Flexible circuit board and application thereof
By dislocating the conductive parts on the flexible circuit board and using warping during bending to achieve conduction, the accuracy and manufacturing difficulty in the automatic closing technology of folding mobile phone screen is solved, and the effect of automatically controlling the opening or closing of the screen is achieved, improving the user experience and reducing costs.
Patent Information
- Application Number
- CN202421245212.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-03
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-06-03
AI Technical Summary
When the prior art realizes the automatic shutdown of the folded mobile phone screen, there are problems such as poor accuracy, high cost, high manufacturing difficulty and difficult to compatible with the existing manufacturing process.
A flexible circuit board is designed to provide the first conductive part and the second conductive part by misaligning the warping generated when the flexible circuit board is bent, so that the first conductive part slips and contacts the second conductive part to be turned on, thereby controlling the opening or closing of the screen.
It realizes automatic detection of the bent state of the mobile phone screen, which is simple, efficient and easy to integrate with the existing technology, improves the user experience, and shows significant advantages at the technical and economic levels.
Smart Images
Figure CN222776379U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of circuit boards, and in particular to a flexible circuit board and its application. Background Art
[0002] In order to improve the user experience of foldable phones, the screen will automatically turn off when the protective cover is closed. This not only helps protect user privacy, but also saves power. The current technical means to achieve this function mainly include magnetic sensing, mechanical sensing, optical sensing and software solutions. However, these solutions have their own limitations in practical applications, such as poor accuracy, high cost, high manufacturing difficulty, and poor compatibility with existing manufacturing processes. Utility Model Content
[0003] In view of this, the present application proposes a flexible circuit board to solve at least one of the above technical problems.
[0004] In addition, it is also necessary to provide a flexible circuit board assembly and an electronic device including the flexible circuit board.
[0005] One embodiment of the present application provides a flexible circuit board, comprising a first substrate, a second substrate and an adhesive layer. The first substrate comprises a first flexible substrate layer and a first circuit layer formed on the surface of the first flexible substrate layer. The first circuit layer comprises a first conductive portion, and the first conductive portion is exposed from the first flexible substrate layer. The second substrate comprises a second flexible substrate layer and a second circuit layer formed on the surface of the second flexible substrate layer. The second circuit layer comprises a second conductive portion, and the second conductive portion is exposed from the second flexible substrate layer. The adhesive layer is provided between the first flexible substrate layer and the second flexible substrate layer to connect the first substrate to the second substrate, and the adhesive layer has a cavity.
[0006] Along the thickness direction of the flexible circuit board, the orthographic projections of the first conductive part and the second conductive part are both located in the cavity. Along the extension direction of the flexible circuit board, the first conductive part and the second conductive part are staggered. The distance between the first conductive part and the second conductive part is 2 mm to 3 mm, and the first conductive part is configured to be in contact with and conductive with the second conductive part.
[0007] In one embodiment, along the extension direction of the flexible circuit board, the length of the cavity is 10 mm to 30 mm.
[0008] In one embodiment, the first flexible substrate layer has a first opening that penetrates the first flexible substrate layer along the thickness direction, and the first conductive portion is exposed from the first flexible substrate layer through the first opening. The second flexible substrate layer has a second opening that penetrates the second flexible substrate layer along the thickness direction, and the second conductive portion is exposed from the second flexible substrate layer through the second opening. Both the first opening and the second opening are connected to the cavity.
[0009] In one embodiment, the first substrate further includes a first covering film layer, which is disposed on a surface of the first circuit layer away from the first base material layer. The second substrate further includes a second covering film layer, which is disposed on a surface of the second circuit layer away from the second base material layer.
[0010] In one embodiment, the first flexible substrate layer is polyimide, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane or liquid crystal polymer. The second flexible substrate layer is polyimide, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane or liquid crystal polymer.
[0011] An embodiment of the present application provides a flexible circuit board assembly, comprising a first component, a second component and the flexible circuit board as described above. The first component is embedded in the first substrate and electrically connected to the first conductive portion, and the second component is embedded in the second substrate and electrically connected to the second conductive portion. Along the thickness direction of the flexible circuit board, the orthographic projections of the first component and the second component are both located in the cavity. Along the extension direction of the flexible circuit board, the distance between the first component and the second component is 2 mm to 3 mm, and the first component is configured to be in contact with and conductive with the second component.
[0012] In one embodiment, the first component includes a first electrical connection portion, and the second component includes a second electrical connection portion. The first electrical connection portion is configured to be in contact with the second electrical connection portion, thereby achieving conduction between the first component and the second component.
[0013] In one embodiment, the first flexible substrate layer has a first opening penetrating the first flexible substrate layer in a thickness direction, and the first component is received in the first opening. The second flexible substrate layer has a second opening penetrating the second flexible substrate layer in a thickness direction, and the second component is received in the second opening.
[0014] In one implementation, the first component is a passive component, and the second component is a passive component.
[0015] An embodiment of the present application provides an electronic device, which includes the flexible circuit board assembly as described above.
[0016] The present application displaces the first conductive part and the second conductive part (or displaces the first component and the second component) in the flexible circuit board so that they have a certain distance, and utilizes the warping generated when the flexible circuit board is bent to make the first conductive part (first component) slide and contact and conduct with the second conductive part (second component), thereby controlling the screen to turn off. The technical solution of the present application is simple, efficient and easy to integrate with the existing technology. It can automatically detect the opening and closing state of the bending of the mobile phone screen, and then control the opening or closing of the screen. The technical solution of the present application can not only improve the user experience, but also show significant advantages in technology and economy. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic structural diagram of a flexible circuit board according to one embodiment of the present application.
[0018] Figure 2 for Figure 1 The structure diagram of the flexible circuit board shown is in a bent state.
[0019] Figure 3 It is a schematic structural diagram of a flexible circuit board assembly according to one embodiment of the present application.
[0020] Figure 4 for Figure 3 The structure diagram of the flexible circuit board assembly shown is in a bent state.
[0021] Figure 5 This is a schematic diagram of the module composition of an electronic device according to an embodiment of the present application.
[0022] Main component symbols
[0023] Flexible circuit board 100
[0024] Flexible circuit board assembly 200
[0025] Electronic equipment 1000
[0026] First substrate 10
[0027] Second substrate 20
[0028] Adhesive layer 30
[0029] The first flexible substrate layer 11
[0030] First circuit layer 12
[0031] The first conductive portion 121
[0032] First opening 110
[0033] The first covering film layer 13
[0034] The second flexible substrate layer 21
[0035] The second circuit layer 22
[0036] The second conductive portion 221
[0037] The second opening 210
[0038] The second covering film layer 23
[0039] Cavity 301
[0040] First Components 201
[0041] Second component 202
[0042] First electrical connection portion 203
[0043] Second electrical connection portion 204
[0044] Thickness direction Z
[0045] Extension direction X
[0046] The following specific implementation manner will further illustrate the embodiments of the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0047] Unless otherwise defined, all technical and scientific terms used herein are identical with the meanings generally understood by those skilled in the art of the technical field belonging to the embodiments of the present application. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present application. In the embodiments, if specific conditions are not specified, they are carried out according to the conditions recommended by normal conditions or manufacturers. If the manufacturer is not specified for reagents or instruments, they are all conventional products that can be obtained by commercial purchase.
[0048] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0049] It will be understood that when a layer is referred to as being "on" another layer, it can be directly on the other layer or there can be intervening layers therebetween. Conversely, when a layer is referred to as being "directly on" another layer, there are no intervening layers. When a component is referred to as being "fixed to," "mounted to," or "disposed on" another component, it can be directly on the other component or there can also be an intervening component. The term "and / or" as used herein includes all and any combinations of one or more of the associated listed items.
[0050] Here, the embodiments of the present application are described with reference to the cross-sectional views, which are schematic diagrams of the idealized embodiments (and intermediate configurations) of the present application. Thus, it is foreseeable that the shapes of the diagrams are different due to manufacturing processes and / or tolerances. Therefore, the embodiments of the present application should not be interpreted as being limited to the specific shapes of the regions illustrated here, but should include deviations in shapes such as those produced due to manufacturing. The regions shown in the figures are themselves only schematic, and their shapes are not intended to illustrate the actual shapes of the devices, and are not intended to limit the scope of the present application.
[0051] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0052] In the structural design of flexible circuit boards, Air Gap is usually used to improve the bending life. However, during the bending process, as the bending area shifts, the plates on both sides of the Air Gap area are usually prone to unilateral warping due to misaligned forces. Through simulation analysis, it can be seen that the bending radius of the inner structure of a flexible circuit board with a multi-layer structure is smaller, so the excessive length of the inner structure is bound to move and produce displacement, and the original positions on both sides of the Air Gap area will shift toward the warping. Based on this discovery, the inventor of the present application conceived that this offset can be used to design a flexible circuit board that can realize a switching function. After the flexible circuit board is bent, the circuits or components on both sides of the Air Gap area will touch each other due to the offset and be energized, thereby realizing the switching function, and then realizing the switching (on / off) of the screen. Therefore, the flexible circuit board 100 and its application of the present application are proposed.
[0053] See also Figure 1 and Figure 2In a first aspect, the present application provides a flexible circuit board 100, which includes a first substrate 10, a second substrate 20 and an adhesive layer 30. The first substrate 10 includes a first flexible substrate layer 11 and a first circuit layer 12 formed on a surface of the first flexible substrate layer 11. The first circuit layer 12 includes a first conductive portion 121, and the first conductive portion 121 is exposed from the first flexible substrate layer 11. The second substrate 20 includes a second flexible substrate layer 21 and a second circuit layer 22 formed on a surface of the second flexible substrate layer 21. The second circuit layer 22 includes a second conductive portion 221, and the second conductive portion 221 is exposed from the second flexible substrate layer 21. The adhesive layer 30 is provided between the first substrate 10 and the second substrate 20 to connect the two, and the adhesive layer 30 can be formed of BS glue. Specifically, the adhesive layer 30 is located between the first flexible substrate layer 11 and the second flexible substrate layer 21. The adhesive layer 30 has a cavity 301, and the cavity 301 penetrates the adhesive layer 30 along the thickness direction of the adhesive layer 30. In some embodiments, the cavity 301 is also referred to as an air gap.
[0054] like Figure 1 As shown, along the thickness direction Z of the flexible circuit board 100, the orthographic projections of the first conductive part 121 and the second conductive part 221 are both located in the cavity 301. Along the extension direction X of the flexible circuit board 100, the first conductive part 121 and the second conductive part 221 are staggered, that is, the orthographic projections of the first conductive part 121 and the second conductive part 221 do not overlap. Along the extension direction X of the flexible circuit board 100, the distance between the first conductive part 121 and the second conductive part 221 is 2 mm to 3 mm. The distance between the first conductive part 121 and the second conductive part 221 along the extension direction X is: the distance between the end of the first conductive part 121 close to the second conductive part 221 and the end of the second conductive part 221 close to the first conductive part 121. The extension direction X of the flexible circuit board 100 can be the length direction of the flexible circuit board 100 or the width direction of the flexible circuit board 100, which is not limited in the present application.
[0055] like Figure 1 As shown, when the second substrate 20 is bent toward the direction close to the first substrate 10 (ie Figure 1 The areas separated by the cavity 301 in the two substrates will contact each other. Due to volume limitation, the first substrate 10 and the second substrate 20 will be pressed against each other. Due to asymmetric compression, the upper first substrate 10 has space to slide to the right, causing the flexible circuit board 100 to tilt on the right. This causes the first conductive part 121 of the first substrate 10 to slide to the right until it contacts the second conductive part 221 of the second substrate 20. The first conductive part 121 and the second conductive part 221 are connected, presenting a Figure 2 When the flexible circuit board 100 is applied to a foldable mobile phone, when the mobile phone screen is opened, the flexible circuit board 100 appears as shown in FIG. Figure 1 In the state shown, the first conductive part 121 and the second conductive part 221 are not conducting, thereby controlling the screen to light up; when the mobile phone screen is folded, the flexible circuit board 100 presents as shown Figure 2 In the state shown, the first conductive part 121 is connected to the second conductive part 221, thereby controlling the screen to turn off.
[0056] In the flexible circuit board 100 of the present application, the distance (i.e., displacement distance or offset distance) between the first conductive portion 121 and the second conductive portion 221 on both sides of the cavity 301 can be expressed by the formula Calculated. Among them, r1 is the bending radius of the inner first substrate 10, r2 is the bending radius of the outer second substrate 20, θ is the bending angle, and the bending angle can be 0°~180°, 0° corresponds to the state of the mobile phone screen being opened, and 180° corresponds to the state of the mobile phone being folded. According to the calculation result of the above formula, the distance between the first conductive part 121 and the second conductive part 221 is set to 2mm~3mm, which can not only ensure that the first conductive part 121 and the second conductive part 221 can be turned on after bending to play the role of turning off the screen, but also provide a certain bending stress so that the first conductive part 121 and the second conductive part 221 are not easy to loosen after contact and conduction, and can also prevent the first conductive part 121 and the second conductive part 221 from accidentally touching when the mobile phone is unfolded.
[0057] In some embodiments, the length of the cavity 301 is 10 mm to 30 mm along the extension direction X of the flexible circuit board 100. In this way, the first substrate 10 inside the cavity 301 can be warped to cause the first conductive portion 121 to be offset, and the displacement amount can be sufficient to make the first conductive portion 121 and the second conductive portion 221 contact and conduct.
[0058] In some embodiments, Figure 1 As shown, the first flexible substrate layer 11 has a first opening 110 penetrating the first flexible substrate layer 11 along the thickness direction Z. The first conductive portion 121 is exposed from the first flexible substrate layer 11 through the first opening 110 , and the first opening 110 is connected to the cavity 301 .
[0059] In some embodiments, Figure 1 As shown, the second flexible substrate layer 21 has a second opening 210 penetrating the second flexible substrate layer 21 along the thickness direction Z. The second conductive portion 221 is exposed from the second flexible substrate layer 21 through the second opening 210 , and the second opening 210 is connected to the cavity 301 .
[0060] In some embodiments, Figure 1 As shown, the first substrate 10 further includes a first cover film layer (CVL) 13. The first cover film layer 13 is disposed on the surface of the first circuit layer 12 away from the first flexible substrate layer 11 to prevent the first circuit layer 12 from being invaded by external water vapor or scratched by foreign objects.
[0061] In some embodiments, Figure 1 As shown, the second substrate 20 further includes a second covering film layer 23. The second covering film layer 23 is disposed on the surface of the second circuit layer 22 away from the second flexible substrate layer 21 to prevent the second circuit layer 22 from being invaded by external water vapor or scratched by foreign objects.
[0062] In some embodiments, the first flexible substrate layer 11 is a flexible substrate such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS) or liquid crystal polymer (LCP). In this embodiment, the first flexible substrate layer 11 is PI. The first circuit layer 12 can be formed of copper.
[0063] In some embodiments, the second flexible substrate layer 21 is a flexible substrate such as polyimide, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane or liquid crystal polymer. In this embodiment, the second flexible substrate layer 21 is PI. The second circuit layer 22 can be formed of copper.
[0064] See also Figure 3 and Figure 4 In a second aspect, the present application provides a flexible circuit board assembly 200, which includes a first component 201, a second component 202, and the flexible circuit board 100 as described above. The first component 201 is embedded in the first substrate 10 and electrically connected to the first conductive part 121, and the second component 202 is embedded in the second substrate 20 and electrically connected to the second conductive part 221. The first component 201 and the second component 202 can be embedded in the process of the flexible circuit board 100, which can reduce the difficulty of mounting (bonding) and reduce space, and is perfectly compatible with the existing process.
[0065] Along the thickness direction Z of the flexible circuit board 100, the orthographic projections of the first component 201 and the second component 202 are both located in the cavity 301. Along the extension direction X of the flexible circuit board 100, the distance between the first component 201 and the second component 202 is 2 mm to 3 mm, and the distance refers to the distance between the end of the first component 201 close to the second component 202 and the end of the second component 202 close to the first component 201. Figure 4 As shown, after the flexible circuit board 100 is bent, the first component 201 can be in contact and conduction with the second component 202 .
[0066] In some embodiments, Figure 3 As shown, the first component 201 includes a first electrical connection portion 203, and the first electrical connection portion 203 is arranged toward the cavity 301. The second component includes a second electrical connection portion 204, and the second electrical connection portion 204 is arranged toward the cavity 301. After bending, as shown in FIG. Figure 4 As shown, the first electrical connection portion 203 contacts the second electrical connection portion 204, thereby achieving conduction between the first component 201 and the second component 202. The first electrical connection portion 203 and the second electrical connection portion 204 may be metal pins.
[0067] In some embodiments, Figure 3 and Figure 4 As shown, the first flexible substrate layer 11 has a first opening 110 penetrating the first flexible substrate layer 11 along the thickness direction Z, and the first component 201 is received in the first opening 110. That is, the surface of the first component 201 facing the cavity 301 may be flush with the surface of the first flexible substrate layer 11 facing away from the first circuit layer 12 or slightly higher than the surface of the first flexible substrate layer 11.
[0068] In some embodiments, Figure 3 and Figure 4 As shown, the second flexible substrate layer 21 has a second opening 210 penetrating the second flexible substrate layer 21 along the thickness direction Z, and the second component 202 is received in the second opening 210. That is, the surface of the second component 202 facing the cavity 301 can be flush with the surface of the second flexible substrate layer 21 facing away from the second circuit layer 22 or slightly higher than the surface of the second flexible substrate layer 21.
[0069] In some embodiments, the first component 201 is a passive component, and the second component 202 is a passive component, which may be, but is not limited to, a capacitor. When the flexible circuit board assembly 200 is applied to a folding mobile phone, the first component 201 and the second component 202 can be connected to a capacitance tester, and the principle of a flat capacitor can be used to control the screen on / off. The first component 201 and the second component 202 can also be connected to a controller between the display module of the mobile phone, and the controller can control the screen on / off through electrical connection between the components.
[0070] See also Figure 5 In a third aspect, the present application provides an electronic device 1000, which includes the flexible circuit board assembly 200 as described above. The electronic device 1000 may be, but is not limited to, a foldable mobile phone.
[0071] The present application displaces the first conductive part 121 and the second conductive part 221 (or displaces the first component 201 and the second component 202) in the flexible circuit board 100 so that they have a certain distance, and utilizes the warping generated when the flexible circuit board 100 is bent to make the first conductive part 121 (first component 201) slide and contact and conduct with the second conductive part 221 (second component 202), thereby controlling the screen to turn off. The technical solution of the present application is simple, efficient and easy to integrate with the existing technology, and can automatically detect the opening and closing state of the bending of the mobile phone screen, thereby controlling the opening or closing of the screen. The technical solution of the present application can not only improve the user experience, but also show significant advantages in technology and economy.
[0072] The above descriptions are some specific implementations of the present application, but they are not limited to these implementations in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.
Claims
1. A flexible circuit board, characterized in that: include: A first substrate, comprising a first flexible substrate layer and a first circuit layer formed on a surface of the first flexible substrate layer, wherein the first circuit layer comprises a first conductive portion, and the first conductive portion is exposed from the first flexible substrate layer; A second substrate, comprising a second flexible substrate layer and a second circuit layer formed on a surface of the second flexible substrate layer, wherein the second circuit layer comprises a second conductive portion, and the second conductive portion is exposed from the second flexible substrate layer; and an adhesive layer, disposed between the first flexible substrate layer and the second flexible substrate layer to connect the first substrate with the second substrate, the adhesive layer having a cavity; Among them, along the thickness direction of the flexible circuit board, the orthographic projections of the first conductive part and the second conductive part are both located in the cavity; along the extension direction of the flexible circuit board, the first conductive part and the second conductive part are staggered, the distance between the first conductive part and the second conductive part is 2 mm~3 mm, and the first conductive part is configured to be in contact and conductive with the second conductive part.
2. The flexible circuit board according to claim 1, characterized in that: Along the extension direction of the flexible circuit board, the length of the cavity is 10 mm to 30 mm.
3. The flexible circuit board according to claim 1, characterized in that: The first flexible substrate layer has a first opening penetrating the first flexible substrate layer along the thickness direction, and the first conductive portion is exposed from the first flexible substrate layer through the first opening; the second flexible substrate layer has a second opening penetrating the second flexible substrate layer along the thickness direction, and the second conductive portion is exposed from the second flexible substrate layer through the second opening; the first opening and the second opening are both connected to the cavity.
4. The flexible circuit board according to claim 1, characterized in that: The first substrate further includes a first covering film layer, which is disposed on a surface of the first circuit layer away from the first flexible substrate layer; the second substrate further includes a second covering film layer, which is disposed on a surface of the second circuit layer away from the second flexible substrate layer.
5. The flexible circuit board according to claim 1, characterized in that: The first flexible substrate layer is polyimide, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane or liquid crystal polymer, and the second flexible substrate layer is polyimide, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane or liquid crystal polymer.
6. A flexible circuit board assembly, characterized in that: The flexible circuit board comprises a first component, a second component and the flexible circuit board as claimed in any one of claims 1 to 5; the first component is buried in the first substrate and electrically connected to the first conductive part, and the second component is buried in the second substrate and electrically connected to the second conductive part; along the thickness direction of the flexible circuit board, the orthographic projections of the first component and the second component are both located in the cavity; along the extension direction of the flexible circuit board, the distance between the first component and the second component is 2 mm to 3 mm, and the first component is configured to be in contact and conductive with the second component.
7. The flexible circuit board assembly according to claim 6, characterized in that: The first component includes a first electrical connection portion, and the second component includes a second electrical connection portion. The first electrical connection portion is configured to be contactable with the second electrical connection portion, thereby achieving conduction between the first component and the second component.
8. The flexible circuit board assembly according to claim 6, wherein: The first flexible substrate layer has a first opening penetrating the first flexible substrate layer along the thickness direction, and the first component is accommodated in the first opening; the second flexible substrate layer has a second opening penetrating the second flexible substrate layer along the thickness direction, and the second component is accommodated in the second opening.
9. The flexible circuit board assembly according to claim 6, wherein: The first component is a passive component, and the second component is a passive component.
10. An electronic device, characterized in that: Comprising the flexible circuit board assembly as claimed in claim 9.