Silicon wafer cooling device

Abstract

The utility model proposes a silicon wafer cooling device, comprising a silicon wafer bearing assembly, the silicon wafer bearing assembly is suitable for bearing a silicon wafer; a trough body, the trough body comprising a first side wall and a second side wall, the first side wall and the second side wall are arranged on both sides of the silicon wafer along a first direction, the first direction intersects with the extension direction of the silicon wafer, the first side wall and the second side wall both comprise a first shell and a second shell, a first gas circulation channel is arranged between the first shell and the second shell, the first shell is arranged on a side of the second shell close to the silicon wafer bearing assembly, and at least a part of the first shell is provided with a plurality of first air holes; an air inlet pipe, the air inlet pipe is connected with the first gas circulation channel. Thus, the cooling efficiency of the silicon wafer is improved, the probability of hidden cracks of the silicon wafer is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of batteries, and in particular, to a silicon wafer cooling device. Background Art

[0002] When preparing crystalline silicon solar cells, multiple processes are usually used to form auxiliary battery structures to improve the conversion efficiency of solar cells. Among these processes, the diffusion process is an indispensable part. The temperature for stable operation of the process is between 600℃ and 900℃. After the process is completed, the temperature of the silicon wafer is above 400℃. It needs to be cooled before it can be unloaded for production and then passed on to the next process. The cooling and temperature reduction device in the related technology uses a single-sided multi-hole air blowing method for cooling. This cooling method has low cooling efficiency, and the temperature difference between different areas on the surface of the silicon wafer is large, which can easily cause hidden cracks in the silicon wafer. Therefore, the current silicon wafer cooling device needs further improvement. Utility Model Content

[0003] The utility model aims to solve one of the technical problems in the related art at least to a certain extent.

[0004] In one aspect of the utility model, a silicon wafer cooling device is proposed, comprising: a silicon wafer supporting assembly, the silicon wafer supporting assembly is suitable for supporting a silicon wafer; a trough body, the trough body comprising a first side wall and a second side wall, the first side wall and the second side wall are arranged on both sides of the silicon wafer along a first direction, the first direction intersects with the extension direction of the silicon wafer, the first side wall and the second side wall both comprise a first shell and a second shell, a first gas circulation channel is arranged between the first shell and the second shell, the first shell is arranged on a side of the second shell close to the silicon wafer supporting assembly, and a plurality of first air holes are arranged in at least a partial area of ​​the first shell; an air inlet pipe, the air inlet pipe is connected to the first gas circulation channel.

[0005] The silicon wafer cooling device involved in the utility model has a first gas circulation channel arranged on the first side wall and the second side wall. The cooling medium enters the first gas circulation channel of the first side wall and the second side wall through the air inlet pipe, and can simultaneously blow air to cool down the two surfaces of the silicon wafer through the first air holes on the first side wall and the second side wall, so that the surface temperature and stress of the silicon wafer are more uniform, the cooling time is reduced, the probability of hidden cracks in the silicon wafer is reduced, and the production efficiency is improved.

[0006] According to some embodiments of the utility model, the trough body also includes: a bottom wall, the two ends of the bottom wall along the first direction are respectively connected to the first side wall and the second side wall, the bottom wall includes a third shell and a fourth shell, a second gas circulation channel is arranged between the third shell and the fourth shell, the air inlet pipe is connected to the second gas circulation channel, the third shell is arranged on the side of the fourth shell close to the silicon wafer supporting assembly, and a plurality of second air holes are arranged in at least a partial area of ​​the third shell.

[0007] According to some embodiments of the utility model, the trough body also includes: a third side wall and a fourth side wall, the third side wall is arranged at both ends of the bottom wall along the second direction, the second direction intersects with the first direction, the third side wall and the fourth side wall both include a fifth shell and a sixth shell, a third gas circulation channel is arranged between the fifth shell and the sixth shell, the air inlet pipe is connected to the third gas circulation channel, the fifth shell is arranged on the side of the sixth shell close to the silicon wafer supporting assembly, and a plurality of third air holes are arranged in at least a partial area of ​​the fifth shell.

[0008] According to some embodiments of the utility model, the silicon wafer cooling device also includes a support frame, the support frame includes a first support frame and a second support frame, the first support frame and the second support frame are arranged at both ends of the silicon wafer supporting assembly along the second direction, and the trough body and the silicon wafer supporting assembly are connected to the support frame.

[0009] According to some embodiments of the present invention, the silicon wafer supporting assembly includes a first silicon wafer supporting frame and a second silicon wafer supporting frame, the first silicon wafer supporting frame is connected to the first supporting frame, and the second silicon wafer supporting frame is connected to the second supporting frame.

[0010] According to some embodiments of the present invention, the silicon wafer cooling device further includes a photoelectric sensor, which is disposed on the silicon wafer supporting assembly and is suitable for sensing the silicon wafer.

[0011] According to some embodiments of the present invention, the photoelectric sensor includes a first photoelectric sensor and a second photoelectric sensor, the first photoelectric sensor is arranged on the first silicon wafer carrier, and the second photoelectric sensor is arranged on the second silicon wafer carrier.

[0012] According to some embodiments of the present invention, the silicon wafer cooling device further includes: a pneumatic valve, wherein the pneumatic valve is arranged on the air inlet pipe to control the opening or closing of the air inlet pipe.

[0013] According to some embodiments of the present invention, a plurality of the first air holes are arranged in an orderly manner at intervals on the first shell, a plurality of the second air holes are arranged in an orderly manner at intervals on the third shell, and a plurality of the third air holes are arranged in an orderly manner at intervals on the fifth shell.

[0014] According to some embodiments of the present invention, the first air hole, the second air hole and the third air hole are independently constructed to be elliptical or circular. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 The figure shows a front view of a silicon wafer cooling device according to an embodiment of the present invention.

[0017] Figure 2 Shows Figure 1 A top view of the silicon wafer cooling device in FIG.

[0018] Figure 3 Shows Figure 1 Left view of the silicon wafer cooling device.

[0019] Figure 4 Shows Figure 1 Schematic diagram of the first air hole on the first side wall.

[0020] Reference numerals:

[0021] 1: silicon wafer cooling device; 11: silicon wafer supporting assembly; 121: first side wall; 122: second side wall; 123: third side wall; 10: first air hole; 111: first silicon wafer supporting frame; 112: second silicon wafer supporting frame; 131: first supporting frame; 132: second supporting frame; 141: first photoelectric sensor; 142: second photoelectric sensor; 15: pneumatic valve. DETAILED DESCRIPTION

[0022] The embodiments of the present invention are described in detail below. The embodiments described below are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. If no specific techniques or conditions are specified in the embodiments, the techniques or conditions described in the literature in this field or the product instructions are used. If the manufacturer of the reagents or instruments used is not specified, they are all conventional products that can be obtained commercially.

[0023] In one aspect of the present invention, a silicon wafer cooling device 1 is provided, referring to Figure 1 and Figure 2The silicon wafer cooling device 1 includes a silicon wafer supporting component 11, and the silicon wafer supporting component 11 is suitable for supporting a silicon wafer; a trough body, the trough body includes a first side wall 121 and a second side wall 122, the first side wall 121 and the second side wall 122 are arranged on both sides of the silicon wafer along a first direction, the first direction intersects with the extension direction of the silicon wafer, the first side wall 121 and the second side wall 122 both include a first shell and a second shell, a first gas circulation channel is arranged between the first shell and the second shell, the first shell is arranged on a side of the second shell close to the silicon wafer supporting component 11, and a plurality of first air holes 10 are arranged in at least a part of the area of ​​the first shell; an air inlet pipe (not shown in the figure), the air inlet pipe is connected to the first gas circulation channel.

[0024] The silicon wafer cooling device 1 involved in the utility model is provided with a first gas circulation channel on the first side wall 121 and the second side wall 122. The cooling medium enters the first gas circulation channel of the first side wall 121 and the second side wall 122 through the air inlet pipe, and can be blown and cooled on the two large surfaces of the silicon wafer at the same time through the first air holes 10 on the first side wall 121 and the second side wall 122, so that the surface temperature and stress of the silicon wafer are more uniform, the cooling time is reduced, the probability of hidden cracks in the silicon wafer is reduced, and the production efficiency is improved.

[0025] It should be noted that the first side wall 121 and the second side wall 122 both include a first shell and a second shell, specifically: the first side wall 121 and the second side wall 122 are both double-layer structures, and the first shell and the second shell are spaced apart to allow the cooling medium to flow between the first shell and the second shell, so as to be blown toward the two large surfaces of the silicon wafer through the first air hole 10 for cooling.

[0026] According to some embodiments of the utility model, the tank body may further include: a bottom wall (not shown in the figure), the two ends of the bottom wall along the first direction are respectively connected to the first side wall 121 and the second side wall 122, the bottom wall includes a third shell and a fourth shell, a second gas circulation channel is arranged between the third shell and the fourth shell, the air inlet pipe is connected to the second gas circulation channel, the third shell is arranged on the side of the fourth shell close to the silicon wafer bearing assembly 11, and at least part of the third shell is provided with a plurality of second air holes (not shown in the figure). Specifically, the air inlet pipe is connected to both the first gas circulation channel and the second gas circulation channel, and the compressed guest gas can enter the first gas circulation channel and the second gas circulation channel, and blow to the silicon wafer through the first air hole 10 and the second air hole, that is, the cooling medium can blow to the silicon wafer from the two large surfaces and one side of the silicon wafer, so as to realize multi-directional and multi-angle heat dissipation and cooling, further improve the cooling efficiency, shorten the cooling time, reduce the probability of silicon wafer cracking, and improve production efficiency.

[0027] It should be noted that the bottom wall includes the third shell and the fourth shell, which specifically means that: the bottom wall can also be a double-layer structure, the third shell and the fourth shell are arranged at an interval, and the cooling medium flows between the third shell and the fourth shell to blow toward the silicon wafer on the side of the silicon wafer through the second air hole to cool the silicon wafer.

[0028] According to some embodiments of the present invention, reference Figure 2 and Figure 3 The trough body may further include: a third side wall 123 and a fourth side wall, the third side wall 123 is arranged at both ends of the bottom wall along the second direction, the second direction intersects with the first direction, the third side wall 123 and the fourth side wall both include a fifth shell and a sixth shell, a third gas circulation channel is arranged between the fifth shell and the sixth shell, the air inlet pipe is connected to the third gas circulation channel, the fifth shell is arranged on a side of the sixth shell close to the silicon wafer supporting assembly 11, and a plurality of third air holes are arranged at least in a partial area of ​​the fifth shell. Specifically, the bottom wall is connected to the first side wall 121, the second side wall 122, the third side wall 123 and the fourth side wall respectively to form a receiving cavity with an opening, the silicon wafer is placed in the receiving cavity through the opening, the two large faces of the silicon wafer are directly opposite to the first side wall 121 and the second side wall 122, the air inlet pipe is connected to the first gas flow channel, the second gas flow channel and the third gas flow channel, and the cooling medium is blown to the silicon wafer through the first air hole 10, the second air hole and the third air hole after entering the first gas flow channel, the second gas flow channel and the third gas flow channel, that is, the cooling medium can be blown to the silicon wafer from the two large faces and three sides of the silicon wafer, further realizing multi-directional and multi-angle heat dissipation and cooling, further improving the cooling efficiency, shortening the cooling time, reducing the probability of silicon wafer cracking, and improving production efficiency. At the same time, due to the large number of air holes, the flow rate and flow velocity of the cooling medium can be appropriately increased, further improving the cooling efficiency, and shortening the time spent on cooling the silicon wafer.

[0029] It should be noted that the third side wall and the fourth side wall both include the fifth shell and the sixth shell, which specifically means that: the third side wall and the fourth side wall are a double-layer structure, the fifth shell and the sixth shell are spaced apart, and the cooling medium flows between the fifth shell and the sixth shell to blow toward the silicon wafer on the side of the silicon wafer through the second air hole to cool the silicon wafer.

[0030] According to some embodiments of the present invention, reference Figure 1 and Figure 2The silicon wafer cooling device 1 may also include a support frame, the support frame includes a first support frame 131 and a second support frame 132, the first support frame 131 and the second support frame 132 are arranged at the two ends of the silicon wafer bearing assembly 11 along the second direction, and the trough body and the silicon wafer bearing assembly 11 are connected to the support frame. Specifically, the trough body includes a bottom wall, a first side wall 121, a second side wall 122, a third side wall 123 and a fourth side wall, the third side wall 123 is connected to the first support frame 131, and the fourth side wall is connected to the second support frame 132. The two ends of the silicon wafer bearing assembly 11 along the second direction are respectively connected to the first support frame 131 and the second support frame 132, so as to support the trough body and the silicon wafer bearing assembly 11 through the support frame.

[0031] According to some embodiments of the present invention, reference Figure 2 The silicon wafer bearing assembly 11 may include a first silicon wafer bearing frame 111 and a second silicon wafer bearing frame 112, wherein the first silicon wafer bearing frame 111 is connected to the first support frame 131, and the second silicon wafer bearing frame 112 is connected to the second support frame 132. Specifically, the bottom wall, the first side wall 121, the second side wall 122, the third side wall 123 and the fourth side wall of the trough body form a receiving cavity with an opening, wherein the first silicon wafer bearing frame 111 and the second silicon wafer bearing frame 112 are arranged in the receiving cavity, and the silicon wafer is vertically placed on the first silicon wafer bearing frame 111 and the second silicon wafer bearing frame 112 in the receiving cavity, and the two large surfaces of the silicon wafer are respectively opposite to the first side wall 121 and the second side wall 122. Therefore, when the silicon wafer is cooled and cooled by the first air hole 10, the second air hole and the third air hole, the stability of the silicon wafer can be improved to prevent the silicon wafer from moving.

[0032] According to some embodiments of the present invention, the first silicon wafer carrier 111 and the second silicon wafer carrier 112 may be quartz boats.

[0033] According to some embodiments of the present invention, reference Figure 1 and Figure 2 The silicon wafer cooling device 1 may further include: a pneumatic valve 15, which is arranged on the air inlet pipe to control the opening or closing of the air inlet pipe. Specifically, when a silicon wafer is placed on the silicon wafer carrier assembly 11, the pneumatic valve 15 opens the air inlet pipe to allow the cooling medium to enter the first gas flow channel, the second gas flow channel and the third gas flow channel, and dissipates heat and cools the silicon wafer through the first air hole 10, the second air hole and the third air hole; when no silicon wafer is placed on the silicon wafer carrier assembly 11, the pneumatic valve 15 closes the air inlet pipe, that is, when the silicon wafer does not need to be cooled, the cooling medium is stopped to avoid waste of the cooling medium.

[0034] According to some embodiments of the present invention, the cooling medium may be compressed air.

[0035] According to some embodiments of the utility model, the silicon wafer cooling device 1 may further include a photoelectric sensor, which is arranged on the silicon wafer carrier assembly 11 and is suitable for sensing the silicon wafer. Specifically, when the photoelectric sensor senses that there is a silicon wafer on the silicon wafer carrier assembly 11, the pneumatic valve 15 opens, and the cooling medium enters the first gas flow channel, the second gas flow channel and the third gas flow channel through the air inlet pipe, and the silicon wafer is dissipated and cooled through the first air hole 10, the second air hole and the third air hole; when the photoelectric sensor does not sense that there is a silicon wafer on the silicon wafer carrier assembly 11, the pneumatic valve 15 is closed. In this way, waste of cooling medium is avoided and production costs are reduced.

[0036] According to some embodiments of the present invention, reference Figure 1 and Figure 2 The photoelectric sensor may include a first photoelectric sensor 141 and a second photoelectric sensor 142. The first photoelectric sensor 141 is disposed on the first silicon wafer carrier, and the second photoelectric sensor 142 is disposed on the second silicon wafer carrier. Thus, the first silicon wafer carrier and the second silicon wafer carrier are both provided with photoelectric sensors, which can improve the sensitivity of the photoelectric sensors and accurately control the opening or closing of the pneumatic valve 15.

[0037] According to some embodiments of the present invention, a plurality of the first air holes 10 are arranged in an orderly manner at intervals on the first shell (refer to Figure 4 ), a plurality of the second air holes are arranged in an orderly manner at intervals on the third shell, and a plurality of the third air holes are arranged in an orderly manner at intervals on the fifth shell. Specifically, a plurality of air holes arranged in an orderly manner at intervals are provided on the first side wall 121, the second side wall 122, the third side wall 123, the fourth side wall and the bottom wall, and cooling medium can be blown to the silicon wafers on the first side wall 121, the second side wall 122, the third side wall 123, the fourth side wall and the bottom wall to achieve multi-angle and multi-directional blowing, improve cooling efficiency, shorten cooling time, reduce the probability of hidden cracks in silicon wafers, and improve production efficiency.

[0038] It should be noted that the shapes, quantities, arrangements and sizes of the first pores 10, the second pores and the third pores may be the same or different. The shapes of the first pores 10, the second pores and the third pores may be circular, rectangular, square or other heterogeneous structures.

[0039] According to some embodiments of the present invention, reference Figure 4 The first air hole 10, the second air hole and the third air hole are independently constructed to be elliptical or circular. Thus, the uniformity of the cooling medium blown by the air holes is improved, the uniformity of the overall surface temperature and stress of the silicon wafer is improved, the probability of hidden cracks in the silicon wafer is reduced, and the production efficiency is improved.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0043] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A silicon wafer cooling device, characterized in that: include: A silicon wafer carrying assembly, wherein the silicon wafer carrying assembly is suitable for carrying a silicon wafer; A trough body, the trough body comprising a first side wall and a second side wall, the first side wall and the second side wall are arranged on both sides of the silicon wafer along a first direction, the first direction intersects with an extension direction of the silicon wafer, the first side wall and the second side wall each comprise a first shell and a second shell, a first gas flow channel is arranged between the first shell and the second shell, the first shell is arranged on a side of the second shell close to the silicon wafer bearing assembly, and a plurality of first air holes are arranged in at least a part of the first shell; An air intake pipe is communicated with the first gas flow channel.

2. The silicon wafer cooling device according to claim 1, characterized in that: The trough body also includes: a bottom wall, the two ends of the bottom wall along the first direction are respectively connected to the first side wall and the second side wall, the bottom wall includes a third shell and a fourth shell, a second gas circulation channel is arranged between the third shell and the fourth shell, the air inlet pipe is connected to the second gas circulation channel, the third shell is arranged on a side of the fourth shell close to the silicon wafer supporting assembly, and a plurality of second air holes are arranged in at least a partial area of ​​the third shell.

3. The silicon wafer cooling device according to claim 2, characterized in that: The trough body also includes: a third side wall and a fourth side wall, the third side wall is arranged at both ends of the bottom wall along the second direction, the second direction intersects with the first direction, the third side wall and the fourth side wall both include a fifth shell and a sixth shell, a third gas circulation channel is arranged between the fifth shell and the sixth shell, the air inlet pipe is connected to the third gas circulation channel, the fifth shell is arranged on a side of the sixth shell close to the silicon wafer supporting assembly, and a plurality of third air holes are arranged in at least a partial area of ​​the fifth shell.

4. The silicon wafer cooling device according to claim 3, characterized in that: The silicon wafer cooling device also includes a support frame, which includes a first support frame and a second support frame. The first support frame and the second support frame are arranged at both ends of the silicon wafer supporting assembly along the second direction, and the trough body and the silicon wafer supporting assembly are connected to the support frame.

5. The silicon wafer cooling device according to claim 4, characterized in that: The silicon wafer supporting assembly includes a first silicon wafer supporting frame and a second silicon wafer supporting frame, wherein the first silicon wafer supporting frame is connected to the first supporting frame, and the second silicon wafer supporting frame is connected to the second supporting frame.

6. The silicon wafer cooling device according to claim 5, characterized in that: The silicon wafer cooling device further comprises a photoelectric sensor, which is arranged on the silicon wafer supporting component and is suitable for sensing the silicon wafer.

7. The silicon wafer cooling device according to claim 6, characterized in that: The photoelectric sensor includes a first photoelectric sensor and a second photoelectric sensor. The first photoelectric sensor is arranged on the first silicon wafer carrier, and the second photoelectric sensor is arranged on the second silicon wafer carrier.

8. The silicon wafer cooling device according to claim 6, characterized in that: The silicon wafer cooling device further comprises: a pneumatic valve, which is arranged on the air inlet pipe to control the opening or closing of the air inlet pipe.

9. The silicon wafer cooling device according to claim 8, characterized in that: A plurality of the first air holes are arranged in an orderly manner at intervals on the first shell, a plurality of the second air holes are arranged in an orderly manner at intervals on the third shell, and a plurality of the third air holes are arranged in an orderly manner at intervals on the fifth shell.

10. The silicon wafer cooling device according to claim 9, characterized in that: The first air hole, the second air hole and the third air hole are independently configured to be elliptical or circular.

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