Corrosion mechanism for quartz wafer
By designing gear and motor-driven lifting and lowering conversion mechanism and stirring mechanism, the problem of quartz wafers being easily damaged during the etching process in the prior art is solved, uniform stirring of the etching liquid and safe treatment of the quartz wafers are achieved, and corrosion quality is improved.
Patent Information
- Application Number
- CN202420564825.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-03-22
AI Technical Summary
In the prior art, agitating the etching liquid is used to agitate, resulting in the quartz wafer being susceptible to collision damage.
A lifting and lowering conversion mechanism and a stirring mechanism including a gear and a motor are designed. Through the cooperation of the gear and the motor, uniform stirring of the etching liquid is achieved, and safe treatment of the quartz wafer is achieved through the cooperation of the lifting and lowering assembly and the screw.
It effectively promotes the uniformity of the concentration and temperature distribution of the etching liquid, improves the corrosion quality of the quartz wafer, and avoids the impact and damage of the wafer.
Smart Images
Figure CN222758157U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of wafer processing, in particular to an etching mechanism for quartz wafers. Background Art
[0002] Quartz wafers are obtained by cutting quartz crystals along a certain direction and then undergoing mechanical processing steps such as grinding, slicing, and polishing. However, there will be a damaged layer on the surface of the quartz wafer after processing, that is, a processing-degraded layer. In order to remove the processing-degraded layer, the quartz wafer is often etched by placing the quartz wafer in an etching liquid for treatment.
[0003] However, in the prior art, a stirring device is often used to stir the etching solution to promote the uniformity of the concentration and temperature distribution of the etching solution, but this can easily cause bump damage to the wafer. Utility Model Content
[0004] The technical problem to be solved by the utility model is that in the prior art, a stirring device is often used to stir the etching liquid to promote the uniformity of the concentration and temperature distribution of the etching liquid, but it is easy to cause bump damage to the wafer.
[0005] In order to achieve the above functions, the technical solution adopted by the utility model is as follows: an etching mechanism for quartz wafers, comprising a box body, on which a corrosion pool and a cleaning pool are provided, and also comprising a lifting conversion mechanism and a connecting stirring mechanism arranged on the box body; the lifting conversion mechanism comprises a gear 1 and a motor 1, the gear 1 is rotatably arranged on the top wall of the box body, the gear 1 is provided with a vertical rod, the vertical rod is provided with a lifting assembly, the motor 1 is embedded in the top wall of the box body, and the output end of the motor 1 is provided with a gear 2, and the gear 2 is meshed with the gear 1; the connecting stirring mechanism comprises a support plate and a support shaft, the support plate is provided on the lifting assembly, the support plate is provided with a stirring assembly, the support shaft is fixedly arranged on the bottom wall of the support plate, and the bottom end of the support shaft is provided with a mesh box.
[0006] Furthermore, the lifting assembly includes an adjustment slot and motor 2, the adjustment slot is arranged on the side wall of the vertical pole, the motor 2 is arranged on the top wall of the vertical pole, the output end of the motor 2 is provided with a screw rod, the screw rod is rotatably arranged in the adjustment slot, and the support plate and the screw rod are threadedly connected.
[0007] Furthermore, the stirring assembly includes a sleeve and a motor three, the sleeve is rotatably arranged on the support shaft, the sleeve is provided with a gear ring and a stirring rod, the motor three is arranged on the support plate, and the output end of the motor three is provided with a gear three, and the gear three is meshed with the gear ring.
[0008] Furthermore, the box body is also provided with a tumbling aeration mechanism, which includes an aeration plate and an air pump. The aeration plate is arranged on the bottom wall of the corrosion tank, and the air pump is arranged on the side wall of the box body. The air pump is provided with an air pipe, which passes through the side wall of the corrosion tank and is connected to the aeration plate.
[0009] Preferably, the stirring rod is arranged in an L shape.
[0010] Preferably, the vertical pole is arranged between the corrosion tank and the cleaning tank.
[0011] The utility model adopts the above structure to achieve the following beneficial effects: the utility model provides an etching mechanism for quartz wafers, which can drive the sleeve by setting gear three and a gear ring, and conveniently drive the stirring rod to stir the liquid around the net box to promote the uniformity of the concentration and temperature distribution of the etching solution. In conjunction with the screw rod, it is convenient to lift the support plate, and the net box and the stirring rod can be lifted. By setting gear one and gear two and driving with motor one, the angle of the vertical rod can be adjusted, which is convenient for transferring the net box to the cleaning tank. The operation is convenient, and the cleaning effect of the quartz wafer is improved in conjunction with the stirring rod; by setting an air pump and an aeration plate, the liquid in the corrosion tank can be aerated, so that the liquid in the corrosion tank rolls, and in conjunction with the stirring rod, the uniformity of the concentration and temperature distribution of the etching solution is further improved, and the corrosion quality of the quartz wafer is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 A three-dimensional etching mechanism for a quartz wafer proposed by the utility model Figure 1 ;
[0013] Figure 2 A three-dimensional etching mechanism for a quartz wafer proposed by the utility model Figure 2 ;
[0014] Figure 3 A top view of an etching mechanism for a quartz wafer proposed by the utility model
[0015] Figure 4 for Figure 1 A partial enlarged view of point A in the middle.
[0016] Among them, 1. box body, 2. corrosion tank, 3. cleaning tank, 4. lifting conversion mechanism, 5. connecting stirring mechanism, 6. gear one, 7. motor one, 8. vertical pole, 9. lifting assembly, 10. gear two, 11. support plate, 12. support shaft, 13. stirring assembly, 14. net box, 15. adjustment slot, 16. motor two, 17. screw rod, 18. sleeve, 19. motor three, 20. gear ring, 21. stirring rod, 22. gear three, 23. tumbling aeration mechanism, 24. aeration plate, 25. air pump, 26. air pipe. DETAILED DESCRIPTION
[0017] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0018] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. The present utility model is further described in detail below in conjunction with the accompanying drawings.
[0019] like Figure 1-4 As shown, the utility model proposes an etching mechanism for quartz wafers, including a box body 1, on which an etching pool 2 and a cleaning pool 3 are arranged, and also includes a lifting conversion mechanism 4 and a connecting stirring mechanism 5 arranged on the box body 1; the lifting conversion mechanism 4 includes a gear 1 6 and a motor 1 7, the gear 1 6 is rotatably arranged on the top wall of the box body 1, the gear 1 6 is provided with a vertical rod 8, the vertical rod 8 is arranged between the etching pool 2 and the cleaning pool 3, the vertical rod 8 is provided with a lifting component 9, the motor 1 7 is embedded in the top wall of the box body 1, and the output end of the motor 1 7 is provided with a gear 2 10, and the gear 2 10 is meshed with the gear 1 6; the connecting stirring mechanism 5 includes a support plate 11 and a support shaft 12, the support plate 11 is arranged on the lifting component 9, the support plate 11 is provided with a stirring component 13, and the support shaft 12 is fixed on the bottom wall of the support plate 11, and a mesh box 14 is provided at the bottom end of the support shaft 12. After the quartz wafer is placed, the lifting component 9 is started to immerse the quartz wafer in the etching solution, and the stirring component 13 is started to stir the etching solution around the quartz wafer to promote the uniformity of the concentration and temperature distribution of the etching solution. After the etching is completed, the lifting component 9 is adjusted again to take out the quartz wafer, and the motor 1 7 is started to drive the gear 2 10 to mesh with the gear 1 6, so that the vertical rod 8 rotates accordingly, driving the quartz wafer to move to the top of the cleaning pool 3, and the lifting component 9 is adjusted to immerse the quartz wafer in the cleaning solution, and the stirring component 13 is started again to stir the cleaning solution to rinse the etching solution. Finally, the quartz wafer is taken out, and the etching and cleaning operation is convenient.
[0020] like Figure 3As shown, the lifting assembly 9 includes an adjusting slot 15 and a second motor 16. The adjusting slot 15 is arranged on the side wall of the vertical rod 8, and the second motor 16 is arranged on the top wall of the vertical rod 8. A screw rod 17 is arranged at the output end of the second motor 16. The screw rod 17 is rotatably arranged in the adjusting slot 15. The support plate 11 and the screw rod 17 are threadedly connected. When the second motor 16 is started, the screw rod 17 is driven to rotate, and the screw rod 17 drives the support plate 11 to move and rise, so as to adjust the immersion height of the quartz wafer.
[0021] like Figure 1 , 2 As shown, the stirring assembly 13 includes a sleeve 18 and a motor 3 19. The sleeve 18 is rotatably arranged on the support shaft 12. The sleeve 18 is provided with a ring gear 20 and a stirring rod 21. The stirring rod 21 is L-shaped. The motor 3 19 is arranged on the support plate 11. The output end of the motor 3 19 is provided with a gear 3 22. The gear 3 22 is meshed with the ring gear 20. When the motor 3 19 is started, the gear 3 22 is driven to rotate. The gear 3 22 drives the ring gear 20 to rotate, so that the sleeve 18 rotates accordingly, and the stirring rod 21 is driven to rotate, so as to stir the liquid around the net box 14 and improve the uniformity of contact between the liquid and the quartz wafer in the net box 14.
[0022] like Figure 3 As shown, the box body 1 is also provided with a tumbling aeration mechanism 23, which includes an aeration plate 24 and an air pump 25. The aeration plate 24 is arranged on the bottom wall of the corrosion tank 2, and the air pump 25 is arranged on the side wall of the box body 1. The air pump 25 is provided with an air pipe 26, which penetrates the side wall of the corrosion tank 2 and is connected to the aeration plate 24. When the air pump 25 is started, air is filled into the aeration plate 24 and sprayed out from the aeration plate 24, driving the etching liquid to tumble. In combination with the stirring of the stirring rod 21, the uniformity of the concentration and temperature distribution of the etching liquid can be further improved.
[0023] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.
Claims
1. An etching mechanism for a quartz wafer, comprising a box, wherein the box is provided with an etching tank and a cleaning tank, characterized in that: It also includes a lifting conversion mechanism and a connecting stirring mechanism arranged on the box body; the lifting conversion mechanism includes gear one and motor one, the gear one is rotatably arranged on the top wall of the box body, the gear one is provided with a vertical rod, the vertical rod is provided with a lifting assembly, the motor one is embedded in the top wall of the box body, the output end of the motor one is provided with gear two, and the gear two is meshed with gear one; the connecting stirring mechanism includes a support plate and a support shaft, the support plate is provided on the lifting assembly, the support plate is provided with a stirring assembly, the support shaft is fixedly provided on the bottom wall of the support plate, and the bottom end of the support shaft is provided with a mesh box.
2. The etching mechanism for a quartz wafer according to claim 1, characterized in that: The lifting assembly includes an adjustment slot and a second motor. The adjustment slot is arranged on the side wall of the vertical pole, and the second motor is arranged on the top wall of the vertical pole. A screw rod is arranged to rotate in the adjustment slot, and the support plate is threadedly connected to the screw rod.
3. The etching mechanism for a quartz wafer according to claim 2, characterized in that: The stirring assembly includes a sleeve and a motor three, the sleeve is rotatably arranged on a support shaft, a gear ring and a stirring rod are arranged on the sleeve, the motor three is arranged on a support plate, a gear three is arranged at the output end of the motor three, and the gear three is meshed with the gear ring.
4. The etching mechanism for a quartz wafer according to claim 3, characterized in that: The box body is also provided with a tumbling aeration mechanism, which includes an aeration plate and an air pump. The aeration plate is arranged on the bottom wall of the corrosion tank, and the air pump is arranged on the side wall of the box body. The air pump is provided with an air pipe, which passes through the side wall of the corrosion tank and is connected to the aeration plate.
5. The etching mechanism for quartz wafer according to claim 4, characterized in that: The stirring rod is arranged in an L shape.
6. The etching mechanism for quartz wafer according to claim 5, characterized in that: The vertical pole is arranged between the corrosion tank and the cleaning tank.