High-precision automatic positioning type wafer brushing machine

Abstract

The utility model discloses a high-precision automatic positioning type wafer brushing machine, relates to the technical field of wafer brushing, and solves the problems of complicated operation and unstable cleaning effect in the prior art. A high-precision automatic positioning type wafer brushing machine comprises a base, a bottom plate is connected to the base, a shell is connected to the bottom plate, a brushing device is fixedly connected into the shell and comprises a connecting frame and a sliding plate, and a driving motor drives a lead screw to drive the sliding plate to longitudinally slide on the connecting frame; the lower end of the sliding plate is connected with a mounting seat, and a plurality of brush heads are uniformly mounted at the lower end of the mounting seat; two fluid nozzles are correspondingly arranged on one side of each brush head; a positioning plate is connected to the base, and a positioning groove is formed in the position, corresponding to the brush head, of the positioning plate. The device has the beneficial effects that pollutants on the surface of the crystal can be quickly and effectively removed, and the cleanliness of the surface of the crystal is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer brushing, in particular to a high-precision automatic positioning wafer brushing machine. Background Art

[0002] During the production, transportation and storage of crystals, they will be affected by various pollutants such as dust, particles, chemical residues, etc. The pollutants on the surface of the crystals not only affect the appearance of the crystals, but also have a negative impact on their performance.

[0003] The current structure of the wafer brushing machine is generally as described in an automatic wafer brushing machine disclosed in patent application number "CN202010804440.8", including a frame, a workbench on the frame, a material rack on the workbench, a number of flower basket placement positions on the material rack, and a wafer positioning mechanism in the middle of the material rack; a robotic arm is also installed on the workbench, and a wafer support plate is installed on the execution end of the robotic arm; wafer brushing boxes are respectively provided on both sides of the robotic arm, and a wafer taking and placing port is opened on one side of the wafer brushing box; a vacuum tube driven by a first drive device and a second drive device is provided under the workbench, and a Bernoulli suction cup is installed on the top of the vacuum tube, and an upper mounting plate driven by a third drive device and a fourth drive device is provided on the workbench, and a sponge brush head driven by a fifth drive device is rotatably installed on one end of the upper mounting plate located in the wafer brushing box.

[0004] However, the existing chip size is getting smaller and smaller, and the integration is getting higher and higher, which also puts forward higher requirements on the accuracy and automation of the brushing process. This utility model has the problems of cumbersome operation and unstable cleaning effect, which makes it difficult to meet the high efficiency and high precision requirements of modern semiconductor manufacturing.

[0005] Therefore, the utility model proposes a high-precision automatic positioning wafer brushing machine to solve the above problems. Utility Model Content

[0006] The utility model aims to provide a high-precision automatic positioning wafer brushing machine, which is used to solve the problems of complicated operation and unstable cleaning effect existing in the prior art.

[0007] The technical solution adopted by the utility model to solve its technical problems is:

[0008] A high-precision automatic positioning wafer brushing machine, comprising a base, a bottom plate connected to the base, a shell connected to the bottom plate, a brushing device fixedly connected in the shell, the brushing device comprising a connecting frame and a sliding plate, the connecting frame is fixedly connected to the shell, the sliding plate slides longitudinally on the connecting frame, a screw rod is rotatably connected to the sliding plate, the screw rod is threadedly connected to the connecting frame, a driving motor drives the screw rod to rotate, and the driving motor is fixedly connected to the shell; the lower end of the sliding plate is connected to a mounting seat, the lower end of the mounting seat A plurality of brush heads are evenly mounted, and a driving mechanism arranged in the mounting seat drives the brush heads to rotate; a two-fluid nozzle is correspondingly arranged on one side of the brush head, and the two-fluid nozzle is mounted on the lower end of the mounting seat; a positioning plate is connected to the bottom plate, a positioning groove is provided on the positioning plate corresponding to the brush head, a group of picking grooves are symmetrically provided on the surrounding side of the positioning groove, a groove is provided on the bottom plate corresponding to the surrounding side of the positioning plate, a plurality of material discharge grooves are evenly arranged in the groove, a material receiving box is correspondingly arranged at the lower end of the material discharge groove, and the material receiving box is slidably connected in the base.

[0009] By adopting the above technical solution, a strong cleaning force can be generated through the high-speed rotating brush head, and the water vapor dual fluid can further improve the cleaning effect while avoiding damage to the chip surface. It can not only remove large particles of impurities on the chip surface, but also effectively control the number of tiny particles above 0.3um to within 50, thereby ensuring the cleanliness and quality of the chip surface.

[0010] Furthermore, the taking groove passes through the positioning plate.

[0011] By adopting the above technical solution, the chip can be easily taken and placed through the picking groove, which improves the convenience of picking up. At the same time, the liquid in the water vapor two fluids can fall into the receiving box through the picking groove, avoiding the accumulation of liquid in the water vapor two fluids in the positioning groove.

[0012] Furthermore, the positioning plate is rotatably connected to the base plate, a clamping block is rotatably connected to the base plate, and the positioning plate is evenly provided with a plurality of clamping grooves corresponding to the clamping blocks.

[0013] By adopting the above technical solution, it is convenient to place and position the chip, the operation is simple, and the difficulty of manual operation is reduced. After the installation of the chip is completed, the clamping block is rotated to fit with the clamping groove, and then the position of the positioning plate is fixed, ensuring the accuracy and stability during the chip brushing process.

[0014] Furthermore, the positioning plate is rotatably connected to the base plate via a rotating shaft, and a nut is threadedly connected to the bottom of the rotating shaft.

[0015] By adopting the above technical solution, the positioning plate can be disassembled by means of nuts, and then the positioning plate can be replaced according to different wafer sizes, thereby increasing the adaptability of the machine.

[0016] Furthermore, the side walls of the shell are each provided with a revolving door, and the revolving door is made of organic glass.

[0017] By adopting the above technical solution, the working status can be checked at any time through the rotating door, ensuring the smooth progress of the overall work.

[0018] Furthermore, the mounting seat is detachably connected to the sliding plate via a connecting assembly.

[0019] By adopting the above technical solution, the mounting seat can be replaced at any time, which reduces the time for machine repair and maintenance and improves work efficiency.

[0020] Furthermore, a plurality of level-adjustable casters are evenly connected to the bottom of the base.

[0021] By adopting the above technical solution, the base of the film brushing machine can be fine-tuned to adapt to different working environments, ensuring that the film brushing machine is in a horizontal state, and at the same time ensuring that the film brushing machine can be moved at any time.

[0022] In summary, compared with the prior art, the utility model has the following beneficial effects:

[0023] 1. The utility model generates a strong cleaning force through the high-speed rotating brush head, and the water vapor two-fluid can further improve the cleaning effect, while avoiding damage to the wafer surface. It can not only remove large particle impurities on the wafer surface, but also effectively control the number of tiny particles above 0.3um to within 50, thereby ensuring the cleanliness and quality of the wafer surface. It can effectively remove pollutants on the crystal surface to ensure its surface cleanliness, and can also remove tiny scratches, flaws and oxide layers on the crystal surface, making the surface smoother and flatter, thereby improving the light transmittance, reflectivity and other properties of the crystal, ensuring that the crystal surface meets the requirements of subsequent processes, and improving the stability and reliability of the overall process.

[0024] 2. The utility model can generate flow through the interaction between bubbles and droplets in the liquid of the water vapor two fluids, so as to achieve a better cleaning effect. First, the bubbles are injected into the surface of the object to be cleaned by pressurization, and the bubbles and the dirt surface produce back-and-forth collision and continuous compression, thereby cleaning the dirt on the crystal surface. At the same time, the droplets injected into the surface of the object to be cleaned at high speed quickly penetrate into the dirt to achieve the effect of wetting and cleaning.

[0025] 3. The utility model can control the up and down speed of the brush head through the screw rod, ensuring the accuracy and stability during the brushing process and effectively removing impurities and pollutants on the surface of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a vertical schematic diagram of the utility model;

[0027] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0028] Figure 3 A partial cross-section diagram of the utility model Figure 1 ;

[0029] Figure 4 A partial cross-section diagram of the utility model Figure 2 ;

[0030] In the figure: 1. base; 2. bottom plate; 3. shell; 4. connecting frame; 5. sliding plate; 6. connecting assembly; 7. horizontal adjustment caster; 8. screw rod; 9. driving motor; 10. mounting seat; 11. brush head; 12. two-fluid nozzle; 13. positioning plate; 14. positioning groove; 15. picking groove; 16. groove; 17. material discharge trough; 18. material receiving box; 19. clamping block; 20. clamping groove; 21. rotating shaft; 22. nut; 23. rotating door. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] In this application, the directions or positional relationships indicated by the terms "upper", "inner", "outer", "middle", etc. are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0033] like Figure 1As shown, a high-precision automatic positioning wafer brushing machine includes a base 1, and a plurality of horizontal adjustment casters 7 are evenly connected to the bottom of the base 1. The base 1 of the wafer brushing machine can be fine-tuned to adapt to different working environments, ensure that the wafer brushing machine is in a horizontal state, and ensure that the wafer brushing machine can move at any time. The base 1 is connected to a bottom plate 2, and the bottom plate 2 is connected to a shell 3. The side walls of the shell 3 are provided with a rotating door 23, and the rotating door 23 is made of organic glass. The shell 3 can play an isolating role during operation, ensure the airtightness of the work, and ensure the cleanliness of the working environment. The wafer can be taken and placed through the rotating door 23, and the working status can be checked at any time through the rotating door 23 when the machine is working, ensuring the smooth progress of the overall work.

[0034] like Figure 2 and Figure 3 As shown, a brush device is fixedly connected in the housing 3, and the brush device includes a connecting frame 4 and a sliding plate 5. The connecting frame 4 is fixedly connected to the housing 3, and the sliding plate 5 slides longitudinally on the connecting frame 4. A screw rod 8 is rotatably connected to the sliding plate 5, and the screw rod 8 is threadedly connected to the connecting frame 4. A driving motor 9 drives the screw rod 8 to rotate, and the driving motor 9 is fixedly connected to the housing 3; a mounting seat 10 is connected to the lower end of the sliding plate 5, and a plurality of brush heads 11 are evenly installed at the lower end of the mounting seat 10. The driving mechanism set in the mounting seat 10 drives the brush head 11 to rotate; then the driving motor 9 drives the screw rod 8 to rotate, and the screw rod 8 drives the sliding plate 5 to slide longitudinally on the connecting frame 4, and the sliding plate 5 drives the mounting seat 10 to slide, and the driving mechanism set in the mounting seat 10 drives the brush head 11 to rotate, and the high-speed rotating brush head 11 generates a strong cleaning force, wherein the screw rod 8 can control the up and down speed of the brush head 11, thereby ensuring the accuracy and stability in the brushing process, and effectively removing impurities and pollutants on the surface of the wafer. The mounting seat 10 is detachably connected to the sliding plate 5 through the connecting component 6. The mounting seat 10 can be replaced at any time, which reduces the time for machine repair and maintenance and improves work efficiency.

[0035] A two-fluid nozzle 12 is provided on one side of the brush head 11, and the two-fluid nozzle 12 is installed at the lower end of the mounting seat 10; the bubbles and droplets in the liquid in the water vapor two-fluid can interact with each other, thereby generating flow, so that the cleaning effect is better. First, the bubbles are injected into the surface of the object to be cleaned by pressurization, and the bubbles and the dirt surface produce back and forth collisions and continuous compression, thereby cleaning the dirt on the surface of the crystal. At the same time, the droplets injected into the surface of the object to be cleaned at high speed quickly penetrate into the dirt to achieve the effect of wet cleaning. A positioning plate 13 is connected to the bottom plate 2, and a positioning groove 14 is provided on the positioning plate 13 corresponding to the brush head 11. A group of picking grooves 15 are symmetrically provided around the positioning groove 14, and the picking grooves 15 penetrate the positioning plate 13. In addition, the picking grooves 15 can be used to facilitate the placement of the wafer, which improves the convenience of picking up. At the same time, the liquid in the water vapor two-fluid can fall into the receiving box 18 through the picking grooves 15, avoiding the accumulation of the liquid in the water vapor two-fluid in the positioning grooves 14.

[0036] The bottom plate 2 is provided with a groove 16 on the peripheral side corresponding to the positioning plate 13, and a plurality of feed troughs 17 are evenly provided in the groove 16. A receiving box 18 is provided at the lower end of the feed trough 17, and the receiving box 18 is slidably connected in the base 1. Then, the liquid in the water vapor and the two fluids first falls into the groove 16, and then falls into the receiving box 18 through the feed trough 17, so as to avoid the overflow of the liquid in the water vapor and the two fluids and ensure the cleanliness of the working environment.

[0037] like Figure 3 and Figure 4 As shown, the positioning plate 13 is rotatably connected to the base plate 2, and a clamping block 19 is rotatably connected to the base plate 2. The positioning plate 13 is evenly provided with a plurality of clamping grooves 20 corresponding to the clamping block 19. The wafer is placed and positioned by rotating the positioning plate 13, which is easy to operate and reduces the difficulty of manual operation. After the wafer is installed, the clamping block 19 is rotated to fit with the clamping groove 20, thereby fixing the position of the positioning plate 13, ensuring the accuracy and stability during the wafer brushing process. The positioning plate 13 is rotatably connected to the base plate 2 by a rotating shaft 21, and a nut 22 is threadedly connected to the bottom of the rotating shaft 21. The positioning plate 13 can then be disassembled by the nut 22, and then the positioning plate 13 can be replaced according to the different wafer sizes, thereby increasing the adaptability of the machine.

[0038] The working process of the utility model is:

[0039] First, the positioning plate 13 is rotated on the bottom plate 2 through the rotating shaft 21, and then the wafer is placed and positioned by rotating the positioning plate 13. After the wafer is installed, the rotating clamping block 19 is matched with the clamping groove 20, and then the position of the positioning plate 13 is fixed. Then the driving motor 9 drives the screw 8 to rotate, and the screw 8 drives the sliding plate 5 to slide longitudinally on the connecting frame 4. The sliding plate 5 drives the mounting seat 10 to slide. A plurality of brush heads 11 are evenly installed at the lower end of the mounting seat 10. The driving mechanism set in the mounting seat 10 drives the brush head 11 to rotate. The high-speed rotating brush head 11 generates a strong cleaning force, wherein the screw 8 can control the up and down speed of the brush head 11, ensuring the accuracy and stability during the brushing process, and effectively removing impurities and pollutants on the wafer surface. A two-fluid nozzle 12 is correspondingly provided on one side of the brush head 11. The water vapor two-fluid can further improve the cleaning effect and avoid damage to the wafer surface. It can not only remove large particles of impurities on the wafer surface, but also effectively control the number of tiny particles above 0.3um to within 50, thereby ensuring the cleanliness and quality of the wafer surface. The liquid falls into the receiving box 18 through the taking slot 15 and the feeding slot 17.

Claims

1. A high-precision automatic positioning wafer brushing machine, comprising a base (1), characterized in that: The base (1) is connected to a bottom plate (2), the bottom plate (2) is connected to a shell (3), a brush device is fixedly connected inside the shell (3), the brush device comprises a connecting frame (4) and a sliding plate (5), the connecting frame (4) is fixedly connected to the shell (3), the sliding plate (5) slides longitudinally on the connecting frame (4), a screw rod (8) is rotatably connected to the sliding plate (5), the screw rod (8) is threadedly connected to the connecting frame (4), and a driving motor (9) is provided. The screw rod (8) is driven to rotate, and the driving motor (9) is fixedly connected to the housing (3); the lower end of the sliding plate (5) is connected to a mounting seat (10), and a plurality of brush heads (11) are evenly mounted on the lower end of the mounting seat (10); a driving mechanism arranged in the mounting seat (10) drives the brush heads (11) to rotate; two fluid nozzles (12) are correspondingly arranged on one side of the brush heads (11), and the two fluid nozzles (12) are mounted on the lower end of the mounting seat (10); The bottom plate (2) is connected to a positioning plate (13), a positioning groove (14) is provided on the positioning plate (13) corresponding to the brush head (11), a group of picking grooves (15) are symmetrically provided around the positioning groove (14), a groove (16) is provided on the bottom plate (2) corresponding to the positioning plate (13) around the positioning plate (13), a plurality of material discharge grooves (17) are evenly provided in the groove (16), a material receiving box (18) is provided at the lower end of the material discharge groove (17), and the material receiving box (18) is slidably connected in the base (1).

2. A high-precision automatic positioning wafer brushing machine according to claim 1, characterized in that: The taking groove (15) passes through the positioning plate (13).

3. A high-precision automatic positioning wafer brushing machine according to claim 2, characterized in that: The positioning plate (13) is rotatably connected to the base plate (2), a clamping block (19) is rotatably connected to the base plate (2), and the positioning plate (13) is evenly provided with a plurality of clamping grooves (20) corresponding to the clamping block (19).

4. A high-precision automatic positioning wafer brushing machine according to claim 3, characterized in that: The positioning plate (13) is rotatably connected to the base plate (2) via a rotating shaft (21), and a nut (22) is threadedly connected to the bottom of the rotating shaft (21).

5. A high-precision automatic positioning wafer brushing machine according to claim 1, characterized in that: The side walls of the housing (3) are each provided with a rotating door (23), and the rotating door (23) is made of organic glass.

6. A high-precision automatic positioning wafer brushing machine according to claim 1, characterized in that: The mounting seat (10) is detachably connected to the sliding plate (5) via a connecting assembly (6).

7. A high-precision automatic positioning wafer brushing machine according to claim 1, characterized in that: The bottom of the base (1) is evenly connected to a plurality of level-adjusting casters (7).

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