Quick clamp for wedge-shaped lead bonding

Abstract

The utility model discloses a quick clamp for wedge-shaped lead bonding. The quick clamp comprises a supporting block (1), a pressing plate (5), a pin column (6) and a base (7). The lower end of the supporting block (1) is arranged on the base (7); a thrust assembly is arranged in the middle of the supporting block (1) and penetrates through the middle of the supporting block (1) from front to back. The upper portion of the supporting block (1) is provided with a U-shaped groove (10) with openings in the front side and the top, a pressing plate (5) is hinged to the rear side of the supporting block (1), pressing strips (9) on the two sides of the upper end of the pressing plate (5) are pressed on the end faces of the two sides of the top of the supporting block (1), and devices to be bonded are positioned and pressed on the end faces of the two sides of the top of the supporting block (1) through the pressing strips (9). The spring sliding block and metal plate bending pressing plate structure is adopted, linear motion of the sliding block is converted into rotation of the pressing plate through elastic force of the spring, a device can be loosened only by pressing the pressing plate, the device can be clamped only by loosening the pressing plate, the whole operation is easy, convenient and rapid, and the clamping time is effectively saved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor device packaging and relates to a quick clamp for wedge-shaped lead bonding. Background Art

[0002] Wedge wire bonding is a key process in the semiconductor device packaging manufacturing process, that is, inserting the metal wire into the wedge-shaped chopper hole. When the wedge-shaped chopper descends to the pad bonding point, the chopper presses the metal wire on the surface of the welding area, and uses pressure and ultrasonic energy to achieve the bonding of the first solder joint. Then the chopper is lifted and moves along a predetermined trajectory. When it reaches the second bonding point, pressure and ultrasonic energy are used again to form the second solder joint bonding. The chopper moves vertically to cut off the tail of the metal wire. In this way, two weldings and one arc cycle are completed, realizing the packaging process of electrical interconnection between the chip, substrate, and shell.

[0003] The semiconductor devices currently produced by our unit require a large number of wedge wire bonding processes inside the chip, between the chip and the shell, and between the chip and the substrate. However, the bonding equipment on the production line is all manual bonding machines, and the bonding efficiency is relatively low. At the same time, the tooling fixtures used for the wedge bonding process on the production line mostly use screws to tighten and clamp, which makes device clamping and disassembly time-consuming and labor-intensive, and the various components of the fixture are in a separated state, which is inconvenient to manage. Therefore, it is necessary to design a quick fixture for wedge wire bonding to improve the efficiency and operability of device wedge wire bonding clamping. Summary of the invention

[0004] (I) Purpose of the invention

[0005] The purpose of the present invention is to provide a quick clamp for wedge wire bonding to improve the efficiency and operability of device wedge wire bonding.

[0006] (II) Technical solution

[0007] In order to solve the above technical problems, the present invention provides a quick clamp for wedge wire bonding, which mainly includes a support block 1, a slider 2, a spring 3, a screw 4, a pressure plate 5, a pin 6, a base 7, a screw 8 and other components.

[0008] Among them, there is a circular through hole with a step inside the support block 1, and the side wall of the circular hole 18 with a larger diameter is threaded. The slider 2 and the spring 3 are successively inserted into the hole, and the screw 4 is screwed into the threaded hole to put the spring 3 in a compressed state; the support block 1 is connected to the pressure plate 5 through the pin 6, and the pressure plate 5 can rotate around the pin 6; there is a cylindrical structure 15 at the lower end of the support block 1, which is installed and matched with the circular hole 16 inside the base 7. The cylindrical structure 15 can slide freely inside the circular hole 16 to realize the adjustment of the overall height of the clamp, and is tightened by the screw 8 screwed into the side wall of the base 7.

[0009] The pressing plate 5 adopts a sheet metal bending structure, which can effectively improve the rigidity of the pressing plate and is not easily deformed during long-term use. There are two pressure strips 9 on one side of the pressing plate 5 for pressing the device. The pressure strips 9 are perpendicular to the side surface 11 of the pressing plate, and the side surface 11 of the pressing plate is in close contact with the side wall of the support plate 1. The surface 111 of the pressing plate forms an angle of about 20° with the surface 212. There is a certain gap between the pressure strip 9 and the top of the support block, and the gap size is slightly smaller than the edge thickness of the pressed device.

[0010] The rear end of the slider 2 is a first disc structure 13, which cooperates with the step hole of the support block 1 to achieve axial limit, and the front end of the slider 2 is a spherical structure 14, which is used to reduce the friction between the slider 2 and the pressure plate 5. The outer diameter of the first disc structure 13 is consistent with the inner diameter of the large diameter hole, and the outer diameter of the spherical structure 14 is consistent with the inner diameter of the small diameter hole.

[0011] There is a U-shaped slot 10 inside the support block 1, which is mainly used to facilitate the installation and removal of the device.

[0012] The end of the screw rod 8 is provided with a second disc structure 17 with knurling to facilitate the tightening operation during height adjustment.

[0013] The utility model utilizes the pressure of the spring 3 to push the slider 2 to move, and the slider 2 then pushes the pressure plate 5 to rotate around the pin 6. By pressing the pressure plate 5, the device can be quickly clamped and loosened, which can effectively improve the clamping efficiency of the wedge-shaped wire bonding device.

[0014] (III) Beneficial effects

[0015] The quick fixture for wedge wire bonding provided by the above technical solution has the following features:

[0016] Beneficial effects:

[0017] (1) The spring slider and sheet metal bending pressure plate structure are used. The elastic force of the spring is used to convert the linear motion of the slider into the rotation of the pressure plate. The device can be loosened by pressing the pressure plate, and the device can be clamped by releasing the pressure plate. The whole operation is simple and fast, effectively saving clamping time.

[0018] (2) The support block and the base adopt a cylindrical and circular hole fitting structure, which is tightened by the side screws. The overall height of the fixture can be quickly adjusted according to actual needs, and it has strong height adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a three-dimensional model diagram of the clamp according to an embodiment of the present invention.

[0020] Figure 2 This is a cross-sectional view of a fixture according to an embodiment of the present invention.

[0021] Figure 3This is a three-dimensional model diagram of the pressure plate in the clamp according to an embodiment of the present invention.

[0022] Figure 4 It is a three-dimensional model diagram of the support block in the clamp according to an embodiment of the present invention.

[0023] Figure 5 A three-dimensional model diagram of a slider in a fixture according to an embodiment of the present invention.

[0024] Figure 6 It is a three-dimensional model diagram of the base in the clamp of an embodiment of the present invention.

[0025] Figure 7 This is a three-dimensional model diagram of the screw in the clamp according to an embodiment of the present invention. DETAILED DESCRIPTION

[0026] In order to make the purpose, content and advantages of the present invention more clear, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples.

[0027] Reference Figures 1 to 7 As shown, the quick clamp for wedge wire bonding in this embodiment includes a support block 1, a pressure plate 5, a pin 6, and a base 7; the lower end of the support block 1 is arranged on the base 7; a thrust assembly is arranged in the middle of the support block 1, and the thrust assembly passes through the middle of the support block 1 from front to back; a U-groove 10 with front and top openings is provided on the upper part of the support block 1, and the pressure plate 5 is hingedly arranged on the rear side of the support block 1, and the two side pressure strips 9 on the upper end of the pressure plate 5 are pressed tightly on the two side end surfaces of the top of the support block 1, and the bonding device is positioned and pressed tightly on the two side end surfaces of the top of the support block 1 by the pressure strips 9.

[0028] A circular through hole with an internal step is opened in the middle of the support block 1 , and the thrust assembly is arranged in the circular through hole, and the end of the thrust assembly contacts the pressure plate 5 .

[0029] The thrust assembly includes a slider 2, a spring 3, and a screw 4. The circular through hole includes a large-diameter hole 18 located at the front and a small-diameter hole located at the rear. The inner wall of the large-diameter hole 18 is threaded. The slider 2 and the spring 3 are sequentially installed in the circular through hole. The screw 4 is screwed into the large-diameter hole 18 to put the spring 3 in a compressed state. The slider 2 presses the pressure plate 5 under the elastic force of the spring 3.

[0030] The rear end of the slider 2 is a disc structure 13, which cooperates with the step hole of the support block 1 to achieve axial limit, and the front end of the slider 2 is a spherical structure 14, which is used to reduce the friction between the slider 2 and the pressure plate 5. The outer diameter of the disc structure 13 is consistent with the inner diameter of the large diameter hole, and the outer diameter of the spherical structure 14 is consistent with the inner diameter of the small diameter hole.

[0031] The pressing plate 5 as a whole adopts a sheet metal bending structure, which can effectively improve the rigidity of the pressing plate and is not easily deformed during long-term use. On the other hand, the sheet metal structure is light and more convenient for practical operation. The pressing plate 5 includes a surface I11, a surface II12 and a pressure strip 9; the surface I11 is located above the surface II12 and forms an angle of 20° with the surface II12, so that the pressing plate 5 can rotate around the pin 6 when pressed; two pressure strips 9 are horizontally formed on both sides of the upper end of the surface I11. There is a certain gap between the pressure strip 9 and the top of the support block 1, and the size of the gap is slightly smaller than the thickness of the edge of the pressed device, so that the pressure strip can be smoothly pressed to the edge of the device.

[0032] Two ears are vertically arranged on both sides of the lower part of surface I11, and the ears are hinged to the side walls of the U-groove 10 of the support block 1 through the pin 6. The slider 2 presses the surface II12, and the surface I11 and the pressure strip 9 rotate under the action of the pin 6, and the edge of the device is pressed by the pressure strips 9 on both sides.

[0033] The lower end of the support block 1 is a cylindrical structure 15, which fits into the circular hole 16 on the base and can slide freely therein. The lateral screw 8 is screwed into the base 7 and tightened against the support block 1 for fixation. The height of the fixture can be quickly adjusted according to actual needs; the U-groove 10 of the support block 1 is mainly used to facilitate the installation and air avoidance of the device, and its size and depth can be adjusted according to the actual structure of the device.

[0034] The end of the screw rod 8 is provided with a knurled disc structure 17 to facilitate the tightening operation during height adjustment.

[0035] The utility model has a simple structure and utilizes a spring slider and a sheet metal bending pressure plate structure. In its own state, the pressure plate is in a pressed state, which can clamp the device. Pressing the pressure plate can loosen the device, and the overall height of the clamp can be adjusted according to actual needs. The operation process is simple and quick, and the efficiency of the device wedge lead bonding clamping can be effectively improved.

[0036] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A quick fixture for wedge wire bonding, characterized in that: The invention comprises a support block (1), a pressure plate (5), a pin (6), and a base (7); the lower end of the support block (1) is arranged on the base (7); a thrust assembly is arranged in the middle of the support block (1), and the thrust assembly passes through the middle of the support block (1) from front to back; a U-groove (10) with a front side and a top opening is arranged on the upper part of the support block (1); a pressure plate (5) is hingedly arranged on the rear side of the support block (1); pressure strips (9) on both sides of the upper end of the pressure plate (5) are pressed against the end surfaces on both sides of the top of the support block (1); and the bonding device to be bonded is positioned and pressed against the end surfaces on both sides of the top of the support block (1) by the pressure strips (9).

2. The quick clamp for wedge wire bonding according to claim 1, characterized in that: A circular through hole with an internal step is provided in the middle of the support block (1), the thrust assembly is arranged in the circular through hole, and the end of the thrust assembly contacts the pressure plate (5).

3. The quick clamp for wedge wire bonding according to claim 2, characterized in that: The thrust assembly comprises a slider (2), a spring (3), and a screw (4); the circular through hole comprises a large diameter hole located at the front and a small diameter hole located at the rear; the inner wall of the large diameter hole is threaded; the slider (2) and the spring (3) are sequentially installed in the circular through hole; the screw (4) is screwed into the large diameter hole to put the spring (3) in a compressed state; and the slider (2) presses against the pressure plate (5) under the elastic force of the spring (3).

4. The quick clamp for wedge wire bonding according to claim 3, characterized in that: The rear end of the slider (2) is a first disc structure (13) which cooperates with the step hole of the support block (1) to achieve axial limiting, and the front end of the slider (2) is a spherical structure (14) which contacts the pressure plate (5).

5. The quick clamp for wedge wire bonding according to claim 4, characterized in that: The outer diameter of the first disc structure (13) is consistent with the inner diameter of the large-diameter hole, and the outer diameter of the spherical structure (14) is consistent with the inner diameter of the small-diameter hole.

6. The quick clamp for wedge wire bonding according to claim 5, characterized in that: The pressing plate (5) as a whole adopts a sheet metal bending structure.

7. The quick fixture for wedge wire bonding according to claim 6, characterized in that: The pressing plate (5) comprises a surface I (11), a surface II (12) and a pressure strip (9); the surface I (11) is located above the surface II (12) and forms an angle of 20° with the surface II (12); when the pressing plate (5) is pressed, it rotates around the pin (6); two pressure strips (9) are horizontally formed on both sides of the upper end of the surface I (11).

8. The quick clamp for wedge wire bonding according to claim 7, characterized in that: There is a gap between the pressure strip (9) and the top of the support block (1), and the gap is smaller than the thickness of the edge of the pressed device.

9. The quick clamp for wedge wire bonding according to claim 8, characterized in that: Two ears are vertically arranged on both sides of the lower part of the surface I (11), and the ears are hinged to the side walls of the U groove (10) of the support block (1) through the pin column (6). The slider (2) presses the surface II (12), and the surface I (11) and the pressure strip (9) rotate under the action of the pin column (6), and the edge of the device is pressed by the pressure strips (9) on both sides.

10. The quick clamp for wedge wire bonding according to claim 9, characterized in that: The lower end of the support block (1) is a cylindrical structure (15) which fits into a circular hole (16) on the base; the lateral screw (8) is screwed into the base (7) and presses against the support block (1); and the end of the screw (8) is provided with a second disc structure (17) with knurling.

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