Bernoulli wafer bearing device

Abstract

The utility model provides a Bernoulli wafer bearing device, which comprises a bearing table and a mounting shaft, the bearing table is connected to the top end of the mounting shaft, a gas path is formed in the mounting shaft, a plurality of first through holes are concentrically distributed in the top surface of the bearing table, a gas cavity communicated with the gas path is formed in the bearing table, and the gas cavity is communicated with the plurality of first through holes; a plurality of second through holes are concentrically distributed in the top face of the bearing table, the distance between the second through holes and the circle center of the top face of the bearing table is larger than the distance between the first through holes and the circle center of the top face of the bearing table, the gas cavity is communicated with the second through holes, and gas is introduced into the gas cavity from the bottom end of the gas circuit and flows out of the first through holes through the gas cavity to adsorb wafers. And gas flows out of the second through hole through the gas cavity to blow away the medicine on the edge of the wafer. The wafer cleaning device is used for solving the problem that in the prior art, when a Bernoulli suction cup supports a wafer to clean the back face of the wafer, medicine flows to the edge of the front face of the wafer, and consequently patterns are corroded.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor cleaning equipment, in particular to a Bernoulli wafer supporting device. Background Art

[0002] During the wafer manufacturing process, the wafer comes into contact with various organic matter, particles, metal impurities and other contaminants, which cause the contaminants to adhere to the wafer, so the wafer needs to be cleaned. The Bernoulli suction cup is a suction cup that uses compressed air to pass through a small diameter (small hole) to generate a high-speed jet, which takes away the surrounding gas, thereby generating negative pressure to absorb objects. Because of its special principle and stable performance, it is widely used in semiconductor wafer cleaning processes.

[0003] When the Bernoulli chuck is used to clean the back of the wafer, the Bernoulli chuck absorbs the wafer and drives it to rotate, and deionized water and other chemicals are used to rinse the back of the wafer. Since the front of the wafer is etched to form a pattern, the deionized water and other chemicals used to clean the back of the wafer are corrosive to a certain extent. When the deionized water is used to clean the back of the wafer, some of the chemicals flow to the edge of the back of the wafer, which may corrode the etched pattern formed on the edge of the front of the wafer and cause failure.

[0004] In view of this, it is necessary to improve the Bernoulli suction cup in the prior art to solve the above problems. Utility Model Content

[0005] The utility model aims to disclose a Bernoulli wafer supporting device, which is used to solve the problem in the prior art that when a Bernoulli suction cup supports a wafer to clean its back side, chemicals flow to the edge of the front side of the wafer, resulting in corrosion patterns.

[0006] To achieve the above-mentioned purpose, the utility model provides a Bernoulli wafer supporting device, comprising: a supporting platform and a mounting shaft, the supporting platform is connected to the top end of the mounting shaft, an air path is formed in the mounting shaft, a plurality of first through holes are concentrically distributed on the top surface of the supporting platform, an air cavity connected to the air path is formed in the supporting platform, and the air cavity is connected to the plurality of first through holes;

[0007] A plurality of second through holes are concentrically distributed on the top surface of the support platform, and the distance between the second through hole and the center of the top surface of the support platform is greater than the distance between the first through hole and the center of the top surface of the support platform. The air cavity is connected to the plurality of second through holes, and gas is introduced into the air cavity from the bottom end of the gas path. The gas flows out from the first through hole through the air cavity to adsorb the wafer, and the gas flows out from the second through hole through the air cavity to blow away the drugs on the edge of the wafer.

[0008] As a further improvement of the present invention, the side wall of the installation shaft is connected to an air inlet near the bottom end, the air inlet is communicated with the air circuit, the bottom end of the installation shaft is connected to a water inlet, an installation channel is formed coaxially with the air circuit in the installation shaft, and the air circuit and the installation channel are isolated from each other;

[0009] The top of the installation channel forms an opening at the center of the top surface of the support platform, and the bottom end of the water channel is connected to the water inlet. The water channel goes upward along the installation channel and passes through the opening of the installation channel, and pure water is sprayed onto the front side of the wafer through the water channel.

[0010] As a further improvement of the utility model, the support platform includes a first plate body and a second plate body, the first plate body covers the upper surface of the second plate body, the top surface of the mounting shaft is connected to the lower surface of the second plate body, and the second plate body forms a plurality of air holes connected to the air path around the center;

[0011] The air cavity is formed on the lower surface of the first plate body, and the air cavity is formed into a cylindrical trough body. One end of the first through hole and the second through hole is connected to the arc-shaped side wall of the air cavity, and the other end is inclined upward in the first plate body to the surface of the first plate body. A water hole connected to the air cavity is provided in the center of the first plate body, and the top of the water channel passes through the water hole.

[0012] As a further improvement of the utility model, a plurality of positioning columns and a top block are provided through the first plate body, the surface of the top block forms an arc-shaped protrusion that contacts the front side of the wafer, the positioning columns have a clamping column that fits with the edge of the wafer, and the clamping columns of the plurality of positioning columns form a shape consistent with the wafer.

[0013] As a further improvement of the utility model, the gas path and the installation channel are isolated from each other by a concentrically arranged cylinder, the top of the cylinder is connected to an isolation piece near the installation channel, the isolation piece is centrally formed with an installation hole, and the installation hole is connected to the installation channel;

[0014] The isolation piece passes through a plurality of air holes opened on the second plate body, and the mounting hole is connected with the water hole. The water path passes through the mounting hole and the water hole upward along the mounting channel. The gas enters the air path from the air inlet, passes through the air holes, and enters the air cavity, and then flows out from the first through hole and the second through hole.

[0015] As a further improvement of the present invention, the outer wall of the mounting shaft is coaxially fixed with the support seat, and the top surface of the support seat is in contact with the lower surface of the second plate body.

[0016] As a further improvement of the present invention, a positioning protrusion is formed on the top surface of the second plate body, a positioning groove is formed on the lower surface of the first plate body that is adapted to and interlocked with the positioning protrusion, a sealing ring is arranged at the joint between the first plate body and the second plate body, and the top surface of the first plate body extends away from the center to form a flange.

[0017] As a further improvement of the present invention, a plurality of weight-reducing grooves are formed on the lower surface of the first plate body, and a cover body is formed vertically downward at the periphery of the lower surface of the second plate body.

[0018] As a further improvement of the present invention, the outer wall of the mounting shaft is fixedly connected to the connecting disk.

[0019] As a further improvement of the present invention, the top end of the second through hole is formed on the top surface of the first plate body close to where the positioning column and the top block pass through.

[0020] Compared with the prior art, the beneficial effects of the utility model are: first, through the air cavity formed on the support table, and the first through hole and the second through hole connected to the air cavity, the gas enters the air cavity through the air path formed in the mounting shaft, and then flows out from the first through hole to produce a Bernoulli effect to adsorb the wafer. At this time, the back of the wafer faces upward, and the front side of the wafer forming a pattern faces downward. The gas in the air cavity then flows out from the second through hole. The second through hole is closer to the periphery of the wafer than the first through hole. When corrosive chemicals are used to clean the back of the wafer, the gas escaping from the second through hole can blow away the chemicals that have a tendency to flow toward the front at the edge of the wafer, thereby avoiding the problem of pattern failure due to the flow of chemicals to the front side of the wafer.

[0021] Secondly, through the installation channel which is coaxially arranged with the gas path and isolated from the gas path in the installation shaft, a water path is axially arranged in the installation channel, and the bottom end of the water path is connected with the water inlet. While the back side of the wafer is cleaned, pure water is introduced through the water inlet to clean the front side of the wafer where a pattern is formed. Moreover, since the installation channel and the air inlet are isolated from each other, the gas path and the water path do not affect each other, so as to facilitate the adsorption and cleaning operations of the wafer.

[0022] Finally, the positioning columns and top blocks are penetrated through the first plate body. The arc-shaped protrusion of the top block can support the front side of the wafer when gas is not passed into the first through hole to avoid friction damage caused by direct contact between the front side of the wafer and the top surface of the first plate body. The clamping columns of several positioning columns are formed into a shape consistent with the wafer to achieve the purpose of positioning the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall structure of the Bernoulli wafer support device used in the present utility model;

[0024] Figure 2This is a structural schematic diagram of the utility model for reflecting the matching relationship between the wafer and the supporting platform;

[0025] Figure 3 It is a cross-sectional schematic diagram used to reflect the specific structure of each part in the present invention;

[0026] Figure 4 It is an exploded schematic diagram used to reflect the specific structure of each part in the present invention;

[0027] Figure 5 for Figure 3 Enlarged view of part A in the middle;

[0028] Figure 6 for Figure 3 Enlarged view of part B in the middle. DETAILED DESCRIPTION

[0029] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these embodiments are all within the scope of protection of the present invention.

[0030] Ginseng Figures 1 to 6 As shown, a Bernoulli wafer supporting device provided by the utility model is compared with the existing Bernoulli supporting device. Through the air cavity 11 formed on the supporting platform 1, and the first through hole 12 and the second through hole 13 connected to the air cavity 11, the gas is passed into the air cavity 11 through the air path 21 formed in the mounting shaft 2, and then flows out from the first through hole 12 to produce a Bernoulli effect to adsorb the wafer 4. At this time, the back of the wafer 4 faces upward, and the front side of the wafer forming the pattern faces downward. The gas in the air cavity 11 flows out from the second through hole 13 at the same time. The second through hole 13 is closer to the edge of the wafer than the first through hole. When using corrosive chemicals to clean the back of the wafer 4, the gas escaping from the second through hole 13 can blow away the chemicals that have a tendency to flow toward the front at the edge of the wafer 4, thereby avoiding the problem of pattern failure due to the flow of chemicals to the front side of the wafer 4.

[0031] Ginseng Figures 1 to 6As shown, in this embodiment, the Bernoulli wafer supporting device includes: a supporting platform 1 and a mounting shaft 2, the supporting platform 1 is connected to the top of the mounting shaft 2, an air path 21 is formed in the mounting shaft 2, a plurality of first through holes 12 are concentrically distributed on the top surface of the supporting platform 1, an air cavity 11 connected to the air path 21 is formed in the supporting platform 1, and the air cavity 11 is connected to the plurality of first through holes 13; a plurality of second through holes 13 are concentrically distributed on the top surface of the supporting platform 1, the distance between the second through hole 13 and the center of the top surface of the supporting platform 1 is greater than the distance between the first through hole 12 and the center of the top surface of the supporting platform 1, the air cavity 11 is connected to the plurality of second through holes 13, gas is introduced into the air cavity 11 from the bottom end of the air path 21, the gas flows out from the first through hole 12 through the air cavity 11 to adsorb the wafer 4, and the gas flows out from the second through hole 13 through the air cavity 11 to blow away the drugs on the edge of the wafer 4. The outer wall of the mounting shaft 2 is fixedly connected to the connecting plate 27.

[0032] It should be noted that when cleaning the back side of the wafer 4, the mounting shaft 2 needs to be connected to a driving device such as a motor through a connecting plate 27 to drive the support table 1 to drive the wafer 4 to rotate with the driving shaft 2 as the axis, and at the same time, spray chemicals on the back side of the wafer 4 to clean the back side of the wafer 4. In this embodiment, gas is introduced into the air cavity 11 through the gas path 21 formed on the mounting shaft 2, and the gas forms a Bernoulli effect to adsorb the wafer 4 in a plurality of first through holes 12. At the same time, the gas flows out from the second through holes 13 through the air cavity 11 to blow away the chemicals on the back side of the wafer 4 that have a tendency to flow toward the front side in a direction away from the wafer 4, so as to avoid the problem in the prior art that the cleaning liquid on the back side of the wafer 4 flows to the edge of the front side of the wafer 4, resulting in failure of the etching pattern.

[0033] Ginseng Figures 1 to 6 As shown, the side wall of the mounting shaft 2 is connected to the air inlet 22 near the bottom end, the air inlet 22 is connected to the air path 21, the bottom end of the mounting shaft 2 is connected to the water inlet 23, and a mounting channel 25 is formed coaxially with the air path 21 inside the mounting shaft 2, and the air path 21 and the mounting channel 24 are isolated from each other by the cylinder 25; the top of the mounting channel 24 forms an opening at the center of the top surface of the support platform 1, the bottom end of the water path 241 is connected to the water inlet 23, the water path 241 goes upward along the mounting channel 24 and passes through the opening of the mounting channel 24, and pure water is sprayed onto the front side of the wafer 4 through the water path 241.

[0034] Ginseng Figures 3 to 6As shown, the support platform 1 includes a first plate body and a second plate body, the first plate body 14 covers the upper surface of the second plate body 15, the top surface of the mounting shaft 2 is connected to the lower surface of the second plate body 15, and the second plate body 15 forms a plurality of air holes 151 connected to the air path 21 around the center; the air cavity 11 is formed on the lower surface of the first plate body 14, the air cavity 11 is formed as a cylindrical groove body, the notch of the air cavity 11 is close to the upper surface of the second plate body 15, one end of the first through hole 12 and the second through hole 13 are connected to the arc-shaped side wall of the air cavity 11, and the other end is inclined upward in the first plate body 14 to the surface of the first plate body 14, and the first plate body 14 has a water hole 141 connected to the air cavity 11 in the center, and the top of the water path 241 passes through the water hole 141. The top of the cylinder 25 is connected to the isolation member 26 near the mounting channel 24, and a mounting hole 261 is formed in the center of the isolation member 26, and the mounting hole 261 is connected to the mounting channel 24; the isolation member 26 passes through a plurality of air holes 151 formed in the second plate body 15, and the mounting hole 261 is connected to the water hole 141, and the water path 241 passes through the mounting hole 261 and the water hole 141 upward along the mounting channel 24, and the gas enters the gas path 21 from the air inlet 22, passes through the air hole 151 and enters the air cavity 11, and then flows out from the first through hole 12 and the second through hole 13.

[0035] Through the installation channel 24 coaxially arranged with the gas circuit 21 and isolated from the gas circuit 21 in the installation shaft 2, a water circuit 241 is axially arranged in the installation channel 24, and the bottom end of the water circuit 241 is connected with the water inlet 23. While the back side of the wafer 4 is cleaned, pure water is introduced through the water inlet 23 to clean the front side of the wafer 4 where a pattern is formed. Moreover, since the installation channel 24 and the gas circuit 21 are isolated from each other, the gas circuit 21 and the water circuit 241 do not affect each other, so that the adsorption and cleaning operations on the front side of the wafer 4 can be carried out simultaneously. The gas is introduced from the air inlet 22, and the gas flows upward along the gas path 21 to the air hole 151 opened on the second plate body 15 and enters the air cavity 11 from the air hole 151. The gas in the air cavity 11 flows out from the first through holes 12 densely distributed on the surface of the first plate body 14, thereby forming a Bernoulli effect to adsorb the wafer 4 to prepare for cleaning the back side of the wafer 4. At the same time, the gas in the air cavity 11 flows out from the second through holes 13 which are more sparsely distributed on the surface of the first plate body 14 than the first through holes 12. The second through holes 13 are closer to the edge of the wafer 4 than the first through holes 12, so as to blow the chemicals flowing to the edge of the wafer 4 away from the surface of the wafer 4, so as to prevent the corrosive chemicals from further flowing to the front side of the wafer 4 and causing corrosion of the front side pattern of the wafer 4.

[0036] Ginseng Figures 4 to 6As shown, the first plate body 14 is provided with a plurality of positioning posts 142 and a top block 143, the surface of the top block 143 forms an arc-shaped protrusion 1431 in contact with the front surface of the wafer 4, the positioning posts 142 have a clamping post 1421 that fits with the edge of the wafer 4, and the clamping posts 1421 of the plurality of positioning posts 142 are surrounded in a shape consistent with the wafer 4. The positioning posts 142 and the top block 143 provided in the first plate body 14, and the arc-shaped protrusion 1431 of the top block 143 can support the front surface of the wafer 4 when no gas is introduced into the first through hole 12, so as to avoid friction damage caused by direct contact between the front surface of the wafer 4 and the top surface of the first plate body 14, and the clamping posts 1421 of the plurality of positioning posts 142 are surrounded in a shape consistent with the wafer 4, so as to achieve the purpose of positioning the wafer 4. It should be noted that the top end of the second through hole 13 is formed on the top surface of the first plate body 14 close to where the positioning column 142 and the top block 143 pass through.

[0037] Ginseng Figure 3 , Figure 4 and Figure 6 As shown, the outer wall of the mounting shaft 2 is coaxially fixed with the support seat 3, and the top surface of the support seat 3 is in contact with the lower surface of the second plate body 15. A positioning protrusion 152 is formed on the top surface of the second plate body 15, and a positioning groove 144 adapted to and interlocked with the positioning protrusion 152 is formed on the lower surface of the first plate body 14. A sealing ring 1441 is provided at the joint between the first plate body 14 and the second plate body 15, and the top surface of the first plate body 14 extends away from the center to form a flange 145. A plurality of weight-reducing grooves 146 are formed on the lower surface of the first plate body 14, and a cover 153 is formed vertically downward at the periphery of the lower surface of the second plate body 15.

[0038] The design of the support seat 3 can increase the supporting area of ​​the mounting shaft 2 on the support platform 1 as a whole, thereby improving the stability of the mounting shaft 2 supporting the support platform 1 as a whole. When assembling the support platform 1, first connect the support platform 3 to the mounting shaft 2, and at this time, the isolation member 26 can be docked to the top of the cylinder 25. Then the second plate body 15 is fixed on the top of the support seat 3 by bolts and other connecting members with a fixing function. At this time, the isolation member 26 passes through the top surface of the second plate body 15 and is evenly distributed on the several air holes 151 of the second plate body 15. Finally, the first plate body 14 connected with the positioning column 142 and the top block 143 is placed on the top of the second plate body 15, and the positioning groove 144 formed on the first plate body 14 is embedded in the positioning protrusion 152 formed on the second plate body 15, and then the first plate body 14 is fixed to the second plate body 15 by bolts and other connecting members with a fixing function. It should be noted that the flange 145 formed on the periphery of the first plate body 14 can play a certain guiding role for the chemicals flowing down when the wafer 4 is cleaned, so that the chemicals can be thrown away from the surface of the first plate body 14 when the mounting shaft 2 drives the support table 1 to rotate as a whole, and the cover body formed on the second plate body 15 can protect the support seat 3 and the mounting shaft 2 inside the cover body 15, and guide away the chemicals flowing down along the edge of the support table 1.

[0039] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

[0040] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0041] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A Bernoulli wafer support device, characterized in that: include: A support platform and a mounting shaft, wherein the support platform is connected to the top end of the mounting shaft, an air path is formed in the mounting shaft, a plurality of first through holes are concentrically distributed on the top surface of the support platform, an air cavity connected to the air path is formed in the support platform, and the air cavity is connected to the plurality of first through holes; A plurality of second through holes are concentrically distributed on the top surface of the support platform, and the distance between the second through hole and the center of the top surface of the support platform is greater than the distance between the first through hole and the center of the top surface of the support platform. The air cavity is connected to the plurality of second through holes, and gas is introduced into the air cavity from the bottom end of the gas path. The gas flows out from the first through hole through the air cavity to adsorb the wafer, and the gas flows out from the second through hole through the air cavity to blow away the drugs on the edge of the wafer.

2. The Bernoulli wafer support device according to claim 1, characterized in that: The side wall of the installation shaft is connected to an air inlet near the bottom end, the air inlet is communicated with the air circuit, the bottom end of the installation shaft is connected to a water inlet, an installation channel is formed coaxially with the air circuit in the installation shaft, and the air circuit and the installation channel are isolated from each other; The top of the installation channel forms an opening at the center of the top surface of the support platform, and the bottom end of the water channel is connected to the water inlet. The water channel goes upward along the installation channel and passes through the opening of the installation channel, and pure water is sprayed onto the front side of the wafer through the water channel.

3. The Bernoulli wafer support device according to claim 2, characterized in that: The support platform comprises a first plate body and a second plate body, the first plate body covers the upper surface of the second plate body, the top surface of the mounting shaft is connected to the lower surface of the second plate body, and the second plate body forms a plurality of air holes connected to the air path around the center; The air cavity is formed on the lower surface of the first plate body, and the air cavity is formed into a cylindrical trough body. One end of the first through hole and the second through hole is connected to the arc-shaped side wall of the air cavity, and the other end is inclined upward in the first plate body to the surface of the first plate body. A water hole connected to the air cavity is provided in the center of the first plate body, and the top of the water channel passes through the water hole.

4. The Bernoulli wafer support device according to claim 3, characterized in that: The first plate body is penetrated by a plurality of positioning posts and a top block, the surface of the top block forms an arc-shaped protrusion that contacts the front side of the wafer, the positioning posts have a holding post that fits the edge of the wafer, and the holding posts of the plurality of positioning posts form a shape consistent with the wafer.

5. The Bernoulli wafer support device according to claim 3, characterized in that: The gas path and the installation channel are isolated from each other by a concentrically arranged cylinder, the top of the cylinder is connected to an isolation piece near the installation channel, the isolation piece forms a mounting hole in the center, and the mounting hole is connected to the installation channel; The isolation piece passes through a plurality of air holes opened on the second plate body, and the mounting hole is connected with the water hole. The water path passes through the mounting hole and the water hole upward along the mounting channel. The gas enters the air path from the air inlet, passes through the air holes, and enters the air cavity, and then flows out from the first through hole and the second through hole.

6. The Bernoulli wafer support device according to claim 5, characterized in that: The outer wall of the installation shaft is coaxially fixed with the support seat, and the top surface of the support seat is in contact with the lower surface of the second plate body.

7. The Bernoulli wafer support device according to claim 6, characterized in that: A positioning protrusion is formed on the top surface of the second plate body, a positioning groove adapted to and engaged with the positioning protrusion is formed on the lower surface of the first plate body, a sealing ring is arranged at the joint between the first plate body and the second plate body, and the top surface of the first plate body extends away from the center to form a flange.

8. The Bernoulli wafer support device according to claim 7, characterized in that: A plurality of weight-reducing grooves are formed on the lower surface of the first plate body, and a cover body is formed vertically downward at the periphery of the lower surface of the second plate body.

9. The Bernoulli wafer support device according to claim 6, characterized in that: The outer wall of the installation shaft is fixedly connected to the connecting disk.

10. The Bernoulli wafer support device according to claim 5, characterized in that: The top end of the second through hole is formed on the top surface of the first plate body near where the positioning column and the top block pass through.

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