Anti-wear hinging mechanism of semiconductor valve

Abstract

The utility model provides an anti-abrasion hinge mechanism of a semiconductor valve. The anti-abrasion hinge mechanism comprises a first hinge rod, a deep groove ball bearing, a lining, a hinge shaft, an anti-abrasion body and a second hinge rod. The deep groove ball bearing comprises an outer ring, balls, a retainer and an inner ring; the hinge shaft comprises a first matching surface, a shaft shoulder and a second matching surface; an outer ring of the deep groove ball bearing is mounted on the first hinge rod; the inner surface of the bushing is mounted on the first matching surface of the hinged shaft; the outer surface of the bushing is mounted on the inner ring of the deep groove ball bearing; the second hinge rod is mounted on the second matching surface of the hinge shaft; the anti-abrasion bodies are installed at the two ends of the hinged shaft. The number of sliding pairs is reduced, rolling pairs are adopted, the friction coefficient in the valve opening and closing process is reduced, accordingly, etching cavity body pollution caused by friction is greatly reduced, a ceramic-perfluoropolymer rolling friction pair is adopted, the friction coefficient is reduced, the friction coefficient is reduced, the friction coefficient is reduced, the friction coefficient is reduced, the friction coefficient is reduced, the friction coefficient is reduced, and the service life of the valve is prolonged. Therefore, the corrosion resistance of the etching cavity is greatly improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor etching chamber design and manufacturing, in particular to an anti-wear hinge mechanism for a semiconductor valve. Background Art

[0002] Semiconductor etching chambers need to be connected by opening and closing valves, and the opening and closing of valves usually need to be achieved through a hinge mechanism. The current hinge mechanism usually adopts a shaft-hole matching method for connection. Since the valve opens and closes quickly and the number of opening and closing times is large, the shaft-hole matching hinge mechanism belongs to sliding friction, which will produce a large amount of wear debris during use, thereby contaminating the etching chamber, affecting the etching quality and etching efficiency, and having a short stable working life. A new structure of the utility model is needed to reduce the cavity contamination caused by friction. Summary of the invention

[0003] In view of the above technical problems, the purpose of the utility model is to provide a wear-resistant hinge mechanism for semiconductor valves, which greatly reduces the friction coefficient during the opening and closing of the valve by reducing the number of sliding pairs and adopting rolling pairs, thereby greatly reducing the contamination of the etching chamber caused by friction. Furthermore, the utility model adopts a ceramic-perfluoropolymer rolling friction pair to greatly improve the corrosion resistance of the etching chamber.

[0004] The utility model achieves the above technical purpose through the following technical means.

[0005] A semiconductor valve anti-wear hinge mechanism, comprising a first hinge rod, a deep groove ball bearing, a bushing, a hinge shaft, an anti-wear body and a second hinge rod; the deep groove ball bearing comprises an outer ring, a ball, a retainer and an inner ring; the hinge shaft comprises a first mating surface, a shaft shoulder and a second mating surface; the outer ring of the deep groove ball bearing is mounted on the first hinge rod, and the outer ring and the first hinge rod are interference fit; the inner surface of the bushing is mounted on the first mating surface of the hinge shaft, and the inner surface and the first mating surface are interference fit; the outer surface of the bushing is mounted on the inner ring of the deep groove ball bearing, and the outer surface The surface and the inner ring are interference fit; the second hinge rod is installed on the second matching surface of the hinge shaft, and the second hinge rod and the second matching surface are interference fit; the anti-wear body is installed at both ends of the hinge shaft; when the first hinge rod and the second hinge rod rotate around the axis of the hinge shaft, there is no relative movement between the second matching surface and the second hinge rod, there is no relative movement between the first matching surface and the inner surface of the bushing, there is no relative movement between the outer surface of the bushing and the inner ring of the deep groove ball bearing, there is no relative movement between the outer ring of the deep groove ball bearing and the first hinge rod, and the balls roll between the outer ring and the inner ring.

[0006] In the above solution, the first hinge rod, the bushing, the hinge shaft and the second hinge rod are made of the same metal material.

[0007] Furthermore, the first hinge rod, the bushing, the hinge shaft and the second hinge rod are made of aluminum alloy or stainless steel.

[0008] In the above solution, the balls are made of ceramic material.

[0009] Furthermore, the ball is made of aluminum oxide or yttrium oxide.

[0010] Furthermore, the surface of the ball is polished, and the surface roughness is less than or equal to Ra0.2μm.

[0011] In the above solution, the outer side of the anti-wear body is a spherical surface and is provided with ventilation holes.

[0012] In the above scheme, the outer ring, the retaining frame, the inner ring and the anti-wear body of the deep groove ball bearing are made of corrosion-resistant perfluoropolymer.

[0013] Furthermore, the outer ring, the retaining frame, the inner ring and the anti-wear body of the deep groove ball bearing are made of polytetrafluoroethylene or polyamide-modified polytetrafluoroethylene.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. In addition to a rolling friction pair, the hinge mechanism of the utility model has interference fits between other mating surfaces, so that no sliding friction occurs, which can minimize the generation of wear debris, thereby greatly reducing the contamination of the etching chamber caused by friction.

[0016] 2. The first hinge rod and the second hinge rod of the utility model are isolated by a shaft shoulder, thereby avoiding friction and generation of wear debris during relative motion.

[0017] 3. Due to the compact structure of the semiconductor valve of the utility model, the hinge mechanism may hit the valve body during operation, resulting in scratches. Perfluoropolymer spherical anti-wear bodies are installed at both ends of the hinge shaft to avoid rigid scratches between the hinge mechanism and the valve body and the generation of wear debris. Vent holes are opened on the anti-wear bodies to ensure the rapid discharge of internal gas from the valve body during vacuuming.

[0018] 4. The utility model adopts deep groove ball bearings. Even when the hinge mechanism generates axial load, the ball and the inner and outer rings can still maintain point contact, thereby ensuring the stability of the friction coefficient of the hinge mechanism during operation.

[0019] 5. The ball of the utility model is made of ceramic material, and the surface roughness is less than or equal to Ra0.2μm. The inner ring and outer ring of the deep groove ball bearing are made of perfluoropolymer, which can ensure that the friction coefficient of the hinge mechanism is less than 0.01 during operation, minimize the generation of wear chips, and have low noise.

[0020] 6. The outer ring, retainer, inner ring and anti-wear body of the deep groove ball bearing of the utility model are made of perfluoropolymer, which has good corrosion resistance and can work stably in a corrosive environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the anti-wear hinge mechanism of a semiconductor valve according to one embodiment of the utility model.

[0022] Figure 2 It is a schematic diagram of the structure of a deep groove ball bearing according to one embodiment of the utility model.

[0023] Figure 3 It is a schematic diagram of the rigid sleeve structure of one embodiment of the utility model.

[0024] Figure 4 It is a schematic diagram of a hinge shaft according to one embodiment of the present utility model.

[0025] In the figure, 1. first hinged rod, 2. deep groove ball bearing, 21. outer ring, 22. ball, 23. retaining frame, 24. inner ring, 3. bushing, 31. outer surface, 32. inner surface bushing, 4. hinge shaft, 41. first matching surface, 42. shaft shoulder, 43. second matching surface, 44. axis, 5. anti-wear body, 51. vent hole, 6. second hinged rod. DETAILED DESCRIPTION

[0026] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0027] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "front", "back", "left", "right", "up", "down", "axial", "radial", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0028] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] like Figure 1-4As shown, a preferred embodiment of the semiconductor valve anti-wear hinge mechanism of the utility model is shown, and the semiconductor valve anti-wear hinge mechanism includes a first hinge rod 1, a deep groove ball bearing 2, a bushing 3, a hinge shaft 4, an anti-wear body 5 and a second hinge rod 6; the deep groove ball bearing 2 includes an outer ring 21, a ball 22, a retainer 23 and an inner ring 24; the hinge shaft 4 includes a first mating surface 41, a shoulder 42 and a second mating surface 43; the outer ring 21 of the deep groove ball bearing 2 is installed on the first hinge rod 1, and the outer ring 21 and the first hinge rod 1 are interference fit; the inner surface 32 of the bushing 3 is installed on the first mating surface 41 of the hinge shaft 4, and the inner surface 32 and the first mating surface 41 are interference fit; the outer surface 31 of the bushing 3 is installed on the inner ring 24 of the deep groove ball bearing 2, and the outer surface 31 and the inner ring 24 are interference fit; The second hinged rod 6 is installed on the second matching surface 43 of the hinge shaft 4, and the second hinged rod 6 and the second matching surface 43 are interference fit; the anti-wear body 5 is installed at both ends of the hinge shaft 4; when the first hinged rod 1 and the second hinged rod 6 rotate around the axis 44 of the hinge shaft 4, there is no relative movement between the second matching surface 43 and the second hinged rod 6, there is no relative movement between the first matching surface 41 and the inner surface 32 of the bushing 3, there is no relative movement between the outer surface 31 of the bushing 3 and the inner ring 24 of the deep groove ball bearing 2, there is no relative movement between the outer ring 21 of the deep groove ball bearing 2 and the first hinged rod 1, and the ball 22 rolls between the outer ring 21 and the inner ring 24. The outer side of the anti-wear body 5 is a spherical surface, which can avoid rigid scraping between the hinge mechanism and the valve body to generate wear debris, and a vent hole 51 is opened to facilitate the rapid discharge of internal gas from the valve body during vacuum extraction.

[0030] The first hinge rod 1, bushing 3, hinge shaft 4 and second hinge rod 6 are made of the same metal material, which can be aluminum alloy or stainless steel. The ball 22 is made of ceramic material, which can be aluminum oxide or yttrium oxide. The surface of the ball 22 is polished, and the surface roughness is less than or equal to Ra0.2μm. The outer ring 21, retaining frame 23, inner ring 24 and anti-wear body 5 of the deep groove ball bearing 2 are made of corrosion-resistant and wear-resistant perfluoropolymer, which can be polytetrafluoroethylene or polyamide-modified polytetrafluoroethylene, with good corrosion resistance and can work stably in a corrosive environment. The ball is made of ceramic material, and the surface roughness is less than or equal to Ra0.2μm. The inner ring and outer ring of the deep groove ball bearing are both made of perfluoropolymer, which can ensure that the friction coefficient of the hinge mechanism during operation is less than 0.01, minimize the generation of wear debris, and have low noise.

[0031] The utility model only includes one rolling friction pair, and the other mating surfaces are all interference fit, so no sliding friction occurs. By reducing the number of sliding pairs and using rolling pairs, the friction coefficient in the process of opening and closing the valve is greatly reduced, thereby greatly reducing the contamination of the etching chamber caused by friction. The utility model uses a ceramic-polytetrafluoroethylene rolling friction pair to greatly improve the corrosion resistance of the etching chamber, and the friction coefficient is low. The utility model can reduce the generation of wear debris to the greatest extent, and has the advantages of good working stability, long service life and low noise. The utility model is a wear-resistant and corrosion-resistant hinge mechanism for semiconductor valves, which can be used for opening and closing semiconductor valves.

[0032] In a specific embodiment of the utility model, the first hinge rod 1, bushing 3, hinge shaft 4 and second hinge rod 6 are made of 6061 aluminum alloy; the ball 22 is made of alumina ceramic material, the surface is polished, and the surface roughness is equal to Ra0.2μm; the outer ring 21, retainer 23, inner ring 24 and anti-wear body 5 of the deep groove ball bearing 2 are all made of polytetrafluoroethylene. The hinge mechanism of this embodiment has good corrosion resistance, a friction coefficient of about 0.008, no wear debris is generated, and it can work stably for more than 100,000 times.

[0033] In another specific embodiment of the utility model, the first hinge rod 1, bushing 3, hinge shaft 4 and second hinge rod 6 are made of ANSI304 stainless steel; the ball 22 is made of yttrium oxide ceramic material, the surface is polished, and the surface roughness is equal to Ra0.18μm; the outer ring 21, retainer 23, inner ring 24 and anti-wear body 5 of the deep groove ball bearing 2 are made of the same material, all made of polyamide modified polytetrafluoroethylene. The hinge mechanism of this embodiment has good corrosion resistance, a friction coefficient of about 0.007, no wear debris is generated, and can work stably for more than 150,000 times.

[0034] It should be understood that although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0035] The series of detailed descriptions listed above are only specific descriptions of feasible embodiments of the present invention. They are not intended to limit the protection scope of the present invention. All equivalent embodiments or changes that do not deviate from the technical spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor valve anti-wear hinge mechanism, characterized in that: It comprises a first hinge rod (1), a deep groove ball bearing (2), a bushing (3), a hinge shaft (4), an anti-wear body (5) and a second hinge rod (6); The deep groove ball bearing (2) comprises an outer ring (21), a ball (22), a retainer (23) and an inner ring (24); the hinge shaft (4) comprises a first mating surface (41), a shaft shoulder (42) and a second mating surface (43); the outer ring (21) of the deep groove ball bearing (2) is mounted on the first hinge rod (1), and the outer ring (21) and the first hinge rod (1) are in an interference fit; the inner surface (32) of the bushing (3) is mounted on the first mating surface (41) of the hinge shaft (4), and the inner surface (32) and the first mating surface (41) are in an interference fit; the outer surface (31) of the bushing (3) is mounted on the inner ring (24) of the deep groove ball bearing (2), and the outer surface (31) and the inner ring (24) are in an interference fit; the second hinge rod (6) The second hinge rod (6) is mounted on the second mating surface (43) of the hinge shaft (4), and the second hinge rod (6) and the second mating surface (43) are in interference fit; the anti-wear body (5) is mounted on both ends of the hinge shaft (4); when the first hinge rod (1) and the second hinge rod (6) rotate around the axis (44) of the hinge shaft (4), there is no relative movement between the second mating surface (43) and the second hinge rod (6), there is no relative movement between the first mating surface (41) and the inner surface (32) of the bushing (3), there is no relative movement between the outer surface (31) of the bushing (3) and the inner ring (24) of the deep groove ball bearing (2), there is no relative movement between the outer ring (21) of the deep groove ball bearing (2) and the first hinge rod (1), and the ball (22) rolls between the outer ring (21) and the inner ring (24).

2. The semiconductor valve anti-wear hinge mechanism according to claim 1, characterized in that: The first hinged rod (1), the bushing (3), the hinge shaft (4) and the second hinged rod (6) are made of the same metal material.

3. The wear-resistant hinge mechanism for semiconductor valve according to claim 2, characterized in that: The first hinged rod (1), the bushing (3), the hinge shaft (4) and the second hinged rod (6) are made of aluminum alloy or stainless steel.

4. The semiconductor valve anti-wear hinge mechanism according to claim 1, characterized in that: The ball (22) is made of ceramic material.

5. The semiconductor valve anti-wear hinge mechanism according to claim 4, characterized in that: The ball (22) is made of aluminum oxide or yttrium oxide.

6. The wear-resistant hinge mechanism for semiconductor valve according to claim 5, characterized in that: The surface of the ball (22) is polished, and the surface roughness is less than or equal to Ra0.2 μm.

7. The wear-resistant hinge mechanism for semiconductor valve according to claim 1, characterized in that: The outer side of the anti-wear body (5) is a spherical surface and is provided with a vent hole (51).

8. The wear-resistant hinge mechanism for semiconductor valve according to claim 1, characterized in that: The outer ring (21), the retaining frame (23), the inner ring (24) and the anti-wear body (5) of the deep groove ball bearing (2) are made of perfluoropolymer.

9. The semiconductor valve anti-wear hinge mechanism according to claim 8, characterized in that: The outer ring (21), the retaining frame (23), the inner ring (24) and the anti-wear body (5) of the deep groove ball bearing (2) are made of polytetrafluoroethylene or polyamide-modified polytetrafluoroethylene.

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