Power MOS device with protection effect

Abstract

The utility model discloses a power MOS (Metal Oxide Semiconductor) device with a protection effect, which relates to the technical field of power MOS devices and comprises a packaging shell, mounting feet are fixedly mounted on the left side and the right side below the outer surface of the packaging shell, soldering tin pins are fixedly arranged at the front end of the packaging shell, a circuit board is fixedly mounted on the inner surface of the packaging shell, and the circuit board is fixedly connected with the packaging shell. A pole piece is inserted and fixed above the rear side of the outer surface of the packaging shell, and the pole piece and the soldering tin pins are connected with the circuit board. Compared with an existing common power MOS device, the power MOS device with the protection effect can protect internal electric parts of equipment, can effectively and quickly dissipate heat, avoids the situation that the equipment is overheated and overloaded due to heat accumulation, can conduct static electricity, and improves the reliability of the power MOS device. The condition that a kernel load of a circuit board is damaged due to static accumulation is effectively prevented, the safety and the stability of the power MOS device in use are greatly improved on the whole, and the protection capability for normal use of equipment is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of power MOS devices, in particular to a power MOS device with protection effect. Background Art

[0002] MOS devices are also known as MOS integrated circuits. MOS integrated circuits are integrated circuits composed of metal-oxide-semiconductor (MOS) field-effect transistors as main components, referred to as MOSIC. MOS integrated circuits are a commonly used integrated circuit and the carrier of MOS devices.

[0003] For example, the public document with application number 202321706588.3 discloses a power MOS device. The utility model achieves a trapezoidal structure between the welding block and the bracket by connecting a heat dissipation component to the circuit board and the output module above the base, so that the bracket is evenly connected with heat sinks above and below, which facilitates the heat dissipation of the MOS device and avoids damage to the power MOS device when it is connected to the output of an electrical appliance, thereby increasing the service life of the power MOS device. However, when the power MOS device is in use, the circuit board will generate a large amount of heat. It is difficult to dissipate the heat in a timely and effective manner with only a single heat sink, which can easily cause the equipment to overheat and overload, shortening the service life of the equipment. In addition, the current on the circuit board continues to flow, which will also generate a certain amount of static electricity. The static electricity cannot be effectively guided and released. The accumulation of a large amount of static electricity will affect or even damage the core of the circuit board motherboard, which is not conducive to the use of the device.

[0004] Therefore, in view of this, the existing structural deficiencies are studied and improved, and a power MOS device with a protective effect is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide a power MOS device with protection effect to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a power MOS device with a protective effect, comprising a packaging shell, wherein mounting feet are fixedly installed on both left and right sides below the outer surface of the packaging shell, a solder pin is fixedly arranged at the front end of the packaging shell, a circuit board is fixedly installed on the inner surface of the packaging shell, a pole piece is plugged and fixed on the upper rear side of the outer surface of the packaging shell, the pole piece and the solder pin are evenly connected to the circuit board, a closing piece is arranged on the top of the packaging shell, and a buffer piece is arranged below the outer surface of the packaging shell.

[0007] Preferably, the closing member comprises a copper sealing plate fixed above the outer surface of the packaging shell by bolts, and fins are fixedly provided on both left and right sides above the surface of the sealing plate.

[0008] Preferably, the closure member further comprises a ventilation mesh groove opened on the inner side of the fin above the surface of the sealing plate, and an exhaust fan is fixedly installed in the middle of the ventilation mesh groove above the surface of the sealing plate.

[0009] Preferably, the sealing member further comprises guide rods fixedly installed at four corners below the surface of the sealing plate, and the guide rods are made of metal and the bottom ends thereof are in contact with the surface of the circuit board.

[0010] Preferably, the buffer component comprises a damping spring rod fixedly installed in the middle portion below the outer surface of the packaging shell, and the damping spring rod is composed of a damper and a spring.

[0011] Preferably, the buffer component further comprises a movable plate fixedly mounted at the bottom end of the damping spring rod, and an insulating pad is fixedly disposed below the surface of the movable plate.

[0012] Preferably, the insulating pad is made of rubber, and the bottom end of the insulating pad is kept level with the bottom of the mounting foot.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model can protect the internal electrical components of the equipment through the arrangement of the sealing member, the sealing plate, the fin, the ventilation mesh slot, the exhaust fan and the guide rod, and can effectively and quickly dissipate the heat to avoid the overheating and overload of the equipment caused by the heat accumulation. It can also conduct static electricity to effectively prevent the damage of the circuit board core load caused by the accumulation of static electricity. Overall, the safety and stability of the use of power MOS devices are greatly improved, and the protection capability of the normal use of the equipment is greatly improved;

[0015] 2. The utility model provides a buffer, a damping spring rod, a movable plate and an insulating pad. When the equipment is assembled and used, the vibration force generated is transmitted, causing the movable plate to displace and squeeze the damping spring rod, so that the damper is used to buffer the vibration impact, avoiding loosening of internal electrical parts due to excessive vibration, and further improving the protection capability of the entire equipment. At the same time, the insulating pad is soft rubber, which can avoid the adhesion and flow of static electricity, and can also avoid friction damage between the movable plate and the assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the separation structure of the sealing member and the packaging shell of the utility model;

[0018] Figure 3 This is a schematic diagram of the solder pin removal structure of the utility model.

[0019] In the figure: 1. packaging shell; 2. mounting foot; 3. solder pin; 4. circuit board; 5. pole piece; 6. closure; 601. sealing plate; 602. fin; 603. ventilation mesh slot; 604. exhaust fan; 605. guide rod; 7. buffer; 701. damping spring rod; 702. movable plate; 703. insulating pad. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] like Figure 1-Figure 2 As shown, a power MOS device with a protective effect comprises a packaging shell 1, mounting feet 2 are fixedly installed on both left and right sides of the lower outer surface of the packaging shell 1, a solder pin 3 is fixedly arranged at the front end of the packaging shell 1, a circuit board 4 is fixedly installed on the inner surface of the packaging shell 1, a pole piece 5 is plugged and fixed on the upper rear side of the outer surface of the packaging shell 1, the pole piece 5 and the solder pin 3 are evenly connected to the circuit board 4, a closing member 6 is arranged on the upper side of the packaging shell 1, and a buffer member 7 is arranged on the lower side of the outer surface of the packaging shell 1.

[0022] By adopting the above technical solution, the sealing member 6 can be used to protect the internal electrical components of the device, and can effectively and quickly dissipate the heat to avoid the overheating and overload of the device caused by heat accumulation. It can also conduct static electricity to effectively prevent the accumulation of static electricity from causing damage to the core load of the circuit board 4;

[0023] The buffer member 7 is used to prevent the internal electrical components from loosening due to excessive vibration.

[0024] Furthermore, the closing member 6 includes a copper sealing plate 601 fixed by bolts above the outer surface of the packaging shell 1 , and fins 602 are fixedly provided on the left and right sides above the surface of the sealing plate 601 .

[0025] By adopting the above technical solution, the sealing plate 601 is assembled with the packaging shell 1 to seal and protect the internal circuit board 4;

[0026] The sealing plate 601 is made of copper and can quickly absorb heat and exchange heat with the outside air, thereby reducing the temperature of the device;

[0027] The fins 602 can assist the sealing plate 601 in improving its own heat exchange performance.

[0028] Furthermore, the sealing member 6 also includes a ventilation mesh groove 603 opened on the inner side of the fin 602 above the surface of the sealing plate 601 , and an exhaust fan 604 is fixedly installed in the middle of the ventilation mesh groove 603 above the surface of the sealing plate 601 .

[0029] By adopting the above technical solution, the ventilation mesh slot 603 can disperse the excess hot air that has not been exchanged in time, thereby avoiding the accumulation of a large amount of hot air;

[0030] The exhaust fan 604 can accelerate the exhaust rate of the internal hot air flow.

[0031] Furthermore, the sealing member 6 also includes guide rods 605 fixedly installed at the four corners below the surface of the sealing plate 601 . The guide rods 605 are made of metal and the bottom ends thereof are in contact with the surface of the circuit board 4 .

[0032] By adopting the above technical solution, the guide rod 605 is attached to the surface of the circuit board 4 to guide the electrostatic current and transmit it to the surface of the sealing plate 601 for dissipation.

[0033] like Figure 1 and Figure 3 As shown, the buffer member 7 further includes a movable plate 702 fixedly mounted at the bottom end of the damping spring rod 701 , and an insulating pad 703 is fixedly disposed below the surface of the movable plate 702 .

[0034] By adopting the above technical solution, the movable plate 702 transmits the impact vibration, and the extrusion damping spring rod 701 uses the damper to buffer the vibration impact.

[0035] Furthermore, the insulating pad 703 is made of rubber, and the bottom end of the insulating pad 703 is kept level with the bottom of the mounting foot 2 .

[0036] By adopting the above technical solution, the insulating pad 703 is made of soft rubber, which can prevent the adhesion and flow of static electricity, and can also prevent the movable plate 702 and the assembly from being damaged by friction.

[0037] Working principle: When using the power MOS device with protective effect, first, the sealing plate 601 and the packaging shell 1 are assembled to seal and protect the internal circuit board 4, then the device and the assembly are fixed by screwing the bolts through the mounting feet 2, and the solder pins 3 are melted and connected to the assembled circuit parts using a heating gun. After power is turned on, it can be used normally. During use, the copper sealing plate 601 can quickly absorb heat and exchange heat with the outside air, thereby reducing the temperature of the device. The fins 602 can assist the sealing plate 601 in its own heat exchange performance, and the ventilation mesh slots 603 can dissipate the excess hot air flow that has not been exchanged in time, and the exhaust fan 604 can Accelerate the internal hot air flow discharge rate to dissipate heat for the equipment. The guide rod 605 is attached to the surface of the circuit board 4 to guide the electrostatic current and transmit it to the surface of the sealing plate 601 for dissipation, thereby protecting the mainboard core of the circuit board 4. At the same time, the vibration force generated during the assembly and use of the equipment will cause the movable plate 702 to shift and squeeze the damping spring rod 701, thereby using the damper to buffer the vibration impact. The insulating pad 703 is soft rubber, which can avoid the adhesion and flow of electrostatic current, and can also avoid friction damage between the movable plate 702 and the assembly. This is the working principle of the power MOS device with a protective effect.

Claims

1. A power MOS device with a protective effect, comprising a packaging shell (1), characterized in that: Mounting feet (2) are fixedly mounted on both left and right sides of the lower outer surface of the packaging shell (1); a solder pin (3) is fixedly arranged at the front end of the packaging shell (1); a circuit board (4) is fixedly mounted on the inner surface of the packaging shell (1); a pole piece (5) is plugged and fixed on the upper rear side of the outer surface of the packaging shell (1); the pole piece (5) and the solder pin (3) are evenly connected to the circuit board (4); a closing piece (6) is arranged on the upper side of the packaging shell (1); and a buffer piece (7) is arranged on the lower side of the outer surface of the packaging shell (1).

2. A power MOS device with protection effect according to claim 1, characterized in that: The closing member (6) comprises a copper sealing plate (601) fixed by bolts above the outer surface of the packaging shell (1), and fins (602) are fixedly provided on both the left and right sides above the surface of the sealing plate (601).

3. The power MOS device with protection effect according to claim 1, characterized in that: The closure member (6) further comprises a ventilation mesh groove (603) provided on the inner side of the fin (602) above the surface of the sealing plate (601), and an exhaust fan (604) is fixedly installed in the middle of the ventilation mesh groove (603) above the surface of the sealing plate (601).

4. The power MOS device with protection effect according to claim 1, characterized in that: The sealing member (6) further comprises guide rods (605) fixedly mounted at four corners below the surface of the sealing plate (601); the guide rods (605) are made of metal and the bottom ends thereof are in contact with the surface of the circuit board (4).

5. The power MOS device with protection effect according to claim 1, characterized in that: The buffer component (7) comprises a damping spring rod (701) fixedly installed in the middle portion below the outer surface of the packaging shell (1); the damping spring rod (701) is composed of a damper and a spring.

6. The power MOS device with protection effect according to claim 1, characterized in that: The buffer member (7) further comprises a movable plate (702) fixedly mounted at the bottom end of the damping spring rod (701), and an insulating pad (703) is fixedly arranged below the surface of the movable plate (702).

7. A power MOS device with protection effect according to claim 6, characterized in that: The insulating pad (703) is made of rubber, and the bottom end of the insulating pad (703) is kept level with the bottom of the mounting foot (2).

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