Structure for preventing local particle aggregation

Abstract

The utility model belongs to the technical field of substrate cleaning equipment, and particularly relates to a structure for preventing local particle aggregation, which comprises a lifting driving part, a lifting frame and a magnetic rotating shaft separation blade assembly. A plurality of groups of magnetic rotating shaft separation blade assemblies are arranged, and each group of magnetic rotating shaft separation blade assemblies is matched with a corresponding lifting Pin centre hole in a back spraying plate of the substrate cleaning equipment for use. The driving end of the lifting driving piece is connected with the lifting frame, and magnetic blocks A are arranged at the positions, corresponding to the magnetic rotating shaft blocking piece assemblies, of the lifting frame. The lifting driving piece, the magnetic rotating shaft blocking piece assembly and the lifting frame provided with the magnetic block A are arranged in a matched mode, the lifting Pin ejector pin hole can be blocked in the cleaning process, and it is avoided that cleaning liquid is sputtered to the top end of the lifting Pin ejector pin through the lifting Pin ejector pin hole to pollute the lifting Pin ejector pin; the wafer lifting device is simple in arrangement structure and convenient to disassemble, assemble and maintain.

Description

Technical Field

[0001] The utility model belongs to the technical field of substrate cleaning equipment, in particular to a structure for preventing local particle aggregation. Background Art

[0002] In the semiconductor manufacturing process, contamination on the substrate surface will have a significant impact on chip quality. In the subsequent processing steps, the semiconductor wafer will undergo multiple process steps. If there are contaminants attached to the wafer surface, the contaminants will affect the processing in the subsequent process steps, thereby affecting the forming area of ​​the semiconductor wafer surface device, directly leading to a decrease in the wafer yield. Therefore, reducing substrate surface contaminants is very important for the wafer process.

[0003] In the wafer cleaning process, since the wafer is close to the back spray plate, in order to ensure that the robot can smoothly pick up and place the wafer in the cleaning unit, it is necessary to keep a certain safe distance between the wafer and the back spray plate before the robot picks up and places the wafer. Therefore, during the wafer lifting process, the driving source drives the lifting pin to pass through the lifting pin hole on the back spray plate to lift the wafer.

[0004] When the chip is undergoing the cleaning process, due to the existence of the lifting pin pin hole, the lifting pin is directly exposed to the process environment. During the chip cleaning process, the cleaning liquid will be splashed onto the top of the lifting pin pin through the lifting pin pin hole through the airflow or other external forces, thereby contaminating the lifting pin, causing secondary contamination after it contacts the chip, and aggregated attached particles will appear in the local position in contact with the chip. Utility Model Content

[0005] In the current substrate cleaning equipment, the cleaning liquid will be splashed onto the top of the lifting pin through the lifting pin hole by airflow or other external forces during the chip cleaning process, thereby contaminating the lifting pin, causing secondary contamination after it contacts the chip, and causing the problem of aggregated attached particles at the local position in contact with the chip. The purpose of the utility model is to provide a structure for preventing local particle aggregation.

[0006] The purpose of this utility model is achieved through the following technical solutions:

[0007] A structure for preventing local particle aggregation, applicable to substrate cleaning equipment, comprises a lifting drive member, a lifting frame and a magnetic shaft baffle assembly;

[0008] The magnetic shaft baffle assembly is provided with a plurality of groups, and each group of the magnetic shaft baffle assembly is used in conjunction with a corresponding lifting pin ejector hole on the back spray plate of the substrate cleaning device;

[0009] The lifting drive member is located below the back spray plate of the substrate cleaning device, and the driving end of the lifting drive member is connected to the lifting frame, and a magnetic block A is provided on the lifting frame at a position corresponding to each group of the magnetic shaft baffle assembly;

[0010] The driving end of the lifting drive member drives the lifting frame to rise and fall, and each of the magnetic blocks A rises and falls together with the lifting frame. Each of the magnetic blocks A drives the corresponding magnetic shaft baffle assembly to move through the magnetic force, thereby causing each group of the magnetic shaft baffle assemblies to close or open the corresponding lifting pin ejector hole.

[0011] The lifting drive component is installed on the frame of the substrate cleaning equipment.

[0012] The lifting frame is provided with a plurality of magnetic block embedding grooves A, and each magnetic block A is embedded in a corresponding magnetic block embedding groove A respectively.

[0013] Each of the magnetic blocks A is fixedly connected to the lifting frame via a fastener.

[0014] Each group of the magnetic shaft baffle assemblies includes a shaft base, a shaft, a magnetic block B, and a baffle. The shaft of each group of the magnetic shaft baffle assemblies is rotatably arranged in the shaft base of the magnetic shaft baffle assemblies of the same group. The magnetic block B of each group of the magnetic shaft baffle assemblies is fixedly connected to the lower part of the shaft of the magnetic shaft baffle assemblies of the same group. The baffle of each group of the magnetic shaft baffle assemblies is fixedly connected to the upper part of the shaft of the magnetic shaft baffle assemblies of the same group. The magnetic block B of all groups of the magnetic shaft baffle assemblies is located below the back spray plate.

[0015] The magnetic block B of each group of the magnetic shaft baffle assemblies is acted upon by the magnetic force of the corresponding magnetic block A, thereby driving the shaft of the magnetic shaft baffle assemblies of the same group to rotate, thereby driving the baffle to close or open the corresponding lifting pin ejector hole.

[0016] The rotating shaft base of each group of the magnetic rotating shaft baffle components is fixedly connected to the back spray plate.

[0017] The rotating shaft base of each group of the magnetic rotating shaft baffle assemblies is rotatably connected to the rotating shaft of the magnetic rotating shaft baffle assemblies in the same group through bearings.

[0018] The bottom of the rotating shaft of each group of the magnetic rotating shaft baffle assemblies is provided with a magnetic block embedding groove B for accommodating the magnetic block B. The lower part of the rotating shaft of each group of the magnetic rotating shaft baffle assemblies is installed with a bottom cover, and each bottom cover covers the magnetic block embedding groove B on the corresponding rotating shaft.

[0019] The shortest line between the N pole of each magnetic block B and the S pole of the magnetic block B is parallel to the horizontal plane, and the shortest line between the N pole of each magnetic block A and the S pole of the magnetic block A is perpendicular to the horizontal plane.

[0020] The baffles of all groups of the magnetic shaft baffle assemblies are located above the back spray plate.

[0021] The advantages and positive effects of the utility model are:

[0022] The utility model can seal the lifting pin hole during the cleaning process through the coordinated arrangement of the lifting drive component, the magnetic shaft baffle assembly and the lifting frame provided with the magnetic block A, thereby preventing the cleaning liquid from splashing to the top of the lifting pin through the lifting pin hole and contaminating the lifting pin, thereby preventing the occurrence of aggregated attached particles at the local position where the chip contacts the lifting pin. The utility model has a simple structure and is easy to disassemble and overhaul. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of a reference state in the prior art where the lifting pin hole is not blocked and before the wafer is cleaned;

[0024] Figure 2 It is a schematic diagram of a reference state in the prior art where the lifting pin hole is not blocked and the wafer is cleaned;

[0025] Figure 3 This is a schematic diagram of the structure of the utility model;

[0026] Figure 4 It is a schematic cross-sectional structure diagram of the magnetic shaft baffle assembly of the utility model;

[0027] Figure 5 It is a schematic diagram of the state of the back spray plate before the lifting frame is raised in a specific embodiment of the utility model;

[0028] Figure 6 It is a schematic diagram of the state of the magnetic shaft baffle assembly and the magnetic block A before the lifting frame is raised in a specific embodiment of the utility model;

[0029] Figure 7 It is a schematic diagram of the state of the back spray plate after the lifting frame is raised in a specific embodiment of the utility model;

[0030] Figure 8 It is a schematic diagram of the state of the magnetic shaft baffle assembly and the magnetic block A after the lifting frame is raised in a specific embodiment of the utility model.

[0031] In the figure: 1 is a lifting drive member, 2 is a lifting frame, 3 is a magnetic block A, 4 is a rotating shaft base, 5 is a rotating shaft, 501 is a magnetic block inlay groove B, 6 is a magnetic block B, 7 is a baffle, 8 is a bearing, 9 is a bottom cover, and 10 is a bearing baffle;

[0032] 001 is the back spray plate, 0011 is the lifting pin ejector hole, 002 is the lifting pin ejector, 003 is the lifting pin ejector holder, and 004 is the chip. DETAILED DESCRIPTION

[0033] The following is combined with Figure 1-8 The utility model is further described in detail.

[0034] like Figure 1-2 As shown, in the prior art, if the lifting pin hole 0011 is not blocked during the cleaning process, the cleaning liquid carrying contaminants will splash through the lifting pin hole 0011 to the top of the lifting pin 002, causing contamination of the lifting pin 002. In the subsequent process of lifting the wafer 004 by the lifting pin 002, the contaminated lifting pin 002 contacts the wafer 004, causing secondary contamination of the wafer 004, resulting in the appearance of aggregated attached particles at the edge of the wafer 004 ( Figure 2 The two circled areas are where the aggregated attached particles appear). The lifting pin 002 is used to lift the wafer 004 after the wafer 004 is cleaned, so that it is separated from the back spray plate 001, so as to provide enough space for the robot to pick up and place the wafer 004. Each lifting pin 002 is installed on the lifting pin ejector holder 003, and the lifting pin ejector holder 003 is driven by the holder driving part of the equipment to rise and fall, so that all the lifting pin ejectors 002 installed on the lifting pin ejector holder 003 can complete the rising and falling actions at the same time, and at the same time provide support for the top ends of all the lifting pin ejectors 002 installed thereon in one plane.

[0035] The utility model proposes a structure for preventing local particle aggregation, such as Figure 3-8 As shown, it is suitable for substrate cleaning equipment, and this embodiment includes a lifting drive component 1, a lifting frame 2 and a magnetic shaft baffle assembly.

[0036] There are several groups of magnetic shaft baffle assemblies, and each group of magnetic shaft baffle assemblies is used in conjunction with a corresponding lifting pin ejector hole 0011 on the back spray plate 001 of the substrate cleaning equipment.

[0037] The lifting drive member 1 is located below the back spray plate 001 of the substrate cleaning device and is installed on the frame of the substrate cleaning device. The driving end of the lifting drive member 1 is connected to the lifting frame 2. A magnetic block A 3 is provided at a position corresponding to each set of magnetic shaft baffle components on the lifting frame 2. In this embodiment, there are multiple lifting drive members 1, all of which are commercially available pneumatic components, and the movements are controlled by the control of the device itself.

[0038] The driving end of the lifting drive member 1 drives the lifting frame 2 to rise and fall, and each magnetic block A3 rises and falls together with the lifting frame 2. Each magnetic block A3 drives the corresponding magnetic shaft baffle assembly to move through the magnetic force, thereby causing each group of magnetic shaft baffle assemblies to close or open the corresponding lifting pin ejector hole 0011, thereby achieving the effect of sealing the lifting pin ejector hole 0011 during the cleaning process, avoiding the cleaning liquid from splashing through the lifting pin ejector hole 0011 to the top of the lifting pin ejector 002 and contaminating the lifting pin ejector 002, thereby preventing the appearance of aggregated attached particles at the local position where the chip 004 contacts the lifting pin ejector 002.

[0039] Specifically, in this embodiment, a plurality of magnet embedding grooves A are provided on the lifting frame 2, and each magnet A 3 is respectively embedded in a corresponding magnet embedding groove A and fixed to the lifting frame 2 by fasteners, so as to facilitate the positioning and installation of the magnet A 3.

[0040] Specifically, if Figure 4 As shown, in this embodiment, each group of magnetic shaft baffle assemblies includes a shaft base 4, a shaft 5, a magnetic block B 6, and a baffle 7. The shaft base 4 of each group of magnetic shaft baffle assemblies is fixed to the back spray plate 001 through fasteners, the shaft 5 of each group of magnetic shaft baffle assemblies is rotatably arranged in the shaft base 4 of the same group of magnetic shaft baffle assemblies, the magnetic block B 6 of each group of magnetic shaft baffle assemblies is fixed to the lower part of the shaft 5 of the same group of magnetic shaft baffle assemblies, and the baffle 7 of each group of magnetic shaft baffle assemblies is fixed to the upper part of the shaft 5 of the same group of magnetic shaft baffle assemblies through fasteners. The magnetic block B 6 of all groups of magnetic shaft baffle assemblies is located below the back spray plate 001, and is used in conjunction with the magnetic block A 3.

[0041] The magnetic block B 6 of each set of magnetic shaft baffle assemblies is acted upon by the magnetic force of the corresponding magnetic block A 3, thereby driving the shaft 5 of the same set of magnetic shaft baffle assemblies to rotate, thereby driving the baffle 7 to close or open the corresponding lifting pin ejector hole 0011.

[0042] Specifically, in this embodiment, the shaft base 4 of each set of magnetic shaft baffle assemblies is rotatably connected to the shaft 5 of the same set of magnetic shaft baffle assemblies through two bearings 8, so that the shaft 5 can rotate smoothly. In this embodiment, the inner side of the shaft base 4 and the outer side of the shaft 5 are formed with stepped surfaces for positioning and supporting the bearing 8, and the upper part of the shaft base 4 is threadedly connected with a bearing cover 10 for locking and positioning the bearing 8.

[0043] Specifically, in this embodiment, the magnetic block B 6 of each group of magnetic shaft baffle assemblies is in the shape of a rectangular parallelepiped, and the bottom of the shaft 5 of each group of magnetic shaft baffle assemblies is provided with a magnetic block inlay groove B 501 for accommodating the magnetic block B 6. The lower part of the shaft 5 of each group of magnetic shaft baffle assemblies is installed with a bottom cover 9 through fasteners, and each bottom cover 9 covers the magnetic block inlay groove B 501 on the corresponding shaft 5. The setting of the bottom cover 9 plays a role in fixing and protecting the magnetic block B 6, and the magnetic block B 6 of each group of magnetic shaft baffle assemblies can be further fixedly connected to the shaft 5 of the same group of magnetic shaft baffle assemblies through fasteners.

[0044] Specifically, the baffles 7 of all groups of magnetic shaft baffle assemblies in this embodiment are located above the back spray plate 001, and the lifting pin ejector hole 0011 can be blocked above the back spray plate 001, effectively preventing the cleaning liquid from splashing into the lifting pin ejector hole 0011.

[0045] Specifically, in this embodiment, the shortest line between the N pole of each magnetic block B6 and the S pole of the magnetic block B6 is parallel to the horizontal plane, and the shortest line between the N pole of each magnetic block A3 and the S pole of the magnetic block A3 is perpendicular to the horizontal plane.

[0046] In a specific embodiment of the present invention, Figure 5-8 As shown (N and S in the figure are used to indicate the distribution position of the magnetic poles), the upper part of the magnetic block A3 is the N pole and the lower part is the S pole, and the left and right sides of the magnetic block B6 are the N pole and the S pole respectively.

[0047] like Figure 5 and 6 As shown, after the wafer 004 is placed in the device, the lifting frame 2 is in a low position, and the N pole of the magnetic block A3 is closer to the magnetic block B6 of the corresponding magnetic shaft baffle assembly than the S pole. Through the magnetic attraction of the magnetic block A3, the magnetic block B6 in the corresponding magnetic shaft baffle assembly is at the S level on the side close to the lifting frame 2 and at the N level on the side away from the lifting frame 2, so that the baffle 7 is in a state of being offset from the lifting pin ejector hole 0011.

[0048] like Figure 7 and 8 As shown, when the lifting pin ejector hole 0011 needs to be blocked, after the lifting drive 1 drives the lifting frame 2 to rise to a certain position, the S pole of the magnetic block A3 is closer to the magnetic block B6 of the corresponding magnetic shaft baffle assembly than the N pole. Through the repulsion of the same magnetic poles and the attraction of the opposite magnetic poles, the magnetic block B6 in the corresponding magnetic shaft baffle assembly drives the shaft 5 of the same group of magnetic shaft baffle assemblies to rotate, and then drives the baffle 7 to block the corresponding lifting pin ejector hole 0011. At this time, the magnetic block B6 in the corresponding magnetic shaft baffle assembly is close to the lifting frame 2 on the side at the N level and away from the lifting frame 2 on the side at the S level.

Claims

1. A structure for preventing local particle aggregation, suitable for substrate cleaning equipment, characterized in that: It comprises a lifting drive component (1), a lifting frame (2) and a magnetic shaft baffle assembly; The magnetic shaft baffle assembly is provided with a plurality of groups, and each group of the magnetic shaft baffle assembly is used in conjunction with a corresponding lifting pin ejector hole (0011) on the back spray plate (001) of the substrate cleaning device; The lifting drive member (1) is located below the back spray plate (001) of the substrate cleaning device, the driving end of the lifting drive member (1) is connected to the lifting frame (2), and a magnetic block A (3) is provided on the lifting frame (2) at a position corresponding to each group of the magnetic shaft baffle assembly; The driving end of the lifting drive member (1) drives the lifting frame (2) to move up and down, and each of the magnetic blocks A (3) moves up and down together with the lifting frame (2). Each of the magnetic blocks A (3) drives the corresponding magnetic shaft baffle assembly to move through the magnetic force, thereby causing each group of the magnetic shaft baffle assemblies to close or open the corresponding lifting pin ejector hole (0011).

2. A structure for preventing local particle aggregation according to claim 1, characterized in that: The lifting drive component (1) is installed on the frame of the substrate cleaning equipment.

3. The structure for preventing local particle aggregation according to claim 1, characterized in that: The lifting frame (2) is provided with a plurality of magnetic block embedding grooves A, and each magnetic block A (3) is respectively embedded in a corresponding magnetic block embedding groove A.

4. The structure for preventing local particle aggregation according to claim 1, characterized in that: Each of the magnetic blocks A (3) is fixedly connected to the lifting frame (2) via a fastener.

5. The structure for preventing local particle aggregation according to claim 1, characterized in that: Each group of the magnetic shaft baffle assemblies comprises a shaft base (4), a shaft (5), a magnetic block B (6), and a baffle (7); the shaft (5) of each group of the magnetic shaft baffle assemblies is rotatably arranged in the shaft base (4) of the magnetic shaft baffle assemblies of the same group; the magnetic block B (6) of each group of the magnetic shaft baffle assemblies is fixedly connected to the lower part of the shaft (5) of the magnetic shaft baffle assemblies of the same group; and the baffle (7) of each group of the magnetic shaft baffle assemblies is fixedly connected to the upper part of the shaft (5) of the magnetic shaft baffle assemblies of the same group; the magnetic blocks B (6) of all groups of the magnetic shaft baffle assemblies are located below the back spray plate (001); The magnetic block B (6) of each group of the magnetic shaft baffle assemblies is acted upon by the magnetic force of the corresponding magnetic block A (3) to drive the shaft (5) of the same group of the magnetic shaft baffle assemblies to rotate, thereby driving the baffle (7) to close or open the corresponding lifting pin ejector hole (0011).

6. The structure for preventing local particle aggregation according to claim 5, characterized in that: The shaft base (4) of each set of the magnetic shaft baffle assembly is fixedly connected to the back spray plate (001).

7. The structure for preventing local particle aggregation according to claim 5, characterized in that: The rotating shaft base (4) of each group of the magnetic rotating shaft baffle assemblies is rotatably connected to the rotating shaft (5) of the same group of the magnetic rotating shaft baffle assemblies via a bearing (8).

8. The structure for preventing local particle aggregation according to claim 5, characterized in that: The bottom of the rotating shaft (5) of each group of the magnetic rotating shaft baffle assemblies is provided with a magnetic block embedding groove B (501) for accommodating a magnetic block B (6), and the lower part of the rotating shaft (5) of each group of the magnetic rotating shaft baffle assemblies is provided with a bottom cover (9), and each bottom cover (9) covers the magnetic block embedding groove B (501) on the corresponding rotating shaft (5).

9. The structure for preventing local particle aggregation according to claim 5, characterized in that: The shortest line between the N pole of each magnetic block B (6) and the S pole of the magnetic block B (6) is parallel to the horizontal plane, and the shortest line between the N pole of each magnetic block A (3) and the S pole of the magnetic block A (3) is perpendicular to the horizontal plane.

10. The structure for preventing local particle aggregation according to claim 5, characterized in that: The baffles (7) of all groups of the magnetic shaft baffle assemblies are located above the back spray plate (001).

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