Fixing tool for semiconductor wafer test

By driving the motor to swing the turntable and the lever, the swing rod and connecting rod are moved, the mating and clamping of multiple clamps is achieved, which solves the problems of blocking the detection range and chip damage by traditional fixing devices, and achieves complete and accurate detection of the wafer.

CN222768217UActive Publication Date: 2025-04-18NANTONG SHIXIN SEMICON EQUIP CO LTD
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Patent Information

Application Number
CN202421603822.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-09
Publication Date
2025-04-18
Estimated Expiration
2034-07-09

AI Technical Summary

Technical Problem

Traditional wafer detection fixtures will block the detection range and easily cause damage to the wafer, making it impossible to achieve a one-time complete detection.

Method used

By driving the motor to drive the turntable, the lever on the edge of the turntable drives the round head plate to swing, so that the connecting rod can move the first swing rod and the second swing rod in the opposite direction. Multiple clamps cooperate to clamp the wafer to form a placement groove to fix and detect the wafer.

Benefits of technology

It effectively avoids the barrier problem during wafer detection, ensures the integrity and accuracy of detection, prevents chip position deviation, and is suitable for wafers of different sizes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a fixing tool for testing a semiconductor wafer, and relates to the technical field of wafer detection and fixing. A fixing tool assembly is arranged on the workbench. The fixing tool assembly comprises a first swing rod and a second swing rod. The same ends of the first swing rod and the second swing rod are provided with a connecting rod through a rotating shaft in a matched mode. A first fixing block, a second fixing block and a matching block are further installed between the first swing rod and the second swing rod in a matched mode. The matching block is located between the first fixing block and the second fixing block. Sliding grooves are formed in the sides, close to the matching block, of the first fixing block and the second fixing block. A first group of clamping plates are arranged in the sliding grooves of the first fixing block and the second fixing block; sliding grooves are formed in the two sides of the matching block. A second group of clamping plates are arranged in the sliding grooves in the two sides of the matching block; the cooperation among the plurality of clamping plates is realized through the swinging of the first swing rod and the second swing rod, and the clamping and fixing of the wafer by the grooves in the clamping plates are effectively realized.
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Description

Technical Field

[0001] The utility model specifically relates to the technical field of wafer detection and fixing, in particular to a fixing tool for semiconductor wafer testing. Background Art

[0002] Semiconductor chip: A semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. Not only silicon chips, but also common ones include gallium arsenide (gallium arsenide is toxic, so don't be curious to disassemble some low-quality circuit boards), germanium and other semiconductor materials. Semiconductors also have trends like cars.

[0003] After the wafer is processed, it is necessary to conduct effective inspection on the wafer to ensure the production quality of the wafer and to ensure that there will be no malfunctions during use. However, when traditional wafers are inspected, a transmission fixed clamping device is used to clamp and fix the wafer. When the wafer is inspected, the fixing device will block the inspection range of the wafer, so that the wafer cannot be effectively inspected in one go. Moreover, due to the low quality of the wafer material, the traditional fixing device can easily damage the wafer.

[0004] After searching, Chinese patent publication number CN202122333704.9 discloses a semiconductor wafer clamping tool; including a base, a rotating component is rotatably connected to the top of the base, two support components and a main support rod are provided on the top of the moving component, the two support components are located on the left and right sides of the main support rod, and one end of the two support components and the main support rod is provided with a clamping component, the clamping component includes a spiral rod, a knob, a second slider, an upper fixed frame, a fan-shaped frame, a fixed shaft, a fixed card, a fixed rod, a connecting rod, a rubber block, a fixed groove, a first slider, a lower fixed frame, and a bracket, and a semiconductor wafer is provided on the inner side of the clamping component;

[0005] The structure in the above patent, when installing and fixing the wafer, places the wafer on the bracket, and then uses the fixing rod to press the wafer, so that the fixing rod and the bracket cooperate to fix the wafer. In this way, when the wafer is inspected by the detection equipment, the fixing rod will block the surface of the wafer, which cannot effectively ensure the complete detection effect of the detection equipment on the wafer, thus greatly reducing the working efficiency of the clamping tooling.

[0006] In view of the above situation, we provide a fixed tool for semiconductor chip testing. In this device, the turntable is driven to rotate by a driving motor, and the lever on the edge of the turntable drives the round head plate to swing. When the round head plate swings, the connecting rod drives the first swing arm and the second swing arm to move in two opposite directions. In the process of moving the swing arm, the first matching clamp and the second matching clamp are matched with the first group of clamps and the second group of clamps to clamp and fix the wafer by multiple clamps. The wafer is placed in the placement groove formed by the multiple clamps, so that when the wafer is tested, the top of the wafer will not be blocked, and the detection position of the wafer can be effectively fixed through the cooperation of multiple clamps to prevent deviation during detection. Utility Model Content

[0007] The purpose of the utility model is to provide a fixing tool for semiconductor wafer testing, in which a connecting rod drives a first swing arm and a second swing arm to move in two opposite directions. During the movement of the swing arm, the first matching clamping plate and the second matching clamping plate are matched with the first group of clamping plates and the second group of clamping plates, so as to achieve the clamping and fixing of the wafer by multiple clamping plates; so as to solve the problems of the above-mentioned background technology.

[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0009] A fixed tool for semiconductor wafer testing, comprising a workbench; a fixed tool assembly is arranged on the workbench; the fixed tool assembly comprises a first swing arm and a second swing arm; a connecting rod is installed on the same end of the first swing arm and the second swing arm through a rotating shaft; a first fixed block, a second fixed block and a matching block are also installed between the first swing arm and the second swing arm; wherein the matching block is located in the middle of the first fixed block and the second fixed block; a sliding groove is provided on one side of the first fixed block and the second fixed block close to the matching block; a first group of clamping plates are arranged in the sliding grooves of the first fixed block and the second fixed block; sliding grooves are provided on both sides of the matching block; and a second group of clamping plates are arranged in the sliding grooves on both sides of the matching block.

[0010] As a further technical solution of the utility model, the first rocker arm and the second rocker arm are fixedly mounted with a second mating splint and a first mating splint, and the second mating splint and the first mating splint are symmetrically arranged; the second mating splint and the first mating splint are located in the middle position on both sides of the first group of splints and the second group of splints.

[0011] As a further technical solution of the utility model, the connecting rod is fixedly installed on the side away from the second fixed block and the round head plate is equipped with a shift rod inside; the shift rod is installed on the curved rod structure at the edge of the turntable; the edge of the turntable is provided with multiple holes for facilitating the installation of the curved rod structure.

[0012] As a further technical solution of the utility model, the edge of the concave cavity at the bottom of the turntable is integrally provided with teeth, which mesh with the driving gear; the driving gear is fixedly mounted on the output shaft of the driving motor.

[0013] As a further technical solution of the utility model, the first group of clamps, the second group of clamps, the first matching clamps and the matching ends of the second matching clamps are all provided with grooves for facilitating the placement of wafers.

[0014] As a further technical solution of the utility model, a slider is provided at the bottom of the first swing arm and the second swing arm; the slider is installed in cooperation with a slide rail fixedly installed on the workbench.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The utility model, when in use, drives the turntable to rotate by driving the motor, and the lever installed on the turntable drives the round head plate to swing, so that the round head plate drives the first swing rod and the second swing rod to rotate in opposite directions, so that the second matching clamping plate fixedly installed on the first swing rod and the second swing rod and the first matching clamping plate cooperate with the first group of clamping plates and the second group of clamping plates, so that a groove for placing the wafer is formed inside the plurality of clamping plates, and the wafer is placed in the groove, so that the wafer is effectively fixed and the detection position is determined, and the position of the wafer is prevented from being offset during detection;

[0017] According to the utility model, when the first swing rod moves forward, the second matching clamping plate moves forward in translation, and the second swing rod moves backward, and the first set of clamping plates and the second set of clamping plates slide clockwise in the sliding grooves of the first fixed block or the second fixed block and the edge of the matching block respectively, so that the grooves on the edges of the multiple clamping plates form a placement groove, which is convenient for fixing and installing the wafer, and effectively determines the detection position of the wafer;

[0018] According to the utility model, when the first swing arm moves backward, the second swing arm moves forward to realize the separation of multiple clamping plates, and when the ends of the first swing arm and the second swing arm overlap, the wafer in the placement groove is taken out, and by installing the lever in different holes of the turntable, when the first swing arm and the second swing arm are controlled, the swing range thereof can be effectively controlled, and wafers of different sizes can be effectively clamped. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0020] Figure 2 This utility model Figure 1 Partial structure diagram.

[0021] Figure 3 This utility model Figure 1Schematic diagram of the rear structure.

[0022] Figure 4 This utility model Figure 1 Top view of the .

[0023] Figure 5 This utility model Figure 1 Bottom view of the bottom structure.

[0024] In the figure: 1-workbench, 2-fixed tooling assembly, 20-first swing arm, 21-second swing arm, 22-first fixed block, 23-second fixed block, 24-matching block, 25-first group of clamps, 26-second group of clamps, 27-slide groove, 28-slider, 29-slide rail, 210-connecting rod, 211-round head plate, 212-first matching clamp, 213-second matching clamp, 3-turntable, 4-driving motor, 5-teeth, 6-driving gear, 7-shift lever. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-5 In an embodiment of the utility model, a fixed tool for semiconductor wafer testing comprises a workbench 1; a fixed tool assembly 2 is arranged on the workbench 1; the fixed tool assembly 2 comprises a first swing arm 20 and a second swing arm 21; a connecting rod 210 is installed at the same end of the first swing arm 20 and the second swing arm 21 through a rotating shaft; a first fixed block 22, a second fixed block 23 and a matching block 24 are also installed between the first swing arm 20 and the second swing arm 21; wherein the matching block 24 is located in the middle position of the first fixed block 22 and the second fixed block 23; a slide groove 27 is provided on one side of the first fixed block 22 and the second fixed block 23 close to the matching block 24; a first group of clamping plates 25 are arranged in the slide grooves of the first fixed block 22 and the second fixed block 23; slide grooves 27 are provided on both sides of the matching block 24; and a second group of clamping plates 26 are provided in the slide grooves 27 on both sides of the matching block 24.

[0027] To be more specific, the first rocker arm 20 and the second rocker arm 21 are fixedly mounted with a second mating plate 213 and a first mating plate 212, and the second mating plate 213 and the first mating plate 212 are symmetrically arranged; the second mating plate 213 and the first mating plate 212 are located in the middle position on both sides of the first group of plates 25 and the second group of plates 26.

[0028] By adopting the above technical solution, when in use, the turntable 3 is driven to rotate by the driving motor 4, and the turntable 3 is driven by the crankshaft transmission process, so that the lever 7 on the crankshaft drives the round head plate 211 to swing, so that the round head plate 211 drives the first swing rod 20 and the second swing rod 21 to rotate in opposite directions, so that the second matching clamping plate 213 and the first matching clamping plate 212 fixedly installed on the first swing rod 20 and the second swing rod 21 cooperate with the first group of clamping plates 25 and the second group of clamping plates 26, so that a groove for placing a wafer is formed inside the multiple clamping plates, and the wafer is placed in the groove, which effectively ensures the fixation of the wafer and the determination of the detection position, and prevents the position of the wafer from being offset during detection;

[0029] The connecting rod 210 is fixedly installed with the round head plate 211 on one side away from the second fixed block 23, and the round head plate 211 is equipped with a lever 7 inside; the lever 7 is installed on the curved rod structure at the edge of the turntable 3; the edge of the turntable 3 is provided with multiple holes for facilitating the installation of the curved rod structure.

[0030] In this embodiment, teeth 5 are integrally provided on the edge of the concave cavity at the bottom of the turntable 3 , and the teeth 5 mesh with the driving gear 6 ; the driving gear 6 is fixedly mounted on the output shaft of the driving motor 4 .

[0031] By adopting the above technical solution, when the first rocker arm 20 moves forward, the second matching clamping plate 213 translates forward, the second rocker arm 21 moves backward, and the first group of clamping plates 25 and the second group of clamping plates 26 slide clockwise in the slide grooves 27 on the edges of the first fixed block 22 or the second fixed block 23 and the matching block 24, respectively, so that the grooves on the edges of multiple clamping plates form placement grooves, which is convenient for fixing and installing the chip, and at the same time effectively determines the detection position of the chip.

[0032] In this embodiment, the first set of clamping plates 25, the second set of clamping plates 26, the first matching clamping plate 212 and the second matching clamping plate 213 are all provided with grooves at their matching ends for easy placement of the wafer;

[0033] The first swing arm 20 and the second swing arm 21 are both provided with a slider 28 at the bottom; the slider 28 is installed in cooperation with a slide rail 29 fixedly installed on the workbench 1 .

[0034] By adopting the above technical solution, when the first swing arm 20 moves backward, the second swing arm 21 moves forward to realize the separation of multiple clamps. When the ends of the first swing arm 20 and the second swing arm 21 overlap, the wafer in the placement slot is taken out. By installing the lever 7 in different holes of the turntable 3, when controlling the first swing arm 20 and the second swing arm 21, the swing range thereof can be effectively controlled, and wafers of different sizes can be effectively clamped.

[0035] The working principle of the utility model is as follows: when in use, the turntable 3 is driven to rotate by the driving motor 4, and the lever 7 installed on the turntable 3 drives the round head plate 211 to swing, so that the round head plate 211 drives the first swing rod 20 and the second swing rod 21 to rotate in opposite directions, so that the second matching clamping plate 213 and the first matching clamping plate 212 fixedly installed on the first swing rod 20 and the second swing rod 21 cooperate with the first group of clamping plates 25 and the second group of clamping plates 26, so that a groove for placing a wafer is formed inside the multiple clamping plates, and the wafer is placed in the groove, so as to effectively ensure the fixation of the wafer and the determination of the detection position, and prevent the position of the wafer from being offset during detection;

[0036] When the first swing bar 20 moves forward, the second matching clamping plate 213 translates forward, the second swing bar 21 moves backward, and the first set of clamping plates 25 and the second set of clamping plates 26 slide clockwise in the slide grooves 27 on the edges of the first fixed block 22 or the second fixed block 23 and the matching block 24, respectively, so that the grooves on the edges of the multiple clamping plates form placement grooves, which is convenient for fixing and installing the wafer, and effectively determines the detection position of the wafer;

[0037] When the first swing arm 20 moves backward, the second swing arm 21 moves forward to separate the multiple clamps. When the ends of the first swing arm 20 and the second swing arm 21 overlap, the wafer in the placement slot is taken out. By installing the lever 7 in different holes of the turntable 3, the swing range of the first swing arm 20 and the second swing arm 21 can be effectively controlled, so that wafers of different sizes can be effectively clamped.

[0038] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0039] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A fixture for semiconductor wafer testing, characterized in that: The invention comprises a workbench (1); a fixing tool assembly (2) is arranged on the workbench (1); the fixing tool assembly (2) comprises a first swing rod (20) and a second swing rod (21); a connecting rod (210) is mounted on the same end of the first swing rod (20) and the second swing rod (21) through a rotating shaft; a first fixing block (22), a second fixing block (23) and a matching block (24) are mounted between the first swing rod (20) and the second swing rod (21); the matching block (24) is located in the middle of the first fixing block (22) and the second fixing block (23); a sliding groove (27) is provided on one side of the first fixing block (22) and the second fixing block (23) close to the matching block (24); a first group of clamping plates (25) are arranged in the sliding grooves of the first fixing block (22) and the second fixing block (23); sliding grooves (27) are provided on both sides of the matching block (24); and a second group of clamping plates (26) are arranged on the sliding grooves (27) on both sides of the matching block (24).

2. A fixture for semiconductor wafer testing according to claim 1, characterized in that: The first swing arm (20) and the second swing arm (21) are fixedly mounted with a second matching clamping plate (213) and a first matching clamping plate (212); the second matching clamping plate (213) and the first matching clamping plate (212) are symmetrically arranged; the second matching clamping plate (213) and the first matching clamping plate (212) are located in the middle of both sides of the first group of clamping plates (25) and the second group of clamping plates (26).

3. A fixture for semiconductor wafer testing according to claim 1, characterized in that: The side of the connecting rod (210) away from the second fixing block (23) is fixedly mounted to the round head plate (211), and a lever (7) is provided inside the round head plate (211); the lever (7) is mounted on a curved rod structure at the edge of the turntable (3); and a plurality of holes are provided on the edge of the turntable (3) for facilitating the installation of the curved rod structure.

4. A fixture for semiconductor wafer testing according to claim 3, characterized in that: The inner edge of the concave cavity at the bottom of the rotating disk (3) is integrally provided with teeth (5), and the teeth (5) mesh with the driving gear (6); the driving gear (6) is fixedly mounted on the output shaft of the driving motor (4).

5. A fixture for semiconductor wafer testing according to claim 4, characterized in that: The mating ends of the first group of clamping plates (25), the second group of clamping plates (26), the first mating clamping plate (212) and the second mating clamping plate (213) are all provided with grooves for facilitating the placement of wafers.

6. A fixture for semiconductor wafer testing according to claim 1, characterized in that: The bottom of the first swing arm (20) and the bottom of the second swing arm (21) are both provided with a sliding block (28); the sliding block (28) is mounted in cooperation with a sliding rail (29) fixedly mounted on the workbench (1).

Citation Information

Patent Citations

  • Semiconductor wafer clamping tool

    CN215701193U