A crystal rod slicer for semiconductor processing

Abstract

The utility model relates to a crystal rod slicer for semiconductor processing, comprising a workbench, a box body is fixedly connected to the bottom of the workbench, a transmission assembly is arranged on the outer surface of the workbench, a cutting assembly is fixedly connected to the left side of the transmission assembly, the transmission assembly comprises a first motor fixedly connected to the right side of the workbench, and a first threaded rod is fixedly connected to the left side of the first motor. The crystal rod slicer for semiconductor processing places the crystal rod to be sliced ​​on the top of the placement plate, rotates the hand wheel to drive the second threaded rod to rotate, the second threaded rod rotates to drive the second threaded block, the fixed rod and the stabilizing plate to move to limit and stabilize the crystal rod, starts the first motor to drive the first threaded rod to rotate, the first threaded rod rotates to drive the first threaded block to move to the left, the first threaded block moves to drive the top rod and the top plate to push the crystal rod to the left, the crystal rod is pushed to the left, and the cutting assembly is started to slice the crystal rod, thereby achieving the effect of improving processing efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal rod processing, in particular to a crystal rod slicer used for semiconductor processing. Background Art

[0002] Nowadays, semiconductors are common electronic components in electronic devices. Semiconductors are materials whose electrical conductivity is between that of conductors and insulators at room temperature. In the production and processing of semiconductors, the crystal rods need to be sliced, and a crystal rod slicer is usually used.

[0003] The carrier of common semiconductor materials is made of silicon. The processing process first generates silicon into a crystal rod, and then cuts the crystal rod into thin slices, and then grinds and polishes it to form a wafer, that is, the main body of the semiconductor material. However, the current process of slicing the crystal rod can only slice a group of crystal rods at a time, which reduces the slicing efficiency of the crystal rod. In addition, the existing crystal rod slicing is uneven and the cutting effect is not ideal. At the same time, manual material delivery is required for the crystal rod, and the processing efficiency is low. Therefore, a crystal rod slicer for semiconductor processing is proposed to solve the above problems. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a crystal rod slicer for semiconductor processing, which has the advantages of high processing efficiency and strong practicality, and solves the problems mentioned in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a crystal rod slicer for semiconductor processing, comprising a workbench, a box body is fixedly connected to the bottom of the workbench, a transmission assembly is arranged on the outer surface of the workbench, and a cutting assembly is fixedly connected to the left side of the transmission assembly.

[0006] The transmission assembly includes a first motor fixedly connected to the right side of the workbench, a first threaded rod fixedly connected to the left side of the first motor, a first threaded block threadedly connected to the outer surface of the first threaded rod, a push rod fixedly connected to the outer surface of the first threaded block, a top plate fixedly connected to the left side of the push rod, a placement plate fixedly connected to the top of the workbench, a hand wheel rotatably connected to the front of the workbench, a second threaded rod fixedly connected to the back of the hand wheel, a second threaded rod threadedly connected to the outer surface of the second threaded rod, a fixing rod fixedly connected to the top of the second threaded block, and a stabilizing plate fixedly connected to the end face of the fixing rod.

[0007] Furthermore, a stabilizing seat is fixedly connected to the top of the workbench, and one end of the first threaded rod is rotatably connected to the inside of the stabilizing seat.

[0008] Furthermore, the first threaded block is limited to be slidably connected to the inside of the workbench and passes through the workbench, and the fixing rod is limited to be slidably connected to the inside of the workbench and passes through the workbench.

[0009] Furthermore, a cutting groove is provided on the top of the workbench.

[0010] Furthermore, the cutting assembly includes a support plate fixedly connected to the inside of the box body, a second motor is fixedly connected to the top of the support plate, a connecting rod is fixedly connected to the outer surface of the output shaft of the second motor, a movable rod is hinged on the left side of the connecting rod, a connecting plate is hinged on the top of the movable rod, a mounting plate is fixedly connected to the outer surface of the connecting plate, two bearing plates are fixedly connected to the top of the workbench, the two bearing plates are slidably connected to a sliding plate, and a cutting knife is fixedly connected to the bottom of the sliding plate.

[0011] Furthermore, a limiting strip is fixedly connected to the right side of the left-side carrying plate, a limiting groove is provided inside the sliding plate, and the sliding plate is slidably connected to the outer surface of the limiting strip.

[0012] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0013] 1. The crystal rod slicer for semiconductor processing places the crystal rod to be sliced ​​on the top of the placement plate, rotates the hand wheel to drive the second threaded rod to rotate, the rotation of the second threaded rod drives the second threaded block, the fixed rod and the stabilizing plate to move to limit and stabilize the crystal rod, starts the first motor to drive the first threaded rod to rotate, the rotation of the first threaded rod drives the first threaded block to move to the left, the movement of the first threaded block drives the top rod and the top plate to push the crystal rod to the left, the crystal rod is pushed to the left, and the cutting component is started to slice the crystal rod, thereby achieving the effect of improving processing efficiency.

[0014] 2. The crystal rod slicer used for semiconductor processing starts the second motor to drive the connecting rod to rotate, and the rotating connecting rod drives the movable rod and the connecting plate to move up and down. The up and down movement of the connecting plate drives the mounting plate, the sliding plate and the cutting knife to move up and down, thereby achieving the effect of slicing the crystal rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of another viewing angle of the present utility model;

[0017] Figure 3 This is a schematic diagram of the cutting assembly of the utility model;

[0018] Figure 4 This is a schematic diagram of the bottom structure of the workbench of the utility model;

[0019] Figure 5It is a schematic diagram of the transmission component of the utility model.

[0020] In the figure: 1 workbench, 2 box, 3 cutting assembly, 301 bearing plate, 302 support plate, 303 second motor, 304 connecting rod, 305 movable rod, 306 connecting plate, 307 mounting plate, 308 sliding plate, 309 cutting knife, 310 limit strip, 311 limit groove, 4 transmission assembly, 401 first motor, 402 first threaded rod, 403 first threaded block, 404 ejector rod, 405 ejector plate, 406 placement plate, 407 hand wheel, 408 second threaded rod, 409 second threaded block, 410 fixing rod, 411 stabilizing plate, 412 stabilizing seat, 5 cutting groove. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-5 In this embodiment, a crystal rod slicer for semiconductor processing includes a workbench 1, a box body 2 is fixedly connected to the bottom of the workbench 1, a transmission component 4 is arranged on the outer surface of the workbench 1, and a cutting component 3 is fixedly connected to the left side of the transmission component 4.

[0023] The transmission assembly 4 includes a first motor 401 fixedly connected to the right side of the workbench 1, a first threaded rod 402 fixedly connected to the left side of the first motor 401, a first threaded block 403 threadedly connected to the outer surface of the first threaded rod 402, a top rod 404 fixedly connected to the outer surface of the first threaded block 403, a top sheet 405 fixedly connected to the left side of the top rod 404, and a placement plate 406 fixedly connected to the top of the workbench 1.

[0024] Secondly, the front of the workbench 1 is rotatably connected to a hand wheel 407, the back of the hand wheel 407 is fixedly connected to a second threaded rod 408, the outer surface of the second threaded rod 408 is threadedly connected to a second threaded block 409, the top of the second threaded block 409 is fixedly connected to a fixed rod 410, and the end face of the fixed rod 410 is fixedly connected to a stabilizing plate 411. The top of the workbench 1 is fixedly connected to a stabilizing seat 412, and one end of the first threaded rod 402 is limited to be rotatably connected to the inside of the stabilizing seat 412, so that the first threaded rod 402 can be more stable when rotating. The first threaded block 403 is limited to be slidably connected to the inside of the workbench 1 and passes through the workbench 1, and the fixed rod 410 is limited to be slidably connected to the inside of the workbench 1 and passes through the workbench 1.

[0025] In addition, a cutting groove 5 is provided on the top of the workbench 1, and a four-way thread groove is provided on the outer surface of the second threaded rod 408. By providing the four-way thread groove, the four second thread blocks 409 can all move toward the side close to the crystal rod.

[0026] Furthermore, the cutting assembly 3 includes a support plate 302 fixedly connected to the inside of the box body 2, a second motor 303 is fixedly connected to the top of the support plate 302, a connecting rod 304 is fixedly connected to the outer surface of the output shaft of the second motor 303, a movable rod 305 is hinged on the left side of the connecting rod 304, a connecting plate 306 is hinged on the top of the movable rod 305, a mounting plate 307 is fixedly connected to the outer surface of the connecting plate 306, two supporting plates 301 are fixedly connected to the top of the workbench 1, sliding plates 308 are slidably connected inside the two supporting plates 301, and a cutting knife 309 is fixedly connected to the bottom of the sliding plate 308.

[0027] In summary, the right side of the left supporting plate 301 is fixedly connected to the limiting strip 310, the sliding plate 308 has a limiting groove 311 inside, and the sliding plate 308 is slidably connected to the outer surface of the limiting strip 310, which can make the sliding plate 308 more stable when sliding up and down.

[0028] The working principle of the above embodiment is:

[0029] (1) The crystal ingot slicer for semiconductor processing places the crystal ingot to be sliced ​​on the top of the placement plate 406, rotates the hand wheel 407 to drive the second threaded rod 408 to rotate, and the second threaded rod 408 rotates to drive the second threaded block 409, the fixing rod 410 and the stabilizing plate 411 to move to limit and stabilize the crystal ingot, rather than clamping and fixing the crystal ingot, starts the first motor 401 to drive the first threaded rod 402 to rotate, and the first threaded rod 402 rotates to drive the first threaded block 403 to move leftward, and the first threaded block 403 moves to drive the top rod and the top plate 405 to push the crystal ingot to the left, and the crystal ingot is pushed to the left, and the cutting component 3 is started to slice the crystal ingot, thereby achieving the effect of improving the processing efficiency.

[0030] (2) The crystal rod slicer used for semiconductor processing starts the second motor 303 to drive the connecting rod 304 to rotate. The rotating connecting rod 304 drives the movable rod 305 and the connecting plate 306 to move up and down. The connecting plate 306 moves up and down to drive the mounting plate 307, the sliding plate 308 and the cutting knife 309 to move up and down, thereby achieving the effect of slicing the crystal rod.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A crystal ingot slicer for semiconductor processing, comprising a workbench (1), characterized in that: The bottom of the workbench (1) is fixedly connected to a box body (2); the outer surface of the workbench (1) is provided with a transmission assembly (4); the left side of the transmission assembly (4) is fixedly connected to a cutting assembly (3); The transmission assembly (4) comprises a first motor (401) fixedly connected to the right side of the workbench (1); a first threaded rod (402) is fixedly connected to the left side of the first motor (401); a first threaded block (403) is threadedly connected to the outer surface of the first threaded rod (402); a push rod (404) is fixedly connected to the outer surface of the first threaded block (403); a top plate (405) is fixedly connected to the left side of the push rod (404); a placement plate (406) is fixedly connected to the top of the workbench (1); a hand wheel (407) is rotatably connected to the front of the workbench (1); a second threaded rod (408) is fixedly connected to the back of the hand wheel (407); a second threaded rod (408) is threadedly connected to the outer surface of the second threaded rod (408); a fixed rod (410) is fixedly connected to the top of the second threaded block (409); and a stabilizing plate (411) is fixedly connected to the end surface of the fixed rod (410).

2. A crystal ingot slicer for semiconductor processing according to claim 1, characterized in that: The top of the workbench (1) is fixedly connected to a stabilizing seat (412), and one end of the first threaded rod (402) is rotatably connected to the inside of the stabilizing seat (412).

3. The ingot slicer for semiconductor processing according to claim 1, characterized in that: The first threaded block (403) is limited to being slidably connected to the inside of the workbench (1) and passing through the workbench (1), and the fixing rod (410) is limited to being slidably connected to the inside of the workbench (1) and passing through the workbench (1).

4. The ingot slicer for semiconductor processing according to claim 1, characterized in that: The top of the workbench (1) is provided with a cutting groove (5), and the outer surface of the second threaded rod (408) is provided with a four-way threaded groove.

5. The ingot slicer for semiconductor processing according to claim 1, characterized in that: The cutting assembly (3) comprises a support plate (302) fixedly connected to the inside of the box body (2); a second motor (303) is fixedly connected to the top of the support plate (302); a connecting rod (304) is fixedly connected to the outer surface of the output shaft of the second motor (303); a movable rod (305) is hingedly connected to the left side of the connecting rod (304); a connecting plate (306) is hingedly connected to the top of the movable rod (305); a mounting plate (307) is fixedly connected to the outer surface of the connecting plate (306); two supporting plates (301) are fixedly connected to the top of the workbench (1); sliding plates (308) are slidably connected to the inside of the two supporting plates (301); and a cutting knife (309) is fixedly connected to the bottom of the sliding plate (308).

6. A crystal ingot slicer for semiconductor processing according to claim 5, characterized in that: The right side of the left-side carrying plate (301) is fixedly connected to a limiting strip (310), a limiting groove (311) is provided inside the sliding plate (308), and the sliding plate (308) is slidably connected to the outer surface of the limiting strip (310).

Images