Faraday cup assembly and process chamber

Abstract

The utility model discloses a Faraday cylinder assembly and a process chamber, and the Faraday cylinder assembly comprises a first cylinder part which is disposed at the upper part in the process chamber; and the second barrel piece is arranged at the lower part in the process chamber, and the second barrel piece and the first barrel piece are arranged at an interval, so that at least one part of the coil is exposed. According to the Faraday cylinder assembly, by adopting the split design of the first cylinder part and the second cylinder part, the problem that glow build-up still cannot be achieved when the ICP discharge power reaches the limit value due to the fact that shielding is generated on the magnetic field of the coil and ICP discharge is weakened can be avoided. In addition, adsorption of particles in the process chamber can be enhanced through the first cylinder part and the second cylinder part, and the problem that the ceramic cylinder is completely exposed in a plasma environment and needs to be cleaned more frequently is solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a Faraday cage assembly and a process chamber. Background Art

[0002] Plasma equipment is widely used in the manufacture of semiconductor devices and flat-panel displays such as LEDs. According to the different discharge types, there are mainly: DC discharge type, capacitively coupled plasma (CCP) type, inductively coupled plasma (ICP) type and electron cyclotron resonance plasma (ECR) type, etc. These types of discharge are widely used in physical vapor deposition (PVD), plasma etching and chemical vapor deposition (CVD) equipment.

[0003] In PVD process equipment, especially for integrated circuit (IC), through silicon via (TSV), packaging (Packaging) manufacturing processes, a pre-clean chamber is required. The function of the pre-clean chamber is to remove impurities on the surface of the wafer or workpiece to be processed, which is conducive to the effective implementation of the subsequent physical vapor deposition (PVD) and significantly improves the adhesion of the deposited film. The next step after the pre-cleaning process is to deposit metal films such as aluminum and copper through magnetron sputtering to form metal contacts, metal interconnects, etc.

[0004] The pre-cleaning chamber can adopt the ICP discharge type. In order to facilitate the cleaning of the pre-cleaning chamber, a Faraday cup is generally provided in the pre-cleaning chamber to adsorb particles generated during the process. The adsorption effect of the Faraday cup made of metal material will be better. When cleaning, just disassemble the Faraday cup for cleaning. However, in some cleaning processes (such as back gold etching), since the grounding of the Faraday cup has a shielding effect on the RF power, it still cannot ignite when the power of the ICP discharge is increased to the limit value. Utility Model Content

[0005] In view of the above technical problems, the present application provides a Faraday cup assembly and a process chamber, which can improve the problem that the existing Faraday cup still cannot be ignited when the power of ICP discharge is increased to a limit value.

[0006] In order to solve the above technical problems, in a first aspect, an embodiment of the present application provides a Faraday cage assembly, which is applied to a process chamber provided with a coil, and the Faraday cage assembly includes:

[0007] A first cylinder is arranged at an upper portion of the process chamber;

[0008] The second cylinder is disposed at the lower part of the process chamber and is spaced apart from the first cylinder to expose at least a portion of the coil.

[0009] Optionally, the lower end of the first cylinder is not lower than the upper end of the coil; and / or,

[0010] The upper end of the second cylinder is not higher than the lower end of the coil.

[0011] Optionally, the distance between the lower end of the first cylinder and the upper end of the coil is 15 to 25 mm; and / or,

[0012] The distance between the upper end of the second cylinder and the lower end of the coil is 15-25 mm.

[0013] Optionally, the first cylinder and / or the second cylinder is a metal cylinder.

[0014] In a second aspect, an embodiment of the present application further provides a process chamber, comprising a chamber body, a coil, and a Faraday cage assembly as described in the above embodiments;

[0015] The chamber body comprises a support tube and an energy feeding tube arranged on the top of the support tube;

[0016] The coil is sleeved on the outside of the energy feeding tube;

[0017] The first cylinder is connected to the upper portion of the inner wall of the energy feeding cylinder;

[0018] The second cylinder is connected to the lower part of the inner wall of the energy feeding cylinder.

[0019] Optionally, the process chamber further comprises a first adapter ring, which is sleeved on the outside of the first cylinder and supported on the top surface of the energy feed cylinder, and an annular groove is provided on the inner side of the top surface of the first adapter ring;

[0020] A flange matching the annular groove is provided on the outer side of the top surface of the first cylinder, and the flange is connected to the annular groove through a first screw.

[0021] Optionally, at least two first grooves are provided on the outer side of the bottom surface of the second cylinder, and connecting holes corresponding to the at least two first grooves are provided on the top surface of the second cylinder, and the connecting holes are connected to the first grooves;

[0022] The process chamber further comprises:

[0023] At least two mounting blocks, matched with the at least two first grooves one by one, and each of the mounting blocks is connected to the first groove by a second screw, wherein the second screw is connected to the top surface of the mounting block through the connecting hole;

[0024] A second adapter ring is sleeved on the outer side of the second cylinder, and at least two second grooves are provided on the inner side of the bottom surface of the second adapter ring, and the number of the second grooves is an integer multiple of the number of the first grooves; each of the mounting blocks is connected to one of the second grooves by a third screw when the second cylinder is at a preset mounting angle, wherein the third screw is connected to the second groove from the side of the mounting block.

[0025] Optionally, the second cylinder comprises a first portion connected up and down and having a first outer diameter and a second portion having a second outer diameter, and the first outer diameter is greater than the second outer diameter, so that a step is formed between the first portion and the second portion;

[0026] The first groove is formed on the step.

[0027] Optionally, a positioning column is provided on the top surface of the mounting block;

[0028] The second groove is provided with a positioning hole matched with the positioning column.

[0029] Optionally, the process chamber further comprises a base disposed in the support cylinder;

[0030] A first radio frequency power source is connected to the base via a first matcher; and / or,

[0031] The second radio frequency power source is connected to the coil through a second matcher.

[0032] As described above, the Faraday cage assembly of the present application includes a first cage and a second cage, which are composed of two separate cages, and a window gap (spaced arrangement) is provided between the two. The size and position of the window gap can expose at least a portion of the coil, so that the magnetic field generated by the coil can directly enter the process chamber in the exposed area, avoiding the shielding of the magnetic field of the coil by the Faraday cage connected as a whole, weakening the ICP discharge of the coil, and thus causing the problem of still being unable to ignite when the power of the ICP discharge is increased to the limit value. In addition, the adsorption of particles in the process chamber can be enhanced by the first cage and the second cage, avoiding the problem that the inner wall of the process chamber is completely exposed to the plasma environment and requires more frequent cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.

[0034] Figure 1 It is a structural schematic diagram of a process chamber in the related art;

[0035] Figure 2 is a schematic structural diagram of a process chamber provided in an embodiment of the present application;

[0036] Figure 3 yes Figure 2 A structural diagram of the Faraday cage assembly in the connection state;

[0037] Figure 4 yes Figure 3 Schematic diagram of the explosion structure;

[0038] Figure 5 is a structural schematic diagram of a first adapter ring provided in an embodiment of the present application;

[0039] Figure 6 yes Figure 3 A schematic diagram of the enlarged structure of part A;

[0040] Figure 7 is a schematic structural diagram of a second cylinder provided in an embodiment of the present application;

[0041] Figure 8 It is a structural schematic diagram of a mounting block provided in an embodiment of the present application;

[0042] Fig. 9 yes Figure 3 Schematic diagram of the enlarged structure of part B.

[0043] The realization of the purpose, functional features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. The above-mentioned drawings have shown clear embodiments of this application, which will be described in more detail later. These drawings and textual descriptions are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0044] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0045] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0046] It should be further understood that the terms "comprising" and "including" indicate the presence of the described features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or", "and / or", "including at least one of the following", etc. used in this application may be interpreted as inclusive, or mean any one or any combination. For example, "including at least one of the following: A, B, C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C", and for another example, "A, B or C" or "A, B and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0047] It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this document, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless otherwise indicated in the context.

[0048] It should be understood that the orientations or positional relationships indicated by terms such as "top", "bottom", "up", "down", "vertical", and "horizontal" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0049] For ease of description, in the following embodiments, the orthogonal space formed by the horizontal plane and the vertical direction is used as an example for explanation, and this premise should not be understood as a limitation to the present application.

[0050] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of a process chamber in the related art, and the process chamber can simultaneously adopt two discharge types, CCP and ICP, and comprises: a support tube 10a, a base 20a, a Faraday cup 31a, a solenoid coil 40a and a ceramic tube 32a, wherein the base 20a is arranged in the support tube 10a, the Faraday cup 31a is arranged above the base 20a and is grounded, the solenoid coil 40a is arranged around the Faraday cup 31a, a first RF power source 50a applies RF power (ICP discharge) to the solenoid coil 40a through a first matcher (Match 1) 60a to excite the process gas into plasma, and a second RF power source 70a applies RF power (ICP discharge) to the solenoid coil 40a through a second matcher (Match 2) 60a to excite the process gas into plasma. 2) 80a applies RF power (CCP discharge) to the base 20a to generate RF self-bias on the wafer 101a to achieve the purpose of ignition. At the same time, it can attract ions to bombard the wafer 101a and react chemically to remove impurities / particles on the wafer 101a.

[0051] In the back gold etching process, in order to avoid ion bombardment causing damage to the wafer and causing leakage current in the wafer, the power of the second RF power supply 70a needs to be canceled, but this may result in the failure of ignition by the power discharged by the first RF power supply 50a alone, and because the Faraday cup 31a is grounded to shield the RF power, ignition still cannot be achieved when the power discharged by the first RF power supply 50a is increased to the limit value. Based on this, the present application provides a Faraday cup assembly and a process chamber.

[0052] See also Figure 2 and Figure 3 , Figure 2 is a schematic diagram of the structure of a process chamber provided in an embodiment of the present application, Figure 3 yes Figure 2Schematic diagram of the structure of the Faraday cage assembly in the connected state, the Faraday cage assembly is mainly used in a process chamber provided with a coil 200, and the Faraday cage assembly may include: a first cylinder 20 and a second cylinder 30. The first cylinder 20 is arranged at the upper part of the process chamber, and the second cylinder 30 is arranged at the lower part of the process chamber and is spaced apart from the first cylinder 20 to expose at least a part of the coil 200.

[0053] As some optional embodiments, one or both of the first cylinder 20 and the second cylinder 30 can be formed of dielectric materials, such as ceramic cylinders, or metal materials, such as aluminum alloy metal cylinders. Metal cylinders are preferred, as they have better adsorption capacity for particles than ceramic cylinders.

[0054] The Faraday cage assembly of the present application includes a first cylinder member 20 and a second cylinder member 30, which are composed of two separate cylinder members, and a window gap (interval setting) is provided between the two. The size and position of the window gap can expose at least a part of the coil 200, so that the magnetic field generated by the coil 200 can directly enter the process chamber in the exposed area, avoiding the shielding of the magnetic field of the coil 200 by the Faraday cage connected as a whole, weakening the ICP discharge of the coil 200, and thus causing the problem that the ignition cannot be started when the power of the ICP discharge is increased to the limit value. In addition, the adsorption of particles in the process chamber can be strengthened by the first cylinder member 20 and the second cylinder member 30, avoiding the problem that the inner wall of the process chamber is completely exposed to the plasma environment and needs more frequent cleaning.

[0055] In one embodiment, please refer to Figure 3 The lower end 21 of the first cylinder is not lower than the upper end of the coil 200, and the upper end 31 of the second cylinder is not higher than the lower end of the coil 200. The first metal cylinder 20 and the second metal cylinder 30 may be aluminum alloy.

[0056] It can be understood that a window gap is provided between the first cylinder member 20 and the second cylinder member 30, and the size and position of the window gap can expose at least a portion of the coil 200 into the process chamber, thereby preventing the cylinder members connected as a whole from shielding the magnetic field of the coil 200 and weakening the ICP discharge of the coil 200.

[0057] The Faraday cage assembly of this embodiment adsorbs particles in the process chamber through the first cylinder member 20 and the second cylinder member 30, thereby avoiding the problem that the inner wall of the process chamber is completely exposed to the plasma environment and requires more frequent cleaning. At the same time, since the first cylinder member 20 and the second cylinder member 30 avoid the coil 200 through the split design, the RF power generated by the coil 200 can be input into the process chamber to the greatest extent, making it easier to ignite.

[0058] As some examples, the spacing L1 between the lower end 21 of the first cylinder 20 and the upper end of the coil 200 can be set to 15 to 25 mm. If the distance is too small, the RF power of the coil 200 will be shielded, and if the distance is too large, the inner wall of the process chamber will be exposed too much, thereby weakening the particle adsorption capacity of the process chamber. The above distance range can achieve a good balance between reducing the shielding of the magnetic field of the coil 200 by the first cylinder 20 and reducing the cleaning frequency of the process chamber. Similarly, the spacing L2 between the upper end 31 of the second cylinder 30 and the lower end of the coil 200 can also be set to 15 to 25 mm. For example, the height of the coil 200 can be set to 70 mm, and the window gap L between the first cylinder 20 and the second cylinder 30 can be set to 110 mm.

[0059] This application also provides a process chamber, please continue to refer to Figure 2 and Figure 3 , the process chamber may include: a chamber body, a coil 200, and a Faraday cage assembly. The chamber body may include a support tube 100 and an energy feeding tube 10 disposed on the top of the support tube 100. For example, the energy feeding tube 10 may be supported on the top surface of the support tube 100. The coil 200 is sleeved on the outside of the energy feeding tube 10. As some examples, the coil 200 may be a cylindrical spiral coil or a strip coil. The first cylinder member 20 is connected to the upper inner wall of the energy feeding tube 10, and the second cylinder member 30 is connected to the lower inner wall of the energy feeding tube 10.

[0060] In the process chamber of this embodiment, since a window gap L is provided between the first cylinder 20 and the second cylinder 30, the size and position of the window gap L can at least expose a part of the coil 200 to the chamber body, so that the RF energy of the coil 200 can directly enter the process chamber through the energy feeding cylinder 10, which can avoid the shielding of the magnetic field of the coil 200 by the Faraday cylinder connected as a whole, weakening the ICP discharge of the coil 200, and thus causing the problem that the ignition cannot be performed even when the power of the ICP discharge is increased to the limit value. Therefore, the process chamber of this embodiment can reduce the difficulty of ignition of the coil 200 while maintaining a low cleaning frequency of the energy feeding cylinder 10.

[0061] It should be noted that the specific connection method between the first cylinder 20 and the second cylinder 30 and the inner wall of the energy feeding cylinder 1010 is not particularly limited in the present embodiment. As an example of a specific connection method between the first cylinder 20 and the inner wall of the energy feeding cylinder 10, please refer to Figure 3-Figure 6 , Figure 4 yes Figure 3 Schematic diagram of the explosion structure. Figure 5 is a schematic structural diagram of a first adapter ring provided in an embodiment of the present application, Figure 6 yes Figure 3The enlarged structural diagram of the A part in the figure shows that the process chamber may also include a first adapter ring 40, which is sleeved on the outside of the first cylinder 20 and supported on the top surface of the energy feed cylinder 10. An annular groove 41 is provided on the inner side of the top surface of the first adapter ring 40, and a flange 22 matching the annular groove 41 is provided on the outer side of the top surface of the first cylinder 20. The flange 22 is connected to the annular groove 41 through a first screw 71. For example, a plurality of threaded holes 42 may be uniformly arranged in the circumferential direction in the annular groove 41, and the first screw 71 passes through the flange 22 and is connected to the threaded hole 42. In addition, an end cover 800 may be provided on the top surface of the first adapter ring 40 to seal the process chamber.

[0062] In this embodiment, the first cylinder 20 is connected via the first adapter ring 40 to limit the first cylinder 20 in the axial direction relative to the energy feeding cylinder 10 , which can simplify the structure of the first cylinder 20 and reduce the manufacturing and maintenance costs of the first cylinder 20 .

[0063] As an example of a specific connection method between the second cylinder 30 and the inner wall of the energy feeding cylinder 10, please refer to Figure 3 , Figure 4 , Figure 7-Figure 9 , Figure 7 is a schematic structural diagram of a second cylinder provided in an embodiment of the present application, Figure 8 is a structural schematic diagram of a mounting block provided in an embodiment of the present application, Fig. 9 yes Figure 3 In the enlarged structural diagram of part B, the process chamber may further include: at least two mounting blocks 50 and a second adapter ring 60.

[0064] Specifically, at least two first grooves 32 are provided on the outer side of the bottom surface of the second cylinder 30, and connecting holes 33 corresponding to the first grooves 32 are provided on the top surface of the second cylinder 30, and the connecting holes 33 pass through the first grooves 32. All mounting blocks 50 are matched with all first grooves 32 one by one, and each mounting block 50 is connected to the first groove 32 through a second screw 72, wherein the second screw 72 is connected to the top surface 51 of the mounting block 50 through the connecting hole 33, and the connecting hole 33 can be a countersunk hole, a straight hole, or a threaded hole. The second adapter ring 60 is sleeved on the outer side of the second cylinder 30, and at least two second grooves 61 are provided on the inner side of the bottom surface of the second adapter ring 60, and the number of the second grooves 61 is an integral multiple of the number of the first grooves 32; each mounting block 50 is connected to one of the second grooves 61 through a third screw 73 when the second cylinder 30 is at a preset installation angle, wherein the third screw 73 is connected to the second groove 61 from the side 52 of the mounting block 50.

[0065] For example, the outer side of the bottom surface of the second cylinder 30 is provided with four first grooves 32, and they are evenly distributed along the circumferential direction, and the angle between two adjacent first grooves 32 is 90°. Accordingly, four mounting blocks 50 can be provided, and one mounting block 50 is provided in each first groove 32. Four second grooves 61 can be provided (1 times, the angle between two adjacent grooves is 90°), or eight (2 times, the angle between two adjacent grooves is 45°), or 12 (3 times, the angle between two adjacent grooves is 30°), etc. When the number of the second grooves 61 is 2 times, the second cylinder 30 is connected to one group of four second grooves 61 through four mounting blocks 50, and can also be connected to another group of four mounting blocks 50 after rotating 45°. The preset rotation angle in this embodiment can be 0° and 45°, and each rotation of 45° can be accurately installed. When the number of the second grooves 61 is 3 times, the second cylinder 30 is connected to the first group of four second grooves 61 through four mounting blocks 50, and can also be connected to the second group of four mounting blocks 50 after rotating 30°, and can also be directly connected to the third group of four mounting blocks 50 after rotating 60°. The preset rotation angles in this embodiment can be 0°, 30° and 60°, and each rotation of 30° can allow accurate installation, which improves the flexibility of installation.

[0066] In this embodiment, one end of the mounting block 50 is placed in the first groove 32 of the second cylinder 30, and the other end is placed in the second groove 61 of the second adapter ring 60. During installation, the mounting block 50 can be placed in the second groove 61 first, and then connected to the second groove 61 from the side 52 of the mounting block 50 by the third screw 73, and then the second cylinder 30 is inserted into the second adapter ring 60 from above, so that the first groove 32 of the second cylinder 30 matches the mounting block 50, and finally the second screw 72 is passed through the connecting hole 33 of the second cylinder 30 to connect with the top surface 51 of the mounting block 50.

[0067] In this embodiment, the second cylinder 30 is connected via the second adapter ring 60 to limit the second cylinder 30 in the axial direction relative to the energy feeding cylinder 10 , which can simplify the structure of the second cylinder 30 and reduce the manufacturing and maintenance costs of the second cylinder 30 .

[0068] For some examples, see Figure 8 and Fig. 9 A threaded hole 511 corresponding to the second screw 72 may be provided on the top surface 51 of the mounting block 50, and the second screw 72 passes through the connection hole 33 on the top surface of the second cylinder 30 and is connected with the threaded hole 511. A connection hole 521 may also be provided on the side surface 52 of the mounting block 50, and the third screw 73 passes through the connection hole 521 and is connected to the second groove 61. The connection hole 521 may be a countersunk hole, a straight hole, or a threaded hole. A plurality of connection holes 521 may be provided.

[0069] In one embodiment, please refer to Figure 7The second cylinder 30 may include a first portion 310 connected up and down and having a first outer diameter and a second portion 320 having a second outer diameter, the first outer diameter being greater than the second outer diameter, so that a step is formed between the first portion 310 and the second portion 320, and the first groove 32 is formed on the step. In this embodiment, by setting the outer wall of the second cylinder 30 to be stepped, the downward length of the second cylinder 30 can be extended, and the depth of the first groove 32 does not need to be too large, thereby reducing the difficulty of processing the second cylinder 30.

[0070] In one embodiment, please refer to Figure 8 The top surface 51 of the mounting block 50 may also be provided with a positioning column 512, and the second groove 61 is provided with a positioning hole that cooperates with the positioning column. Fig. 9 Not shown, the mounting block 50 can be positioned in the second groove 61 by the positioning column 512 and then assembled, which can improve the assembly efficiency.

[0071] In one embodiment, the process chamber may further include a shielding tube 400 sleeved on the outside of the coil 200 , and the shielding tube 400 may prevent the magnetic field of the coil 200 from interfering with external devices or circuits.

[0072] In one embodiment, the process chamber may further include a base 500, a first RF power supply 600, and a second RF power supply 700 disposed in the lower cavity 100. The first RF power supply 600 is connected to the base 500 through the first matcher 610, and the second RF power supply 700 is connected to the coil 200 through the second matcher 710. The process chamber of this embodiment can selectively turn on the first RF power supply 600 according to the thickness of the wafer and the cleaning intensity requirements. Since the Faraday cylinder assembly is composed of two separate cylinders, the first cylinder 20 and the second cylinder 30, the gap between the two avoids the coil 200, and when the first RF power supply 600 is not turned on and only the second RF power supply 700 is turned on, it can also ensure that it can be ignited normally. It should be noted that for some process chambers, the first RF power supply 600 and the first matcher 610 can also be directly cancelled, and only the second RF power supply 700 and the second matcher 710 are set.

[0073] For other working principles and processes of the process chamber of this embodiment, please refer to the description of the Faraday cage assembly in the above embodiment of the present invention, which will not be repeated here.

[0074] The above is a detailed introduction to a Faraday cup assembly and a process chamber provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. It should be noted that in the present application, the descriptions of various embodiments have different focuses. For parts that are not described or recorded in detail in a particular embodiment, please refer to the relevant descriptions of other embodiments.

[0075] The above are only preferred embodiments of the present application, and the patent scope of the present application is not limited thereto. The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of this application, or directly or indirectly used in other related technical fields, as long as there is no contradiction in the combination of these technical features, are equally included in the patent protection scope of the present application.

Claims

1. A Faraday cage assembly, applied to a process chamber provided with a coil, characterized in that: The Faraday cage assembly comprises: A first cylinder is arranged at an upper portion of the process chamber; The second cylinder is disposed at the lower part of the process chamber and is spaced apart from the first cylinder to expose at least a portion of the coil.

2. The Faraday cage assembly according to claim 1, characterized in that: The lower end of the first cylinder is not lower than the upper end of the coil; and / or, The upper end of the second cylinder is not higher than the lower end of the coil.

3. The Faraday cage assembly according to claim 2, characterized in that: The distance between the lower end of the first cylinder and the upper end of the coil is 15 to 25 mm; and / or, The distance between the upper end of the second cylinder and the lower end of the coil is 15-25 mm.

4. The Faraday cage assembly according to claim 1, characterized in that: The first cylinder and / or the second cylinder is a metal cylinder.

5. A process chamber, characterized in that: It comprises a chamber body, a coil, and a Faraday cage assembly according to any one of claims 1 to 4; The chamber body comprises a support tube and an energy feeding tube arranged on the top of the support tube; The coil is sleeved on the outside of the energy feeding tube; The first cylinder is connected to the upper portion of the inner wall of the energy feeding cylinder; The second cylinder is connected to the lower part of the inner wall of the energy feeding cylinder.

6. The process chamber according to claim 5, characterized in that: It also includes a first adapter ring, which is sleeved on the outside of the first cylinder and supported on the top surface of the energy feed cylinder, and an annular groove is provided on the inner side of the top surface of the first adapter ring; A flange matching the annular groove is provided on the outer side of the top surface of the first cylinder, and the flange is connected to the annular groove through a first screw.

7. The process chamber according to claim 5, characterized in that: At least two first grooves are arranged on the outer side of the bottom surface of the second cylinder, and connecting holes corresponding to the at least two first grooves are arranged on the top surface of the second cylinder, and the connecting holes are connected to the first grooves; The process chamber further comprises: At least two mounting blocks, matched with the at least two first grooves one by one, and each of the mounting blocks is connected to the first groove by a second screw, wherein the second screw is connected to the top surface of the mounting block through the connecting hole; A second adapter ring is sleeved on the outer side of the second cylinder, and at least two second grooves are provided on the inner side of the bottom surface of the second adapter ring, and the number of the second grooves is an integer multiple of the number of the first grooves; each of the mounting blocks is connected to one of the second grooves by a third screw when the second cylinder is at a preset mounting angle, wherein the third screw is connected to the second groove from the side of the mounting block.

8. The process chamber according to claim 7, characterized in that: The second cylinder comprises a first portion connected up and down and having a first outer diameter and a second portion having a second outer diameter, wherein the first outer diameter is greater than the second outer diameter, so that a step is formed between the first portion and the second portion; The first groove is formed on the step.

9. The process chamber according to claim 7, characterized in that: A positioning column is provided on the top surface of the mounting block; The second groove is provided with a positioning hole matched with the positioning column.

10. The process chamber according to any one of claims 5 to 9, characterized in that: Also included is a base disposed in the support cylinder; A first radio frequency power source is connected to the base via a first matcher; and / or, The second radio frequency power source is connected to the coil through a second matcher.

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