Heating cover body and testing device
By designing the heating cover body and the test platform to form a closed space, and setting an avoidance part on the conductive part, the problem of high temperature testing is solved, the problem of high temperature testing is high, the inability to quickly increase the temperature and collision during movement is achieved, and the effect of rapid heating, long-term high temperature maintenance and collision avoidance is achieved.
Patent Information
- Application Number
- CN202421610962.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-07-08
AI Technical Summary
In the prior art, high temperature testing costs are too high, cannot quickly heat up, and may cause damage to the storage device during movement.
A heating cover body is designed, including a main body and a heating structure contained in the main body. The heating structure includes a heating part and a plurality of conductive parts arranged parallel to each other. The conductive part is defined on it to avoid collision with the storage device when moving.
The heating cover body and the test platform form a confined space, which can achieve rapid heating and long-term maintenance of high temperatures, avoid collision between the heating cover body and the storage device, and reduce the testing cost.
Smart Images
Figure CN222762665U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of detection technology, and in particular to a heating hood and a testing device. Background Art
[0002] Storage devices, such as dual in-line memory modules (DIMMs), are widely used in computer devices such as computers, servers, and workstations. The available memory capacity of a computer can be increased by installing multiple DIMMs. Storage devices need to be tested in a high temperature environment before leaving the factory to ensure product performance and quality under high temperature conditions. The test device is usually placed in an open space and the ambient temperature is heated. Due to the existence of conditions such as excessive air flow and slow heating rate in the open space, the testing cost will increase. At the same time, the heating element is far away from the storage device, and it is impossible to heat up quickly and keep the test temperature stable for a long time. If the heating element is set between the storage devices, although rapid heating can be achieved, collisions may occur between the heating element and the storage device during the movement of the heating element, which may cause damage to the storage device. Utility Model Content
[0003] The main purpose of the present application is to provide a heating hood and a testing device, which are intended to solve the problems in the prior art of high temperature testing being too costly, unable to heat up quickly, and colliding with storage devices during movement.
[0004] A heating cover body is movably covered on a test platform with at least one storage device inserted; the storage device has at least one thickness restriction area; the heating cover body comprises a main body and a heating structure accommodated and fixed in the main body; the heating structure can generate heat under the control of the test platform to heat the closed space formed by the heating cover body and the test platform; the heating structure comprises a heating part and a plurality of conducting parts arranged in parallel with each other; the heating part is used to generate heat under the control of the test platform; when the heating cover body is covered on the test platform, any one of the conducting parts is located between two adjacent storage devices; at least one avoidance part is defined on the conducting part; when the heating cover body is covered on the test platform, the avoidance part corresponds to the thickness restriction area; the avoidance part is used to provide avoidance space during the movement of the heating cover body to avoid collision between the conducting part and the storage device.
[0005] In some embodiments, the avoidance portion is a groove.
[0006] In some embodiments, the avoidance portion is a notch.
[0007] In some embodiments, in a first direction, two adjacent conductive parts are spaced apart by a predetermined anti-collision distance; wherein the first direction is an arrangement direction of a plurality of storage devices; and in the first direction, the anti-collision distance is greater than or equal to a thickness of a storage device.
[0008] In some embodiments, in the first direction, the interval between the center points of any two adjacent slots is defined as a slot pitch, and the slot pitch is greater than the sum of the thickness of one of the storage devices and the thickness of one of the conductive portions.
[0009] A testing device comprises a heating cover and a testing platform; at least one storage device is inserted on the testing platform for testing the inserted storage device; the heating cover is movably covered on the testing platform; the storage device has at least one thickness restriction area; the heating cover comprises a main body and a heating structure accommodated and fixed in the main body; the heating structure can generate heat under the control of the testing platform to heat the enclosed space formed by the heating cover and the testing platform; the heating structure comprises a heating part and a plurality of conducting parts arranged parallel to each other; the heating part is used to generate heat under the control of the testing platform; when the heating cover is covered on the testing platform, any one of the conducting parts is located between two adjacent storage devices; at least one avoidance part is defined on the conducting part; when the heating cover is covered on the testing platform, the avoidance part corresponds to the thickness restriction area; the avoidance part is used to provide avoidance space during the movement of the heating cover to avoid collision between the conducting part and the storage device.
[0010] In some embodiments, the avoidance portion is a groove.
[0011] In some embodiments, the avoidance portion is a notch.
[0012] In some embodiments, in a first direction, two adjacent conductive parts are spaced apart by a predetermined anti-collision distance; wherein the first direction is an arrangement direction of a plurality of storage devices; and in the first direction, the anti-collision distance is greater than or equal to a thickness of a storage device.
[0013] In some embodiments, in the first direction, the interval between the center points of any two adjacent slots is defined as a slot pitch, and the slot pitch is greater than the sum of the thickness of one of the storage devices and the thickness of one of the conductive portions.
[0014] The above-mentioned heating cover and testing device can achieve rapid temperature rise and maintain high temperature in the closed space for a long time by forming a closed space with the heating cover and the testing platform; by arranging the heating structure in the closed space, rapid temperature rise in the closed space can be achieved; by transferring the heat generated by the heating part downward from the conducting part to the area between two adjacent storage devices, the temperature of the environment where the storage devices are located can be quickly increased. By providing an avoidance part on the conducting part, the possibility of collision between the heating cover and the storage device during the movement of the heating cover can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.
[0016] Figure 1 This is a cross-sectional schematic diagram of a testing device according to a preferred embodiment of the present application.
[0017] Figure 2 for Figure 1 Schematic diagram of the heating gear at another angle.
[0018] Figure 3 for Figure 1 A cross-sectional schematic diagram showing the test device in the open state from another angle.
[0019] Figure 4 for Figure 1 A cross-sectional schematic diagram showing the test device in the fastened state from another angle.
[0020] Main component symbols
[0021] Test device 100
[0022] Storage device 200
[0023] Heating hood 1
[0024] Test platform 2
[0025] Body 10
[0026] Heating structure 20
[0027] Heating part 21
[0028] Conducting part 23
[0029] Circuit board 201
[0030] Thickness Restriction Area A
[0031] Chip component 202
[0032] Passive Components 203
[0033] Avoidance 231
[0034] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0035] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.
[0036] It should be noted that in this application, "at least one" means one or more, and "more than one" means two or more than two. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims and drawings of this application are used to distinguish similar objects, rather than to describe a specific order or sequence.
[0037] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete way. The following embodiments and features in the embodiments may be combined with each other without conflict.
[0038] The specific implementation of the testing device 100 of the present application is described below with reference to the accompanying drawings.
[0039] See also Figure 1, which is a module schematic diagram of a test device 100 provided in an embodiment of the present application. The test device 100 is used to electrically connect multiple storage devices 200 at the same time and test the storage devices 200. The test device 100 can test multiple storage devices 200 at the same time at normal temperature or high temperature. In one embodiment of the present application, multiple test devices 100 can be stacked on a rack (not shown) to achieve batch testing of a large number of storage devices 200; the test device 100 can also be placed on a desktop to achieve testing of a small number of storage devices 200. Among them, the small-scale number can be 1-32.
[0040] The storage device 200 includes a circuit board 201, a plurality of chip components 202, and a plurality of passive components 203. The circuit board 201 is generally in the shape of a rectangular plate. A plurality of metal conductive terminals 2011 are arranged at one end of the circuit board 201. The plurality of metal conductive terminals 2011 are arranged at intervals, and any two adjacent metal conductive terminals 2011 are insulated. The metal conductive terminals 2011 are used to be plugged with the test device 100 to establish an electrical connection between the storage device 200 and the test device 100. In at least one embodiment of the present application, the thickness of the circuit board 201 ranges from 1.0 mm to 1.4 mm. The plurality of chip components 202 and the plurality of passive components 203 are protrudingly arranged on two opposite surfaces of the circuit board 201 and are electrically connected to the internal circuit of the circuit board 201. The thickness of the chip component 202 is within 1.2 mm; the thickness of the passive component 203 is between 0.5 mm and 2.2 mm. In at least one embodiment of the present application, the chip component 202 may be a power chip or a dynamic random access memory chip (DRAM), etc., but is not limited thereto; the passive component 203 may be a resistor, a capacitor, and an inductor, etc., but is not limited thereto. Furthermore, at least one thickness restriction area A (such as Figure 3 As shown). In at least one embodiment of the present application, the thickness restriction area A is a rectangle. The thickness restriction area A is the maximum thickness of the components set on the storage device 200 in the first direction X. That is, the maximum thickness of the chip component 202 or the passive component 203 set on the surface of the circuit board 201 in the first direction X. The passive component 203 is set in the thickness restriction area A. In at least one embodiment of the present application, part of the chip component 202 may also be set in the thickness restriction area A. In at least one embodiment of the present application, two thickness restriction areas A are set on the circuit board 201. Among them, one thickness restriction area A is located in the middle of the storage device 200, and the other thickness restriction area A is located at the edge of the storage device 200 and is close to the metal conductive terminal 2011.
[0041] The test device 100 heats the cover 1 and the test platform 2. The heating cover 1 is movably mounted on the test platform 2. When performing a high-temperature environment test, the heating cover 1 is mounted on the test platform 2 so that the heating cover 1 and the test platform 2 cooperate to form a closed space, and the test platform 2 is used to control the heating cover 1 to perform a heating operation to heat the closed space. When performing a room temperature environment test, the heating cover 1 is removed so that the test platform 2 is exposed to the air. In addition, when the closed space needs to be cooled, the heating cover 1 can also be temporarily removed from the test platform 2 to cool the storage device 200 by air convection.
[0042] The heating cover 1 includes a main body 10 and a heating structure 20. The main body 10 is roughly a hollow keycap-shaped structure. The main body 10 is movably covered on the test platform 2 to enclose a closed space with the test platform 2. The heating structure 20 is accommodated and fixedly arranged in the main body 10. The heating structure 20 is used to perform a heating operation under the control of the test platform 2 to heat the closed space, thereby simulating a high temperature environment. In at least one embodiment of the present application, the heating structure 20 is roughly a fin structure and is made of a metal material. In other embodiments, the heating structure 20 can also be made of other materials with high thermal conductivity. The heating structure 20 includes a heating portion 21 and a plurality of conducting portions 23. The heating portion 21 is fixedly arranged inside the main body 10 and is arranged parallel to the top surface of the main body 10. In at least one embodiment of the present application, the heating portion 21 is roughly in the shape of a cuboid. In other embodiments, the shape of the heating portion 21 can be adjusted according to the shape of the main body 10 or the test platform 2. The heating portion 21 is used to generate heat under the control of the test platform 2 to heat the air in the closed space. A plurality of conducting parts 23 are parallel to each other and fixed vertically on the surface of the heating part 21 away from the main body 10. When the heating cover 1 is covered on the test platform 2, any one of the conducting parts 23 is located between two adjacent storage devices 200. In the first direction X, two adjacent conducting parts 23 are arranged at a predetermined anti-collision spacing L1. The first direction X is the arrangement direction of the plurality of storage devices 200. Among them, in the first direction X, the anti-collision spacing L1 is greater than or equal to the thickness of a storage device 200, which can avoid the collision between the conducting part 23 and the chip component 202 and the passive component 203 on the storage device 200. In at least one embodiment of the present application, the plurality of conducting parts 23 have the same structure. The conducting part 23 is used to transfer the heat generated by the heating part 21 from the top of the storage device 200 downward to the area between the two adjacent storage devices 200, so as to achieve accurate and rapid heating of the test environment where the storage device 200 is located. That is, the conducting part 23 transfers the heat generated by the heating part 21 in the second direction perpendicular to the first direction X toward the direction close to the test platform 2. The following description will be made by taking one of the conducting parts 23 as an example. Figure 3 As shown, the conductive portion 23 is substantially a rectangular sheet-shaped structure.
[0043] Please also read Figure 2 , Figure 2 It is a cross-sectional schematic diagram of the heating structure 20 at another angle. The conducting part 23 is defined with at least one avoidance part 231. In the third direction Z, the width of the avoidance part 231 corresponds to the width of the thickness limiting area A. Among them, the third direction Z is perpendicular to the first direction X and the second direction Y at the same time. The first direction X, the second direction Y and the third reverse direction Z constitute a rectangular coordinate system. The avoidance part 231 is used to provide an avoidance space during the movement of the heating cover body 1, which can further avoid the collision between the conducting part 23 and the storage device 200. In at least one embodiment of the present application, the avoidance part 231 can be a notch. That is, in the second direction Y, the avoidance part 231 is formed by the inward depression of one end of the conducting part 23 away from the heating part 21. In other embodiments, the avoidance part 231 can be a groove. That is, in the third direction Z, the avoidance part 231 is formed by the inward depression of the surface perpendicular to the conducting part 23 and the heating part 21. When there are multiple avoidance parts 231, the structure of the avoidance part 231 can be set according to demand. For example, the plurality of avoidance portions 231 are all notches, or the plurality of avoidance portions 231 are all grooves, or some of the avoidance portions 231 are notches, and some of the avoidance portions 231 are grooves.
[0044] The test platform 2 has a plurality of slots (not shown). The slots are used to provide a space for inserting the storage device 200 so as to establish an electrical connection between the test platform 2 and the storage device 200. The interval between the center points of any two adjacent slots is defined as the slot spacing L2 interval. In at least one embodiment of the present application, the slot spacing L2 is generally less than or equal to 10 mm. In a first direction, the slot spacing L2 is greater than the sum of the thickness of a storage device 200 and the thickness of a conductive portion 23. The test platform 2 can control the heating structure 20 to perform a heating operation.
[0045] Specifically, the working principle of the testing device 100 is as follows:
[0046] When performing a high temperature environment test, the test platform 2 with the storage device 200 inserted is aligned with the heating cover 1 so that the storage device 200 is aligned with the area between two adjacent conductive parts 23. At this time, the avoidance part 231 corresponds to the thickness restriction area A (such as Figure 3 In the second direction Y, the heating cover 1 is moved from the upper direction of the test platform 2 to the direction close to the test platform 2 (as shown in FIG. Figure 3 in the direction indicated by the arrow in the middle) until it contacts the upper surface of the test platform 2 (as shown in the figure). Figure 4As shown). At this time, the heating cover 1 cooperates with the test platform 2 to form a closed space. During the movement, if the heating cover 1 shakes along the first direction X, the avoidance portion 231 can avoid the possibility of collision between the heating cover 1 and the storage device 200. The test platform 2 is used to control the heating cover 1 to perform a heating operation to heat the closed space.
[0047] When performing the room temperature environment test, the heating cover 1 is moved from the upper direction of the test platform 2 to the direction away from the test platform 2 in the second direction Y, so that the heating cover 1 is separated from the test platform 2, and the test platform 2 is exposed to the air. Similarly, during the movement, if the heating cover 1 shakes along the first direction X, the avoidance portion 231 can avoid the possibility of collision between the heating cover 1 and the storage device 200.
[0048] When the temperature of the enclosed space needs to be lowered, the heating cover 1 may be temporarily removed from the test platform 2 to lower the temperature of the storage device 200 by air convection.
[0049] The above-mentioned heating cover body 1 and the testing device 100 with the heating cover body 1 can form a closed space by the heating cover body 1 and the testing platform 2, so as to achieve rapid temperature increase and maintain the high temperature in the closed space for a long time; by arranging the heating structure 20 in the closed space, rapid temperature increase in the closed space can be achieved; the heat generated by the heating part 21 is transferred downward from the conduction part 23 to the area between two adjacent storage devices 200 through the conduction part 23, so as to quickly increase the temperature of the environment in which the storage devices 200 are located; and by providing an avoidance part 231 on the conduction part 23 located between two adjacent storage devices 200, the possibility of collision between the heating cover body 1 and the storage device 200 during the movement of the heating cover body 1 can be avoided.
[0050] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A heating cover, movably covered on a test platform with at least one storage device inserted; the storage device has at least one thickness restriction area; the heating cover comprises a main body and a heating structure accommodated and fixed in the main body; the heating structure can generate heat under the control of the test platform to heat the enclosed space formed by the heating cover and the test platform; characterized in that: The heating structure includes a heating part and a plurality of conducting parts arranged parallel to each other; the heating part is used to generate heat under the control of the test platform; when the heating cover is covered on the test platform, any one of the conducting parts is located between two adjacent storage devices; at least one avoidance part is defined on the conducting part; when the heating cover is covered on the test platform, the avoidance part corresponds to the thickness limiting area; the avoidance part is used to provide avoidance space during the movement of the heating cover to avoid collision between the conducting part and the storage device.
2. The heating cover according to claim 1, characterized in that: The avoidance portion is a groove.
3. The heating cover according to claim 1, characterized in that: The avoidance portion is a notch.
4. The heating cover according to claim 1, characterized in that: In the first direction, two adjacent conductive parts are arranged at a predetermined anti-collision distance; wherein the first direction is the arrangement direction of the plurality of storage devices; in the first direction, the anti-collision distance is greater than or equal to the thickness of one storage device.
5. The heating cover according to claim 4, characterized in that: In the first direction, the interval between the center points of any two adjacent slots is defined as a slot pitch, and the slot pitch is greater than the sum of the thickness of one of the storage devices and the thickness of one of the conductive parts.
6. A testing device, comprising a heating cover and a testing platform; at least one storage device is inserted on the testing platform for testing the inserted storage device; the heating cover is arranged on the testing platform; the storage device has at least one thickness restriction area; the heating cover comprises a main body and a heating structure accommodated and fixed in the main body; the heating structure can generate heat under the control of the testing platform to heat the enclosed space formed by the heating cover and the testing platform; characterized in that, The heating structure includes a heating part and a plurality of conducting parts arranged parallel to each other; the heating part is used to generate heat under the control of the test platform; when the heating cover is covered on the test platform, any one of the conducting parts is located between two adjacent storage devices; at least one avoidance part is defined on the conducting part; when the heating cover is covered on the test platform, the avoidance part corresponds to the thickness limiting area; the avoidance part is used to provide avoidance space during the movement of the heating cover to avoid collision between the conducting part and the storage device.
7. The testing device according to claim 6, characterized in that: The avoidance portion is a groove.
8. The testing device according to claim 6, characterized in that: The avoidance portion is a notch.
9. The testing device according to claim 6, characterized in that: In the first direction, two adjacent conductive parts are arranged at a predetermined anti-collision distance; wherein the first direction is the arrangement direction of the plurality of storage devices; in the first direction, the anti-collision distance is greater than or equal to the thickness of one storage device.
10. The testing device according to claim 9, characterized in that: In the first direction, the interval between the center points of any two adjacent slots is defined as a slot pitch, and the slot pitch is greater than the sum of the thickness of one of the storage devices and the thickness of one of the conductive parts.