Semiconductor slicing device

Abstract

The utility model discloses a semiconductor slicing device. The semiconductor slicing device comprises a slicing machine table; the diamond wire saw is arranged above the slicing machine table, and one end of the diamond wire saw is provided with a cutting part used for cutting a semiconductor; and the transferring assembly is installed at the upper end of the slicing machine table, an installation frame is installed at the upper end of the transferring assembly, a semiconductor fixing assembly is installed at the upper end of the installation frame, the fixing assembly comprises a vertically-arranged adsorption plate, and the end, facing the cutting part, of the adsorption plate is concaved inwards to form a containing groove. According to the utility model, vacuum adsorption is used as a fixing part of the semiconductor, the end face of the semiconductor is installed in the accommodating groove to complete preliminary positioning before slicing, and air suction fixing of the semiconductor is realized through vacuum adsorption. Therefore, the semiconductor crystal column can be fully cut, material waste is avoided, and the production cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing, in particular to a semiconductor slicing device. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Today, the core units of most electronic products, such as computers, mobile phones, or digital recorders, are closely related to semiconductors. In the processing of semiconductors, slicing is often an indispensable step.

[0003] At present, the wire saw is mainly used to cut semiconductors on the market. In order to ensure the cutting quality, a clamp is usually used to fix it before cutting. Since semiconductors are generally cut into sheets, and the clamp is clamped on both sides of the semiconductor, only the part extending out of the clamp can be cut during cutting. As a result, a small amount of semiconductor can only be used as waste each time it is cut, thereby increasing the overall manufacturing cost. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor slicing device in order to solve the above-mentioned problem.

[0005] The technical solution adopted by the utility model is as follows: a semiconductor slicing device, comprising:

[0006] Slicing machine table;

[0007] A diamond wire saw, which is arranged above the slicer table, and one end of the diamond wire saw has a cutting portion for cutting semiconductors;

[0008] A transfer assembly is installed on the upper end of the slicer table, a mounting frame is installed on the upper end of the transfer assembly, a semiconductor fixing assembly is installed on the upper end of the mounting frame, the fixing assembly includes a vertically arranged adsorption plate, the adsorption plate is recessed inwardly toward one end of the cutting portion to form a receiving groove, a plurality of vacuum adsorption holes are evenly distributed inside the receiving groove, and a vacuum pumping assembly connected to the vacuum adsorption holes is arranged at one end of the slicer table.

[0009] In a preferred embodiment, the transfer assembly includes an X-axis electric guide rail and a Y-axis electric guide rail, and the X-axis electric guide rail is installed on the upper end of the slicer table and is located below the cutting part.

[0010] In a preferred embodiment, the Y-axis electric guide rail is installed on the upper end of the electric slider of the X-axis electric guide rail, the cutting part is located within the running track of the Y-axis electric guide rail, and the mounting frame is installed on the upper end of the electric slider of the Y-axis electric guide rail.

[0011] In a preferred embodiment, the vacuum pump assembly includes a vacuum pump and a telescopic hose connected to the vacuum end of the vacuum pump, the telescopic hose is detachably mounted on the back side of the adsorption plate and is connected to the vacuum adsorption hole, and an air inlet connected to the vacuum adsorption hole is installed on the back side of the adsorption plate, and an electrically controlled valve is installed on the air inlet.

[0012] In a preferred embodiment, mounting brackets are integrally provided on both sides of the bottom of the adsorption plate, a mounting plate with threaded holes is fixed to the upper end of the mounting frame, and the mounting brackets are fixed to the mounting plate by bolts.

[0013] In a preferred embodiment, it further comprises a collection box, which is installed on the upper end of the slicer table and located at the discharge side of the cutting part.

[0014] In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:

[0015] 1. In the present invention, vacuum adsorption is used as the fixing part of the semiconductor. Before slicing, the end face of the semiconductor is installed in the receiving groove to complete the preliminary positioning, and the semiconductor is fixed by air suction through vacuum adsorption. Since the whole is positioned only by the end, it is ensured that the semiconductor crystal column can be fully cut, so that there will be no waste of materials and the production cost is reduced;

[0016] 2. In the utility model, a transfer component for moving the fixed component along the X and Y axes is designed below the fixed part of the semiconductor, which can drive the semiconductor to automatically move to the required cutting thickness, with higher accuracy than traditional manual adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0018] Figure 2 It is a three-dimensional structural schematic diagram of the fixing component in the utility model.

[0019] Markings in the figure: 1-slicing machine table, 2-diamond wire saw, 21-cutting part, 3-collection box, 4-fixing component, 41-adsorption plate, 42-mounting support, 43-accommodating groove, 44-vacuum adsorption hole, 45-mounting plate, 5-telescopic hose, 6-vacuum pump, 7-mounting frame, 8-X-axis electric guide rail, 9-Y-axis electric guide rail. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0021] Reference Figure 1-2 A semiconductor slicing device includes: a slicing machine table 1, a diamond wire saw 2, which is arranged above the slicing machine table 1, and one end of the diamond wire saw 2 has a cutting part 21 for cutting semiconductors. Through the continuous circulation of the diamond sand wire in the diamond wire saw 2, the cutting operation of the semiconductor crystal column can be realized.

[0022] The diamond wire saw 2 is a commonly used device in the prior art, and its specific structure is not described in detail. The diamond wire in the cutting part 21 is in a leaking state, thereby satisfying the cutting operation.

[0023] A transfer assembly is installed on the upper end of the slicer table 1. A mounting frame 7 is installed on the upper end of the transfer assembly. A semiconductor fixing assembly 4 is installed on the upper end of the mounting frame 7. The fixing assembly 4 includes a vertically arranged adsorption plate 41. The adsorption plate 41 is recessed inwardly at one end toward the cutting portion 21 to form a receiving groove 43. A plurality of vacuum adsorption holes 44 are evenly distributed inside the receiving groove 43. A vacuum pumping assembly connected to the vacuum adsorption holes 44 is provided at one end of the slicer table 1. Vacuum adsorption is used as the fixing part of the semiconductor. Before slicing, the end face of the semiconductor is installed in the receiving groove 43 to complete preliminary positioning (the depth of the receiving groove 43 is the depth required after slicing), and the semiconductor is vacuumed by the vacuum pumping assembly to achieve air suction fixation. Since the semiconductor can be positioned as a whole only by the end, it is ensured that the semiconductor crystal column can be fully cut, so that there will be no waste of materials, and the overall production cost can be reduced.

[0024] Furthermore, the transfer assembly includes an X-axis electric guide rail 8 and a Y-axis electric guide rail 9. The X-axis electric guide rail 8 is installed at the upper end of the slicer table 1 and is located below the cutting part 21. The Y-axis electric guide rail 9 is installed at the upper end of the electric slider of the X-axis electric guide rail 8. The cutting part 21 is located within the running track of the Y-axis electric guide rail 9. The mounting frame 7 is installed at the upper end of the electric slider of the Y-axis electric guide rail 9. The X-axis electric guide rail 8 and the Y-axis electric guide rail 9 are designed below the fixed part of the semiconductor for moving the fixed assembly along the X and Y axes. The semiconductor can be driven to automatically move to the required cutting thickness, which has higher accuracy than traditional manual adjustment.

[0025] Furthermore, the vacuum pump assembly includes an air pump 6 and a telescopic hose 5 connected to the air suction end of the air pump 6. The telescopic hose 5 can be detachably mounted on the back of the adsorption plate 41 and is connected to the vacuum adsorption hole 44. An air inlet connected to the vacuum adsorption hole 44 is mounted on the back of the adsorption plate 41. An electrically controlled valve is mounted on the air inlet. The air pump 6 is used to draw air to evacuate the connection between the vacuum adsorption hole 44 and the semiconductor to complete the vacuum adsorption operation. When deflation is required, the electrically controlled valve is opened to complete the deflation operation, and the remaining semiconductor can be taken out.

[0026] Furthermore, mounting brackets 42 are integrally provided on both sides of the bottom of the adsorption plate 41, and a mounting plate 45 with threaded holes is fixed to the upper end of the mounting frame 7. The mounting brackets 42 are fixed to the mounting plate 45 by bolts. The adsorption plates 41 of corresponding sizes can be replaced according to semiconductors of different sizes. When disassembling, it is only necessary to remove the bolts and then take out the telescopic hose 5, thereby realizing the cutting of semiconductors of different sizes with very little additional cost.

[0027] Furthermore, it also includes a collecting box 3, which is installed on the upper end of the slicer table 1 and located at the discharge side of the cutting part 21. The cut semiconductor wafers can be collected by the collecting box 3 to prevent the semiconductor wafers from being scattered everywhere.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor slicing device, characterized in that: include: Slicing machine table; A diamond wire saw, which is arranged above the slicer table, and one end of the diamond wire saw has a cutting portion for cutting semiconductors; A transfer assembly is installed on the upper end of the slicer table, a mounting frame is installed on the upper end of the transfer assembly, a semiconductor fixing assembly is installed on the upper end of the mounting frame, the fixing assembly includes a vertically arranged adsorption plate, the adsorption plate is recessed inwardly toward one end of the cutting portion to form a receiving groove, a plurality of vacuum adsorption holes are evenly distributed inside the receiving groove, and a vacuum pumping assembly connected to the vacuum adsorption holes is arranged at one end of the slicer table.

2. A semiconductor slicing device as claimed in claim 1, characterized in that: The transfer assembly includes an X-axis electric guide rail and a Y-axis electric guide rail. The X-axis electric guide rail is installed on the upper end of the slicer table and is located below the cutting part.

3. A semiconductor slicing device as claimed in claim 2, characterized in that: The Y-axis electric guide rail is installed on the upper end of the electric slider of the X-axis electric guide rail, the cutting part is located in the running track of the Y-axis electric guide rail, and the mounting frame is installed on the upper end of the electric slider of the Y-axis electric guide rail.

4. A semiconductor slicing device as claimed in claim 1, characterized in that: The vacuum pump assembly includes an air pump and a telescopic hose connected to the air suction end of the air pump. The telescopic hose is detachably mounted on the back of the adsorption plate and is connected to the vacuum adsorption hole. An air inlet connected to the vacuum adsorption hole is installed on the back of the adsorption plate, and an electrically controlled valve is installed on the air inlet.

5. A semiconductor slicing device as claimed in claim 1, characterized in that: Mounting supports are integrally provided on both sides of the bottom of the adsorption plate, a mounting plate with threaded holes is fixed to the upper end of the mounting frame, and the mounting supports are fixed to the mounting plate by bolts.

6. A semiconductor slicing device as claimed in claim 1, characterized in that: It also includes a collection box, which is installed on the upper end of the slicer table and located at the discharge side of the cutting part.

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