A sealing structure of wafer etching equipment

By installing a sealing ring between the motor protective cover of the wafer etching equipment and the lifting CUP and forming a step-type sealing structure, the problem of liquid flowing into the gap and liquid storage is solved, and the drug liquid recovery effect is improved.

CN222735915UActive Publication Date: 2025-04-08KINGSEMI CO LTD
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Patent Information

Application Number
CN202420780373.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-16
Publication Date
2025-04-08
Estimated Expiration
2034-04-16

AI Technical Summary

Technical Problem

The existing wafer etching equipment lacks a suitable sealing structure in the later stage of the etching process, which causes the liquid to flow into the gap between the lifting CUP and the motor protective cover or is blocked, resulting in liquid storage, and the liquid recovery effect is poor.

Method used

A sealing structure for wafer etching equipment is designed. By installing a sealing ring between the motor protective cover and the lifting CUP, and using the sealing ring crimp edge to cooperate with the sealing ring, a step-type sealing structure is formed to ensure that the liquid does not flow into the gap.

Benefits of technology

It effectively improves the sealing effect between the lifting CUP that is lowered to the lowest position and the motor protective cover, prevents the liquid from flowing into the gap, ensures the liquid is recovered smoothly, and avoids liquid storage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of wafer etching equipment, specifically, a sealing structure of wafer etching equipment, which is suitable for the motor protective cover and lifting CUP of the wafer etching equipment, the outer peripheral edge of the motor protective cover is provided with a sealing ring installation groove, the sealing ring is embedded in the sealing ring installation groove, and the top opening of the lifting CUP extends a sealing ring crimping edge toward the inner side close to the motor protective cover. The utility model can connect the motor protective cover with the lowered lifting CUP to form a stepped sealing structure, which can effectively ensure the sealing effect between the lifting CUP lowered to the lowest position and the motor protective cover, avoid the liquid used in the later stage of the etching process from flowing into the gap between the lifting CUP and the motor protective cover, and can fully flow along the outer side of the lowered lifting CUP through the flow path located on the outside of the lifting CUP and be recovered, and can avoid the accumulation of liquid between the motor protective cover and the lowered lifting CUP, effectively improving the liquid recovery effect.
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Description

Technical Field

[0001] The utility model belongs to the technical field of wafer etching equipment, in particular to a sealing structure of wafer etching equipment. Background Art

[0002] At present, wafer etching equipment generally sets a motor protection cover on the back of the wafer, that is, on the main cavity of the wafer etching equipment below the wafer, and protects the spindle motor used to drive the wafer stage. A lifting CUP driven by the lifting mechanism of the wafer etching equipment is set on the outside of the wafer stage. When etching the wafer on the wafer stage directly, it is necessary to raise the lifting CUP to block the liquid used for the process at this time, so that it flows away from the gap between the lifting CUP and the motor protection cover.

[0003] With the improvement and update of etching process, when the types of liquid medicine used become two, the main liquid medicine used is generally made to flow away from the gap between the motor protection cover and the raised lifting CUP and be recovered, and the other liquid medicine used in the later stage of some etching processes flows along the outer side of the lowered lifting CUP through the flow path located on the outside of the lifting CUP and is recovered. However, there is currently a lack of a suitable sealing structure between the lowered lifting CUP and the motor protection cover, which makes it easy for the other liquid medicine used in the later stage of some etching processes to flow into the gap between the lifting CUP and the motor protection cover, or be blocked between the motor protection cover and the lowered lifting CUP to cause liquid accumulation, resulting in poor liquid medicine recovery effect. Utility Model Content

[0004] In view of the above problems, the purpose of the present utility model is to provide a sealing structure for wafer etching equipment.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A sealing structure for a wafer etching device is applicable to a motor protective cover and a lifting CUP of the wafer etching device. The bottom end of the motor protective cover is mounted on a main body cavity of the wafer etching device. A through hole for passing through the middle of a wafer stage of the wafer etching device is provided in the middle of the top surface of the motor protective cover. A sealing ring installation groove is provided on the outer peripheral edge of the motor protective cover. A sealing ring is embedded in the sealing ring installation groove.

[0007] A sealing ring crimping edge extends from the top opening of the lifting CUP toward the inner side close to the motor protective cover; when the lifting CUP is lowered to the lowest position, the sealing ring crimping edge of the lifting CUP is crimped on the sealing ring, and the top surface of the lifting CUP gradually tilts downward from the inner side close to the motor protective cover to the outer side away from the motor protective cover.

[0008] The top surface of the motor protection cover gradually slopes downward from the through hole located in the middle to the sealing ring installation groove located at the outer peripheral edge.

[0009] The inner circumferential surface of the sealing ring installation groove presses against the inner circumferential surface of the sealing ring, and a top stop edge is provided at the top position of the inner circumferential surface of the sealing ring installation groove extending toward the outer circumference of the motor protective cover, and the top stop edge presses against the sealing ring from above the sealing ring, and the bottom surface of the sealing ring installation groove presses against the sealing ring from below the sealing ring.

[0010] When the lifting CUP is lowered to the lowest position, the height position of the sealing ring crimping edge of the lifting CUP is lower than the height position of the top stop edge.

[0011] A side guard edge is convexly provided on the bottom surface of the sealing ring installation groove, and the side guard edge abuts against the outer peripheral surface of the sealing ring; when the lifting CUP is lowered to the lowest position, the height position of the sealing ring crimping edge of the lifting CUP is higher than the height position of the side guard edge.

[0012] The advantages and positive effects of the utility model are:

[0013] The utility model forms a stepped sealing structure by crimping the sealing ring along the crimping sealing ring, thereby connecting the motor protective cover with the lowered lifting CUP, which can effectively ensure the sealing effect between the lifting CUP lowered to the lowest position and the motor protective cover, and avoid the medicine liquid used in the later stage of the etching process from flowing into the gap between the lifting CUP and the motor protective cover. The medicine liquid can fully flow away along the outer side surface of the lowered lifting CUP through the flow path located on the outer side of the lifting CUP and be recovered, and can avoid the accumulation of liquid between the motor protective cover and the lowered lifting CUP, thereby effectively improving the medicine liquid recovery effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of the utility model in a wafer etching device;

[0015] Figure 2 for Figure 1 Enlarged view of point A.

[0016] In the figure: 1 is a motor protective cover, 101 is a sealing ring installation groove, 1011 is a top retaining edge, 1012 is;

[0017] 2 is the lifting CUP, 201 is the crimping edge of the sealing ring;

[0018] 3 is a sealing ring;

[0019] 001 is the wafer, 002 is the spindle motor, 003 is the wafer stage, and 004 is the main cavity. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1-2 The utility model is further described in detail.

[0021] A sealing structure of a wafer etching device, such as Figure 1-2 As shown, the motor protection cover 1 and the lifting CUP 2 are suitable for the wafer etching equipment, and the bottom end of the motor protection cover 1 is installed on the main cavity 004 of the wafer etching equipment. In this embodiment, the installation method between the motor protection cover 1 and the main cavity 004 adopts the existing technology to protect the spindle motor 002 inside the motor protection cover 1; the lifting CUP 2 is driven by the lifting mechanism of the wafer etching equipment to lift and lower, and the installation method of the lifting CUP 2 is also the existing technology. The spindle motor 002 is connected to the wafer holding table 003, and drives the wafer holding table 003 to rotate the wafer 001 held by the wafer holding table 003 to perform the etching process. On the main cavity 004, corresponding to the gap between the lifting CUP 2 and the motor protection cover 1, and corresponding to the outer side of the lifting CUP 2, flow paths for recovering different liquids are respectively provided, and the setting method of the flow path is the existing technology.

[0022] A through hole for the middle of the wafer stage 003 of the wafer etching equipment is provided in the middle of the top surface of the motor protective cover 1; by allowing the wafer stage 003 to pass through the middle of the top surface of the motor protective cover 1, the gap between the motor protective cover 1 and the wafer 001 can be made smaller, which facilitates the outflow of the liquid medicine along the surface of the motor protective cover 1. A sealing ring installation groove 101 is provided on the outer peripheral edge of the motor protective cover 1, and a sealing ring 3 is embedded in the sealing ring installation groove 101. In this embodiment, the sealing ring 3 is a sealing ring product made of soft and corrosion-resistant material in the prior art.

[0023] A sealing ring crimping edge 201 extends from the top opening of the lifting CUP 2 toward the inner side close to the motor protective cover 1. When the lifting CUP 2 is lowered to the lowest position, the sealing ring crimping edge 201 of the lifting CUP 2 is crimped on the sealing ring 3, and the top surface of the lifting CUP 2 gradually tilts downward from the inner side close to the motor protective cover 1 to the outer side away from the motor protective cover 1. By making the sealing ring crimping edge 201 crimp the sealing ring 3, the motor protective cover 1 and the lowered lifting CUP 2 are connected to form a stepped sealing structure, which can effectively ensure the sealing effect between the lifting CUP 2 lowered to the lowest position and the motor protective cover 1, avoid the liquid used in the later stage of the etching process from flowing into the gap between the lifting CUP 2 and the motor protective cover 1, and can fully flow along the top surface and outer side surface of the lowered lifting CUP through the flow path located on the outer side of the lifting CUP 2 and be recovered, and also avoid the accumulation of liquid between the motor protective cover 1 and the lowered lifting CUP 2. By pressing the sealing ring crimping edge 201 into a certain distance, the sealing effect can be better ensured.

[0024] Specifically, if Figure 2 As shown, in this embodiment, the inner circumference of the sealing ring installation groove 101 abuts against the inner circumference of the sealing ring 3, and a top retaining edge 1011 is provided at the top position of the inner circumference of the sealing ring installation groove 101 extending toward the outer circumference of the motor protective cover 1, and the top retaining edge 1011 abuts against the sealing ring 3 from above the sealing ring 3, and the bottom surface of the sealing ring installation groove 101 abuts against the sealing ring 3 from below the sealing ring 3, and a side retaining edge 1012 is convexly provided on the bottom surface of the sealing ring installation groove 101, and the side retaining edge 1012 abuts against the outer circumference of the sealing ring 3, so that the sealing ring 3 can be fully and reliably clamped in the sealing ring installation groove 101, and the installation is convenient.

[0025] Specifically, the top surface of the motor protection cover 1 in this embodiment gradually tilts downward from the through hole in the middle to the sealing ring installation groove 101 at the outer edge. When the lifting cup 2 is lowered to the lowest position, the height position of the sealing ring crimping edge 201 of the lifting cup 2 is lower than the height position of the top retaining edge 1011, and the height position of the sealing ring crimping edge 201 of the lifting cup 2 is higher than the height position of the side retaining edge 1012, which can avoid interference with the sealing ring crimping edge 201 crimping the sealing ring 3, and effectively ensure that the liquid medicine flowing down from the motor protection cover 1 passes smoothly through the sealing ring 3 and the sealing ring crimping edge 201, and flows out from the top surface and outer side surface of the lifting cup 2.

Claims

1. A sealing structure for a wafer etching device, suitable for a motor protection cover (1) and a lifting CUP (2) of the wafer etching device, characterized in that: The bottom end of the motor protective cover (1) is mounted on the main body cavity of the wafer etching device, and a through hole for passing through the middle of the wafer stage of the wafer etching device is provided in the middle of the top surface of the motor protective cover (1); a sealing ring installation groove (101) is provided on the outer peripheral edge of the motor protective cover (1), and a sealing ring (3) is embedded in the sealing ring installation groove (101); A sealing ring crimping edge (201) extends from the top opening of the lifting cup (2) toward the inner side of the motor protective cover (1); when the lifting cup (2) is lowered to the lowest position, the sealing ring crimping edge (201) of the lifting cup (2) is crimped onto the sealing ring (3), and the top surface of the lifting cup (2) gradually tilts downward from the inner side close to the motor protective cover (1) to the outer side away from the motor protective cover (1).

2. The sealing structure of a wafer etching device according to claim 1, characterized in that: The top surface of the motor protection cover (1) gradually slopes downward from the through hole in the middle to the sealing ring installation groove (101) at the outer peripheral edge.

3. The sealing structure of a wafer etching device according to claim 1, characterized in that: The inner circumferential surface of the sealing ring installation groove (101) abuts against the inner circumferential surface of the sealing ring (3); a top stop edge (1011) is provided at the top position of the inner circumferential surface of the sealing ring installation groove (101) and extends toward the outer circumference of the motor protective cover (1); the top stop edge (1011) abuts against the sealing ring (3) from above the sealing ring (3); and the bottom surface of the sealing ring installation groove (101) abuts against the sealing ring (3) from below the sealing ring (3).

4. The sealing structure of a wafer etching device according to claim 3, characterized in that: When the lifting cup (2) is lowered to the lowest position, the height position of the sealing ring crimping edge (201) of the lifting cup (2) is lower than the height position of the top stop edge (1011).

5. The sealing structure of a wafer etching device according to claim 3, characterized in that: A side retaining edge (1012) is convexly provided on the bottom surface of the sealing ring installation groove (101), and the side retaining edge (1012) abuts against the outer peripheral surface of the sealing ring (3); when the lifting cup (2) is lowered to the lowest position, the height position of the sealing ring crimping edge (201) of the lifting cup (2) is higher than the height position of the side retaining edge (1012).