Wave soldering device and soldering equipment

Abstract

The utility model provides a wave soldering device and soldering equipment. The wave soldering device comprises a tin furnace, a wave crest generating mechanism and a flow guide component. The tin furnace is formed with a containing cavity for containing tin liquid. The wave crest generating mechanism is arranged in the tin furnace. The wave crest generating mechanism is suitable for being connected with the containing cavity to spray out the tin liquid and form a wave crest. The flow guide component is arranged in the wave crest generating mechanism. The flow guide component is connected with the containing cavity and the wave crest generating mechanism so that the tin liquid after being sprayed can flow back. The problem of large impact force generated by direct drop of the tin liquid can be effectively solved, thereby improving the stability in the welding process, making the welding process more stable and reliable, and reducing the adverse effects on the welding quality.

Description

Technical Field

[0001] The utility model relates to the technical field of welding equipment, in particular to a wave soldering device and welding equipment. Background Art

[0002] In the related art, the wave soldering equipment sprays molten tin liquid to form a wave crest to solder the circuit board. The sprayed tin liquid will fall directly back into the tin furnace. Due to the large height difference of the tin liquid falling, it will produce a large impact and splashing, which can easily cause vibration and instability in the welding process, affecting the welding quality. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the related art. To this end, the utility model proposes a wave soldering device, which aims to improve the stability of the soldering device and improve the soldering quality.

[0004] An embodiment of the second aspect of the utility model provides a welding device.

[0005] According to the first aspect of the present invention, the wave soldering device comprises:

[0006] A tin furnace is formed with a receiving cavity for receiving molten tin;

[0007] A wave crest generating mechanism is arranged in the tin furnace, and the wave crest generating mechanism is connected with the tin furnace;

[0008] The flow guide component is arranged on the crest generating mechanism, and the flow guide component is connected with the accommodating cavity and the crest generating mechanism to make the sprayed tin liquid flow back.

[0009] According to the wave soldering device of the embodiment of the utility model, it includes a tin furnace, a wave crest generating mechanism and a guide component. The tin furnace is formed with a containing chamber for containing tin liquid. The wave crest generating mechanism is arranged in the tin furnace. The wave crest generating mechanism is suitable for being connected with the containing chamber to spray out the tin liquid and form a wave crest. The guide component is arranged in the wave crest generating mechanism. The guide component connects the containing chamber and the wave crest generating mechanism to make the tin liquid flow back after being sprayed. By setting the guide component to guide the tin liquid back to the tin furnace, the problem of large impact force generated by direct falling of the tin liquid can be effectively solved, thereby improving the stability of the welding process, making the welding process more stable and reliable, and reducing the adverse effects on the welding quality.

[0010] According to the wave soldering device of the embodiment of the utility model, the guide component is arranged side by side along the wave generating mechanism, the guide component is at least partially arranged below the wave generating mechanism, and the guide component is formed with a guide hole, which is connected to the accommodating cavity.

[0011] According to the wave soldering device of the embodiment of the utility model, there are multiple guide holes, and the multiple guide holes are arranged along the length direction of the guide component, or the multiple guide holes are arranged in an array on the guide component.

[0012] According to the wave soldering device of the embodiment of the utility model, the guide component includes a first side and a second side that are arranged opposite to each other, the height of the first side is lower than the height of the second side, and the guide hole is arranged close to the first side.

[0013] According to the wave soldering device of the embodiment of the utility model, the wave generating mechanism includes:

[0014] A base, mounted on the tin furnace;

[0015] A disturbance wave generating component and a flat wave generating component are arranged on the base;

[0016] Wherein, at least one of the spoiler wave generating component and the flat wave generating component is provided with the flow guiding component.

[0017] According to the wave soldering device of the embodiment of the utility model, the guide assembly includes a first guide groove and a second guide groove, the spoiler wave generating assembly and the smooth wave generating assembly are arranged side by side, the first guide groove is arranged on one side of the spoiler wave generating assembly, the second guide groove is arranged on one side of the smooth wave generating assembly, and the first guide groove and the second guide groove are arranged opposite to each other.

[0018] According to the wave soldering device of the embodiment of the utility model, the height of at least one of the first guide groove and the second guide groove is adjustable.

[0019] According to the wave soldering device of the embodiment of the utility model, the spoiler wave generating assembly includes a front baffle, a spoiler and a middle baffle which are arranged in sequence, a spoiler cavity is formed between the front baffle, the spoiler and the middle baffle, and the front baffle is provided with a guide surface which is inclined toward the direction of the first guide groove.

[0020] According to the wave soldering device of the embodiment of the utility model, the base is formed with a guide cavity, the spoiler wave generating component and the flat wave generating component are both connected to the guide cavity, and the wave soldering device also includes a driving device, which connects the accommodating cavity and the guide cavity to transport the tin liquid to the spoiler wave generating component and the flat wave generating component.

[0021] The welding device according to the second embodiment of the utility model includes:

[0022] A conveying device, used for conveying a circuit board;

[0023] The wave soldering device described in any of the above embodiments is arranged on the conveying device and is used to solder the circuit board.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a structural schematic diagram of a wave soldering device provided by an embodiment of the utility model;

[0027] Figure 2 It is a top view of the wave soldering device provided by an embodiment of the utility model;

[0028] Figure 3 It is a schematic diagram of the installation of the wave crest generating mechanism and the flow guide assembly provided in the embodiment of the utility model;

[0029] Figure 4 It is a structural schematic diagram of a welding device provided in an embodiment of the utility model.

[0030] Reference numerals:

[0031] 10. Wave soldering device; 20. Conveying device;

[0032] 100. Tin furnace;

[0033] 200, wave crest generating mechanism; 210, base; 220, spoiler wave generating assembly; 230, flat wave generating assembly; 221, front baffle; 222, spoiler; 223, middle baffle; 224, guide surface;

[0034] 300, flow guide assembly; 301, flow guide hole; 302, first side; 303, second side; 310, first flow guide groove; 320, second flow guide groove;

[0035] 400. Driving device. DETAILED DESCRIPTION

[0036] The following is a further detailed description of the implementation of the present utility model in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0037] In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0038] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0039] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0040] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model embodiment. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0041] Wave soldering is a common electronic component soldering process, mainly used for soldering circuit boards. During the wave soldering process, the molten tin liquid sprayed out by the soldering equipment forms a wave crest, and then the soldering surface on the circuit board is immersed along this wave crest to achieve soldering connection. The advantage of this soldering method is that it can complete the connection of multiple solder joints at the same time, with high efficiency and suitable for mass production. Wave soldering can also ensure soldering quality and consistency because each solder joint is subject to similar soldering conditions.

[0042] The embodiments of the present utility model refer to Figure 1-Figure 4 As shown, a wave soldering device 10 and soldering equipment are provided.

[0043] In the related art, during the wave soldering process, the wave crest formed by the sprayed molten tin liquid is a key step in achieving soldering connection. However, when the sprayed tin liquid falls directly back into the soldering furnace 100, due to the large height difference, the tin liquid will be subjected to a large impact and splashing, which may cause vibration and instability during the soldering process, seriously affecting the soldering quality.

[0044] According to an embodiment of the present utility model, please refer to Figure 1 and Figure 2 The wave soldering device 10 of the embodiment of the utility model includes a tin furnace 100, which is formed with a containing cavity for containing tin liquid; a wave crest generating mechanism 200, which is arranged in the tin furnace 100, and the wave crest generating mechanism 200 is suitable for being connected with the containing cavity to spray out the tin liquid and form a wave crest; a guide component 300, which is arranged in the wave crest generating mechanism 200, and the guide component 300 connects the containing cavity and the wave crest generating mechanism 200 to reflux the tin liquid sprayed by the wave crest mechanism 200.

[0045] In this embodiment, the tin furnace 100 is a device for melting tin material and maintaining it at a suitable temperature. The tin furnace 100 can be made of high temperature resistant materials (such as ceramics, stainless steel, etc.) and has a certain capacity to accommodate sufficient soldering materials. A heating element (such as an electric heater or a flame) is usually provided inside the tin furnace 100 to provide the temperature required for melting, and a constant melting temperature is maintained through a temperature control system.

[0046] In the wave soldering device 10, the tin furnace 100 is not only used to melt the soldering material, but also serves to store the soldering material and is connected to the wave generating mechanism 200 to receive the sprayed tin liquid. By reasonably designing and controlling the temperature and capacity of the tin furnace 100, it is possible to ensure that the soldering material is in a suitable state, thereby achieving a high-quality wave soldering process.

[0047] The crest generating mechanism 200 is connected to the accommodating cavity in the tin furnace 100 so as to obtain the molten welding material (tin liquid) from the tin furnace 100, and the tin liquid can be sprayed out to form a crest. By controlling the parameters such as the spraying amount, spraying speed and spraying angle of the crest generating mechanism 200, the height, shape and stability of the crest can be adjusted to meet different welding requirements and workpiece requirements. The formation of the crest can help the welding material to be evenly coated on the welding joint to ensure the welding quality and strength.

[0048] The flow guide component 300 can be arranged at the lower side of the wave crest generating mechanism 200 to effectively guide the ejected tin liquid back to the tin furnace 100 to achieve buffering. In some embodiments, the height of the flow guide component 300 is between the height of the nozzle of the wave crest generating mechanism 200 and the liquid level of the tin furnace 100, so as to achieve buffering for the tin liquid ejected from the wave crest generating mechanism 200 and prevent the tin liquid from falling directly into the tin furnace 100.

[0049] It can be understood that, in the present embodiment, the wave soldering device 10 includes a tin furnace 100, a wave crest generating mechanism 200 and a guide assembly 300. The tin furnace 100 is formed with a containing cavity for containing tin liquid. The wave crest generating mechanism 200 is arranged in the tin furnace 100. The wave crest generating mechanism 200 is suitable for being connected with the containing cavity to spray out the tin liquid and form a wave crest. The guide assembly 300 is arranged in the wave crest generating mechanism 200. The guide assembly 300 is suitable for guiding the tin liquid sprayed out by the wave crest generating mechanism 200 back to the tin furnace 100. By setting the guide assembly 300 to guide the tin liquid back to the tin furnace 100, the problem of large impact force caused by direct falling of the tin liquid can be effectively solved, thereby improving the stability during the welding process, making the welding process more stable and reliable, and reducing the adverse effects on the welding quality.

[0050] According to one embodiment of the present invention, referring to Figure 1-Figure 3 As shown, the flow guide component 300 is arranged side by side with the crest generating mechanism 200, the flow guide component 300 is at least partially arranged below the crest generating mechanism 200, and the flow guide component 300 is formed with a flow guide hole 301, which is connected to the accommodating cavity.

[0051] It can be understood that, in this embodiment, the flow guide component 300 is arranged side by side with the crest generating mechanism 200. For example, the flow guide component 300 can be arranged side by side with the length direction of the crest generating mechanism 200, so as to ensure that the tin liquid sprayed from the crest generating mechanism 200 can be effectively guided through the flow guide component 300. This design can make the most of the flow guide component 300, and ensure that the flow guide component 300 covers the entire length of the crest generating mechanism 200 as much as possible. The sprayed tin liquid will be guided by the flow guide component 300. In this way, no matter where the welding material is sprayed, it can be received and guided by the flow guide component 300 in a timely manner, achieving the effect of full-course guidance.

[0052] In some embodiments, the guide component 300 is a trough structure, and a guide hole 301 is provided on the guide component 300. The guide hole 301 is connected to the receiving cavity. The tin liquid sprayed by the peak generating mechanism 200 can fall back into the receiving cavity of the tin furnace 100 through the guide hole 301. The design of the guide hole 301 further realizes the buffering of the tin liquid, further reduces the impact force generated when the tin liquid falls back to the tin furnace 100, and improves the stability and reliability of the welding process.

[0053] According to one embodiment of the present invention, referring to Figure 1-Figure 3 As shown, there are multiple flow guide holes 301 , and the multiple flow guide holes 301 are arranged along the length direction of the flow guide component 300 , or the multiple flow guide holes 301 are arranged in an array in the flow guide component 300 .

[0054] It is understandable that in this embodiment, multiple guide holes 301 are arranged along the length direction of the guide component 300, or multiple guide holes 301 are arranged in an array in the guide component 300, which can effectively achieve the diversion and reflux of the tin liquid. This design can more evenly distribute the flow of the soldering material, improve the diversion effect and reflux efficiency, ensure that the tin liquid is fully guided and returned to the accommodating cavity of the tin furnace 100, and promote the reflux and circulation of the solder.

[0055] If multiple guide holes 301 are arranged along the length direction of the guide component 300, the flow of the tin liquid can be evenly controlled during the entire welding process, thereby improving the welding quality and stability. If multiple guide holes 301 are arranged in an array on the guide component 300, the flow path of the welding material can be more accurately controlled, further improving the guide effect and the accuracy of the reflux.

[0056] In this embodiment, the size and number of the guide holes 301 need to be reasonably designed according to the specific welding parameters and equipment characteristics. The through holes can be evenly distributed in the length and width directions of the tin slag collection trough to ensure that the reflux of the solder is evenly distributed to avoid local accumulation or excessive flow.

[0057] According to one embodiment of the present invention, referring to Figure 1-Figure 3 As shown, the guide assembly 300 includes a first side 302 and a second side 303 that are oppositely disposed. The height of the first side 302 is lower than that of the second side 303 , and the guide hole 301 is disposed close to the first side 302 .

[0058] It can be understood that in this embodiment, the guide component 300 can be tilted so that the height of the first side 302 is lower than the height of the second side 303, and a guide hole 301 is provided near the first side 302. By setting the guide hole 301 at a lower position on the first side 302, the solder can flow naturally along the tilted direction more easily, and due to the effect of gravity, it can flow back more smoothly through the guide hole 301. This design can improve the efficiency of solder reflux.

[0059] In this embodiment, the first side 302 and the second side 303 may be two opposite sides of the guide assembly 300 along the length direction, or may be two opposite sides of the guide assembly 300 along the width direction. When the first side 302 is set lower along the length direction of the guide assembly 300, the solder can be encouraged to flow naturally to the guide hole 301 and smoothly flow back into the tin furnace 100. Similarly, when the first side 302 is set lower along the width direction of the guide assembly 300, the solder can also be smoothly refluxed, which is not specifically limited in this embodiment.

[0060] According to one embodiment of the present invention, referring to Figure 1-Figure 3 As shown, the wave crest generating mechanism 200 includes a base 210, a spoiler wave generating component 220 and a peaceful wave generating component 230. The spoiler wave generating component 220 and the peaceful wave generating component 230 are arranged on the base 210, and are used to generate spoiler waves and peaceful waves respectively, wherein at least one of the spoiler wave generating component 220 and the peaceful wave generating component 230 is provided with a guide component 300.

[0061] It can be understood that, in this embodiment, the wave crest generating mechanism 200 includes a base 210, a spoiler wave generating component 220 and a flat wave generating component 230, wherein the base 210 is installed on the tin furnace 100, and the base 210 is formed with a guide cavity connected to the accommodating cavity of the tin furnace 100, and the tin liquid in the tin furnace 100 can reach the spoiler wave generating component 220 and the flat wave generating component 230 through the guide cavity, and the spoiler wave generating component 220 and the flat wave generating component 230 are arranged on the base 210, and are respectively used to generate spoiler waves and flat waves. In this design, at least one of the generating components (the spoiler wave generating component 220 or the flat wave generating component 230) is provided with a guide component 300, which is used to guide the flow of the welding material and realize the guide and reflow functions during the welding process.

[0062] By providing the flow guide assembly 300, the flow path of the welding material can be effectively controlled to ensure that the welding material is correctly guided and returned to the receiving chamber of the welding device. This design can improve the stability and consistency of the welding process, reduce the waste of welding materials, and ensure that the welding quality meets the standard requirements.

[0063] In an optional embodiment, both the spoiler wave generating component 220 and the peaceful wave generating component 230 are provided with a guide component 300, which can fully guide the tin liquid of the spoiler wave and the peaceful wave, thereby ensuring the quality stability of the spoiler wave welding and the peaceful wave welding.

[0064] According to one embodiment of the present invention, referring to Figure 1-Figure 3 As shown, the guide assembly 300 includes a first guide groove 310 and a second guide groove 320, the spoiler wave generating assembly 220 and the smooth wave generating assembly 230 are arranged side by side, the first guide groove 310 is arranged on one side of the spoiler wave generating assembly 220, the second guide groove 320 is arranged on one side of the smooth wave generating assembly 230, and the first guide groove 310 and the second guide groove 320 are arranged opposite to each other.

[0065] It is understandable that when welding a circuit board, the spoiler wave welding is usually first performed through the spoiler wave generating component 220, and then through the flat wave generating component 230 for flat wave welding. In this embodiment, a first guide groove is provided on one side of the spoiler wave generating component 220, and a second guide groove 320 is provided on one side of the flat wave generating component 230. The first guide groove 310 can reduce the tin discharge impact on the front side of the spoiler wave nozzle, so that the welding process is smoother and more continuous; the second guide groove 320 can reduce the tin discharge impact on the rear side of the flat wave nozzle, so that the welding process is smoother and more continuous, thereby reducing tin oxide and ensuring welding quality and reliability.

[0066] It should be noted that, in some embodiments, the first guide groove 310 is arranged on the side of the spoiler wave generating component 220 away from the flat wave generating component 230, and the second guide groove 320 is arranged on the side of the flat wave generating component 230 away from the spoiler wave generating component 220; in some embodiments, the first guide groove 310 can be arranged on the side of the spoiler wave generating component 220 close to the flat wave generating component 230, and the second guide groove 320 can be arranged on the side of the flat wave generating component 230 close to the spoiler wave generating component On one side of the component 220; in some other embodiments, the first guide groove 310 can also be arranged on the side of the spoiler wave generating component 220 close to the smooth wave generating component 230, and the second guide groove 320 can be arranged on the side of the smooth wave generating component 230 away from the spoiler wave generating component 220. As long as the first guide groove 310 and the second guide groove 320 can guide the tin liquid sprayed from the spoiler wave generating component 220 and the smooth wave generating component 230, this embodiment does not make any specific limitation on this.

[0067] In an optional embodiment, the height of the second guide groove 320 near the flat wave generating component 230 is lower than the height away from the flat wave generating component 230, and the guide hole 301 is arranged at the end of the second guide groove 320 near the flat wave generating component 230 to improve the efficiency of solder reflux.

[0068] According to one embodiment of the present invention, referring to Figure 1-Figure 3 As shown, the height of at least one of the first guide groove 310 and the second guide groove 320 is adjustable.

[0069] In an optional embodiment, the height of the first guide groove 310 is adjustable. In another optional embodiment, the height of the second guide groove 320 is adjustable. In another optional embodiment, the heights of both the first guide groove 310 and the second guide groove 320 are adjustable.

[0070] In this embodiment, by adjusting the height of the first guide groove 310 or the second guide groove 320, the impact force of the molten tin of the disturbance wave or the flat wave falling back to the tin furnace 100 can be adjusted, the reflux effect of the molten tin during welding is optimized, the generation of splashing and bubbles is reduced, and the welding quality and stability are improved. This adjustment method can be flexibly adjusted according to specific welding requirements and workpiece characteristics to obtain the best welding effect.

[0071] For example, in some embodiments, the height of the first guide groove 310 or the second guide groove 320 can be adaptively adjusted according to the height of the wave crest generating mechanism 200 and the liquid level of the tin furnace 100, so as to achieve sufficient buffering of the tin liquid and reduce the impact force, thereby improving the stability and quality during the welding process. By adjusting the height of the guide groove according to the height of the wave crest generating mechanism 200 and the liquid level of the tin furnace 100, it can be ensured that the tin liquid is properly buffered and controlled when it flows back to the tin furnace 100, reducing the impact of the impact force on the equipment and welding quality. This adaptive adjustment design can be flexibly adjusted according to specific welding conditions and requirements, making the welding process more stable and controllable, better suitable for different welding processes and requirements, and improving the success rate and efficiency of welding. At the same time, reducing the impact force when the tin liquid flows back also helps to reduce material loss and equipment wear during the welding process and extend the service life of the equipment.

[0072] Specifically, the height adjustment method of the first guide groove 310 and the second guide groove 320 can be manual adjustment, for example, the operator can adjust the height of the guide groove by manually rotating bolts or levers. The height of the guide groove can also be automatically adjusted by a motor drive structure. The height of the guide groove can also be adjusted by using pneumatic devices or hydraulic systems. The selection can be based on specific adjustment requirements, and this embodiment does not make specific limitations on this.

[0073] In some other optional implementations, the inclination angle of the first guide groove 310 or the second guide groove 320 can also be adjusted as needed, so that it can be fully adapted to different application scenarios. The specific adjustment method is not specifically limited in this embodiment.

[0074] According to one embodiment of the present invention, referring to Figure 1-Figure 3 As shown, the spoiler wave generating assembly 220 includes a front baffle 221, a spoiler 222 and a middle baffle 223 which are arranged in sequence, a spoiler cavity is formed between the front baffle 221, the spoiler 222 and the middle baffle 223, and the front baffle 221 is provided with a guide surface 224 which is inclined toward the direction of the first guide groove 310.

[0075] It can be understood that in this embodiment, a spoiler cavity is formed between the front baffle 221, the spoiler 222 and the middle baffle 223, and a spoiler wave nozzle is provided on the spoiler 222 to generate a spoiler wave, and the guide surface 224 is inclined toward the direction of the first guide groove 310. Due to the inclined design of the guide surface 224, the tin liquid will be guided to flow in the direction of the first guide groove 310, reducing unnecessary impact and violent flow, and finally flowing back to the tin furnace 100, which can achieve the effect of buffering and reducing impact of the tin liquid, and help to improve the welding quality and protect the welding equipment.

[0076] In the related art, the turbulence wave generating component 220 and the horizontal wave generating component 230 of the wave soldering device 10 are independently arranged and are driven separately by turbulence pumps and horizontal flow pumps respectively. The turbulence pump drives the tin liquid in the tin furnace 100 to eject from the turbulence wave nozzle to form turbulence waves. The turbulence wave nozzle is designed with a specific shape and aperture to generate rotating airflow and eddy current, thereby disturbing the gas flow and heat distribution in the welding area; the horizontal flow pump drives the tin liquid in the tin furnace 100 to eject from the horizontal wave nozzle to form horizontal waves. The horizontal wave nozzle is designed with a specific shape and aperture to maintain the temperature of the welding area and the stability of the gas flow, thereby achieving uniform heat distribution.

[0077] According to one embodiment of the present invention, referring to Figure 1-Figure 3 As shown, the base 210 is formed with a guide cavity, and the spoiler wave generating component 220 and the smooth wave generating component 230 are both connected to the guide cavity. The wave soldering device 10 also includes a driving device 400, which connects the accommodating cavity and the guide cavity to transport the tin liquid to the spoiler wave generating component 220 and the smooth wave generating component 230.

[0078] It can be understood that in this embodiment, the spoiler wave generating component 220 and the peaceful wave generating component 230 are integrated on the same base 210 and connected to the same guide cavity, so as to realize the integration of the spoiler wave and the peaceful wave, that is, the spoiler wave component and the peaceful wave component can work simultaneously and coordinate with each other, thereby improving the stability and efficiency of the welding process.

[0079] The spoiler wave nozzle is a component on the spoiler wave generating assembly 220, through which the tin liquid can be sprayed to the welding area and a spoiler wave can be generated, thereby enhancing the mixing degree of the tin liquid and improving the welding quality. The spoiler wave nozzle is usually designed to be a plurality of small holes or slits, so that the tin liquid can be dispersed into a plurality of small streams to generate spoiler waves. The spoiler wave nozzle can also adjust the angle and effect of the spray by changing the parameters such as the position, size and shape of the hole, so as to meet the needs of different occasions.

[0080] The advection wave nozzle is a component of the advection wave generating assembly 230, through which the tin liquid can be evenly sprayed to the welding area, maintaining the stability and fluidity of the tin liquid during the spraying process, thereby achieving the accuracy and stability of welding. The advection wave nozzle is usually designed in a long strip shape, which can make the tin liquid evenly cover the entire welding area during spraying, avoiding the violent fluctuation of the tin liquid due to inertia, and ensuring the welding quality.

[0081] Only one driving motor is needed to convey the solder into the flow guide cavity to realize the welding work of the turbulent wave nozzle and the flat wave nozzle, which simplifies the operation steps, reduces the operation complexity, and thus improves the work efficiency. In addition, only one driving motor is needed to convey the solder during the entire welding process. Compared with the traditional two motors driving the turbulent wave generating component 220 and the flat wave generating component 230 respectively, it reduces energy consumption and reduces production costs.

[0082] And because the spoiler wave generating component 220 and the peaceful wave generating component 230 are connected to the same guide cavity, the operation of the spoiler wave generating component 220 and the peaceful wave generating component 230 can be realized by only one driving device 400. Compared with the previous design in which the spoiler wave generating component 220 and the peaceful wave generating component 230 are independently driven by a driving motor respectively, one driving motor, impeller, inverter and guide groove can be reduced, thereby greatly saving the manufacturing cost and maintenance cost of the wave soldering equipment.

[0083] The embodiment of the second aspect of the utility model refers to Figure 4 As shown, a soldering device is provided, including a conveying device 20 and a wave soldering device 10 of any one of the above embodiments, wherein the conveying device 20 is used to convey a circuit board, and the wave soldering device 10 is arranged on the conveying device 20 to solder the circuit board.

[0084] It can be understood that, in this embodiment, the conveying device 20 is used to convey the circuit board to be soldered, and convey the circuit board from the starting position along the production line to the wave soldering work area. The conveying device 20 can be in the form of a conveyor belt, a chain conveyor system, etc., to ensure that the circuit board moves stably during the spraying and soldering process, and the wave soldering device 10 can be set below the conveying device 20 or at other positions to solder the circuit board to be soldered.

[0085] Furthermore, the welding equipment may also include structures such as a preheating device and a flux spraying device. The preheating device can preheat the welding area before welding, thereby reducing the temperature difference during welding, helping to reduce the thermal stress during welding, and improving the quality and reliability of welding. The preheating device can be in various ways, such as a heater, a flame, etc. The flux spraying device is used to spray flux on the welding area to increase the surface tension and wettability of the welding. This helps to reduce oxidation and impurity generation during welding, and improve the quality and reliability of the welded joint. The flux is usually a liquid or powder that can be evenly applied to the welding area by a spraying device.

[0086] It can be understood that the wave soldering device 10 has the beneficial effects of the above-mentioned embodiment, and the soldering equipment correspondingly has the beneficial effects of the above-mentioned embodiment. The specific implementation method thereof can refer to the above-mentioned embodiment, and this application will not elaborate on it.

[0087] Finally, it should be noted that the above implementation modes are only used to illustrate the present invention, rather than to limit the present invention. Although the present invention is described in detail with reference to the embodiments, a person skilled in the art should understand that various combinations, modifications or equivalent replacements of the technical solutions of the present invention do not deviate from the spirit and scope of the technical solutions of the present invention, and should be included in the protection scope of the present invention.

Claims

1. A wave soldering device, characterized in that: include: A tin furnace is formed with a receiving cavity for receiving molten tin; A wave crest generating mechanism is arranged in the tin furnace, and the wave crest generating mechanism is connected with the tin furnace; A flow guide component is arranged on the crest generating mechanism, and the flow guide component is connected with the accommodating cavity and the crest generating mechanism to make the sprayed tin liquid flow back; The flow guide component is arranged side by side with the wave crest generating mechanism, the flow guide component is at least partially arranged below the wave crest generating mechanism, and the flow guide component is formed with a flow guide hole, and the flow guide hole is communicated with the accommodating cavity.

2. The wave soldering device according to claim 1, characterized in that: There are multiple flow guide holes, and the multiple flow guide holes are arranged along the length direction of the flow guide component, or the multiple flow guide holes are arranged in an array on the flow guide component.

3. The wave soldering device according to claim 1, characterized in that: The flow guide component includes a first side and a second side that are arranged opposite to each other, the height of the first side is lower than the height of the second side, and the flow guide hole is arranged close to the first side.

4. The wave soldering device according to any one of claims 1 to 3, characterized in that: The wave crest generating mechanism comprises: A base, mounted on the tin furnace; A disturbance wave generating component and a flat wave generating component are arranged on the base; Wherein, at least one of the spoiler wave generating component and the flat wave generating component is provided with the flow guiding component.

5. The wave soldering device according to claim 4, characterized in that: The guide assembly includes a first guide groove and a second guide groove, the spoiler wave generating assembly and the flat wave generating assembly are arranged side by side, the first guide groove is arranged on one side of the spoiler wave generating assembly, the second guide groove is arranged on one side of the flat wave generating assembly, and the first guide groove and the second guide groove are arranged opposite to each other.

6. The wave soldering device according to claim 5, characterized in that: The height of at least one of the first guide groove and the second guide groove is adjustable.

7. The wave soldering device according to claim 5, characterized in that: The spoiler wave generating assembly includes a front baffle, a spoiler and a middle baffle which are arranged in sequence, a spoiler cavity is formed between the front baffle, the spoiler and the middle baffle, and the front baffle is provided with a guide surface which is inclined toward the direction of the first guide groove.

8. The wave soldering device according to claim 4, characterized in that: The base is formed with a guide cavity, and the spoiler wave generating component and the flat wave generating component are both connected to the guide cavity. The wave soldering device also includes a driving device, which connects the accommodating cavity and the guide cavity to transport the tin liquid to the spoiler wave generating component and the flat wave generating component.

9. A welding device, characterized in that: include: A conveying device, used for conveying a circuit board; The wave soldering device according to any one of claims 1 to 8 is arranged on the conveying device and is used to solder the circuit board.

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