A new type of silicon carbide carrier

Abstract

The utility model relates to the technical field of carriers, and discloses a novel silicon carbide carrier, comprising a silicon carbide carrier body, a positioning hole is reserved on the top surface of the silicon carbide carrier body, a screw is passed through the bottom thread of the silicon carbide carrier body, the end of the screw passes through the inside of the positioning hole, an isolation component is arranged on the surface of the silicon carbide carrier body, the isolation component and the positioning hole are connected to each other, the isolation component and the screw are connected to each other, external protrusions are arranged at the corners of the silicon carbide carrier body, the external protrusions are symmetrically distributed about the longitudinal center axis of the silicon carbide carrier body, two positioning holes are arranged, and the utility model cooperates with the silicon carbide carrier body and the positioning hole so that the parts can be disassembled and assembled when the device is in use, thereby forming interval areas of different sizes, thereby meeting the processing requirements of semiconductors of different sizes, thereby solving the problem that the fixed design of the existing device cannot meet the processing requirements of semiconductors of different sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of carrier discs, in particular to a novel silicon carbide carrier disc. Background Art

[0002] Silicon carbide carrier is an industrial equipment container that can be used for semiconductor processing. Compared with other materials, silicon carbide carrier has better thermal conductivity, corrosion resistance and higher mechanical strength. Therefore, silicon carbide carrier is becoming more and more popular.

[0003] In a Chinese patent with authorization announcement number CN214477362U, a new type of silicon carbide carrier is disclosed. The device has a simple structure and is easy to use. By adding outwardly protruding arc portions at the four corners of the sheet body, the number of slots on the disk body is increased, the capacity is increased, and the production capacity of the equipment is increased without changing the cavity of the production instrument, thereby improving production efficiency and the use effect of the silicon carbide carrier.

[0004] However, in actual use, manufacturers will encounter processing requirements of different sizes when processing semiconductors. Therefore, the size of the silicon carbide carrier should also be changed. However, the silicon carbide carrier of the existing device is a fixed style, so it cannot be used when facing processing requirements of different sizes. For this reason, a new type of silicon carbide carrier is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide a novel silicon carbide carrier to solve the problem raised in the above background technology that in the actual use process, when manufacturers process semiconductors, they will encounter processing requirements of different sizes. Therefore, the size of the silicon carbide carrier should also be changed accordingly. However, the silicon carbide carrier of the existing device is a fixed style, so it cannot be used when facing processing requirements of different sizes.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a new type of silicon carbide carrier, including a silicon carbide carrier body, a positioning hole is reserved on the top surface of the silicon carbide carrier body, a screw is passed through the bottom thread of the silicon carbide carrier body, the end of the screw passes through the interior of the positioning hole, an isolation component is arranged on the surface of the silicon carbide carrier body, the isolation component is interconnected with the positioning hole, and the isolation component is interconnected with the screw.

[0007] Preferably, outer protrusions are provided at the corners of the silicon carbide carrier body, and the outer protrusions are symmetrically distributed about the longitudinal center axis of the silicon carbide carrier body.

[0008] Preferably, two of the above-mentioned positioning holes are provided, and the two positioning holes are symmetrically distributed about the longitudinal center axis of the silicon carbide carrier body.

[0009] Preferably, the isolation assembly comprises a partition and a positioning rod, the top surface of the silicon carbide carrier body is attached with a partition, the bottom of the partition is fixed with a positioning rod, the positioning rod is inserted into the positioning hole, and the positioning rod is connected to the screw.

[0010] Preferably, a placement groove is provided on the surface of the partition, and the placement groove separates the partition into five placement areas.

[0011] Preferably, two of the above-mentioned positioning rods are provided, and the two positioning rods are symmetrically distributed about the transverse center axis of the partition.

[0012] Preferably, a threaded hole is provided on the surface of the positioning rod, and the screw is threadedly connected to the positioning rod through the threaded hole.

[0013] Compared with the prior art, the utility model adopts the above technical solution and has the following technical effects:

[0014] 1. The utility model uses the mutual cooperation between the silicon carbide carrier body and the positioning holes to enable the parts to be disassembled and assembled when the device is in use, thereby forming spacing areas of different sizes to meet the processing requirements of semiconductors of different sizes, thereby solving the problem that the fixed design of the existing device cannot meet the processing requirements of semiconductors of different sizes.

[0015] 2. The utility model uses the screws and the isolation components to cooperate with each other, so that during the use of the device, the isolation components can be used to increase the number of semiconductors processed in a single time, thereby greatly improving the processing efficiency of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the structure of the utility model from a first perspective;

[0018] Figure 2 This is a schematic diagram of the structure of the utility model from a second viewing angle;

[0019] Figure 3 It is a schematic diagram of the three-dimensional structure of the isolation component of the utility model;

[0020] Figure 4 This is a schematic diagram of the top view structure of the positioning hole of the utility model;

[0021] Figure 5 It is a schematic diagram of the three-dimensional structure of the positioning rod of the utility model.

[0022] Explanation of the reference numerals: 1. silicon carbide carrier body; 2. positioning hole; 3. screw; 4. isolation assembly; 401. partition; 402. positioning rod. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0025] Example

[0026] In the Chinese patent with authorization announcement number CN214477362U, in actual use, when manufacturers process semiconductors, they will encounter processing requirements of different sizes. Therefore, the size of the silicon carbide carrier should also be changed. However, the silicon carbide carrier of the existing device is a fixed style, so it cannot be used when facing processing requirements of different sizes.

[0027] See also Figure 1-5The utility model provides a technical solution: a new type of silicon carbide carrier, including a silicon carbide carrier body 1, a positioning hole 2 is reserved on the top surface of the silicon carbide carrier body 1, a screw 3 is passed through the bottom thread of the silicon carbide carrier body 1, and the end of the screw 3 passes through the interior of the positioning hole 2, and an isolation component 4 is arranged on the surface of the silicon carbide carrier body 1, and the isolation component 4 is connected to the positioning hole 2, and the isolation component 4 is connected to the screw 3. In order to increase the total number of semiconductors processed by the device at a single time and improve the processing efficiency, external protrusions are arranged at the corners of the silicon carbide carrier body 1, and the external protrusions are symmetrically distributed about the longitudinal center axis of the silicon carbide carrier body 1. In order to quickly place the new partition 401 on the surface of the silicon carbide carrier body 1 when replacing the partition 401 and shorten the installation time, two positioning holes 2 are arranged, and the two positioning holes 2 are symmetrically distributed about the longitudinal center axis of the silicon carbide carrier body 1.

[0028] In order to enable the device to meet the processing requirements of semiconductors of different sizes, an isolation component 4 is provided, and the isolation component 4 includes a partition 401 and a positioning rod 402. The top surface of the silicon carbide carrier body 1 is attached with the partition 401, and the bottom of the partition 401 is fixed with a positioning rod 402, and the positioning rod 402 is inserted into the inside of the positioning hole 2. The positioning rod 402 is connected to the screw 3. In order to increase the total number of semiconductors processed by the device at a single time and improve the processing efficiency, a placement groove is provided on the surface of the partition 401. In order to facilitate the removal of the completely processed semiconductors, a groove is provided on the surface of the partition 401. The placement groove isolates the partition 401 into five placement areas. Two positioning rods 402 are provided, and the two positioning rods 402 are symmetrically distributed about the transverse center axis of the partition 401. In order to enhance the stability of the partition 401 and prevent it from shaking and deviating after installation, thereby affecting the processing accuracy of the semiconductor, a threaded hole is provided on the surface of the positioning rod 402, and the screw 3 is threadedly connected to the positioning rod 402 through the threaded hole.

[0029] Working principle or structural principle, when using the device to process semiconductors, the staff can place five semiconductors at a time in the placement groove formed by the partition 401 and the silicon carbide carrier body 1, so that the device can process multiple semiconductors during processing, greatly improving the processing efficiency. After the processing is completed, the semiconductor can be taken out by using the groove, which improves the speed of taking out. If the size of the processed semiconductor changes, the staff needs to disassemble and replace the partition 401 so that the new placement groove fits the semiconductor better. When replacing, the staff can use professional tools Rotate the screw 3 to disengage the threaded connection with the positioning rod 402. After that, the positioning rod 402 and the partition 401 can be removed from the surface of the silicon carbide carrier body 1. Then, take out the new partition 401 and insert the positioning rod 402 on its surface into the inside of the positioning hole 2. Finally, rotate the screw 3 again to connect it with the new positioning rod 402, so as to lock and limit the new partition 401 to ensure its own stability, thereby improving the accuracy of semiconductor processing. After completing the replacement operation of the partition 401, the staff can use the device to process semiconductors of different sizes.

[0030] In summary, the device has the advantages of high processing efficiency and wide application range.

[0031] Those skilled in the art will appreciate that the features described in the various embodiments and / or claims of the present invention may be combined and / or combined in various ways, even if such combinations and / or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments and / or claims of the present invention may be combined and / or combined in various ways without departing from the spirit and teachings of the present invention. All of these combinations and / or combinations fall within the scope of the present invention.

Claims

1. A novel silicon carbide carrier, comprising a silicon carbide carrier body (1), characterized in that: A positioning hole (2) is reserved on the top surface of the silicon carbide carrier body (1), a screw (3) is passed through the bottom thread of the silicon carbide carrier body (1), and the end of the screw (3) passes through the interior of the positioning hole (2). An isolation component (4) is arranged on the surface of the silicon carbide carrier body (1), and the isolation component (4) is connected to the positioning hole (2), and the isolation component (4) is connected to the screw (3).

2. A novel silicon carbide carrier according to claim 1, characterized in that: External protrusions are provided at the corners of the silicon carbide carrier body (1), and the external protrusions are symmetrically distributed about the longitudinal center axis of the silicon carbide carrier body (1).

3. A novel silicon carbide carrier according to claim 1, characterized in that: Two positioning holes (2) are provided, and the two positioning holes (2) are symmetrically distributed about the longitudinal center axis of the silicon carbide carrier body (1).

4. The novel silicon carbide carrier according to claim 1, characterized in that: The isolation assembly (4) comprises a partition (401) and a positioning rod (402); the partition (401) is attached to the top surface of the silicon carbide carrier body (1); the positioning rod (402) is fixed to the bottom of the partition (401); the positioning rod (402) is inserted into the interior of the positioning hole (2); and the positioning rod (402) is connected to the screw (3).

5. A novel silicon carbide carrier according to claim 4, characterized in that: The surface of the partition (401) is provided with a placement groove, and the placement groove separates the partition (401) into five placement areas.

6. A novel silicon carbide carrier according to claim 4, characterized in that: Two positioning rods (402) are provided, and the two positioning rods (402) are symmetrically distributed about the transverse center axis of the partition (401).

7. A novel silicon carbide carrier according to claim 4, characterized in that: A threaded hole is provided on the surface of the positioning rod (402), and the screw (3) is threadedly connected to the positioning rod (402) through the threaded hole.

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