Grinding wheel used in sapphire wafer chamfering process

By designing a hollow disc-shaped grinding wheel body, using annular grooves and hollow design, the diameter of the sapphire wafer is not removed during the chamfering process, solving the problem of the grinding outer diameter of the existing grinding wheel, achieving a longer service life and higher wafer quality.

CN222768155UActive Publication Date: 2025-04-18HARBIN ZHIGUI OPTOELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202421431439.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-21
Publication Date
2025-04-18
Estimated Expiration
2034-06-21

AI Technical Summary

Technical Problem

Existing grinding wheels will grind the outer diameter of the sapphire during chamfering of the sapphire wafer, affecting the size of its available parts, and lack special grinding wheels that do not change the maximum outer diameter of the sapphire.

Method used

A hollow disc-shaped grinding wheel body is designed, with an arc section with a concave cross-section, and an annular groove is provided to accommodate the middle part of the outer ring of the sapphire wafer, and debris are discharged through high-speed rotation and hollow design to avoid removing the diameter of the sapphire.

Benefits of technology

It is realized that the shape of the chamfered circumference is changed without removing the sapphire wafer diameter, extending the service life of the grinding wheel, reducing the generation of edge collapse and mechanical stress, and improving the quality of the wafer.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the field of sapphire wafer processing, relates to a grinding wheel used in a sapphire wafer chamfering process, and aims to solve the problem that a grinding wheel which is specially used for sapphire chamfering and does not change the maximum outer diameter of sapphire does not exist at present. According to the scheme, the grinding wheel comprises a grinding wheel body which is in a hollow disc shape, the inner circle of the grinding wheel body is used for being connected with high-rotating-speed grinding equipment, the section of the outer ring of the grinding wheel body is an inwards-concave arc section, a groove is formed in the middle of the arc section, and a circle of groove forms an annular groove formed in the outer ring of the grinding wheel body; the outer ring of the grinding wheel body is used for grinding and chamfering the outer ring of the sapphire wafer, the annular groove is used for containing the middle portion of the outer ring of the sapphire wafer and discharging chippings generated when the sapphire wafer is ground, and the scheme can achieve the chipping discharging effect, so that generation of edge breakage and mechanical stress generated by the grinding wheel on the wafer are reduced, and the service life of the sapphire wafer is prolonged. And the effect of prolonging the service life can be achieved.
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