A mold for mini-LED backlight adhesive production

Abstract

The utility model discloses a mold for mini-LED backlight adhesive production, which includes an upper mold and a lower mold, wherein the upper mold is located above the lower mold, an upper mold is provided at the bottom of the upper mold, a sealing groove is provided on the upper mold, the sealing groove opens to the bottom surface of the upper mold, a vacuum pump for evacuating the sealing groove is provided on the upper mold, and the sealing groove is connected to the vacuum pump. The mold for mini-LED backlight adhesive production of the utility model can improve the thickness consistency of the backlight adhesive, so that the backlight protective adhesive is evenly distributed on the mini-LED substrate, thereby improving the lamp shadow and reducing the film material to reduce the cost, shortening the production process time, and improving production efficiency.

Description

Technical Field

[0001] The utility model relates to a mold for producing mini-LED backlight surface adhesive. Background Art

[0002] At present, mini-LED production involves setting backlight surface glue on mini-LED light-emitting components. Mini-LED backlight OD0 projects basically use the method of full-surface transparent protective glue. The first function is to protect the LED chip to prevent the LED from being damaged; the second is that the LED light is reflected and refracted by the protective glue and the substrate to achieve a fully uniform optical effect; the third is to provide a placement platform for the built film material. The traditional production method is to use a dispensing machine to dispense glue on the light-emitting component. The dispensing machine is used to dispense glue in the form of an S-shaped path to draw a line, and a plane is formed by the self-leveling method of the glue. However, the self-leveling method cannot be fully leveled due to the tension of the glue itself and the tension between the glue and the substrate and the LED. It is easy to form local ripples and pits, and the plane consistency is poor. In addition, the thickness tolerance of the glue dispensed by the dispensing machine is large, generally 50um, and the flatness and consistency of the surface glue vary greatly, which affects the optical effect to a certain extent. The optical effect of the backlight will have clustered stripes and dark spots. To improve the optical effect, it is necessary to increase the structural film material for improvement, so the cost of the film material becomes high.

[0003] In addition, this dispensing operation mode of the dispensing machine makes the production process time too long, resulting in low production efficiency. Taking the 16-inch mini-LED as an example, the process time is about 17 minutes, which is ultimately reflected in the increase of production costs. Utility Model Content

[0004] The purpose of the utility model is to provide a mold for the production of mini-LED backlight adhesive. The mold for the production of mini-LED backlight adhesive can improve the thickness consistency of the backlight adhesive, so that the backlight protective adhesive is evenly distributed on the mini-LED substrate, thereby improving the lamp shadow and reducing the film material to reduce the cost, shorten the production process time, and improve production efficiency.

[0005] In order to solve the above technical problems, a technical solution adopted by the utility model is: to provide a mold for the production of mini-LED backlight adhesive, which includes an upper mold and a lower mold, the upper mold is located above the lower mold, and an upper mold is arranged at the bottom of the upper mold, and a sealing groove is arranged on the upper mold, and the sealing groove opens to the bottom surface of the upper mold, and a vacuum pump for evacuating the sealing groove is arranged on the upper mold, and the sealing groove is connected to the vacuum pump.

[0006] Preferably, the sealing groove is located at the edge of the upper template.

[0007] Preferably, the sealing groove is annular and distributed on the upper template.

[0008] The beneficial effect of the utility model is that the mold for the production of mini-LED backlight adhesive adopts a molding method. The backlight board is first placed on the lower mold, and the backlight adhesive glue is squeezed arbitrarily to the middle of the backlight board. Then the upper and lower molds are closed and vacuum is drawn between the upper and lower molds to make the backlight adhesive, i.e., the protective adhesive, evenly distributed to each position of the backlight board. The thickness of the protective adhesive has good consistency and can solve the problem of glue bubbles. This method can control the thickness tolerance of the protective adhesive to about 20um, and the thickness consistency of the protective adhesive is greatly improved, thereby improving the lamp shadow and reducing the film material and reducing the cost. In addition, since the upper and lower molds can set the temperature according to the curing conditions of the glue, the process of re-curing the protective adhesive is reduced after the molding is completed, and the production process time can be controlled within 5 minutes, reducing the time cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0010] Figure 1 It is a structural schematic diagram of the mold used for mini-LED backlight surface adhesive production of the utility model. DETAILED DESCRIPTION

[0011] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0012] Embodiments of the utility model:

[0013] The utility model provides a mold for the production of mini-LED backlight adhesive. Figure 1 , including an upper mold 1 and a lower mold 2, the upper mold 1 is located above the lower mold 2, an upper mold plate 3 is provided at the bottom of the upper mold 1, a sealing groove 4 is provided on the upper mold plate 3, the sealing groove 4 opens at the bottom surface of the upper mold plate 3, a vacuum pump 5 for evacuating the sealing groove 4 is provided on the upper mold 1, and the sealing groove 4 is connected to the vacuum pump 5.

[0014] Preferably, the sealing groove 4 is located at the bottom edge of the upper template 3 .

[0015] Preferably, the sealing groove 4 is annular and distributed on the upper mold plate 3 .

[0016] When the mold for producing mini-LED backlight adhesive of the utility model is working, the mini-LED backlight board 6 is first placed on the lower mold 2, and the backlight adhesive, i.e., the protective adhesive glue 7, is squeezed into the middle of the backlight board 6. Then, the upper and lower molds are closed, and the vacuum pump 5 works to draw a vacuum in the sealing groove 4, and also draws a vacuum between the upper and lower molds at the same time, so that the protective adhesive glue 7 is evenly distributed to each position of the backlight board 6, and the problem of glue bubbles can also be solved. This method can control the thickness tolerance of the protective adhesive to about 20um, and the consistency of the thickness of the protective adhesive on the backlight board 6 is greatly improved, thereby improving the lamp shadow and reducing the film material and reducing the cost. In addition, since the upper and lower molds of the molding can set the temperature according to the curing conditions of the glue, the process of curing the protective adhesive again is reduced after the molding is completed, and the process time can be controlled within 5 minutes, thereby reducing the time cost.

[0017] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A mold for producing mini-LED backlight adhesive, comprising an upper mold and a lower mold, wherein the upper mold is located above the lower mold, and an upper mold plate is provided at the bottom of the upper mold, characterized in that: The upper mold plate is provided with a sealing groove, the sealing groove opens to the bottom surface of the upper mold plate, the upper mold is provided with a vacuum pump for evacuating the sealing groove, and the sealing groove is connected to the vacuum pump.

2. The mold for mini-LED backlight adhesive production according to claim 1, characterized in that: The sealing groove is located at the edge of the upper template.

3. The mold for producing mini-LED backlight adhesive according to claim 1, characterized in that: The sealing groove is annular and distributed on the upper template.

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