A heat exchanger and power equipment

Abstract

The present application discloses a heat exchanger and a power device. The heat exchanger includes a temperature-averaging plate and a fin group. The temperature-averaging plate is provided with an evaporation zone and a condensation zone. The inner cavity of the temperature-averaging plate is filled with a phase-change medium. The heat is dissipated between the evaporation zone and the condensation zone by gas-liquid phase conversion of the phase-change medium. The fin group is provided in the evaporation zone and / or the condensation zone to accelerate heat transfer. The power device includes the above-mentioned heat exchanger. Beneficial effects of the present application: Compared with traditional heat dissipation methods, the present application transfers internal heat to the outside based on phase-change medium, which can achieve smaller heat dissipation thermal resistance, thereby reducing the temperature of the inner cavity of the device. In addition, the temperature-averaging plate can achieve a larger heat flux, lower cost, and lighter weight.

Description

Technical Field

[0001] The present application relates to the technical field of electrical equipment, and in particular to a heat exchanger and a power device. Background Art

[0002] As the overall power of the inverter increases, the heat dissipation problem becomes more serious. Generally, power modules such as IGBT and BOOST are directly connected to the fin heat sink for heat dissipation, but the electronic components on the PCBA board inside the inverter are often not effectively cooled, resulting in excessively high temperatures inside the inverter, threatening the normal life of the electronic components.

[0003] The main methods of cooling the inverter in the prior art are: generating staggered airflow in the inverter box to cool the electronic components in the box, then transferring the heat to the heat sink fins and introducing fresh air from the outside to reduce the temperature in the inverter box. Alternatively, heat pipes are used to achieve heat exchange inside and outside the inverter cavity, and the inner cavity fins and outer cavity fins are used to strengthen the heat exchange between the air and the heat pipes. Alternatively, liquid cooling radiators are used to dissipate heat from power modules and electronic components.

[0004] However, there are the following defects in actual use:

[0005] (1) Due to the harsh working environment of the inverter, the protection level of the inverter chassis often needs to reach IP66 or above, which limits the air exchange inside and outside the chassis, and the patent for cooling the box by introducing fresh air from the outside cannot be implemented. Simply using the air circulation inside the chassis to cool the electrical devices will lead to more and more heat accumulation inside the chassis, and the internal temperature will become higher and higher, which will bring huge risks of thermal failure of electronic devices.

[0006] (2) Since the cost of heat pipes is relatively high and there is an upper limit to the heat transfer capacity of a single heat pipe, the number of heat pipes needs to be increased accordingly when the heat dissipation increases, which brings challenges to the manufacturing process and sealing.

[0007] (3) The use of liquid cooling requires the addition of liquid cooling circuits and supporting components, which not only increases the complexity of the structure, but also increases the cost and possibility of failure. Utility Model Content

[0008] One of the objects of the present application is to provide a heat exchanger that can solve at least one of the defects in the above-mentioned background technology.

[0009] Another object of the present application is to provide a power device that can solve at least one of the defects in the above-mentioned background technology.

[0010] In order to achieve at least one of the above-mentioned purposes, the technical solution adopted in the present application is: a heat exchanger, including a temperature equalizing plate and a fin group, the temperature equalizing plate is provided with an evaporation zone and a condensation zone, and the inner cavity of the temperature equalizing plate is filled with a phase change working fluid; heat is dissipated between the evaporation zone and the condensation zone through gas-liquid phase conversion of the phase change working fluid; the fin group is arranged in the evaporation zone and / or the condensation zone to accelerate heat transfer.

[0011] Preferably, the fin group includes a first fin group and a second fin group respectively arranged in the evaporation zone and the condensation zone; the first fin group is suitable for transferring ambient heat to the evaporation zone; the second fin group is suitable for dissipating heat released by condensing the phase change working fluid in the condensation zone.

[0012] Preferably, the fins included in the first fin group and the second fin group are connected to the temperature equalizing plate by brazing; and the first fin group and the second fin group perform heat exchange by natural convection or forced convection.

[0013] Preferably, the temperature averaging plate is made of aluminum or copper; the temperature averaging plate is made of a blown plate, a profile tube, a stamped plate, or a CNC processed plate.

[0014] Preferably, the inner cavity of the temperature equalizing plate is provided with a blowing area which is interconnected in a network, and the phase change working medium is filled in the blowing area.

[0015] Preferably, the surface of the temperature averaging plate is provided with pressing areas arranged in a dot matrix, and the temperature averaging plate forms the inflation area through the pressing areas which are concavely arranged.

[0016] Preferably, the evaporation zone is lower than the condensation zone in the gravity direction; and the phase change working fluid is one of pure water, acetone, Freon and fluorinated liquid.

[0017] Preferably, the temperature homogenizing plate further comprises a connection area arranged between the evaporation area and the condensation area, and the temperature homogenizing plate is installed through the connection area.

[0018] Preferably, there are multiple temperature averaging plates, which are spaced apart from each other; adjacent temperature averaging plates are connected through the two ends of the first fin group and the second fin group; the number of the first fin group and the second fin group is equal to or less than one of the number of temperature averaging plates.

[0019] A power device comprises a shell, a PCBA module and the above-mentioned heat exchanger; the shell is provided with an installation cavity and a heat dissipation cavity; the PCBA module is arranged in the installation cavity, and the heat exchanger is installed in the shell, so that the evaporation area of ​​the temperature homogenizing plate is arranged in the installation cavity, and the condensation area is arranged in the heat dissipation cavity connected to the outside.

[0020] Compared with the prior art, the beneficial effects of this application are:

[0021] Compared with traditional heat dissipation methods, this application transfers internal heat to the outside based on phase change working fluid, which can achieve smaller heat dissipation resistance, thereby reducing the temperature of the device cavity. In addition, the temperature plate can achieve greater heat flux, lower cost and lighter weight. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of one embodiment of the heat exchanger in the utility model.

[0023] Figure 2 It is a structural schematic diagram of the temperature averaging plate in the utility model.

[0024] Figure 3 It is a schematic diagram of the partial cross-sectional structure of the temperature averaging plate in the utility model.

[0025] Figure 4 It is a structural schematic diagram of another embodiment of the heat exchanger in the utility model.

[0026] Figure 5 It is a structural schematic diagram of the medium power equipment of the utility model.

[0027] In the figure: heat exchanger 1, temperature equalizing plate 11, evaporation area 111, connection area 112, condensation area 113, pressing area 114, inflation area 115, first fin group 12, second fin group 13, shell 2, installation cavity 21, heat dissipation cavity 22, partition 23, heat dissipation plate 24, PCBA module 3, PCB board 31, electronic components 32, power module 33, radiator 4, substrate 41, heat dissipation fins 42. DETAILED DESCRIPTION

[0028] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0029] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present application.

[0030] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0031] The terms "including" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0032] One aspect of the present application provides a heat exchanger, such as Figure 1 and Figure 2 As shown, one of the preferred embodiments includes a temperature equalizer 11 and a fin group. The temperature equalizer 11 is provided with an evaporation zone 111 and a condensation zone 113. The evaporation zone 111 is used to absorb heat, and the condensation zone 113 is used to dissipate heat. The inner cavity of the temperature equalizer 11 is filled with a phase change medium, and the phase change medium can be gasified by the heat absorbed by the evaporation zone 111, and the gasified phase change medium can carry heat to the condensation zone 113. After the phase change medium reaches the condensation zone 113, the heat can be released, and then the phase change medium is condensed and liquefied through heat dissipation cooling and flows back to the evaporation zone 111; the heat dissipation of the required environment is achieved through the cyclic phase change process of the phase change medium. The fin group is arranged in the evaporation zone 111 and / or the condensation zone 113. The setting of the fin group can accelerate the heat transfer, so that the gas-liquid phase conversion speed of the phase change medium between the evaporation zone 111 and the condensation zone 113 is accelerated to improve the heat dissipation efficiency.

[0033] It should be known that there are mainly three examples of the arrangement of the fin group. For ease of understanding, a detailed description will be given below.

[0034] Example 1: The fin group is only arranged in the evaporation zone 111 of the temperature equalizing plate 11. The ambient heat can be accelerated to be transferred to the evaporation zone 111 through the fin group, thereby accelerating the vaporization speed of the phase change medium located in the evaporation zone 111 in the temperature equalizing plate 11, thereby improving the heat exchange efficiency of the entire heat exchanger 1.

[0035] Example 2: The fin group is only arranged in the condensation zone 113 of the temperature equalizing plate 11. The fin group can accelerate the transfer of heat carried by the vaporized phase change medium to the cold environment, thereby accelerating the condensation speed of the phase change medium located in the condensation zone 113 in the temperature equalizing plate 11, thereby improving the heat exchange efficiency of the entire heat exchanger 1.

[0036] Example 3: The evaporation zone 111 and the condensation zone 113 of the temperature homogenizing plate 11 are both provided with fin groups. The fin groups located in the evaporation zone 111 and the condensation zone 113 can respectively meet the heat transfer efficiency of the above-mentioned examples 1 and 2, so as to further improve the heat exchange efficiency of the entire heat exchanger 1.

[0037] It can be understood that the above three examples can all meet the needs of this application. In order to ensure that the temperature plate 11 can stably exchange heat, the evaporation zone 111 and the condensation zone 113 of the temperature plate 11 need to maintain a balance in the phase change conversion of the phase change medium. If the fin group is set in the evaporation zone 111 or the condensation zone 113 alone, the phase change conversion balance of the phase change medium may be destroyed. Therefore, in this embodiment, the above example 3 is preferably used for the setting of the fin group.

[0038] Specifically, Figure 1 and Figure 2 As shown, the fin group includes a first fin group 12 and a second fin group 13 respectively arranged in the evaporation area 111 and the condensation area 113. The first fin group 12 can accelerate the heat transfer to the evaporation area 111, so that the phase change medium is transformed from the liquid phase to the gas phase and flows to the condensation area 113. The second fin group 13 can accelerate the heat dissipation of the condensation area 113, so that the phase change medium is condensed from the gas phase to the liquid phase and flows back to the evaporation area 111.

[0039] In this embodiment, the first fin group 12 and the second fin group 13 each include a plurality of fins, and the plurality of fins are arranged in an array with equal spacing, and the spacing distance between adjacent fins and the thickness of the fins should match the heat transfer method and the heat exchange amount. The heat transfer method for the first fin group 12 and the second fin group 13 can be natural convection heat exchange or forced convection heat exchange, and the specific heat transfer method can be matched and selected according to the heat exchange amount required by the environment.

[0040] It should be known that when the heat transfer mode is natural convection heat exchange, the growth direction of the fins included in the first fin group 12 and the second fin group 13 needs to be perpendicular to the direction of gravity g, that is, the air circulation direction is parallel to the direction of gravity g. When the heat transfer mode is forced convection heat exchange, a fan should be installed at the inlet or outlet of the air duct of the heat exchange environment.

[0041] It should also be known that there are various ways to connect the first fin group 12 and the second fin group 13 to the temperature equalizing plate 11. They can be bonded, such as by using a coating with high thermal conductivity such as silicone; they can also be welded, such as by brazing. Brazing should ensure good thermal contact of the welding surface to avoid defects such as cold welding.

[0042] In this embodiment, there are many specific materials for the temperature equalizing plate 11, which only needs to have high thermal conductivity; in order to ensure the structural strength of the temperature equalizing plate 11 and a larger heat flux, the temperature equalizing plate 11 preferably adopts a metal temperature equalizing plate, such as an aluminum temperature equalizing plate and a copper temperature equalizing plate.

[0043] It should be known that although the thermal conductivity of copper temperature equalizing plates is higher than that of aluminum temperature equalizing plates, the weight and price of copper temperature equalizing plates are higher than those of aluminum temperature equalizing plates; therefore, aluminum temperature equalizing plates are preferably used for environments with less stringent heat exchange requirements, and copper temperature equalizing plates are preferably used for environments with strict heat exchange requirements. Common manufacturing methods for metal temperature equalizing plates 11 include blown plate type, profile tube type, stamping type, and CNC processing type. The specific manufacturing principles and processes of blown plate type, profile tube type, stamping type, and CNC processing type are well known to those skilled in the art, so they will not be elaborated here in detail; in this embodiment, the manufacturing method of the temperature equalizing plate 11 preferably adopts a blown plate type, and the subsequent content is explained using this as an example.

[0044] In this embodiment, Figure 2 As shown, the evaporation zone 111 is lower than the condensation zone 113 in the direction of gravity g; thus, the phase-change working medium can be accelerated to flow toward the evaporation zone 111 under the action of gravity after being condensed and liquefied in the condensation zone 113 .

[0045] It should be known that, since the phase-change working medium in the liquid phase is located at the bottom of the region under the action of gravity, and the phase-change working medium in the gas phase will rise at the top of the region, the evaporation zone 111 and the condensation zone 113 can also be set flush. Then, after the phase-change working medium is converted into the gas phase in the evaporation zone 111, it will rise to the top of the evaporation zone 111 and then flow to the top of the condensation zone 113. After the phase-change working medium is condensed and liquefied in the condensation zone 113, it will first flow to the bottom of the condensation zone 113 and then flow to the evaporation zone 111. After the condensation zone 113 and the evaporation zone 111 are arranged up and down in the direction of gravity g, the phase-change working medium in the gas phase flows directly to the condensation zone 113, and the phase-change working medium in the liquid phase flows directly to the evaporation zone 111. Compared with the flush arrangement of the evaporation zone 111 and the condensation zone 113 , the flow rate of the phase change medium can be effectively accelerated. Therefore, in this embodiment, the evaporation zone 111 and the condensation zone 113 are preferably arranged in a high and low position in the direction of gravity g.

[0046] It should also be known that there are many specific types of phase change fluids, and the specific selection of phase change fluids can be determined based on the heat exchange environment of the heat exchanger 1 and the corresponding heat exchange amount; common phase change fluids include pure water, acetone, Freon and fluorinated liquid.

[0047] In this embodiment, Figure 2 and Figure 3 As shown, the inner cavity of the temperature-averaging plate 11 is provided with a mesh-connected blowing area 115, and the phase-change medium is filled in the blowing area 115. The setting of the blowing area 115 can divide the phase-change medium filled in the inner cavity of the temperature-averaging plate 11 into multiple regions, and the contact area corresponding to each region is increased, thereby accelerating the phase change process of the phase-change medium.

[0048] For ease of understanding, the blowing zone 115 corresponding to the condensation zone 113 is taken as an example for detailed description. It should be known that the second fin group 13 is arranged on the outer surface of the temperature-averaging plate 11, so the heat carried by the phase-change working fluid needs to be transferred to the second fin group 13 through the heat conduction of the temperature-averaging plate 11. After adopting the mesh-connected blowing zone 115, the gas phase phase change working fluid is hindered by the interval area between adjacent blowing zones 115 during the rising process and will gradually diffuse into the condensation zone 113, and then the gas phase phase change working fluid can be evenly dispersed in each blowing zone 115 of the condensation zone 113, thereby effectively improving the heat transfer efficiency of the phase change working fluid. At the same time, the mesh-connected blowing zone 115 set in the inner cavity of the temperature-averaging plate 11 can effectively increase the contact area between the phase change working fluid and the inner wall of the temperature-averaging plate 11 compared with the traditional cavity structure, thereby further improving the heat transfer efficiency of the phase change working fluid.

[0049] In this embodiment, there are many specific ways to form the inflation area 115 required by the temperature equalizing plate 11; Figure 3As shown, one preferred method is: the surface of the temperature equalizing plate 11 is provided with a pressing area 114 arranged in a dot matrix, and the temperature equalizing plate 11 forms a blowing area 115 through the pressing area 114 set inwardly, so that the wall thickness of each position of the blowing area 115 can be uniform to ensure the uniformity of heat transfer of the phase change working fluid.

[0050] It is understandable that the formation of the inflation zone 115 can also be to directly set a columnar structure arranged in a lattice in the inner cavity of the temperature equalizing plate 11. However, this will cause the wall thickness of the side of the inflation zone 115 to be greater than the wall thickness of the end, and then the phase change working fluid will be mainly concentrated at the end position during heat transfer, making the heat transfer efficiency of the side lower. By forming the required inflation zone 115 by setting the side wall of the temperature equalizing plate 11 to be concave, it can be ensured that the wall thickness of each position of the inflation zone 115 is uniform. Therefore, in this embodiment, the deformation of the inflation zone 115 is preferably formed by using the concave pressing zone 114.

[0051] It should also be known that the cross-sectional shape of the pressing area 114 can be a circle or other shapes, such as a regular polygon; the specific shape and size can be determined according to actual needs; considering that under the same size conditions, the circle has the largest circumference, the cross-sectional shape of the pressing area 114 is preferably a circle.

[0052] In this embodiment, since the heat exchanger 1 is generally used in a relatively closed environment, the heat in the closed environment is transferred to the outside for heat dissipation; and the heat exchanger 1 is kept away from other elements of the environment as much as possible during use to avoid affecting the working efficiency of the heat exchanger 1. Therefore, for the installation of the heat exchanger 1, Figure 2 As shown, the temperature equalizing plate 11 also includes a connection area 112 arranged between the evaporation area 111 and the condensation area 113. The temperature equalizing plate 11 is installed through the connection area 112, so that the heat exchanger 1 can be stably installed, and the connection area 112 can make the evaporation area 111 and the condensation area 113 located in two different spaces in the horizontal direction.

[0053] In this embodiment, Figure 4 As shown, the number of the temperature averaging plates 11 can be multiple, and the multiple temperature averaging plates 11 are arranged at intervals; adjacent temperature averaging plates 11 are connected through the two ends of the first fin group 12 and the second fin group 13.

[0054] It is understandable that the heat exchange efficiency of the heat exchanger 1 can be further increased by providing a plurality of temperature averaging plates 11. The specific number of temperature averaging plates 11 can be determined according to the required heat exchange environment and heat exchange amount. Figure 4 As shown, there are two temperature averaging plates 11 , and the two temperature averaging plates 11 are connected via two ends of a group of first fin groups 12 and a group of second fin groups 13 .

[0055] It can also be understood that the specific number of the first fin group 12 and the second fin group 13 can be determined according to the required heat exchange environment and the heat exchange amount. For an environment with relatively small heat exchange amount, the number of the first fin group 12 and the second fin group 13 is the number of the temperature equalizer 11 minus one; that is, the front end and the rear end of the heat exchanger 1 along the direction perpendicular to the gravity g are both temperature equalizers 11. A specific example, such as Figure 4 In the case of two temperature averaging plates 11, the number of the first fin group 12 and the second fin group 13 is one group, and they are arranged between the two temperature averaging plates 11. For an environment with relatively large heat exchange, the number of the first fin group 12 and the second fin group 13 is equal to the number of the temperature averaging plates 11; that is, the front end of the heat exchanger 1 is a group of the first fin group 12 and a group of the second fin group 13, and the rear end is the temperature averaging plate 11.

[0056] Another aspect of the present application provides a power device, such as Figure 5 As shown, it includes a housing 2, a PCBA module 3 and the above-mentioned heat exchanger 1. The housing 2 is provided with an installation cavity 21 and a heat dissipation cavity 22; the PCBA module 3 is arranged in the installation cavity 21, and the heat exchanger 1 is installed in the housing 2, so that the evaporation area 111 of the temperature plate 11 is arranged in the installation cavity 21, and the condensation area 113 is arranged in the heat dissipation cavity 22 connected to the outside; and then the heat inside the housing 2 is transferred to the outside through the gas-liquid phase conversion of the phase change medium in the temperature plate 11. Compared with the traditional heat dissipation method, it can achieve a smaller heat dissipation thermal resistance, thereby reducing the temperature of the installation cavity 21 inside the housing 2.

[0057] Specifically, Figure 5 As shown, the inner cavity of the shell 2 is divided into an installation cavity 21 and a heat dissipation cavity 22 by a partition 23, and the heat exchanger 1 is fixedly connected to the partition 23 through a connection area 112 in the middle of the temperature averaging plate 11, so that the evaporation area 111 and the first fin group 12 of the temperature averaging plate 11 are located in the installation cavity 21 of the shell 2, and the condensation area 113 of the temperature averaging plate 11 and the second fin group 12 are located in the heat dissipation cavity 22 of the shell 2. Through the tight and fixed connection between the temperature averaging plate 11 and the partition 23, it can be ensured that the installation of the heat exchanger 1 meets the airtightness level requirements of power equipment.

[0058] It should be known that there are many types of power equipment, such as inverters, converters, and distribution cabinets. In order to ensure the operational stability of the power equipment, the power equipment has grade requirements for internal air tightness. For example, the air tightness requirements of the inverter generally need to meet the IP66 standard. In this embodiment, the heat exchanger 1 is installed by sealingly connecting the heat exchanger 1 with the partition 23 through a thin plate structure of the temperature equalizing plate 11, which can effectively ensure that the air tightness of the power equipment is not destroyed, and at the same time can achieve a good heat dissipation effect. In addition, the structure, production, and assembly difficulty of the heat exchanger 1 are less than those of the traditional liquid-cooled radiator.

[0059] In this embodiment, Figure 5 As shown, the PCBA module 3 mainly includes a PCB board 31, electronic components 32 and a power module 33. There is at least one PCB board 31, and the specific number can be determined according to the actual needs of the power device. There are multiple electronic components 32 and multiple power modules 33. Both the electronic components 32 and the power module 33 are installed on the PCB board 31; the electronic components 32 and the power module 33 can be installed on the same PCB board 31 at the same time, or they can be installed on different PCB boards 31 separately.

[0060] A specific example is Figure 5 As shown in FIG. 1 , there are two PCB boards 31, one of which is provided with only electronic components 32, and the other PCB board 31 is provided with electronic components 32 and power modules 33. The electronic components 32 and the power modules 33 may be provided on the same side of the PCB board 31, or may be provided on the same side of the PCB board 31. Figure 5 As shown, they are arranged on both sides of the PCB board 31.

[0061] In this embodiment, Figure 5 As shown, for the arrangement of multiple PCB boards 31, they can be arranged at intervals in the installation cavity 21, and in order to further ensure the safety of the power equipment, for the PCB board 31 with a larger heat generation, that is, the PCB board 31 is installed with more electronic components 32 and / or power modules 33, it can be installed close to the inner wall of the partition 23, and then a radiator 4 close to the outer wall of the partition 23 can be installed in the heat dissipation cavity 22 to dissipate heat. Through the coordinated work of the external radiator 4 and the heat exchanger 1, the heat dissipation of the power equipment can be effectively improved to ensure the safety of the power equipment.

[0062] It should be known that the specific structure and working principle of the radiator 4 are well known to those skilled in the art; for ease of understanding, the structure of the radiator 4 will be briefly described below. Figure 5 As shown, the heat sink 4 includes a substrate 41 and heat dissipation fins 42, the substrate 41 is closely mounted on the outer side wall of the partition 23, and the heat dissipation fins 42 are mounted on the side of the substrate 41 away from the partition 23. The heat dissipation mode of the heat sink 4 can be natural convection heat exchange or forced convection heat exchange, and the specific heat dissipation mode can match the heat dissipation of the power module 33. There are multiple heat dissipation fins 42, and the multiple heat dissipation fins 42 are arranged in an array with equal intervals. The spacing between adjacent heat dissipation fins 42 and the thickness of the heat dissipation fins 42 can be determined according to the heat dissipation mode of the heat sink 4 and the required heat dissipation. The specific installation requirements can refer to the first fin group 12 and the second fin group 13.

[0063] It should also be known that, generally speaking, the power module 33 generates more heat than the electronic components 32 , so the PCB board 31 mounted with the power module 33 can be installed close to the partition 23 so that the power module 33 can be close to the partition 23 and dissipate heat through the radiator 4 .

[0064] Specifically, Figure 5 As shown, the power module 33 can be fixed on the side close to the substrate 41 by riveting, bolting, etc. In addition, the contact surface between the power module 33 and the substrate 41 can be coated with thermal grease, thermal adhesive, or thermal pads to reduce the contact thermal resistance of the interface. At the same time, the substrate 41 can be embedded with a heat pipe and a built-in temperature plate 11 to enhance the temperature uniformity performance.

[0065] In this embodiment, in order to ensure the normal operation of the radiator 4 and the heat exchanger 1, a heat sink 24 can be installed on the outside of the heat dissipation cavity 22. The heat sink 24 is generally a hollow structure, so as to ensure that the radiator 22 is connected to the outside world while avoiding direct exposure of the radiator 4 and the heat exchanger 1 to the outside world, thereby ensuring the safe operation of the radiator 4 and the heat exchanger 1.

[0066] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and the specification only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.

Claims

1. A heat exchanger, characterized in that: include: A temperature averaging plate; the temperature averaging plate is provided with an evaporation zone and a condensation zone, and the inner cavity of the temperature averaging plate is filled with a phase change medium; heat is transferred between the evaporation zone and the condensation zone through gas-liquid phase conversion of the phase change medium; and Fin group; the fin group is arranged in the evaporation area and / or the condensation area.

2. The heat exchanger according to claim 1, characterized in that The fin group includes a first fin group and a second fin group respectively arranged in the evaporation area and the condensation area; The first fin group is suitable for transferring ambient heat to the evaporation area; the second fin group is suitable for dissipating heat released by condensing the phase-change working medium in the condensation area.

3. The heat exchanger according to claim 2, characterized in that The fins included in the first fin group and the second fin group are connected to the temperature equalizing plate by brazing; the first fin group and the second fin group perform heat exchange by natural convection or forced convection.

4. The heat exchanger according to claim 1, characterized in that The temperature averaging plate is made of aluminum or copper; the temperature averaging plate is made of a blown plate, a profile tube, a stamping or a CNC processing method.

5. The heat exchanger according to claim 4, characterized in that The inner cavity of the temperature equalizing plate is provided with a blowing area which is interconnected in a network, and the phase change working medium is filled in the blowing area.

6. The heat exchanger according to claim 5, characterized in that The surface of the temperature averaging plate is provided with pressing areas arranged in a dot matrix, and the temperature averaging plate forms the inflation area through the pressing areas which are concavely arranged.

7. The heat exchanger according to claim 1, characterized in that: The evaporation zone is lower than the condensation zone in the gravity direction; the phase change working fluid is one of pure water, acetone, Freon and fluorinated liquid.

8. The heat exchanger according to claim 1, characterized in that The temperature homogenizing plate further includes a connection area disposed between the evaporation area and the condensation area, and the temperature homogenizing plate is installed through the connection area.

9. The heat exchanger according to claim 2, characterized in that: There are multiple temperature averaging plates, which are spaced apart from each other; adjacent temperature averaging plates are connected via the two ends of the first fin group and the second fin group; the number of the first fin group and the second fin group is equal to or less than one of the temperature averaging plates.

10. A power device, characterized in that: include: A housing; a mounting cavity and a heat dissipation cavity are provided in the housing; PCBA module; The PCBA module is disposed in the mounting cavity, and The heat exchanger according to any one of claims 1 to 9; the heat exchanger is installed in the shell so that the evaporation area of ​​the temperature homogenizing plate is arranged in the installation cavity, and the condensation area is arranged in the heat dissipation cavity connected to the outside.

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