Etching electrode for etching machine

Abstract

The utility model relates to the technical field of etching machines, and discloses an etching electrode for an etching machine, which comprises a lower electrode plane shell, an upper water inlet shell is arranged at the top of one end of the lower electrode plane shell, a lower water outlet shell is arranged at the bottom of one end of the lower electrode plane shell, and a cooling table is arranged at the top of the lower electrode plane shell. A cooling table is arranged on the lower electrode plane shell, a bottom plate is arranged on the top of the lower electrode plane shell, a top plate is arranged on the top of the bottom plate, through holes are formed in the bottom plate and the top and located on the outer side of the cooling table, and a negative pressure suction groove is formed between the bottom plate and the top plate. The cooling liquid can enter the cooling table to directly cool the placing plate, heat exchange between the wafer and the cooling liquid is carried out through the placing plate, the wafer is in direct contact with the placing plate, and the contact area is large, so that the cooling efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of etching machines, in particular to an etching electrode for an etching machine. Background Art

[0002] An etcher is a key piece of equipment used in semiconductor manufacturing. Its primary function is to remove material from the wafer surface through an etching process. The etching electrode is a key component used in the etching process. In electrochemical etching, a specific voltage is applied to the material being etched, placing it in a reverse bias state, thereby achieving targeted etching.

[0003] The lower electrode structure of the etching electrode used in the etching machine currently on the market mostly cools the wafer placed on the lower electrode tray by introducing cooling airflow through the bottom during use. However, the introduced cooling airflow may cause the placed wafer to shift, resulting in poor etching effect.

[0004] After searching, the Chinese utility model patent with publication number: CN212542351U discloses a lower electrode structure of an etching electrode for an etcher, including a lower electrode tray and a support tray, a support tray is provided at the bottom of the lower electrode tray, a plurality of grooves are evenly provided at the bottom of the lower electrode tray and the top of the support tray, and multiple U-shaped tubes are placed in the grooves on the upper and lower sides, placement grooves are evenly provided on the top of the lower electrode tray, and a first adsorption hole is provided at the bottom axis of the placement groove. The utility model provides a lower electrode structure of an etching electrode for an etcher, which avoids the problem of most methods of cooling the wafers placed on the lower electrode tray by introducing cooling airflow through the bottom through the design and use of a series of structures, but the introduced cooling airflow will cause the placed wafers to shift, resulting in poor etching effect.

[0005] In the above technical solution, the chip on the lower electrode tray is cooled by a multi-pass U-shaped tube. However, in order to avoid the adsorption hole, the multi-pass U-shaped tube is not located directly below the lens. As a result, when cooling the chip, it is necessary to cool it through heat conduction of the lower electrode tray. The placement holes opened on the lower electrode tray affect the contact area between the chip and the lower electrode tray, resulting in a decrease in the cooling efficiency of the chip. Utility Model Content

[0006] The purpose of the utility model is to provide an etching electrode for an etching machine to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an etching electrode for an etcher, comprising: a lower electrode plane shell, an upper water inlet shell is provided at the top of one end of the lower electrode plane shell, a lower water outlet shell is provided at the bottom of one end of the lower electrode plane shell, a cooling platform is provided at the top of the lower electrode plane shell, a bottom plate is provided at the top of the lower electrode plane shell, a top plate is provided on the top of the bottom plate, through holes are provided inside the bottom plate and the top plate and located outside the cooling platform, a negative pressure suction groove is provided between the bottom plate and the top plate, and a placement hole is provided on the top plate.

[0008] Furthermore, the interior of the cooling platform is connected to the lower electrode plane shell, the top of the cooling platform is a placement plate, and the placement plate is used to place the chip. The diameter of the middle part of the cooling platform is smaller than the diameter at both ends. Connecting grooves are provided on both sides of the negative pressure suction groove, and the connecting grooves extend to the area with small diameter in the middle part of the cooling platform.

[0009] Furthermore, a connecting shell is provided at one end of the negative pressure suction groove, and a negative pressure pipe is provided at one side of the connecting shell.

[0010] Furthermore, a water inlet pipe is provided at one end of the upper water inlet shell, and the water inlet pipe is located above the top surface of the lower electrode plane shell.

[0011] Furthermore, a water outlet pipe is provided at one end of the lower water outlet shell, and the water outlet pipe is located below the bottom surface of the lower electrode plane shell.

[0012] Furthermore, there are a plurality of cooling stages, and the cooling stages are arranged on the lower electrode plane shell at equal intervals in the vertical and horizontal directions.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] The utility model realizes that when the etching electrode of the etcher is used, the chip is placed above the cooling table, the vacuum pump is connected through the negative pressure pipe, and the negative pressure suction force is generated. The negative pressure suction force is transmitted by the penetration of the connecting shell, the negative pressure suction groove and the connecting groove. The negative pressure suction force is generated on the outside of the middle of the cooling table by the penetration of the connecting groove and the outer area of ​​the middle of the cooling table. The size of the placement plate on the top of the cooling table is slightly smaller than the chip, so that the negative pressure suction force can directly adsorb the chip to fix the chip, and prevent the chip from moving during the etching process. In addition, during the chip etching process, the pressurized coolant is connected through the water inlet pipe, the coolant enters the interior of the lower electrode plane shell through the upper water inlet shell, and is finally discharged through the lower water outlet shell. Due to the penetration design of the cooling table and the lower electrode plane shell, the coolant can enter the interior of the cooling table, directly cool the placement plate, and heat exchange between the chip and the coolant is carried out through the placement plate. Since the chip is in direct contact with the placement plate and the contact area is large, the cooling efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a three-dimensional diagram of an etching electrode for an etching machine according to the present invention;

[0016] Figure 2 This is a schematic diagram of the bottom plate connection structure of an etching electrode for an etching machine according to the present invention;

[0017] Figure 3 This is a main cross-sectional view of an etching electrode for an etching machine according to the present invention;

[0018] Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle.

[0019] In the figure: 1-lower electrode plane shell; 2-upper water inlet shell; 3-lower water outlet shell; 4-water inlet pipe; 5-water outlet pipe; 6-bottom plate; 7-top plate; 8-placement hole; 9-connecting shell; 10-negative pressure pipe; 11-negative pressure suction groove; 12-connecting groove; 13-cooling table. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] See also Figure 1-Figure 4 The utility model provides a technical solution: an etching electrode for an etching machine, comprising: a lower electrode flat shell 1, an upper water inlet shell 2 provided at the top of one end of the lower electrode flat shell 1, a lower water outlet shell 3 provided at the bottom of one end of the lower electrode flat shell 1, a cooling platform 13 provided at the top of the lower electrode flat shell 1, a bottom plate 6 provided at the top of the lower electrode flat shell 1, a top plate 7 provided on top of the bottom plate 6, through-holes provided inside the bottom plate 6 and the top plate 7, located outside the cooling platform 13, and a negative pressure suction groove 11 provided between the bottom plate 6 and the top plate 7. A placement hole 8 is provided on the top plate 7. Pressurized coolant is connected through a water inlet pipe 4, enters the interior of the lower electrode flat shell 1 through the upper water inlet shell 2, and is finally discharged through the lower water outlet shell 3. Due to the through-connection design between the cooling platform 13 and the lower electrode flat shell 1, the coolant can enter the interior of the cooling platform 13, directly cooling the placement plate, and heat exchange between the wafer and the coolant is carried out through the placement plate. Since the wafer is in direct contact with the placement plate and the contact area is large, the cooling efficiency is improved.

[0022] The interior of the cooling platform 13 is connected to the lower electrode plane shell 1. The top of the cooling platform 13 is a placement plate for placing wafers. The diameter of the middle part of the cooling platform 13 is smaller than the diameters at both ends. Connecting grooves 12 are provided on both sides of the negative pressure suction groove 11. The connecting grooves 12 extend to the area with a small diameter in the middle part of the cooling platform 13. A connecting shell 9 is provided at one end of the negative pressure suction groove 11, and a negative pressure pipe 10 is provided on one side of the connecting shell 9. The connection between the connecting groove 12 and the outer area of ​​the middle part of the cooling platform 13 generates negative pressure suction on the outer side of the middle part of the cooling platform 13. The size of the placement plate on the top of the cooling platform 13 is slightly smaller than the wafer, so that the negative pressure suction can directly adsorb the wafer to fix it, preventing the wafer from moving during the etching process.

[0023] An inlet pipe 4 is provided at one end of the upper water inlet shell 2, located above the top surface of the lower electrode flat shell 1. An outlet pipe 5 is provided at one end of the lower water outlet shell 3, located below the bottom surface of the lower electrode flat shell 1. This design allows any air in the coolant to be concentrated at the top of the upper water inlet shell 2, improving contact between the coolant and the placement plate and enhancing heat exchange efficiency.

[0024] There are a plurality of cooling stages 13 , which are arranged on the lower electrode plane housing 1 at equal intervals in the vertical and horizontal directions, and are used for etching a plurality of wafers.

[0025] Working principle: When the etcher is used with an etching electrode, the wafer is placed above the cooling table 13, and the vacuum pump is connected through the negative pressure pipe 10 to generate negative pressure suction. The negative pressure suction is transmitted through the connection between the connecting shell 9, the negative pressure suction groove 11 and the connecting groove 12. The negative pressure suction is generated on the outside of the middle of the cooling table 13 through the connection between the connecting groove 12 and the outer area of ​​the middle part of the cooling table 13. The size of the placement plate on the top of the cooling table 13 is slightly smaller than the wafer, so that the negative pressure suction can directly adsorb the wafer to fix the wafer, preventing the wafer from moving during the etching process. In addition, during the wafer etching process, pressurized coolant is connected through the water inlet pipe 4, and the coolant enters the lower electrode plane shell 1 through the upper water inlet shell 2, and is finally discharged through the lower water outlet shell 3. Due to the through-connection design of the cooling table 13 and the lower electrode plane shell 1, the coolant can enter the interior of the cooling table 13, directly cool the placement plate, and perform heat exchange between the wafer and the coolant through the placement plate. Since the wafer is in direct contact with the placement plate and the contact area is large, the cooling efficiency is improved.

[0026] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.

Claims

1. An etching electrode for an etcher, comprising: A lower electrode plane shell (1), characterized in that: an upper water inlet shell (2) is provided at the top of one end of the lower electrode plane shell (1), a lower water outlet shell (3) is provided at the bottom of one end of the lower electrode plane shell (1), a cooling platform (13) is provided at the top of the lower electrode plane shell (1), a bottom plate (6) is provided at the top of the lower electrode plane shell (1), a top plate (7) is provided at the top of the bottom plate (6), a through hole is provided inside the bottom plate (6) and the top plate (7) and located outside the cooling platform (13), a negative pressure suction groove (11) is provided between the bottom plate (6) and the top plate (7), and a placement hole (8) is provided on the top plate (7).

2. The etching electrode for an etcher according to claim 1, characterized in that: The interior of the cooling platform (13) is connected to the lower electrode plane shell (1); the top of the cooling platform (13) is a placement plate, and the placement plate is used to place a wafer; the diameter of the middle part of the cooling platform (13) is smaller than the diameters at both ends; connecting grooves (12) are provided on both sides of the negative pressure suction groove (11), and the connecting grooves (12) extend to the area with a small diameter in the middle part of the cooling platform (13).

3. The etching electrode for an etcher according to claim 2, characterized in that: A connecting shell (9) is provided at one end of the negative pressure suction groove (11), and a negative pressure pipe (10) is provided at one side of the connecting shell (9).

4. The etching electrode for an etcher according to claim 1, characterized in that: A water inlet pipe (4) is provided at one end of the upper water inlet shell (2), and the water inlet pipe (4) is located above the top surface of the lower electrode plane shell (1).

5. The etching electrode for an etcher according to claim 1, characterized in that: A water outlet pipe (5) is provided at one end of the lower water outlet shell (3), and the water outlet pipe (5) is located below the bottom surface of the lower electrode plane shell (1).

6. The etching electrode for an etcher according to claim 1, characterized in that: There are a plurality of cooling stages (13), and the plurality of cooling stages (13) are arranged on the lower electrode plane shell (1) at equal intervals in the vertical and horizontal directions.

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