Thin plate machining device

Abstract

The utility model belongs to the technical field of part machining, and discloses a thin plate machining device. The device comprises a base, a groove is formed in the base, at least three sets of supporting columns are installed on the bottom face of the groove, the height of the supporting columns is the same, a polygon is defined by the supporting columns, and a thin plate is placed at the top ends of the supporting columns; the problem that in the prior art, due to the fact that residues cannot be thoroughly cleaned, plate machining is inconsistent is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of parts processing, in particular to a thin plate processing device. Background Art

[0002] Under the existing technology, when processing a circular thin plate, the circular plate is placed in a circular groove, and then the base with the circular groove rotates around its own axis, and drives the thin plate to contact the tool to start processing. After the processing is completed, the processing residues in the circular groove need to be cleaned, and then the next group of circular plates are processed. However, there may be residual processing residues after cleaning, and the residues will pad one end of the circular plate, which will cause the next group of circular plates to be placed in the circular groove. There will be a tilting phenomenon, and the circular plate to be processed cannot fit with the bottom surface of the groove, and one side of the circular plate will be tilted, which will cause the circular plate to be installed in the circular groove at an angle. When the circular plate contacts the processing tool, the contact depth of each position with the tool is inconsistent, which will cause errors in the processing of the circular plate, resulting in inconsistent processing of the circular plate and reduced processing accuracy. Utility Model Content

[0003] The utility model aims to provide a thin plate processing device to solve the problem of inconsistent plate processing caused by inability to thoroughly clean residues in the prior art.

[0004] To achieve this purpose, the utility model adopts the following technical solution: the utility model provides a thin plate processing device, including a base, a groove is formed on the base, support columns are installed on the bottom surface of the groove, the support columns have the same height, the support columns include at least three groups, the support columns form a polygon, and a thin plate is placed on the top of the support columns.

[0005] Preferably, a first through hole is formed at the center of the support column base.

[0006] Preferably, the support columns are distributed at equal intervals in the circumferential direction of the first through hole.

[0007] Preferably, the support columns are distributed radially along the radial direction of the base.

[0008] Preferably, a circular chamfer is formed at the junction of the support column and the bottom surface.

[0009] Preferably, the support column has a cylindrical cross-section and is welded to the bottom surface.

[0010] Preferably, arc-shaped chamfers are formed in the circular corners of the groove.

[0011] Preferably, the thin plate processing device further comprises a pressing plate, a stud is passed through the pressing plate, a screw hole is formed at an edge of the base, the stud is screwed into the screw hole, and the pressing plate is pressed onto the thin plate.

[0012] Preferably, the groove is provided with six groups of screw holes at equal intervals in the circumferential direction, and the pressure plates correspond to the screw holes one by one.

[0013] Beneficial effect: When the thin plate processing device of the utility model is processing, the thin plate will be placed on the top surface of the support column so that the thin plate will not contact the bottom surface where residues are easily accumulated. Since the height of the support columns is the same, the plane where the thin plate is located will be parallel to the bottom surface of the groove. Each group of thin plates will be placed on the support column, away from the bottom surface of the groove. The residues left over from processing can also be swept from the support column to the bottom surface, which is convenient for the staff to clean up. The remaining residues cannot affect the position of the thin plate on the support column, so that the depth of the tool entering the thin plate remains consistent, thereby improving the processing accuracy of the thin plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a working schematic diagram of the thin plate processing device of the utility model;

[0015] Figure 2 It is an exploded view of the thin plate processing device of the utility model.

[0016] In the figure: 1, base; 11, groove; 12, support column; 13, first through hole; 14, bottom surface; 2, thin plate; 3, pressure plate; 31, stud. DETAILED DESCRIPTION

[0017] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0018] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0019] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0020] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0021] Under the existing technology, a groove is generally formed on the base. After the thin plate is placed in the groove for fixing, the thin plate on the base in a rotating state is processed by a processing tool. However, since there will be processing residues that cannot be removed in the dead corner of the groove, the installation position of the thin plate will be offset, resulting in processing errors during the processing of the thin plate.

[0022] In order to solve the above problems, Figure 1 to Figure 2 As shown, the utility model provides a thin plate processing device, which includes a base 1, the base 1 is circular, and a groove 11 is formed on the base 1, and the groove 11 is also circular, wherein the groove 11 is coaxial with the base 1, and support columns 12 are installed on the bottom surface 14 of the groove 11, and the support columns 12 have the same height. The support columns 12 include at least three groups, and the support columns 12 are surrounded by a polygon, and a thin plate 2 is placed on the top of the support columns 12.

[0023] In the groove 11 of the base 1 of the utility model, more than three groups of support columns 12 are installed. The arrangement of more than three groups of support columns 12 can ensure the basic stability of the thin plate 2 supported by the support columns 12. The thin plate 2 is placed on the support columns 12, and under the support of the support columns 12, the thin plate 2 is kept away from the bottom surface 14 of the groove 11 which is difficult to clean. Even if there are residues that have not been cleaned in the base 1, the support of the support columns 12 can make the thin plate 2 parallel to the plane where the base 1 is located, and thus when the thin plate 2 is being rotated, the depth of the tool entering the thin plate 2 can be kept consistent, so that the processing accuracy of the thin plate 2 is higher, and even if there is residue on the upper surface of the support columns 12, it is convenient for workers to remove it, and the height installation error of the thin plate 2 can be eliminated in time, thereby improving the accuracy of the processing of the thin plate 2.

[0024] A first through hole 13 is formed at the center of the base 1 of the support column 12. By setting the first through hole 13, the base 1 can clamp the annular workpiece and the processing tool can enter the first through hole 13. The support columns 12 are circumferentially distributed around the first through hole 13, so that the thin plate 2 can be stably placed on the support columns 12, and the thickness surface of the thin plate 2 can be processed, thereby improving the versatility of the thin plate processing device of the utility model, so that the utility model can process more forms of thin plates 2.

[0025] The support columns 12 are evenly spaced around the first through hole 13 to make the placement of the thin plate 2 more stable, thereby preventing the thin plate 2 from shaking excessively during processing, thereby improving the accuracy of the processing.

[0026] The support columns 12 of the utility model are radially distributed along the radial direction of the base 1, and a plurality of support columns 12 are evenly distributed on the bottom surface 14 of the groove 11, so that the support columns 12 can fully support the thin plate 2. When the tool processes a local area of ​​the thin plate 2, the thin plate 2 is less likely to be deformed significantly under the pressure of the tool. The dense support of the support columns 12 suppresses the thin plate 2 from being deformed significantly, thereby improving the accuracy of the processing.

[0027] The support column 12 of the utility model is connected with the bottom surface 14 to form an arc chamfer to avoid dead corners, which makes it easier for workers to clean the residues left over from the processing of the previous set of thin plates 2, avoids the accumulation of residues in the dead corners, and reduces the phenomenon of residues being unable to be cleaned.

[0028] The support column 12 of the present invention has a cylindrical cross section, and the support column 12 is welded to the bottom surface 14 .

[0029] The support column 12 of the utility model can be installed on the bottom surface 14 by welding, which can make the installation of the support column 12 more stable, and thus the thin plate 2 placed on the support column 12 can be more stable. The support column 12 can also be plugged into the bottom surface 14 by plugging. After the support column 12 is completely disassembled, it is convenient for workers to thoroughly clean the bottom surface 14, further reducing the probability of residue entering between the support column 12 and the thin plate 2. The support column 12 can also be thoroughly cleaned to make the processing more precise.

[0030] Similarly, arc-shaped chamfers are formed in the circular corners of the groove 11 to reduce dead corners and facilitate workers to clean processing residues on the bottom surface 14, thereby reducing the amount of residues left on the thin plate 2 and improving the accuracy of processing the thin plate 2.

[0031] The thin plate processing device of the present invention also includes a pressing plate 3, on which a stud 31 is passed, and a screw hole is formed at the edge of the base 1. The stud 31 is screwed into the screw hole, and the pressing plate 3 is pressed onto the thin plate 2. When the tool processes the thin plate 2, the pressing plate 3 on the upper side of the thin plate 2 can fix the thin plate 2 more stably, thereby reducing the amplitude of the shaking of the thin plate 2 and improving the processing accuracy of the thin plate 2.

[0032] The groove 11 of the utility model is provided with six groups of screw holes at equal intervals in the circumferential direction, and the pressure plates 3 correspond to the screw holes one by one. The six groups of pressure plates 3 in the circumferential direction can make the thin plate 2 on the support column 12 be crimped more stably, reduce the amplitude of the shaking of the thin plate 2 during the rotation processing, and improve the processing accuracy of the thin plate 2.

[0033] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A thin plate processing device, characterized in that: The invention comprises a base (1), wherein a groove (11) is formed on the base (1), and support columns (12) are installed on the bottom surface (14) of the groove (11), wherein the support columns (12) have the same height, and the support columns (12) include at least three groups, wherein the support columns (12) form a polygon, and a thin plate (2) is placed on the top of the support columns (12).

2. The thin plate processing device according to claim 1, characterized in that: A first through hole (13) is formed at the center of the base (1) of the support column (12).

3. The thin plate processing device according to claim 2, characterized in that: The support columns (12) are distributed at equal intervals in the circumferential direction of the first through hole (13).

4. The thin plate processing device according to claim 3, characterized in that: The support columns (12) are distributed radially along the radial direction of the base (1).

5. The thin plate processing device according to claim 1, characterized in that: A circular chamfer is formed at the junction of the support column (12) and the bottom surface (14).

6. The thin plate processing device according to claim 1, characterized in that: The support column (12) has a cylindrical cross section, and the support column (12) is welded to the bottom surface (14).

7. The thin plate processing device according to claim 1, characterized in that: Arc chamfers are formed in the circular corners of the groove (11).

8. The thin plate processing device according to claim 1, characterized in that: The thin plate processing device also includes a pressing plate (3), a stud (31) is passed through the pressing plate (3), a screw hole is formed on the edge of the base (1), the stud (31) is screwed into the screw hole, and the pressing plate (3) is pressed onto the thin plate (2).

9. The thin plate processing device according to claim 8, characterized in that: The groove (11) is provided with six groups of screw holes at equal intervals in the circumferential direction, and the pressing plates (3) correspond to the screw holes one by one.

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