A single crystal silicon wafer production slicing device

Abstract

The utility model discloses a single crystal silicon wafer production and slicing device, which relates to the technical field of single crystal silicon wafer slicing, and comprises a workbench, wherein the upper surface of the workbench is fixedly connected with a fixing seat, the inner wall of the fixing seat is slidably connected with a single crystal silicon rod, a feeding port is provided on the upper surface of the workbench relative to one side of the fixing seat, a mounting plate is fixedly connected with the upper surface of the workbench relative to a side of the fixing seat away from the feeding port, an adjusting structure is installed on the long arm of the mounting plate, a hydraulic rod is fixedly connected with the short arm of the mounting plate, a cutting knife is fixedly connected with the output end of the hydraulic rod, a protective structure is provided on the upper surface of the workbench, and the protective structure comprises two U-shaped frames. This single crystal silicon wafer production and slicing device achieves the effect of protecting silicon wafers that fall after the single crystal silicon rod is sliced, and solves the problem that there is a certain height between the single crystal silicon rod and the feeding plate, which makes it easy to cause certain bumps and damages in the process of silicon wafers falling.

Description

Technical Field

[0001] The utility model relates to the technical field of single crystal silicon slice slicing, in particular to a single crystal silicon slice production slicing device. Background Art

[0002] Monocrystalline silicon wafers are single crystals of silicon with a basically complete lattice structure and different properties in different directions. They are often used as semiconductor materials to manufacture semiconductor devices, solar cells, etc. In the production process of monocrystalline silicon wafers, monocrystalline silicon rods need to be sliced ​​and then processed into monocrystalline silicon wafers. Therefore, single crystal silicon wafer slicing equipment is needed.

[0003] Prior art includes a utility model with announcement number CN219132808U, which discloses a single crystal silicon wafer slicing device, including a workbench and a single crystal silicon rod. A fixed seat is provided on the top of the workbench, a positioning plate is provided inside the fixed plate, a threaded rod is provided on the top of the positioning plate through a bearing, one end of the threaded rod passes through the top of the fixed plate and is connected to a rotating plate provided on the outside, a mounting plate is provided on the right side of the top of the workbench, a hydraulic rod is provided on the top of the mounting plate, a cutting knife is connected to one end of the hydraulic rod, and an adjustment mechanism is provided in the mounting plate, which solves the problem that it is inconvenient to adjust the thickness of the slices in the existing slicing devices.

[0004] The above-mentioned and existing related technologies often have the following defects: after the slice thickness of the single crystal silicon rod is adjusted through the adjustment structure, the hydraulic rod drives the cutter to slice, and the sliced ​​silicon wafers will fall onto the unloading plate through the unloading port. There is a certain height between the single crystal silicon rod and the unloading plate. Therefore, the silicon wafers will cause bumps and wear to a certain extent after falling, which will make it difficult to fully inject electrodes and other operations in the later stage, thereby increasing the slice breakage rate.

[0005] To this end, we propose a single crystal silicon wafer production slicing device. Utility Model Content

[0006] The utility model aims to provide a single crystal silicon wafer production slicing device to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a single crystal silicon wafer production slicing device, comprising a workbench, the upper surface of the workbench is fixedly connected to a fixed seat, the inner wall of the fixed seat is slidably connected to a single crystal silicon rod, a feed opening is provided on the upper surface of the workbench relative to one side of the fixed seat, a mounting plate is fixedly connected to the upper surface of the workbench relative to a side of the fixed seat away from the feed opening, an adjustment structure is installed on the long arm of the mounting plate, a hydraulic rod is fixedly connected to the short arm of the mounting plate, a cutter is fixedly connected to the output end of the hydraulic rod, a protective structure is provided on the upper surface of the workbench, and the protective structure The protective structure includes two U-shaped frames, the lower surfaces of the two U-shaped frames are fixedly connected to the workbench, the two U-shaped frames are located on both sides of the unloading port, the inner wall of the U-shaped frame is fixedly connected with an inner plate, the lower surface of the inner plate is fixedly connected with two elastic ropes, the lower surface of the U-shaped frame is fixedly connected with two long rods, the arc surfaces of the long rods are slidably connected with sliding sleeves, the four sliding sleeves are grouped in pairs, the arc surface of each group of the sliding sleeves is fixedly connected with a side plate, the lower surfaces of the two elastic ropes are fixedly connected to the side plates, the lower ends of the four long rods are fixedly connected with the unloading plate, and the arc surfaces of the four sliding sleeves are fixedly connected with protective cloths.

[0008] The effect achieved by the above components is: it achieves the effect of protecting the silicon wafers that fall after the single crystal silicon rod is sliced, thereby trying to avoid a certain height between the single crystal silicon rod and the blanking plate, which makes it easy for the silicon wafers to be bumped and damaged during the falling process.

[0009] Preferably, a plurality of leakage holes are evenly formed on the upper surface of the protective cloth, and an expansion hole is formed on the upper surface of the blanking plate at a position relative to the protective cloth.

[0010] The effect achieved by the above components is that during the cutting process, the debris falls from the leak holes and the expanded holes of the protective cloth, and the expanded holes serve to discharge the debris and prevent it from being retained on the surface of the protective cloth as much as possible.

[0011] Preferably, a buffer pad is fixedly connected to the upper surface of the blanking plate, and a baffle is fixedly connected to the upper surface of the protective cloth.

[0012] The effect achieved by the above components is that when the silicon wafer falls on the protective cloth and falls over, it contacts the baffle plate, and the baffle plate prevents the silicon wafer from falling over to the other side.

[0013] Preferably, the four long rods are arranged in groups of two, the long rods in each group have different lengths, and the inner wall size of the sliding sleeve is larger than the arc size of the long rods.

[0014] The effects achieved by the above components are: the sliding sleeve drives the protective cloth to slide and tilt from the arc surface of the long rod, and the long rods of different lengths and the sliding sleeve with a larger inner wall can play a role in tilting the protective cloth during the descent process.

[0015] Preferably, a collecting structure is provided on the lower surface of the workbench, and the collecting structure includes a connecting plate, the upper surface of the connecting plate is fixedly connected to the workbench, an insertion rod is fixedly connected to one side of the connecting plate, a card frame is slidably connected to the surface of the insertion rod, a collection box is fixedly connected to one side of the card frame, and the collection box is located below the expansion hole.

[0016] The effect achieved by the above components is: the debris discharged after cutting is collected. With the cooperation of various components, the discharged debris can be well collected in a centralized manner, so that personnel can quickly handle the debris.

[0017] Preferably, the insertion rod is a rectangular rod, and one side of the card frame is in contact with the connecting plate.

[0018] The effect achieved by the above components is that the card frame slides from the surface of the plug rod and fits into the connecting plate, and the connecting plate plays a role in positioning the moving position of the card frame.

[0019] Preferably, a rotating frame is fixedly connected to the upper surface of the collection box, a cover plate is rotatably connected to the surface of the rotating frame, and the upper surface of the cover plate abuts against the collection box.

[0020] The effect achieved by the above components is: the cover plate is rotated to fit with the collection box, and the cover plate covers the collection box to prevent debris from falling during the movement.

[0021] Preferably, a limiting rod is fixedly connected to one side of the collection box close to the card frame, and an upper surface of the limiting rod abuts against the cover plate.

[0022] The effect achieved by the above components is that the rotating cover plate fits into the limiting rod, and the limiting rod serves to limit the rotation angle of the cover plate to facilitate the guiding of side debris.

[0023] Compared with the prior art, the beneficial effects of the utility model are:

[0024] The utility model achieves the effect of protecting the silicon wafers that fall after the single crystal silicon rod is sliced ​​by arranging a protective structure. The protective cloth and the elastic rope buffer the silicon wafers, so that the falling speed of the silicon wafers after cutting is reduced, so that the contact between the silicon wafers and the blanking plate is smoother, thereby effectively improving the integrity rate of the silicon wafers after the single crystal silicon rod is cut, and the debris in the cutting process can be discharged, effectively improving the cleanliness of the silicon wafers themselves.

[0025] The utility model achieves the effect of collecting the debris discharged after cutting by arranging the collection structure. With the help of the cooperation of various components, the discharged debris can be well collected in a centralized manner, so that personnel can quickly process the debris. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0027] Figure 2 For this utility model Figure 1 Schematic diagram of the local structure;

[0028] Figure 3 This is a schematic diagram of the structure of the protective cloth of the utility model;

[0029] Figure 4 It is a schematic diagram of the lower partial structure of the utility model;

[0030] Figure 5 For this utility model Figure 4 Schematic diagram of the local structure.

[0031] In the figure: 1. workbench; 2. fixed seat; 3. single crystal silicon rod; 4. mounting plate; 5. unloading port; 6. hydraulic rod; 7. cutter; 8. protective structure; 801. U-shaped frame; 802. inner plate; 803. elastic rope; 804. long rod; 805. sliding sleeve; 806. side plate; 807. unloading plate; 808. protective cloth; 809. leakage hole; 810. expansion hole; 811. buffer pad; 812. baffle; 9. collection structure; 91. connecting plate; 92. plug rod; 93. card frame; 94. collection box; 95. rotating frame; 96. cover plate; 97. limit rod; 10. adjustment structure. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] See also Figure 1The utility model provides a technical solution: a single crystal silicon wafer production slicing device, comprising a workbench 1, a fixed seat 2 is fixedly connected to the upper surface of the workbench 1, a single crystal silicon rod 3 is slidably connected to the inner wall of the fixed seat 2, a feeding port 5 is opened on the upper surface of the workbench 1 relative to one side of the fixed seat 2, a mounting plate 4 is fixedly connected to the upper surface of the workbench 1 relative to the feeding port 5 away from the fixed seat 2, an adjustment structure 10 is installed on the long arm of the mounting plate 4, a hydraulic rod 6 is fixedly connected to the short arm of the mounting plate 4, and a cutter 7 is fixedly connected to the output end of the hydraulic rod 6, a protective structure 8 is provided on the upper surface of the workbench 1, so as to achieve the effect of protecting the silicon wafers dropped after the single crystal silicon rod 3 is sliced, so as to avoid the single crystal silicon rod 3 having a certain height during the feeding process, so that the silicon wafers are easily damaged during the falling process, and a collecting structure 9 is provided on the lower surface of the workbench 1, so as to achieve the effect of collecting the debris after cutting and discharging, and with the cooperation of various components, the discharged debris can be well collected in a centralized manner, so as to facilitate personnel to quickly handle the debris.

[0034] The specific settings and functions of the protection structure 8 and the collection structure 9 are described in detail below.

[0035] like Figure 2 and Figure 3 As shown, the protective structure 8 includes two U-shaped frames 801, the lower surfaces of the two U-shaped frames 801 are fixedly connected to the workbench 1, the two U-shaped frames 801 are located on both sides of the unloading port 5, the inner wall of the U-shaped frame 801 is fixedly connected with an inner plate 802, the lower surface of the inner plate 802 is fixedly connected with two elastic ropes 803, the lower surface of the U-shaped frame 801 is fixedly connected with two long rods 804, the arc surface of the long rod 804 is slidably connected with a sliding sleeve 805, the four sliding sleeves 805 are grouped in pairs, and the arc surface of each group of sliding sleeves 805 is fixedly connected with a side plate 806. The lower surfaces of the two elastic ropes 803 are fixedly connected to the side plates 806, the lower ends of the four long rods 804 are fixedly connected to the blanking plates 807, the arc surfaces of the four sliding sleeves 805 are fixedly connected to the protective cloth 808, a number of leakage holes 809 are evenly opened on the upper surface of the protective cloth 808, and an expansion hole 810 is opened on the upper surface of the blanking plate 807 relative to the protective cloth 808. During the cutting process, debris falls from the leakage holes 809 and the expansion hole 810 of the protective cloth 808, and the expansion hole 810 serves to discharge the debris and prevent it from being retained on the surface of the protective cloth 808 as much as possible.

[0036] A buffer pad 811 is fixedly connected to the upper surface of the unloading plate 807, and a baffle 812 is fixedly connected to the upper surface of the protective cloth 808. When the silicon wafer falls on the protective cloth 808 and tips over, it contacts the baffle 812. The baffle 812 prevents the silicon wafer from tipping over to the other side. The four long rods 804 are grouped in pairs, and each group of long rods 804 has different lengths. The inner wall size of the sliding sleeve 805 is larger than the arc size of the long rod 804. The sliding sleeve 805 drives the protective cloth 808 to slide and tilt from the arc surface of the long rod 804. The long rods 804 of different lengths and the sliding sleeve 805 with a larger inner wall can be used to tilt the protective cloth 808 during the descent process.

[0037] like Figure 4 and Figure 5 As shown, the collecting structure 9 includes a connecting plate 91, the upper surface of which is fixedly connected to the workbench 1, a plug rod 92 is fixedly connected to one side of the connecting plate 91, a card frame 93 is slidably connected to the surface of the plug rod 92, a collecting box 94 is fixedly connected to one side of the card frame 93, and the collecting box 94 is located below the expansion hole 810, the plug rod 92 is a rectangular rod, one side of the card frame 93 is in contact with the connecting plate 91, and the card frame 93 slides from the surface of the plug rod 92 and fits with the connecting plate 91, and the connecting plate 91 is used to position the moving position of the card frame 93.

[0038] The upper surface of the collecting box 94 is fixedly connected to a rotating frame 95, and the surface of the rotating frame 95 is rotatably connected to a cover plate 96, the upper surface of the cover plate 96 abuts against the collecting box 94, and the rotating cover plate 96 fits against the collecting box 94, and the cover plate 96 achieves the effect of covering the collecting box 94 to prevent debris from falling during movement. The side of the collecting box 94 close to the card frame 93 is fixedly connected to a limiting rod 97, the upper surface of the limiting rod 97 abuts against the cover plate 96, and the rotating cover plate 96 fits against the limiting rod 97, and the limiting rod 97 serves to limit the rotation angle of the cover plate 96 to facilitate the guiding of side debris.

[0039] Working principle: when the single crystal silicon rod 3 needs to be sliced, first place the single crystal silicon rod 3 in the fixed seat 2, then move the single crystal silicon rod 3 to one side of the adjustment structure 10 to fit, and adjust the adjustment structure 10 to limit the cutting thickness between the cutter 7 and the single crystal silicon rod 3, and then the hydraulic rod 6 drives the cutter 7 to cut the single crystal silicon rod 3. After cutting, the silicon wafer falls on the upper surface of the protective cloth 808 through the discharge port 5. At this time, the protective cloth 808 is bent due to the falling of the silicon wafer, and the silicon wafer will fall to one side due to the bent protective cloth 808, and then fit with the baffle 812, and the baffle 812 can prevent the silicon wafer from falling to the other side. In this process, the protective cloth 808 will drive the sliding sleeve 805 to descend, and the sliding sleeve 805 drives the side plate 806 to slide from the arc surface of the long rod 804. At this time, the elastic rope 803 The side plate 806 is lowered and is in a stretched state until the sleeve 805 drops to a certain distance. Then, the sleeve 805 is tilted by long rods 804 of different lengths, so that the silicon wafer on the protective cloth 808 is tilted toward the side of the buffer pad 811. At this time, the silicon wafer falls on the surface of the buffer pad 811. With the support of the protective cloth 808 and sliding on the surface of the buffer pad 811, the speed of the slice is reduced when it falls, which avoids the slice from being damaged by collision and improves the integrity of the single crystal silicon wafer. Finally, it slides to the next workstation through the buffer pad 811 of the unloading plate 807, and the debris in the cutting process will fall from the leak hole 809 of the protective cloth 808. The expansion hole 810 serves to discharge the debris and prevent it from being retained on the surface of the protective cloth 808 as much as possible, and then falls into the collection box 94 through the expansion hole 810.

[0040] The cover 96 is then slid into the collection box 94 through the cover plate 96 to cover the collection box 94 and prevent the debris from falling during the movement.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A single crystal silicon wafer production slicing device, comprising a workbench (1), characterized in that: The upper surface of the workbench (1) is fixedly connected to a fixing seat (2), and a single crystal silicon rod (3) is slidably connected to the inner wall of the fixing seat (2). A feeding port (5) is provided on the upper surface of the workbench (1) at a position on one side of the fixing seat (2). A mounting plate (4) is fixedly connected to the upper surface of the workbench (1) at a position on the side of the fixing seat (2) away from the feeding port (5). An adjustment structure (10) is installed on the long arm of the mounting plate (4), and a hydraulic rod (6) is fixedly connected to the short arm of the mounting plate (4). A cutter (7) is fixedly connected to the output end of the hydraulic rod (6). A protective structure (8) is provided on the upper surface of the workbench (1), and the protective structure (8) comprises two U-shaped frames (801), and the lower surfaces of the two U-shaped frames (801) are fixedly connected to the workbench (1). The two U-shaped frames (801) are located on both sides of the material discharge port (5); the inner wall of the U-shaped frame (801) is fixedly connected to an inner plate (802); the lower surface of the inner plate (802) is fixedly connected to two elastic ropes (803); the lower surface of the U-shaped frame (801) is fixedly connected to two long rods (804); the arc surfaces of the long rods (804) are slidably connected to sliding sleeves (805); the four sliding sleeves (805) are arranged in groups of two; the arc surfaces of each group of sliding sleeves (805) are fixedly connected to side plates (806); the lower surfaces of the two elastic ropes (803) are fixedly connected to the side plates (806); the lower ends of the four long rods (804) are fixedly connected to a material discharge plate (807); and the arc surfaces of the four sliding sleeves (805) are fixedly connected to protective cloths (808).

2. The single crystal silicon wafer production slicing device according to claim 1, characterized in that: A plurality of leak holes (809) are evenly formed on the upper surface of the protective cloth (808), and an expansion hole (810) is formed on the upper surface of the blanking plate (807) at a position relative to the protective cloth (808).

3. The single crystal silicon wafer production slicing device according to claim 1, characterized in that: A buffer pad (811) is fixedly connected to the upper surface of the blanking plate (807), and a baffle (812) is fixedly connected to the upper surface of the protective cloth (808).

4. The single crystal silicon wafer production slicing device according to claim 1, characterized in that: The four long rods (804) are arranged in groups of two, and the long rods (804) in each group have different lengths. The inner wall size of the sliding sleeve (805) is larger than the arc size of the long rods (804).

5. The single crystal silicon wafer production slicing device according to claim 1, characterized in that: A collecting structure (9) is provided on the lower surface of the workbench (1), the collecting structure (9) comprising a connecting plate (91), the upper surface of the connecting plate (91) being fixedly connected to the workbench (1), an insertion rod (92) being fixedly connected to one side of the connecting plate (91), a card frame (93) being slidably connected to the surface of the insertion rod (92), a collecting box (94) being fixedly connected to one side of the card frame (93), and the collecting box (94) being located below the expansion hole (810).

6. The single crystal silicon wafer production slicing device according to claim 5, characterized in that: The insert rod (92) is a rectangular rod, and one side of the clamping frame (93) is in contact with the connecting plate (91).

7. The single crystal silicon wafer production slicing device according to claim 5, characterized in that: The upper surface of the collection box (94) is fixedly connected to a rotating frame (95), the surface of the rotating frame (95) is rotatably connected to a cover plate (96), and the upper surface of the cover plate (96) is in contact with the collection box (94).

8. The single crystal silicon wafer production slicing device according to claim 7, characterized in that: A side of the collection box (94) close to the card frame (93) is fixedly connected to a limiting rod (97), and an upper surface of the limiting rod (97) is in contact with the cover plate (96).

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