A high thermal conductivity patch rectifier bridge

Abstract

The utility model relates to a high thermal conductivity patch rectifier bridge, which includes a plastic-encapsulated shell, a copper-clad ceramic substrate, a first diode, a second diode, a third diode and a fourth diode. The front of the copper-clad ceramic substrate is sintered with a first positive copper sheet, a first negative copper sheet, a first AC copper sheet and a second AC copper sheet. The back of the copper-clad ceramic substrate is provided with a second positive copper sheet, a second negative copper sheet, a third AC copper sheet and a fourth AC copper sheet. The cathode of the third diode and the cathode of the fourth diode are welded to the first positive copper sheet. The plastic-encapsulated shell wraps the copper-clad ceramic substrate, and the back of the copper-clad ceramic substrate is exposed on the plastic-encapsulated shell. The utility model adopts the copper-clad ceramic substrate as a base. The thermal resistance of the copper-clad ceramic substrate is much lower than that of conventional epoxy plastic-encapsulated materials, and has higher heat dissipation efficiency. Heat dissipation can directly conduct the heat of the diode chip to the PCB circuit board through the copper-clad ceramic substrate, and heat dissipation is more efficient and convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of patch rectifier bridge applications, in particular to a high thermal conductivity patch rectifier bridge. Background Art

[0002] At present, the patch rectifier bridges on the market are basically fully plastic-sealed, and their nominal current is the same as the parameters of the internal chip. However, in actual applications, considering the dissipated power and heat conduction of the rectifier bridge, the actual application can only be suitable for low current use. It generally includes a plastic-sealed shell, four diodes, a copper frame and four pins. The four diodes are welded on the copper frame, and the plastic-sealed shell wraps the copper frame and the four diodes. However, the existing patch rectifier bridge has the following problems: 1. The existing patch rectifier bridge is fully plastic-sealed and has poor heat dissipation. 2. After the existing patch rectifier bridge is welded, there will be a certain gap between the bottom and the PCB, and the heat can only be conducted through the pins. 3. The size of the diode chip is limited by the package, and a larger chip cannot be placed. 4. The existing patch rectifier has poor heat dissipation performance, and the performance of the rectifier bridge is limited. 5. The strip production has high requirements for equipment. Therefore, the structure of the existing patch rectifier bridge needs to be further improved. Utility Model Content

[0003] The utility model aims to provide a high thermal conductivity patch rectifier bridge with good heat dissipation effect.

[0004] The first utility model object of the utility model is achieved in this way:

[0005] A high thermal conductivity patch rectifier bridge comprises a plastic-encapsulated shell, a copper-clad ceramic substrate, a first diode, a second diode, a third diode and a fourth diode, a first positive copper sheet, a first negative copper sheet, a first alternating current copper sheet and a second alternating current copper sheet are sintered on the front of the copper-clad ceramic substrate, a second positive copper sheet, a second negative copper sheet, a third alternating current copper sheet and a fourth alternating current copper sheet are arranged on the back of the copper-clad ceramic substrate, the first positive copper sheet, the first negative copper sheet, the first alternating current copper sheet and the second alternating current copper sheet are respectively connected to the second positive copper sheet, the second negative copper sheet, the third alternating current copper sheet and the fourth alternating current copper sheet, the cathode of the first diode and the cathode of the second diode are respectively welded to the first alternating current copper sheet and the second alternating current copper sheet, the cathode of the third diode and the cathode of the fourth diode are welded to the first positive copper sheet, the plastic-encapsulated shell wraps the copper-clad ceramic substrate, and the back of the copper-clad ceramic substrate is exposed on the plastic-encapsulated shell. The utility model adopts a copper-clad ceramic substrate as a base, and the thermal resistance of the copper-clad ceramic substrate is much lower than that of conventional epoxy plastic-encapsulated materials, and has higher heat dissipation efficiency. Heat dissipation can be achieved by directly transferring the heat generated by the diode chip to the PCB circuit board through the copper-clad ceramic substrate, making heat dissipation more efficient and convenient.

[0006] The present invention can also be further improved as follows.

[0007] The utility model also includes a first conductive sheet, a second conductive sheet, a third conductive sheet and a fourth conductive sheet. The anode of the first diode is connected to the first negative copper sheet through the first conductive sheet, the anode of the second diode is connected to the first negative copper sheet through the second conductive sheet, the anode of the third diode is connected to the second AC copper sheet through the third conductive sheet, and the anode of the fourth diode is connected to the first AC copper sheet through the fourth conductive sheet.

[0008] The utility model also includes a first connecting copper column, a second connecting copper column, a third connecting copper column, and a fourth connecting copper column. The first connecting copper column, the second connecting copper column, the third connecting copper column, and the fourth connecting copper column penetrate the copper-clad ceramic substrate. The two ends of the first connecting copper column are respectively connected to the first positive copper sheet and the second positive copper sheet, the two ends of the second connecting copper column are respectively connected to the first negative copper sheet and the second negative copper sheet, the two ends of the third connecting copper column are respectively connected to the first AC copper sheet and the third AC copper sheet, and the two ends of the fourth connecting copper column are respectively connected to the second AC copper sheet and the fourth AC copper sheet.

[0009] The beneficial effects of the utility model are as follows:

[0010] 1. The utility model adopts a copper-clad ceramic substrate as the base. The thermal resistance of the copper-clad ceramic substrate is much lower than that of conventional epoxy plastic packaging materials, and has higher heat dissipation efficiency. Therefore, the heat dissipation effect of the rectifier bridge of the utility model is good. The copper-clad ceramic substrate of the utility model is used as a direct electrical connection and heat dissipation path between the internal part of the product and the PCB. The copper-clad ceramic substrate has excellent thermal cycling, stable shape, good rigidity, high thermal conductivity, high reliability, and the copper-clad surface can be etched with various graphics. It is a pollution-free, pollution-free green product with a wide range of operating temperatures, from -55°C to 850°C, and the thermal expansion coefficient is close to that of silicon.

[0011] 2. The utility model adopts a copper-clad ceramic substrate, and the processing technology does not require a large-scale assembly machine, and can be completed using ordinary assembly technology.

[0012] 3. The multiple copper sheets welded to the PCB circuit board of the utility model have a larger area than the pins of the rectifier bridge in the prior art, and are designed to be located at the bottom of the copper-clad ceramic substrate. The utility model directly conducts the heat of the diode to the PCB circuit board through the copper-clad ceramic substrate, and the heat dissipation is more efficient and convenient.

[0013] 4. Compared with the existing SMD rectifier bridge, the appearance size is almost the same, but the internal chip placement space is larger, which can accommodate larger chips.

[0014] 5. Due to the optimization of heat dissipation and chip placement space, the utility model can achieve greater rectification capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the high thermal conductivity patch rectifier bridge of the utility model.

[0016] Figure 2 It is a structural schematic diagram of the high thermal conductivity patch rectifier bridge of the utility model from another angle.

[0017] Figure 3 It is a rear view of the high thermal conductivity patch rectifier bridge of the utility model.

[0018] Figure 4 It is a structural schematic diagram of the utility model's high thermal conductivity patch rectifier bridge after omitting the plastic sealing shell.

[0019] Figure 5 The utility model is a schematic structural diagram of a high thermal conductivity patch rectifier bridge after omitting a plastic package shell and a plurality of conductive sheets.

[0020] Figure 6 It is a structural schematic diagram from another angle of the utility model of the high thermal conductivity patch rectifier bridge after omitting the plastic package shell and multiple conductive sheets.

[0021] Figure 7 It is a structural schematic diagram of the copper-clad ceramic substrate of the utility model.

[0022] Figure 8 It is a structural schematic diagram of the copper-clad ceramic substrate of the utility model from another angle. DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0024] Embodiment 1, as Figures 1 to 8 As shown, a high thermal conductivity patch rectifier bridge includes a plastic package shell 1, a copper-clad ceramic substrate 2, a first diode D1, a second diode D2, a third diode D3 and a fourth diode D4, a first positive copper sheet 5, a first negative copper sheet 6, a first AC copper sheet 3 and a second AC copper sheet 4 are sintered on the front of the copper-clad ceramic substrate 2, a second positive copper sheet 10, a second negative copper sheet 9, a third AC copper sheet 8 and a fourth AC copper sheet 7 are arranged on the back of the copper-clad ceramic substrate 2, the first positive copper sheet 5, the first negative copper sheet 6, the first AC copper sheet 3 and the second AC copper sheet 4 are sintered on the front of the copper-clad ceramic substrate 2, and a second positive copper sheet 10, a second negative copper sheet 9, a third AC copper sheet 8 and a fourth AC copper sheet 7 are arranged on the back of the copper-clad ceramic substrate 2. 6. The first AC copper sheet 3 and the second AC copper sheet 4 are connected to the second positive copper sheet 10, the second negative copper sheet 9, the third AC copper sheet 8 and the fourth AC copper sheet 7 respectively. The cathode of the first diode D1 and the cathode of the second diode D2 are welded to the first AC copper sheet 3 and the second AC copper sheet 4 respectively. The cathode of the third diode D3 and the cathode of the fourth diode D4 are welded to the first positive copper sheet 5. The plastic package 1 wraps the copper-clad ceramic substrate 2, and the back of the copper-clad ceramic substrate 2 is exposed on the plastic package 1. The second positive copper sheet 10, the second negative copper sheet 9, the third AC copper sheet 8 and the fourth AC copper sheet 7 on the back of the copper-clad ceramic substrate are welded to the circuit board.

[0025] As a more specific technical solution of the utility model.

[0026] The utility model also includes a first conductive sheet 11, a second conductive sheet 12, a third conductive sheet 13 and a fourth conductive sheet 14. The anode of the first diode D1 is connected to the first negative copper sheet 6 through the first conductive sheet 11, the anode of the second diode D2 is connected to the first negative copper sheet 6 through the second conductive sheet 12, the anode of the third diode D3 is connected to the second AC copper sheet 4 through the third conductive sheet 13, and the anode of the fourth diode D4 is connected to the first AC copper sheet 3 through the fourth conductive sheet 14.

[0027] The utility model also includes a first connecting copper pillar 15, a second connecting copper pillar 16, a third connecting copper pillar 17 and a fourth connecting copper pillar 18. The first connecting copper pillar 15, the second connecting copper pillar 16, the third connecting copper pillar 17 and the fourth connecting copper pillar 18 penetrate the copper-clad ceramic substrate 2. The two ends of the first connecting copper pillar 15 are respectively connected to the first positive copper sheet 5 and the second positive copper sheet 10, the two ends of the second connecting copper pillar 16 are respectively connected to the first negative copper sheet 6 and the second negative copper sheet 9, the two ends of the third connecting copper pillar 17 are respectively connected to the first AC copper sheet 3 and the third AC copper sheet 8, and the two ends of the fourth connecting copper pillar 18 are respectively connected to the second AC copper sheet 4 and the fourth AC copper sheet 7.

Claims

1. A high thermal conductivity patch rectifier bridge, characterized in that: The invention comprises a plastic-encapsulated housing (1), a copper-clad ceramic substrate (2), a first diode (D1), a second diode (D2), a third diode (D3) and a fourth diode (D4); a first positive copper sheet (5), a first negative copper sheet (6), a first alternating current copper sheet (3) and a second alternating current copper sheet (4) are sintered on the front side of the copper-clad ceramic substrate (2); a second positive copper sheet (10), a second negative copper sheet (9), a third alternating current copper sheet (8) and a fourth alternating current copper sheet (7) are provided on the back side of the copper-clad ceramic substrate (2); The copper sheet (3) and the second AC copper sheet (4) are respectively connected to the second positive copper sheet (10), the second negative copper sheet (9), the third AC copper sheet (8) and the fourth AC copper sheet (7); the cathode of the first diode (D1) and the cathode of the second diode (D2) are respectively welded to the first AC copper sheet (3) and the second AC copper sheet (4); the cathode of the third diode (D3) and the cathode of the fourth diode (D4) are welded to the first positive copper sheet (5); the plastic package shell (1) wraps the copper-clad ceramic substrate (2); and the back surface of the copper-clad ceramic substrate (2) is exposed on the plastic package shell (1).

2. According to claim 1, the high thermal conductivity patch rectifier bridge is characterized in that: It also comprises a first conductive sheet (11), a second conductive sheet (12), a third conductive sheet (13) and a fourth conductive sheet (14); the anode of the first diode (D1) is connected to the first negative copper sheet (6) via the first conductive sheet (11); the anode of the second diode (D2) is connected to the first negative copper sheet (6) via the second conductive sheet (12); the anode of the third diode (D3) is connected to the second AC copper sheet (4) via the third conductive sheet (13); and the anode of the fourth diode (D4) is connected to the first AC copper sheet (3) via the fourth conductive sheet (14).

3. According to claim 2, the high thermal conductivity patch rectifier bridge is characterized in that: The invention also comprises a first connecting copper pillar (15), a second connecting copper pillar (16), a third connecting copper pillar (17), and a fourth connecting copper pillar (18). The first connecting copper pillar (15), the second connecting copper pillar (16), the third connecting copper pillar (17), and the fourth connecting copper pillar (18) penetrate the copper-clad ceramic substrate (2). The two ends of the first connecting copper pillar (15) are respectively connected to the first positive copper sheet (5) and the second positive copper sheet (10). The two ends of the second connecting copper pillar (16) are respectively connected to the first negative copper sheet (6) and the second negative copper sheet (9). The two ends of the third connecting copper pillar (17) are respectively connected to the first AC copper sheet (3) and the third AC copper sheet (8). The two ends of the fourth connecting copper pillar (18) are respectively connected to the second AC copper sheet (4) and the fourth AC copper sheet (7).

Images