Thin film deposition apparatus

Abstract

The utility model discloses a thin film deposition device which comprises a cavity, the cavity comprises a first chamber and a second chamber, the thin film deposition device further comprises a first pressure regulating assembly, the first pressure regulating assembly comprises a first pressure regulating pipeline, the first pressure regulating pipeline is connected with an exhaust port of the first chamber, and the second pressure regulating pipeline is connected with an exhaust port of the second chamber. The pressure regulator is used for regulating the pressure of the first chamber; and the second pressure regulating assembly comprises a second pressure regulating pipeline, and the second pressure regulating pipeline is connected with the exhaust port of the second cavity and used for regulating the pressure of the second cavity. According to the utility model, the first pressure regulating pipeline and the second pressure regulating pipeline are respectively used for regulating the pressure of the first chamber and the second chamber, so that the constant pressure in the chambers on the two sides is ensured, and the uniformity of the thickness of a film is improved.

Description

Technical Field

[0001] The embodiment of the utility model relates to the technical field of thin film deposition, and in particular to a thin film deposition device. Background Art

[0002] The atomic layer film deposition process mainly includes the following steps: introducing precursor A gas into the reaction chamber; introducing inert gas into the reaction chamber for purging; introducing precursor B gas into the reaction chamber; introducing inert gas into the reaction chamber for purging; repeating this process for multiple cycles to obtain a film of a certain thickness. In the existing double-sided chamber, different precursor gases need to be transported to the lid end using a gas delivery system. After the precursor gas is transported to the lid end, it is first controlled by a valve and then distributed to the first chamber and the second chamber through a three-way joint. In some double-sided chambers, a single valve is used to control the single-station air intake, that is, the precursor gas is first distributed to the first side and the second side through a three-way joint, and then the valve controls the flow of the gas into the first chamber and the second chamber. In the film deposition process, the closer the gas flow into the double-sided chamber, the more constant the pressure in the double-sided chamber, and the better the overall quality of the film. Therefore, how to ensure the constant pressure in the double-sided chamber to improve the uniformity of the film thickness is an urgent problem to be solved. Utility Model Content

[0003] The embodiment of the utility model provides a thin film deposition device, which can ensure constant pressure in double-sided chambers and improve the uniformity of film thickness.

[0004] In a first aspect, an embodiment of the utility model provides a thin film deposition device, comprising: a cavity, comprising a first chamber and a second chamber, the thin film deposition device also comprising: a first pressure regulating component, the first pressure regulating component comprising a first pressure regulating pipeline, the first pressure regulating pipeline is connected to a first exhaust port of the first chamber, and is used to regulate the pressure of the first chamber; a second pressure regulating component, the second pressure regulating component comprises a second pressure regulating pipeline, the second pressure regulating pipeline is connected to a second exhaust port of the second chamber, and is used to regulate the pressure of the second chamber.

[0005] Further, a first reading member and a first adjusting member are provided in the first pressure regulating pipeline, the first reading member is close to the first exhaust port, the first adjusting member is located at an end of the first reading member away from the first exhaust port, and the first adjusting member is used to regulate the pressure of the first chamber according to a first pressure value of the first chamber read by the first reading member; and / or a second reading member and a second adjusting member are provided in the second pressure regulating pipeline, the second reading member is close to the second exhaust port, the second adjusting member is located at an end of the second reading member away from the second exhaust port, and the second adjusting member is used to regulate the pressure of the second chamber according to a second pressure value of the second chamber read by the second reading member.

[0006] Furthermore, the air extraction member is connected to an end of the first pressure regulating pipeline and an end of the second pressure regulating pipeline.

[0007] Further, the vacuum component includes a first vacuum component and a second vacuum component, the first vacuum component is connected to the end of the first pressure regulating pipeline, and the second vacuum component is connected to the end of the second pressure regulating pipeline; or the thin film deposition device also includes a connecting pipeline, the connecting pipeline includes a main connecting pipeline, a first branch connecting pipeline and a second branch connecting pipeline, one end of the main connecting pipeline is connected to the vacuum component, and the other end is connected to one end of the first branch connecting pipeline and the second branch connecting pipeline, the other end of the first branch connecting pipeline is connected to the end of the first pressure regulating pipeline, and the other end of the second branch connecting pipeline is connected to the end of the second pressure regulating pipeline.

[0008] Furthermore, the thin film deposition device also includes an air intake regulating component, and the air intake regulating component includes a first air intake pipeline, and the first air intake pipeline is connected to a first air inlet in the first chamber.

[0009] Furthermore, an intake regulating valve is provided on the first intake pipeline.

[0010] Furthermore, the air intake adjustment component also includes a second air intake pipeline, and the second air intake pipeline is connected to the second air intake port in the second chamber.

[0011] Furthermore, an intake regulating valve is provided on the second intake pipeline.

[0012] Furthermore, a heating plate is provided in the first chamber.

[0013] Furthermore, a heating plate is provided in the second chamber.

[0014] The embodiment of the utility model provides a thin film deposition device. The thin film deposition device includes a cavity, the cavity includes a first chamber and a second chamber, and the thin film deposition device also includes: a first pressure regulating component, the first pressure regulating component includes a first pressure regulating pipeline, the first pressure regulating pipeline is connected to the exhaust port of the first chamber, and is used to regulate the pressure of the first chamber; a second pressure regulating component, the second pressure regulating component includes a second pressure regulating pipeline, the second pressure regulating pipeline is connected to the exhaust port of the second chamber, and is used to regulate the pressure of the second chamber. The embodiment of the utility model regulates the pressure of the first chamber and the second chamber respectively through the first pressure regulating pipeline and the second pressure regulating pipeline, thereby ensuring the constant pressure in the chambers on both sides and improving the uniformity of the film thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A schematic diagram of a thin film deposition device provided by an embodiment of the utility model;

[0017] Figure 2 A schematic diagram of a thin film deposition method according to an embodiment of the present invention;

[0018] Figure 3 A schematic diagram of a sub-process of a thin film deposition method provided by an embodiment of the utility model;

[0019] Figure 4 A schematic diagram of a thin film deposition method according to another embodiment of the present invention

[0020] Figure 5 A schematic diagram of a sub-process of a thin film deposition method provided by another embodiment of the utility model;

[0021] Reference numerals:

[0022] 11. cavity; 111. first chamber; 1111. first exhaust port; 1112. first sub-inlet; 1113. second sub-inlet; 112. second chamber; 1121. second exhaust port; 1122. third sub-inlet; 1123. fourth sub-inlet; 12. first pressure regulating pipeline; 121. first reading member; 122. first regulating member; 13. second pressure regulating pipeline; 131. second reading member; 132. second regulating member; 14. exhaust member; 15. connecting pipeline; 151. main connecting pipe Road; 152, the first branch connecting pipeline; 153, the second branch connecting pipeline; 16, the first air intake pipeline; 161, the first air intake branch pipeline; 162, the second air intake branch pipeline; 17, the second air intake pipeline; 171, the third air intake branch pipeline; 172, the fourth air intake branch pipeline; 181, the first air intake regulating valve; 182, the second air intake regulating valve; 183, the third air intake regulating valve; 184, the fourth air intake regulating valve; 19, the heating plate; 20, the first air intake main road; 21, the second air intake main road. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0025] It should also be understood that the terms used in this utility model specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in this utility model specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0026] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0027] As used in this specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0028] See also Figure 1 , Figure 1 A schematic diagram of a thin film deposition device provided by an embodiment of the utility model; Figure 1 As shown, the thin film deposition device includes a cavity 11, a first pressure regulating assembly and a second pressure regulating assembly, wherein the cavity 11 includes a first chamber 111 and a second chamber 112; the first pressure regulating assembly includes a first pressure regulating pipeline 12, the first pressure regulating pipeline 12 is connected to a first exhaust port 1111 of the first chamber 111, and is used to regulate the pressure of the first chamber 111; the second pressure regulating assembly includes a second pressure regulating pipeline 13, the second pressure regulating pipeline 13 is connected to a second exhaust port 1121 of the second chamber 112, and is used to regulate the pressure of the second chamber 112. It should be noted that, in this embodiment, the first chamber 111 and the second chamber 112 are pressure-regulated respectively by the first pressure regulating pipeline 12 and the second pressure regulating pipeline 13, thereby ensuring that the pressure in the chambers on both sides is constant and improving the uniformity of the film thickness.

[0029] Please continue reading Figure 1In this embodiment, a first reading member 121 and a first adjusting member 122 are provided in the first pressure regulating pipeline 12, the first reading member 121 is close to the first exhaust port 1111, and the first adjusting member 122 is located at an end of the first reading member 121 away from the first exhaust port 1111, and the first adjusting member 122 is used to regulate the pressure of the first chamber 111 according to the first pressure value of the first chamber 111 read by the first reading member 121; and / or a second reading member 131 and a second adjusting member 132 are provided in the second pressure regulating pipeline 13, the second reading member 131 is close to the second exhaust port 1121, and the second adjusting member 132 is located at an end of the second reading member 131 away from the second exhaust port 1121, and the second adjusting member 132 is used to regulate the pressure of the second chamber 112 according to the second pressure value of the second chamber 112 read by the second reading member 131. It should be noted that, in this embodiment, the first reading member 121 and the second adjusting member are both chamber pressure gauges, and the chamber pressure gauges are used to measure the pressure in the first chamber 111 and the second chamber 112; the first adjusting member 122 and the second adjusting member 132 are both butterfly valves, and the butterfly valves are provided with valve plates, and the opening angle of the valve plates can be adjusted. It can be understood that the butterfly valve in the first pressure regulating pipeline 12 regulates the pressure of the first chamber 111 according to the first pressure value of the first chamber 111 read by the chamber pressure gauge; the butterfly valve in the second pressure regulating pipeline 13 regulates the pressure of the second chamber 112 according to the second pressure value of the second chamber 112 read by the chamber pressure gauge.

[0030] Please continue reading Figure 1 In this embodiment, the thin film deposition device further includes a vacuum pump 14, and the vacuum pump 14 is connected to the end of the first pressure regulating pipeline 12 and the end of the second pressure regulating pipeline 13. It should be noted that in this embodiment, the vacuum pump 14 is a vacuum pump. It can be understood that by controlling the opening angle of the butterfly valve in the first pressure regulating pipeline 12, the vacuum pump's vacuum capacity can be adjusted, and then the pressure of the first chamber 111 can be adjusted; by controlling the opening angle of the butterfly valve in the second pressure regulating pipeline 13, the vacuum pump's vacuum capacity can be adjusted, and then the pressure of the second chamber 112 can be adjusted.

[0031] Please continue reading Figure 1In this embodiment, the vacuum component 14 includes a first vacuum component 14 and a second vacuum component 14, the first vacuum component 14 is connected to the end of the first pressure regulating pipeline 12, and the second vacuum component 14 is connected to the end of the second pressure regulating pipeline 13; or the thin film deposition device also includes a connecting pipeline 15, the connecting pipeline 15 includes a main connecting pipeline 151, a first branch connecting pipeline 152 and a second branch connecting pipeline 153, one end of the main connecting pipeline 151 is connected to the vacuum component 14, and the other end is connected to one end of the first branch connecting pipeline 152 and the second branch connecting pipeline 153, the other end of the first branch connecting pipeline 152 is connected to the end of the first pressure regulating pipeline 12, and the other end of the second branch connecting pipeline 153 is connected to the end of the second pressure regulating pipeline 13. It is understandable that when the vacuum member 14 includes the first vacuum member 14 and the second vacuum member 14, it indicates that the present embodiment includes two vacuum pumps, one of which is connected to the end of the first pressure regulating pipeline 12, and the other is connected to the end of the second pressure regulating pipeline 13, and the first chamber 111 and the second chamber 112 are evacuated respectively by the two vacuum pumps. It should be noted that in the present embodiment, when there is only one vacuum pump, the first pressure regulating pipeline 12 is connected to the vacuum pump via the first branch connecting pipeline 152 and the main connecting pipeline 151, and the second pressure regulating pipeline 13 is connected to the vacuum pump via the second branch connecting pipeline 153 and the main connecting pipeline 151. It is understandable that at this time, the first chamber 111 and the second chamber 112 are evacuated by one vacuum pump.

[0032] Please continue reading Figure 1In the present embodiment, the thin film deposition device further includes an air intake regulating component, and the air intake regulating component includes a first air intake pipeline 16 and a second air intake pipeline 17, the first air intake pipeline 16 is connected to the first air inlet in the first chamber 111, and the second air intake pipeline 17 is connected to the second air inlet in the second chamber 112, and the first air intake pipeline 16 and the second air intake pipeline 17 are both provided with air intake regulating valves, and the air intake amounts in the first chamber 111 and the second chamber 112 are regulated by the air intake regulating valves. It should be noted that, in the present embodiment, the first air intake pipeline 16 includes a first air intake branch pipeline 161 and a second air intake branch pipeline 162, the second air intake pipeline 17 includes a third air intake branch pipeline 171 and a fourth air intake branch pipeline 172, the first air intake branch pipeline 161, the second air intake branch pipeline 162, the third air intake branch pipeline 171 and the fourth air intake branch pipeline 172 are all provided with the air intake regulating valve. For the convenience of distinction, the air intake regulating valve on the first air intake branch pipeline 161 is referred to as the first air intake regulating valve 181, the air intake regulating valve on the second air intake branch pipeline 162 is referred to as the second air intake regulating valve 182, and the air intake regulating valve on the second air intake branch pipeline 162 is referred to as the second air intake regulating valve 182. The air intake regulating valve on the third air intake branch pipeline 171 is called the third air intake regulating valve 183, and the air intake regulating valve on the fourth air intake branch pipeline 172 is called the fourth air intake regulating valve 184; the first air intake port includes a first sub-air intake port 1112 and a second sub-air intake port 1113, and the second air intake port includes a third sub-air intake port 1122 and a fourth sub-air intake port 1123. It can be understood that the air intake amount in the first chamber 111 can be adjusted by the first air intake regulating valve 181 and the second air intake regulating valve 182; the air intake amount in the second chamber 112 can be adjusted by the third air intake regulating valve 183 and the fourth air intake regulating valve 184. It should also be noted that, in the present embodiment, the air intake regulating component also includes a first air intake main line 20 and a second air intake main line 21, one end of the first air intake main line 20 is connected to an end of the first air intake branch line 161 away from the first sub-air inlet 1112 and to an end of the third air intake branch line 171 away from the third sub-air inlet 1122; the other end of the first air intake main line 20 is connected to the first gas delivery system; one end of the second air intake main line 21 is connected to an end of the second air intake branch line 162 away from the second sub-air inlet 1113 and to an end of the fourth air intake branch line 172 away from the fourth sub-air inlet 1123; the other end of the second air intake main line 21 is connected to the second gas delivery system.It can be understood that in this embodiment, the gas in the first air intake main line 20 is distributed to the first air intake branch line 161 and the third air intake branch line 171 through a three-way joint, so that the gas in the first air intake main line 20 can enter the first chamber 111 and the second chamber 112; the gas in the second air intake main line 21 is distributed to the second air intake branch line 162 and the fourth air intake branch line 172 through a three-way joint, so that the gas in the second air intake main line 21 can enter the first chamber 111 and the second chamber 112.

[0033] Please continue reading Figure 1 In this embodiment, a heating plate 19 is provided in each of the first chamber 111 and the second chamber 112. When thin film deposition is performed, a wafer is placed on the heating plate 19, and the wafer is used for thin film deposition.

[0034] See also Figure 2 , Figure 2 Schematic diagram of the thin film deposition method provided by the embodiment of the utility model. The thin film deposition method is described in detail below. Figure 2 As shown, the method includes the following steps S110-S120.

[0035] S110, obtaining preset chamber pressures of the first chamber and the second chamber;

[0036] S120, regulating the pressure of the first chamber and the second chamber through a first pressure regulating pipeline and a second pressure regulating pipeline according to the chamber pressure.

[0037] In this embodiment, during the thin film deposition process, the preset chamber pressures of the first chamber and the second chamber are first obtained; understandably, the chamber pressures of the first chamber and the second chamber are set equal. The first chamber and the second chamber are pressure-regulated through the first pressure regulating pipeline and the second pressure regulating pipeline according to the chamber pressures.

[0038] In some embodiments, such as the present embodiment, Figure 3 As shown, the step S120 may include steps S121-S124.

[0039] S121, reading the pressure in the first chamber by a first reading element in the first pressure regulating pipeline to obtain a first pressure;

[0040] S122, reading the pressure in the second chamber by a second reading element in the second pressure regulating pipeline to obtain a second pressure;

[0041] S123, if the first pressure is not equal to the chamber pressure, adjusting the first regulating member in the first pressure regulating pipeline to control the pressure in the first chamber;

[0042] S124. If the second pressure is not equal to the chamber pressure, adjust the second regulating member in the second pressure regulating pipeline to control the pressure in the second chamber.

[0043] In this embodiment, the first pressure regulating pipeline includes a first adjusting member and a first reading member, and the second pressure regulating pipeline includes a second adjusting member and a second reading member. The first adjusting member and the second adjusting member are butterfly valves, and the butterfly valve is provided with a valve plate, and the opening angle of the valve plate can be adjusted; the first reading member and the second reading member are chamber pressure gauges. After obtaining the preset chamber pressures of the first chamber and the second chamber, first read the pressure in the first chamber through the first reading element to obtain the first pressure; read the pressure in the second chamber through the second reading element to obtain the second pressure; then compare the first pressure and the second pressure; if the first pressure is not equal to the chamber pressure, indicating that the pressure in the first chamber is not equal to the preset chamber pressure, then adjust the first adjusting member in the first pressure regulating pipeline, that is, adjust the opening angle of the valve plate, so as to control the pressure in the first chamber, thereby ensuring that the pressure in the first chamber is constant; if the second pressure is not equal to the chamber pressure, indicating that the pressure in the second chamber is not equal to the preset chamber pressure, then adjust the second adjusting member in the second pressure regulating pipeline, that is, adjust the opening angle of the valve plate, so as to control the pressure in the second chamber, thereby ensuring that the pressure in the second chamber is constant.

[0044] More specifically, if the first pressure is greater than the chamber pressure, indicating that the pressure in the first chamber is too high, the opening angle of the first regulating member is increased, the air pumping capacity of the first chamber is increased, and the pressure in the first chamber is reduced; understandably, if the first pressure is less than the chamber pressure, indicating that the pressure in the first chamber is too low, the opening angle of the first regulating member is reduced, the air pumping capacity of the first chamber is reduced, and the pressure in the first chamber is increased. If the second pressure is greater than the chamber pressure, indicating that the pressure in the second chamber is too high, the opening angle of the second regulating member is increased, the air pumping capacity of the second chamber is increased, and the pressure in the second chamber is reduced; understandably, if the second pressure is less than the chamber pressure, indicating that the pressure in the second chamber is too low, the opening angle of the second regulating member is reduced, the air pumping capacity of the second chamber is reduced, and the pressure in the second chamber is increased. It should be noted that in this embodiment, by controlling the pressures of the first chamber and the second chamber to be constant, the uniformity of the film thickness can be improved.

[0045] Figure 4 A schematic diagram of a thin film deposition method according to another embodiment of the present invention is shown in FIG. Figure 4 As shown, in this embodiment, the method includes steps S110-S150. That is, in this embodiment, after step S120 of the above embodiment, the method further includes steps S130-S150.

[0046] S130, detecting the thickness of the thin film deposited in the first chamber and the second chamber to obtain a first thin film thickness and a second thin film thickness;

[0047] S140, adjusting the opening time of the intake regulating valves in the first intake pipeline and the second intake pipeline according to the first film thickness, the second film thickness and a preset film thickness difference;

[0048] S150, returning to the step of regulating the pressures of the first chamber and the second chamber through the first pressure regulating pipeline and the second pressure regulating pipeline according to the chamber pressure, until a thin film deposition end condition is met.

[0049] In this embodiment, during the thin film deposition process, the thickness of the deposited thin film in the first chamber and the second chamber is detected by a thin film thickness detection device to obtain a first film thickness and a second film thickness; the opening time of the intake regulating valve in the first intake pipeline and the second intake pipeline is adjusted according to the first film thickness, the second film thickness and the preset film thickness difference; specifically, Figure 5As shown, the S140 may include steps S141-S145: S141, calculating the absolute value of the difference between the first film thickness and the second film thickness to obtain the film thickness difference; S142, if the film thickness difference is greater than the preset film thickness difference, determining that the film thickness in the first chamber does not match the film thickness in the second chamber; S143, if the film thickness in the first chamber does not match the film thickness in the second chamber, comparing the first film thickness with the second film thickness; S144, if the first film thickness is greater than the second film thickness, shortening the opening time of the air intake regulating valve in the first air intake line; S145, if the first film thickness is less than the second film thickness, shortening the opening time of the air intake regulating valve in the second air intake line. It can be understood that if the film thickness in the first chamber matches the film thickness in the second chamber, there is no need to adjust the opening time of the air intake regulating valve in the first air intake line and the second air intake line. It should be noted that, in the present embodiment, the preset film thickness difference is 0.2, and in other embodiments, the preset film thickness difference can also be set according to requirements, which is not specifically limited here; for ease of understanding, assuming that the first film thickness is X, the second film thickness is Y, and the preset film thickness difference is 0.2, if |XY|>0.2, it is determined that the film thickness in the first chamber does not match the film thickness in the second chamber; X is compared with Y; if X is greater than Y, indicating that the film thickness in the first chamber is thicker, the opening time of the air intake regulating valve in the first air intake pipeline is shortened, specifically, the opening time of the first air intake regulating valve and the second air intake regulating valve is shortened; if the first film thickness is less than the second film thickness, indicating that the film thickness in the second chamber is thicker, the opening time of the air intake regulating valve in the second air intake pipeline is shortened; specifically, the opening time of the third air intake regulating valve and the fourth air intake regulating valve is shortened. It should also be noted that, in the present embodiment, after adjusting the opening time of the air intake regulating valves in the first air intake pipe and the second air intake pipe according to the first film thickness, the second film thickness and the preset film thickness difference, it is necessary to return to the step of regulating the pressure of the first chamber and the second chamber through the first pressure regulating pipe and the second pressure regulating pipe according to the chamber pressure, that is, return to execute step S120 until the film deposition end condition is met, wherein the film deposition end condition may be receiving a film deposition end command to keep the pressure in the first chamber and the second chamber constant and improve the uniformity of the film thickness.

[0050] To summarize, in this embodiment, the pressure of the first chamber is regulated by the first reading member and the first adjusting member, and the pressure of the second chamber is regulated by the second reading member and the second adjusting member. After the opening time of the first air intake regulating valve, the second air intake regulating valve, the third air intake regulating valve and the fourth air intake regulating valve are adjusted according to the film thickness in the first chamber and the film thickness in the second chamber, it is necessary to return to regulate the pressure of the first chamber by the first reading member and the first adjusting member, and regulate the pressure of the second chamber by the second reading member and the second adjusting member, thereby ensuring the constant pressure in the chambers on both sides and improving the uniformity of the film thickness.

[0051] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A thin film deposition device, comprising a chamber, wherein the chamber comprises a first chamber and a second chamber, wherein: The thin film deposition device further comprises: A first pressure regulating assembly, the first pressure regulating assembly comprising a first pressure regulating pipeline, the first pressure regulating pipeline being connected to a first exhaust port of the first chamber and being used for regulating the pressure of the first chamber; The second pressure regulating assembly comprises a second pressure regulating pipeline connected to the second exhaust port of the second chamber for regulating the pressure of the second chamber.

2. The thin film deposition device according to claim 1, characterized in that: A first reading member and a first adjusting member are provided in the first pressure regulating pipeline, the first reading member is close to the first exhaust port, the first adjusting member is located at an end of the first reading member away from the first exhaust port, and the first adjusting member is used to adjust the pressure of the first chamber according to a first pressure value of the first chamber read by the first reading member; and / or A second reading member and a second adjusting member are provided in the second pressure regulating pipeline. The second reading member is close to the second exhaust port, and the second adjusting member is located at an end of the second reading member away from the second exhaust port. The second adjusting member is used to regulate the pressure of the second chamber according to the second pressure value of the second chamber read by the second reading member.

3. The thin film deposition device according to claim 1, characterized in that: The thin film deposition device further includes an air suction component connected to an end of the first pressure regulating pipeline and an end of the second pressure regulating pipeline.

4. The thin film deposition device according to claim 3, characterized in that: The air suction member includes a first air suction member and a second air suction member, the first air suction member is connected to the end of the first pressure regulating pipeline, and the second air suction member is connected to the end of the second pressure regulating pipeline; or The thin film deposition device also includes a connecting pipeline, which includes a main connecting pipeline, a first branch connecting pipeline and a second branch connecting pipeline. One end of the main connecting pipeline is connected to the vacuum component, and the other end is connected to one end of the first branch connecting pipeline and the second branch connecting pipeline. The other end of the first branch connecting pipeline is connected to the end of the first pressure regulating pipeline, and the other end of the second branch connecting pipeline is connected to the end of the second pressure regulating pipeline.

5. The thin film deposition device according to any one of claims 1 to 4, characterized in that: The thin film deposition device further includes an air intake regulating component, wherein the air intake regulating component includes a first air intake pipeline connected to a first air intake port in the first chamber.

6. The thin film deposition device according to claim 5, characterized in that: The first air intake pipeline is provided with an air intake regulating valve.

7. The thin film deposition device according to claim 5, characterized in that: The air intake adjustment assembly also includes a second air intake pipeline, which is connected to a second air intake port in the second chamber.

8. The thin film deposition device according to claim 7, characterized in that: The second air intake pipeline is provided with an air intake regulating valve.

9. The thin film deposition device according to any one of claims 1 to 4, characterized in that: A heating plate is arranged in the first chamber.

10. The thin film deposition device according to any one of claims 1 to 4, characterized in that: A heating plate is arranged in the second chamber.

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