, additional operating steps or tools may be required to safely remove the circuit board, which increases the complexity of the operation. Therefore, it is necessary to provide a multi-layer circuit board pressing device to solve the above problem.

[0005] It should be noted that the above information disclosed in this background technology section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute the prior art. Summary of the invention

[0006] Based on the above problems existing in the prior art, the problem to be solved by the present application is: to provide a multi-layer circuit board pressing device to achieve the effect of facilitating removal from the device after pressing is completed.

[0007] The technical solution adopted by the present application to solve its technical problems is: a multi-layer circuit board pressing device, including a workbench; a pressing assembly, which is arranged on the workbench, the pressing assembly includes a cover shell, a cylinder is arranged on the top of the cover shell, and a pressing plate is arranged on the bottom of the cylinder; a loading assembly, which is arranged at the bottom of the pressing assembly, the loading assembly includes a slide rail, and the slide rail is arranged on the top of the workbench; a placement plate, which is slidably installed on the slide rail, and an installation cavity is arranged in the placement plate; a connecting groove, which is arranged inside the placement plate, a spring is fixedly installed in the connecting groove, and a card plate is fixedly installed on the side of the spring away from the connecting groove, and the size of the card plate is adapted to the size of the connecting groove.

[0008] Furthermore, the output end of the cylinder passes through the cover shell and is installed with a connecting plate, the bottom of the connecting plate has a mounting groove, a pressing plate is slidably installed in the mounting groove, and the size of the pressing plate is smaller than the size of the connecting plate.

[0009] Furthermore, the interior of the connecting plate is hollow, and an air pump is fixedly installed on the top of the connecting plate, and the air pump is connected to the interior of the connecting plate.

[0010] Furthermore, a card slot is provided at the bottom of the cover shell, a baffle is slidably installed in the card slot, and a gripping portion is provided on the outer side of the baffle.

[0011] The beneficial effect of the present application is that the multi-layer circuit board pressing device provided by the present application, by setting a placement plate, allows the material to be quickly taken out of the installation cavity after the pressing is completed. At the same time, by setting a baffle, the working area can be shielded during pressing to prevent high temperature from causing harm to the staff, thereby increasing the practicality of the device.

[0012] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings in the specification, which constitute a part of the present application, are used to provide further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0014] In the attached picture:

[0015] Figure 1 This is an overall schematic diagram of the multi-layer circuit board pressing device in this application;

[0016] Figure 2 for Figure 1 The structural diagram of the workbench in the middle;

[0017] Figure 3 for Figure 2 The enlarged schematic diagram of point A in the middle;

[0018] Figure 4 for Figure 2 A schematic diagram of the structure of the middle baffle;

[0019] Figure 5 for Figure 2 Structural diagram of the middle loading component;

[0020] Among them, the reference numerals in the figure are:

[0021] 1. Pressing machine; 11. Workbench; 2. Pressing assembly; 21. Cover; 22. Cylinder; 221. Baffle; 222. Grabbing part; 23. Connecting plate; 24. Air pump; 3. Mounting groove; 31. Pressing plate; 4. Loading assembly; 41. Slide rail; 42. Placement plate; 43. Mounting cavity; 431. Handle; 44. Connecting groove; 45. Spring; 46. Card plate. DETAILED DESCRIPTION

[0022] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0023] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0024] like Figure 1 As shown, the present application provides a multilayer circuit board laminating device, including a laminating machine 1, which is arranged in an electronic material processing plant, and a workbench 11 is arranged on the laminating machine 1, and a laminating assembly 2 is arranged on the workbench 11, and the laminating assembly 2 is used to press the inner layer board with the prepreg and the copper foil (hereinafter referred to as the material);

[0025] like Figure 2-Figure 3 As shown, the pressing assembly 2 includes a cover shell 21, which is fixedly mounted on the top of the workbench 11, and a cylinder 22 is fixedly mounted on the cover shell 21. The output end of the cylinder 22 passes through the cover shell 21 and is installed with a connecting plate 23. The interior of the connecting plate 23 is hollow, and the bottom of the connecting plate 23 has a mounting groove 3. A pressing plate 31 is fixedly mounted in the mounting groove 3. The pressing plate 31 is made of copper material with good thermal conductivity and is used for direct contact with the material. The size of the pressing plate 31 is smaller than that of the connecting plate 23. When the pressing plate 31 is placed in the mounting groove 3, the bottom of the pressing plate 31 will protrude from the mounting groove 3.

[0026] At the same time, an air pump 24 is fixedly installed on the top of the connecting plate 23, and the air pump 24 is connected to the inside of the connecting plate 23, and is used to introduce heating gas into the inside of the connecting plate 23 and conduct heat energy to the pressing plate 31, thereby achieving hot pressing;

[0027] At the same time, a card slot (not shown in the figure) is provided at the bottom of the cover shell 21, and a baffle 221 is slidably installed in the card slot. A grabbing portion 222 is provided on the outer side of the baffle 221. When the pressing starts, the grabbing portion 222 is controlled to drive the baffle 221 to move toward the workbench 11, so that the baffle 221 closes the cover shell 21 to prevent the high temperature generated during the pressing from affecting the staff.

[0028] like Figure 2-Figure 5 As shown, a loading assembly 4 is provided on the workbench 11, and the loading assembly 4 includes two sets of slide rails 41, and a placement plate 42 is slidably installed on the slide rails 41, and the placement plate 42 is used to place the material to be pressed, and a handle 431 is provided on one side of the placement plate 42, and the placement plate 42 is suitable for moving on the slide rails 41 driven by the handle 431, and then reaching the bottom of the pressing assembly 2;

[0029] The placement plate 42 has an installation cavity 43 whose size matches the size of the material. A connecting groove 44 is provided inside the installation cavity 43. A spring 45 is fixedly installed in the connecting groove 44. A clamping plate 46 is fixedly installed on the side of the spring 45 away from the connecting groove 44. The size of the clamping plate 46 matches the size of the connecting groove 44. When pressed together, the clamping plate 46 will be completely immersed in the connecting groove 44 under the action of external force. At this time, the bottom of the installation cavity 43 is flat and will not affect the pressing of the material.

[0030] When the pressing starts, the material is first placed inside the connecting groove 44, and then the placing plate 42 is moved to the bottom of the pressing assembly 2, and the air pump 24 and the cylinder 22 are started, so that the pressing plate 31 moves toward the placing plate 42 driven by the cylinder 22, and during the pressing, the pressing plate 31 will sink into the installation cavity 43 and press the material, and at this time, the clamping plate 46 and the spring 45 will be synchronously sunk into the connecting groove 44;

[0031] When the pressing is completed, the pressing plate 31 is away from the installation cavity 43, the force of the spring 45 disappears and drives the clamping plate 46 to rebound, thereby driving one end of the material to tilt up. At this time, the staff can quickly take the material out of the installation cavity 43.

[0032] In summary, the device sets a placement plate 42 so that the material can be quickly taken out of the installation cavity 43 after the pressing is completed. At the same time, the baffle 221 is set to shield the working area during pressing to prevent high temperature from causing harm to the staff, thereby increasing the practicality of the device.

[0033] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. Multilayer circuit board pressing device, including: Workbench (11); A pressing assembly (2), the pressing assembly (2) being arranged on the workbench (11), the pressing assembly (2) comprising a housing (21), a cylinder (22) being arranged on the top of the housing (21), and a pressing plate (31) being arranged on the bottom of the cylinder (22); A feeding assembly (4), which is arranged at the bottom of the pressing assembly (2), characterized in that the feeding assembly (4) comprises: A slide rail (41), the slide rail (41) being arranged on the top of the workbench (11); A placement plate (42), the placement plate (42) being slidably mounted on the slide rail (41), and a mounting cavity (43) being provided in the placement plate (42); A connecting groove (44) is arranged inside the placement plate (42), a spring (45) is fixedly installed inside the connecting groove (44), a clamping plate (46) is fixedly installed on a side of the spring (45) away from the connecting groove (44), and the size of the clamping plate (46) is adapted to the size of the connecting groove (44).

2. The multi-layer circuit board pressing device according to claim 1, characterized in that: The output end of the cylinder (22) passes through the housing (21) and is installed with a connecting plate (23). The bottom of the connecting plate (23) has a mounting groove (3). A pressing plate (31) is installed in the mounting groove (3). The size of the pressing plate (31) is smaller than the size of the connecting plate (23).

3. The multi-layer circuit board pressing device according to claim 2, characterized in that: The interior of the connecting plate (23) is hollow, and an air pump (24) is fixedly installed on the top of the connecting plate (23), and the air pump (24) is connected to the interior of the connecting plate (23).

4. The multi-layer circuit board pressing device according to claim 3, characterized in that: The bottom of the cover shell (21) is provided with a slot, a baffle (221) is slidably mounted in the slot, and a gripping portion (222) is provided on the outer side of the baffle (221).

5. The multi-layer circuit board pressing device according to claim 4, characterized in that: The pressing plate (31) is made of copper material.

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