Wafer film peeling device

Abstract

A wafer film tearing device includes an electric linear slide, an electric push rod, a linear bearing, a vacuum suction cup, a workbench, a support plate, a cylinder, and a film tearing mechanism; the film tearing mechanism includes a fixed plate, a motor reduction mechanism, a winding wheel, a take-up pulley, and a guide wheel. The electric linear slide, the electric push rod, the linear bearing, the vacuum suction cup, the workbench, the support plate, the cylinder, the film tearing mechanism, and the fixed plate are installed together. The device can tighten or loosen the flexible tape by controlling the working mode of the cylinder. After the wafer to be film-torn is placed, the electric linear slide can be controlled to drive the wafer to move from right to left. The second guide wheel will bond the left front upper end of the protective film to the lower end of the flexible tape, and then the protective film of the wafer to be continuously torn off can be bonded and wound on the take-up pulley through the guidance of multiple other guide wheels. After the subsequent take-up pulley is wound up, it can be removed and replaced. After the take-up pulley that has not wound up a new take-up pulley and the take-up pulley that has not unwound the tape can be put into production again.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production auxiliary equipment, in particular to a wafer film tearing device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. During production, high-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single silicon crystal rod. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. Wafers (silicon wafers with circuits on the front) need to be thinned on the back before subsequent dicing, welding, and packaging to reduce the package mounting height, thereby reducing the chip packaging volume, improving the chip's thermal diffusion efficiency, electrical performance, mechanical properties, and reducing the amount of dicing. Back grinding thinning has the advantages of high efficiency and low cost. It has now replaced traditional wet etching and ion etching processes to become the most important thinning technology.

[0003] After the wafer is thinned, in order to ensure stable production of the next process, its lower end is bonded to a processing ring by glue (the inner diameter of the processing ring is slightly larger than the outer diameter of the wafer). After the next process is completed, the wafer is removed from the ring). A layer of protective film is bonded to the outside of the upper end of the wafer. Before the next process is produced, the protective film bonded to the wafer needs to be torn off. In the prior art, for the process of tearing off the protective film after thinning, the staff generally fix the ring at the relevant work station, and then tear off the protective film on the wafer by hand. In the above process, the need for manual operation will bring inconvenience to the staff, which is correspondingly not conducive to improving work efficiency. In summary, it is very necessary to provide a device that can realize automatic film tearing. Utility Model Content

[0004] In order to overcome the disadvantages of manual operation of wafer film tearing after thinning, which brings inconvenience to the staff and is not conducive to improving work efficiency, the utility model provides a wafer film tearing device which, under the joint action of relevant mechanisms, can automatically tear off the sticky film on the outer upper end of the wafer and wind it on a reel after the staff puts the wafer to be peeled off at the work station, thereby bringing convenience to the staff and correspondingly improving the work efficiency.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A wafer film tearing device, comprising an electric linear slide, an electric push rod, a linear bearing, a vacuum suction cup, a workbench, a support plate, and a cylinder, characterized in that it also has a film tearing mechanism; characterized in that the electric linear slide is installed at the lower end of the workbench, the lower ends of the bearing seats of multiple sets of linear bearings are respectively installed on the periphery of the sliding block of the electric linear slide, the lower end of the electric push rod is installed at the upper end of the sliding block, the upper ends of the bearing rods of multiple sets of linear bearings and the upper end of the electric push rod are respectively installed at the lower end of the support plate; the lower end of the vacuum suction cup is provided with an exhaust pipe, and the surface of the vacuum suction cup is provided with a plurality of air holes, The upper end of the support plate and the lower end of the vacuum suction cup are installed together; the film tearing mechanism includes a fixed plate, a motor reduction mechanism, a winding wheel, a take-up pulley, and a guide wheel, the winding wheel is movably sleeved on the front end of one side of the fixed plate, and the motor reduction mechanism is installed on the rear end of the other side of the fixed plate; there are multiple sets of guide wheels, the piston rod of the cylinder and the first and second sets of guide wheels are rotatably installed together, and the third and fourth sets of guide wheels and the fifth set of guide wheels are rotatably installed in the middle of the front side of the fixed plate respectively; the take-up pulley and the rotating shaft of the motor reduction mechanism are fixedly installed together; the fixed plate is installed on the upper end of the workbench.

[0007] Furthermore, a guide hole is provided in the middle of the winding wheel, a fixing hole is provided in the middle of the winding belt wheel, and the outer diameters of the front and rear ends of the winding wheel and the winding belt wheel are larger than the outer diameter of the middle part.

[0008] Furthermore, the outer diameters of the front and rear ends of the second, fourth and fifth sets of guide wheels are larger than the outer diameters of the middle parts.

[0009] Furthermore, a plurality of turns of flexible tape are wound on the outside of the winding wheel, and the front end of the flexible tape is fixed on the outside of the winding wheel via five sets of guide wheels, and the width of the flexible tape is greater than the width of the wafer protection film.

[0010] Furthermore, a fixing ring is installed on the outside of the vacuum suction cup, the outer diameter of the fixing ring is larger than the outer diameter of the processing ring, the inner diameter of the fixing ring is larger than the outer diameter of the wafer, and a limiting plate is installed on the rear side of the fixing ring.

[0011] Furthermore, after the processing ring is placed on the fixed ring, the lower end of the wafer contacts the upper end of the vacuum chuck.

[0012] Furthermore, the guide wheel is made of rubber.

[0013] The beneficial effect of the utility model is that the upper and lower layers of the protective film on the upper end of the wafer after thinning have adhesive properties, and the flexible tape can be tightened or loosened by controlling the working mode of the cylinder. After the wafer to be torn off is placed, the electric linear slide can be controlled to drive the wafer to move from right to left, and the second guide wheel will bond the upper left front end of the protective film to the lower end of the flexible tape, and then the protective film of the wafer to be continuously torn off can be bonded and wound on the winding wheel through the guidance of other multiple guide wheels. After the subsequent winding wheel is wound up, it can be removed and replaced, and there is no new winding wheel to be wound up and no winding wheel to unwind the tape, and then it can be put into production again. The utility model brings convenience to the staff and correspondingly improves the work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0015] Figure 1 , 2 It is a schematic diagram of the overall structure and local structure of the utility model.

[0016] Figure 3 It is a partial enlarged structural schematic diagram of the utility model. DETAILED DESCRIPTION

[0017] Figure 1 , 2As shown in , 3, a wafer film tearing device includes a PLC or a host computer (existing mature technology, the working principle of which is no longer detailed in this application, and is not drawn in the figure), an electric linear slide 1 (existing mature technology, the working principle of which is no longer detailed in this application), an electric push rod 2 (existing mature technology, the working principle of which is no longer detailed in this application), a linear bearing 3, a vacuum pump (not drawn in the figure, existing mature technology, the working principle of which is no longer detailed in this application), a vacuum suction cup 4, a "]"-shaped workbench 5, a support plate 6, a cylinder 7 (existing mature technology, the working principle of which is no longer detailed in this application), an air compressor (not drawn in the figure, existing mature technology, the working principle of which is no longer detailed in this application), an air compressor The exhaust pipe and the electromagnetic valves at the upper and lower parts of the side ends of the cylinder 7 are respectively connected through hoses, and the multi-way power output ends of the PLC or the host computer are respectively connected to the electric linear slide 1, the electric push rod 2, the vacuum pump, the electromagnetic valves at the upper and lower parts of the side ends of the cylinder 7, and the power input ends of the motor reduction mechanism of the film tearing mechanism 8 through wires, and also have a film tearing mechanism 8; the electric linear slide 1 is horizontally installed in the upper middle part of the lower end of the workbench 5, and there are four sets of linear bearings 3. The lower ends of the bearing seats 31 of the four sets of linear bearings are respectively installed on the four sides of the sliding block 101 of the electric linear slide 1 by bolts, and the lower ends of the cylinders of the electric push rods 2 are vertically distributed and installed in the middle of the upper end of the sliding block 101 by bolts. The upper ends of the bearing rods 32 of the four sets of linear bearings and the upper ends of the movable columns of the electric push rods 2 are respectively installed on the four sides of the sliding block 101 of the electric linear slide 1 by bolts. The vacuum suction cup 4 is a circular hollow sealing mechanism, and an exhaust pipe 41 communicating with the inside of the vacuum suction cup 4 is welded to the lower end of the vacuum suction cup 4, and a plurality of air holes 42 are distributed on the surface of the vacuum suction cup 4. The upper end of the support plate 6 and the lower outer end of the vacuum suction cup 4 are fixed together by four connecting rods 43, and the exhaust pipe 41 of the vacuum suction cup 4 and the air inlet pipe of the vacuum pump are connected by a hose with a certain strength; the film tearing mechanism includes a fixed plate 81, a guide rod 82, a motor reduction mechanism 83, a winding wheel 84, a winding pulley 85, and a guide wheel. The guide rod 82 is longitudinally welded to the middle of the front right end of the fixed plate 81, and the middle of the winding wheel 84 rotates and sleeves on the outside of the guide rod 82; the fixed plate There is an axial hole (not shown) at the upper left end of 81, the motor reduction mechanism 2 is longitudinally distributed and bolted to the rear outer end of the fixing plate 81 at the rear end of the upper left end axial hole, and the rotating shaft of the motor reduction mechanism 2 is led out to the front outer end of the fixing plate through the axial hole (the inner diameter of the axial hole is larger than the outer diameter of the rotating shaft); there are five sets of guide wheels, a fixing seat 71 is welded to the lower end of the piston rod of the cylinder 7, the first set of guide wheels 861 and the second set of guide wheels 862 are horizontally distributed and rotatably installed at the front side end of the fixing seat 71 at a distance, the third set of guide wheels 863 and the fourth set of guide wheels 864 are respectively rotatably installed on the left side of the middle of the lower end of the fixing plate 81 (located on the upper part of the cylinder), and the fifth set of guide wheels 865 is rotatably installed on the right side of the middle of the lower end of the fixing plate 81;The winding pulley 85 has a rectangular through hole 851 in the middle, a rectangular limit rod 852 is welded in front of the rotating shaft of the motor reduction mechanism (a rear limit plate with an outer diameter larger than the inner diameter of the through hole is welded on the outer side of the rear end of the limit rod), the winding pulley through hole 851 is tightly sleeved on the outer side of the limit rod 852, a screw rod is welded in the middle of the front end of the limit rod, a washer with an outer diameter larger than the through hole is sleeved on the outer side of the screw rod, and a nut is screwed into the inner thread of the screw rod to fix the winding pulley on the front outer side of the limit rod; the upper end of the fixing plate 81 is welded to the lower part of the upper end of the workbench 5. ;

[0018] Figure 1 , 2As shown in , 3, there is a through hole in the middle longitudinal part of the winding wheel 84, the outer diameter of which is slightly larger than the outer diameter of the guide rod 82, and the outer diameters of the front and rear ends of the winding wheel 85 and the winding wheel 84 are larger than the outer diameters of the middle part. The front and rear end outer diameters of the second set of guide wheels 862, the fourth set of guide wheels 864, and the fifth set of guide wheels 865 are larger than the outer diameters of the middle part, and the front and rear end widths of the second set of guide wheels 862, the fourth set of guide wheels 864, and the fifth set of guide wheels 865 are consistent with the front and rear widths of the winding wheel 85 and the winding wheel 84, and the widths of the first set of guide wheels 861 and the third set of guide wheels 863 are consistent with the middle widths of the second set of guide wheels 862, the fourth set of guide wheels 864, the fifth set of guide wheels 865, the winding wheel 85, and the winding wheel 84. The middle of the winding wheel 84 is wound with several turns of flexible tape 87, which is slightly smaller than the middle width of the winding wheel. The front end of the flexible tape 87 passes through the middle of the right end of the fifth set of guide wheels 865 to the left, passes through the middle of the second set of guide wheels 862 from top to bottom, and passes between the third set of guide wheels 863 and the middle of the fourth set of guide wheels from bottom to top. The front end of the flexible tape is wound around and fixed on the outer side of the middle of the winding wheel 85. The width of the flexible tape 87 is greater than the width of the wafer protective film. A circle of fixed ring 44 is welded on the outer side of the vacuum suction cup 4. The outer diameter of the fixed ring 44 is greater than the outer diameter of the processing ring 8, and the inner diameter of the fixed ring 44 is greater than the outer diameter of the wafer 9. A limit plate 10 with a height greater than the processing ring is welded on the upper part of the two ends of the rear side of the fixed ring 44. After the processing ring 8 is placed on the fixed ring, the lower end of the wafer 9 and the upper end of the vacuum suction cup 4 are in contact. When the first set of guide wheels 861 and the second set of guide wheels 862 are located on the left side of the vacuum suction cup 4, they are located in the upper middle of the left end of the vacuum suction cup 4. The lower end heights of the first set of guide wheels 861 and the second set of guide wheels 862 are lower than the lower end height of the fixing seat 71, and the five sets of guide wheels are made of rubber. The outer diameters of the first set of guide wheels 861 and the third set of guide wheels 862 are respectively smaller than the outer diameters of the second set of guide wheels 863, the fourth set of guide wheels 864, and the fifth set of guide wheels 865. The first set of guide wheels 861 and the third set of guide wheels 863 are respectively located in the middle of the left side of the second set of guide wheels 862 and the fourth set of guide wheels 864, and the right side of the first set of guide wheels 861 and the third set of guide wheels 863 is respectively separated from the left side of the second set of guide wheels 862 and the fourth set of guide wheels 864 by a certain distance (slightly larger than the thickness of the tape 87, and the same thickness after the tape 87 and the protective film 11 are bonded together).

[0019] Figure 1 , 23. Before the present invention works, the middle part of the winding wheel 84 with several turns of flexible tape 87 is rotated and sleeved on the outside of the guide rod 82, and the winding wheel is fixedly installed on the front end of the limit rod 852. The front end of the flexible tape 87 passes through the middle part of the right end of the fifth set of guide wheels 865 to the left, passes through the middle part between the second set of guide wheels 862 and the first set of guide wheels 861 from top to bottom, and passes between the third set of guide wheels 863 and the middle part of the fourth set of guide wheels and winding wheels from bottom to top. The front end of the flexible tape is wound and fixed on the outside of the middle part of the winding wheel 85. Then, the flexible tape 87 can be tightened or loosened by controlling the working mode of the cylinder (loosening the tape can remove the reel and winding wheel, etc., and tightening the tape can subsequently cause the motor deceleration mechanism to drive the tape to unwind; when the PLC controls the electromagnetic valve on the outer side of the upper end of the cylinder to be energized, the compressed air output by the air compressor enters the upper end of the cylinder, and the piston rod of the cylinder drives the first and second sets of guide wheels downward, and when the electromagnetic valve on the outer side of the lower end of the cylinder is energized, the compressed air output by the air compressor enters the lower end of the cylinder, and the piston rod of the cylinder drives the first and second sets of guide wheels upward), and then the film tearing process can be entered. The novel workflow is as follows. (1): After thinning, the upper and lower layers of the protective film 11 on the upper end of the wafer have adhesive properties. Before tearing the film, the staff places the wafer to be torn off on the fixed ring 44 through the processed ring 8, and the rear end of the fixed ring is stuck between the inner sides of the limit plate 10. Then turn on the power switch of the PLC or the host computer (preferably PLC). The PLC controls the vacuum pump to generate negative pressure suction inside the vacuum suction cup 4, and the lower end of the wafer 9 is tightly sucked on the vacuum suction cup 4 to prevent the wafer and the vacuum suction cup from separating during film tearing, resulting in the inability to tear the film normally. (2): PLC controls the sliding block of the electric linear slide (its motor positive and negative power input terminals are powered) to move from right to left. After the sliding block drives the vacuum suction cup and the wafer to move to the lower end of the first and second guide wheels, PLC controls the motor reduction mechanism 83 to be powered. The motor reduction mechanism 2 drives the reel 85 to rotate counterclockwise. The reel 85 reels the tape 87 (the winding wheel unwinds the tape). The tape moves along the rear side of the fifth reel 85, between the first and second reel wheels, and between the third and fourth reel wheels and is reeled by the reel 85 (the five guide wheels rotate to guide the tape movement). (3): PLC controls the movable column of the electric push rod 2 (its motor positive and negative power input terminals are powered) to move upward to the stop point. The movable column drives the vacuum suction cup 4 upward (the linear bearing is the upward guide for the vacuum suction cup). In this way, the lower end of the second reel wheel and the upper side of the film 11 in the middle of the upper left side of the wafer 9 are bonded. (4): The PLC controls the movable block of the electric linear slide (the negative and positive power input terminals of the motor are powered) to continue to move from right to left, and the film on the wafer will be completely adhered by the rotating tape 87, and will be taken up by the take-up pulley 85 through the movement guide between the first and second sets of take-up wheels and between the third and fourth sets of take-up wheels.(5) After the winding is completed, the PLC controls the motor deceleration mechanism to lose power, and controls the electric push rod to drive the vacuum suction cup to descend, and controls the vacuum pump to stop working. The PLC controls the electric linear slide to drive the vacuum suction cup to move to the right end. Then, the staff removes the wafer after the film is torn off and can start the film tearing work of the next wafer. It should be noted that the PLC controls the motor deceleration mechanism, vacuum pump, electric push rod, electric linear slide, solenoid valve of the cylinder, motor deceleration mechanism, etc. respectively, and working one by one at intervals is an existing mature control technology. This application does not provide any protection for this technical point. This application protects the technical solution that in actual production, the staff only needs to place the wafer that needs to be torn off the film at the film tearing station and remove it from the film tearing station after the film is torn off, which brings convenience to the staff and correspondingly improves the work efficiency.

[0020] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the utility model.

[0021] In addition, it should be understood that although the present specification is described according to the implementation mode, the implementation mode does not only include an independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments can also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer film tearing device, comprising an electric linear slide, an electric push rod, a linear bearing, a vacuum suction cup, a workbench, a support plate, and a cylinder, characterized in that: It also has a film tearing mechanism; it is characterized in that the electric linear slide is installed at the lower end of the workbench, the lower ends of the bearing seats of multiple sets of linear bearings are respectively installed on the surroundings of the sliding block of the electric linear slide, the lower end of the electric push rod is installed at the upper end of the sliding block, the upper ends of the bearing rods of multiple sets of linear bearings and the upper ends of the electric push rods are respectively installed at the lower end of the support plate; the lower end of the vacuum suction cup is provided with an exhaust pipe, and the surface of the vacuum suction cup is provided with a plurality of air holes, and the upper end of the support plate and the lower end of the vacuum suction cup are installed together; the film tearing mechanism comprises a fixed plate, a motor reduction mechanism, a winding wheel, a winding pulley, and a guide wheel, the winding wheel is movably sleeved on the front end of one side of the fixed plate, and the motor reduction mechanism is installed at the rear end of the other side of the fixed plate; there are multiple sets of guide wheels, the piston rod of the cylinder and the first and second sets of guide wheels are rotatably installed together, and the third and fourth sets of guide wheels and the fifth set of guide wheels are respectively rotatably installed in the middle of the front side of the fixed plate; the winding pulley and the rotating shaft of the motor reduction mechanism are fixedly installed together; the fixed plate is installed at the upper end of the workbench.

2. A wafer film tearing device according to claim 1, characterized in that: A guide hole is arranged in the middle of the winding wheel, a fixing hole is arranged in the middle of the winding belt wheel, and the outer diameters of the front and rear ends of the winding wheel and the winding belt wheel are larger than the outer diameter of the middle part.

3. The wafer film tearing device according to claim 1, characterized in that: The outer diameters of the front and rear ends of the second, fourth and fifth sets of guide wheels are larger than the outer diameters of the middle parts.

4. The wafer film tearing device according to claim 1, characterized in that: Several turns of flexible tape are wound on the outside of the winding wheel, and the front end of the flexible tape is surrounded and fixed on the outside of the winding wheel by five sets of guide wheels. The width of the flexible tape is greater than the width of the wafer protective film.

5. The wafer film tearing device according to claim 1, characterized in that: A fixed ring is installed on the outside of the vacuum suction cup, the outer diameter of the fixed ring is larger than the outer diameter of the processing ring, the inner diameter of the fixed ring is larger than the outer diameter of the wafer, and a limit plate is installed on the rear side of the fixed ring.

6. The wafer film tearing device according to claim 1, characterized in that: After the processing ring is placed on the fixed ring, the lower end of the wafer contacts the upper end of the vacuum chuck.

7. The wafer film tearing device according to claim 1, characterized in that: The guide wheels are made of rubber.

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