Silicon wafer carrier and silicon wafer wet processing device

Abstract

The utility model relates to the technical field of solar cells, and discloses a silicon wafer carrier and a silicon wafer wet processing device. A plurality of insert rods, wherein any insert rod is arranged between the two side plates; the latches are arranged on the insertion piece rod at intervals in the axial direction of the insertion piece rod; the clamping teeth are provided with clamping tooth sections perpendicular to the axial direction of the inserting piece rod, the inserting piece rod is provided with inserting piece rod sections perpendicular to the axial direction of the inserting piece rod, the connecting positions of the clamping tooth sections and the inserting piece rod sections are defined as connecting edges, and the side edges, adjacent to the connecting edges, of the inserting piece rod sections are liquid guiding edges. The included angle between the extension line of the connecting edge and the liquid guide edge is 30-100 degrees. Therefore, the liquid carrying amount of the latch is reduced, and the photoelectric conversion efficiency and the productivity of the solar cell are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cells, in particular to a silicon wafer carrier and a silicon wafer wet processing device. Background Art

[0002] Wet processing is a common technology for making solar cells. During wet processing, a carrier such as a basket is needed to carry or transfer the silicon wafer to ensure that the silicon wafer can be processed by the liquid used in wet processing (such as reaction liquid or water), and can be pulled out of the liquid after processing and transferred to other processes. However, since there will be residual liquid in the area where the teeth on the carrier contact the silicon wafer, it is difficult to remove it effectively, which affects the processing effect of subsequent processes, and then affects the electrochemical performance of the solar cell, and also affects the production capacity of the solar cell. Utility Model Content

[0003] The embodiment of the utility model discloses a silicon wafer carrier and a silicon wafer wet processing device, which can effectively reduce the amount of liquid carried by the clamping teeth and improve the photoelectric conversion efficiency and production capacity of solar cells.

[0004] In a first aspect, an embodiment of the present application provides a silicon wafer carrier, the silicon wafer carrier comprising:

[0005] Two side panels arranged opposite to each other;

[0006] A plurality of inserting rods, any of which is arranged between the two side plates;

[0007] A plurality of latch teeth, which are arranged on the inserting rod at intervals along the axial direction of the inserting rod;

[0008] The latch tooth has a latch tooth section perpendicular to the axial direction of the insert rod, the insert rod has an insert rod section perpendicular to the axial direction of the insert rod, the position where the latch tooth section is connected to the insert rod section is defined as a connecting edge, the side of the insert rod section adjacent to the connecting edge is a liquid guiding edge, and the angle between the extension line of the connecting edge and the liquid guiding edge is 30° to 100°.

[0009] Furthermore, the cross section of the insert rod is a polygon formed by connecting a plurality of line segments end to end.

[0010] Furthermore, in the cross section of the insert rod, the angle between at least one of the liquid-conducting edges and the connecting edge is a right angle.

[0011] Furthermore, the length of the connecting edge is 5.0 mm to 7.2 mm.

[0012] Furthermore, the cross section of the latch tooth is a triangle, and two waistlines of the triangle are respectively connected to the liquid-conducting edges.

[0013] Furthermore, slots for clamping silicon wafers are formed between adjacent teeth, and the slot spacing of the slots gradually increases in a direction away from the wafer insertion rod, and the maximum slot spacing of the slots is 5 mm to 6 mm.

[0014] Furthermore, the insert rod comprises:

[0015] A bottom bar, the bottom bar being arranged at the bottom of the side plate;

[0016] The side rods include a first side rod and a second side rod that are arranged opposite to each other. The first side rod and the second side rod are respectively arranged close to the left and right edges of the side plate. The position of the bottom rod corresponds to between the first side rod and the second side rod.

[0017] In a second aspect, an embodiment of the present application provides a wet silicon wafer processing device, the processing device comprising:

[0018] Reaction tank;

[0019] Silicon wafer carrier: including the silicon wafer carrier described in the first aspect, the silicon wafer carrier is used to be placed in the reaction tank when the silicon wafer is undergoing wet processing;

[0020] Lifting mechanism: The lifting mechanism is located above the reaction tank, and is used to lift the silicon wafer carrier at a lifting angle. The lifting angle is the angle between the width direction of the silicon wafer carrier and the tank liquid plane of the reaction tank, and the lifting angle is 10° to 40°.

[0021] Furthermore, the angle between the extension line of the connecting edge and the liquid-conducting edge is greater than or equal to 30° and less than 90°.

[0022] Furthermore, the lifting mechanism includes a grasping component and a driving component that are electrically connected, wherein the driving component is used to drive the grasping component, and the grasping component is used to lift the silicon wafer carrier along the lifting angle.

[0023] Compared with the prior art, the beneficial effects of this application include:

[0024] The present application can reduce the amount of liquid carried by the silicon wafer carrier during wet processing by optimizing the arrangement of the latch teeth and the insert rod structure on the silicon wafer carrier, which is beneficial to both improving the electrochemical performance of the solar cell and ensuring the production capacity of the solar cell.

[0025] The present application provides a silicon wafer carrier and a silicon wafer wet processing device, the silicon wafer carrier includes two side plates arranged opposite to each other, a plurality of insert rods arranged between the side plates, and a plurality of latches arranged at intervals along the axial direction of the insert rods, wherein the insert rods and the side plates constitute a silicon wafer accommodation cavity, and the arrangement of the latches helps to improve the stability of silicon wafer placement. In addition, the latches and the insert rods respectively have a latch section and an insert rod section perpendicular to the axial direction of the insert rods, the position where the latch section is connected to the insert rod section is defined as a connecting edge, and the side edge adjacent to the connecting edge in the insert rod section is a liquid guiding edge, and the angle between the liquid guiding edge and the extension line of the connecting edge is 30° to 100°, so that the liquid in the area where the connecting edge is located is more obviously affected by gravity due to the angle between the liquid guiding edge and the extension line of the connecting edge, the liquid slides off more effectively, and the amount of liquid carried by the latches is reduced. That is, because the connecting edge is adjacent to the liquid-conducting edge, and the angle between the liquid-conducting edge and the extension line is set, the synergistic effect of the two further accelerates the effect of liquid sliding and reduces the amount of liquid carried by the teeth, which is not only beneficial to improving the photoelectric conversion efficiency of solar cells, but also ensuring production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 is a top view of a silicon wafer carrier provided in an embodiment of the present application;

[0028] Figure 2 It is a structural schematic diagram of a first type of inserting rod provided in an embodiment of the present application;

[0029] Figure 3 The embodiment of this application provides Figure 2 Middle BB section;

[0030] Figure 4 is a schematic diagram of a cross section of a second insert rod provided in an embodiment of the present application;

[0031] Figure 5 is a schematic diagram of a cross section of a third type of insert rod provided in an embodiment of the present application;

[0032] Figure 6 is a schematic diagram of a cross section of a fourth type of insert rod provided in an embodiment of the present application;

[0033] Figure 7 is a schematic diagram of a cross section of a fifth type of insert rod provided in an embodiment of the present application;

[0034] Figure 8 is a schematic diagram of a sixth type of insert rod cross section provided in an embodiment of the present application;

[0035] Fig. 9 is a schematic diagram of a seventh type of insert rod cross section provided in an embodiment of the present application;

[0036] Fig.10 The embodiment of this application provides Figure 1 A magnified view of middle;

[0037] Fig.11 It is a schematic diagram of a wet processing device provided in an embodiment of the present application.

[0038] Icons: 1. Side panel; 2. Insert rod; 21. Bottom rod; 22. Side rod; 221. First side rod; 222. Second side rod; 23. Liquid guiding edge; 231. Left liquid guiding edge; 232. Right liquid guiding edge; 3. Clamping teeth; 4. Connecting edge; 5. Clamping slot; 6. Reaction slot; 7. Silicon wafer. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0040] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0041] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0042] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0043] The technical solution provided by the utility model will be further described below in conjunction with embodiments and drawings.

[0044] The wet processing of solar cells is a cleaning process that involves multiple chemical reactions. The chemical reactions influence each other and are highly correlated. When wet processing silicon wafers, in order to avoid drift and chip bonding during the wet processing, a carrier such as a flower basket is used to carry the silicon wafers so that the silicon wafers react with the liquid, thereby ensuring the efficiency of the wet processing.

[0045] Among them, the silicon wafer is located between adjacent teeth, so the light-receiving surface and the backlight surface of the silicon wafer are in contact with the teeth, which may cause the light-receiving surface and the backlight surface of the silicon wafer to be stained with liquid. Specifically, during the wet processing, liquid is easily left on the teeth, and these liquids will contact the silicon wafer during the drying process. On the one hand, it will make the silicon wafer difficult to dry. In order to further reduce the amount of liquid on the silicon wafer, it is necessary to extend the drying time, but this will affect the production efficiency of the silicon wafer and reduce production capacity. On the other hand, these liquids will react with the silicon wafer and grow an abnormal film layer on the surface of the silicon wafer, which will have an adverse effect on the subsequent processing process and affect the photoelectric conversion efficiency of the solar cell. In addition, there will be tooth marks on the silicon wafer, which will affect the yield of the solar cell.

[0046] Based on the above problems, the embodiments of the present application provide a silicon wafer carrier and a silicon wafer wet processing device, which can reduce the amount of liquid carried by the teeth and improve the photoelectric conversion efficiency and production efficiency of solar cells.

[0047] In a first aspect, the present application provides a silicon wafer carrier, such as Figures 1 to 8 As shown, the silicon wafer carrier includes:

[0048] Two side panels 1 arranged opposite to each other;

[0049] A plurality of inserting rods 2, any one of which is arranged between two side panels 1;

[0050] A plurality of latch teeth 3 are arranged on the inserting rod 2 at intervals along the axial direction of the inserting rod 2;

[0051] The latching tooth 3 has a latching tooth section perpendicular to the axial direction of the insert rod 2, and the insert rod 2 has an insert rod section perpendicular to the axial direction of the insert rod 2. The position where the latching tooth section is connected to the insert rod section is defined as the connecting edge 4, and the side of the insert rod section adjacent to the connecting edge 4 is the liquid guiding edge 23, and the angle between the extension line of the connecting edge 4 and the liquid guiding edge 23 is 30° to 100°.

[0052] The insert rod 2 and the side plate 1 form a receiving cavity for the silicon wafer 7, and the insert rod 2 is provided with a latch 3, which is used to fix the silicon wafer 7, thereby improving the stability of the placement of the silicon wafer 7, which is conducive to reducing the difficulty of processing during wet processing. In addition, the liquid-guiding edge 23 of the insert rod cross section is adjacent to the connecting edge 4, that is, after the liquid on the latch 3 slides from the latch 3 to the area where the connecting edge 4 is located, since the liquid-guiding edge 23 is adjacent to the connecting edge 4, and the angle between the extended line of the connecting edge 4 and the liquid-guiding edge 23 is set to 30° to 100°, through this type of structural design, the liquid is easier to slide from the liquid-guiding edge 23, so that the guiding effect of the liquid-guiding edge 23 is better, the speed at which the liquid is separated from the latch 3 is faster, and the amount of liquid carried by the latch 3 is reduced. In other words, through this structural setting, while ensuring that the liquid-guiding edge has a liquid-guiding effect, the sliding speed of the liquid is further improved. Under the synergistic effect of the two, the amount of liquid carried by the latch 3 can be effectively reduced, and the photoelectric conversion efficiency and production capacity of the solar cell can be improved. When the angle between the connecting edge 4 and the liquid guiding edge 23 is less than 30°, the guiding effect of the liquid guiding edge 23 on the liquid is poor, which increases the difficulty of the liquid in the connecting edge 4 area to slide down, thereby making it difficult to effectively reduce the amount of liquid carried by the latch 3; when the angle between the connecting edge 4 and the liquid guiding edge 23 is greater than 100°, the stability of the connection between the latch 3 and the insert rod 2 is affected, thereby reducing the service life of the silicon wafer carrier and increasing the production cost of the solar cell.

[0053] Exemplarily, the angle between the extension line of the connecting edge 4 and the liquid-conducting edge 23 is 30°, 60°, 90°, or 100°.

[0054] In an optional embodiment, the insert rod 2 and the latch tooth 3 are two independent structures, which are first processed independently and then the latch tooth 3 is welded to the insert rod 2, so that the edge of the welding area is called the connecting edge 4; in another optional embodiment, the latch tooth 3 is directly formed on the insert rod 2, so the edge of the insert rod 2 where the latch tooth 3 is formed is called the connecting edge 4, for example, the latch tooth 3 and the insert rod 2 can be an integrally formed structure.

[0055] like Figure 3 As shown, Figure 3 for Figure 2In the cross-sectional view at BB in the middle, the extension line of the connecting edge 4 means that the connecting edge 4 has two endpoints, and the two endpoints are respectively used as starting points and extended in the direction away from the connecting edge 4. Specifically, the endpoints are respectively called the left endpoint and the right endpoint. The left endpoint is used as the starting point and continues to extend to the left to form the left extension line of the connecting edge 4. Therefore, the left extension line of the connecting edge 4 and the left liquid-conducting edge 231 form an angle a. The right endpoint is used as the starting point and continues to extend to the right to form the right extension line of the connecting edge 4. Therefore, the right extension line of the connecting edge 4 and the right liquid-conducting edge 232 form an angle a. By controlling the angle a between the extension line and the liquid-conducting edge 23, the sliding effect of the liquid is improved.

[0056] Since the present application designs the structure of the silicon wafer carrier, thereby reducing the amount of liquid on the teeth 3, when the silicon wafer carrier is wet processed, after entering the slow pull tank, the teeth 3 are slowly pulled, and the liquid content on the teeth 3 gradually decreases. Therefore, after entering the drying tank, the drying effect is high, and it helps to shorten the drying time and improve production efficiency. If the amount of liquid on the teeth 3 is reduced by increasing the pulling time of the slow pull and the drying time, on the one hand, since the silicon wafer carrier is exposed to the air for a long time during the slow pull process, it is inevitable that dust or impurities will contact the surface of the silicon wafer 7. After being dried by the subsequent drying process, there will be undesirable phenomena on the surface of the silicon wafer 7, thereby affecting the yield of the solar cell and having an adverse effect on the photoelectric conversion efficiency of the solar cell; on the other hand, the efficiency of production and processing is greatly reduced, and the cost of production is increased.

[0057] In the embodiment of the present application, the cross section of the insert rod can have a variety of shapes. As the shape of the first type of the cross section of the insert rod, for example Figures 3 to 5 As shown, the cross section of the insert rod 2 is a polygon formed by connecting multiple line segments end to end; as the cross-sectional shape of the second type of insert rod, as shown Figure 6 As shown, the cross section of the insert rod is a figure formed by connecting several arc lines end to end; as the cross section shape of the third type of insert rod, the cross section of the insert rod is a figure formed by connecting arc lines and line segments end to end, wherein, Figure 7 As shown, the line type of the liquid-conducting edge 23 is an arc line, and the line types of other edges are line segments, or, as shown in FIG. Figures 8 to 9 As shown, the line type of the liquid-conducting edge 23 is a line segment, and the line types of the other edges are arc lines. Among them, the shape of the first type of the cross section of the insert rod is the preferred solution, because the cross section of the insert rod is a figure composed of line segments. Compared with the arc lines in the cross section of the insert rod 2, this type of straight line line type not only shortens the distance for the liquid to slide, but also prevents the liquid from sliding around the arc direction of the arc line, thereby effectively reducing the amount of liquid carried by the latch 3 and the insert rod 2.

[0058] As the first type of insert rod cross-section shape, refer to Figure 4The angle between the two liquid-conducting edges 23 and the connecting edge 4 is not 90°, so both edges are inclined edges. In this type of solution, if an inclined pulling method is adopted in the subsequent pulling process of the silicon wafer carrier, more liquid will be gathered on one liquid-conducting edge 23, making it difficult to effectively reduce the amount of liquid carried by the tooth 3.

[0059] Furthermore, in the cross section of the insert rod, the angle between at least one liquid-conducting edge 23 and the connecting edge 4 is a right angle. When the angle between the liquid-conducting edge 23 and the connecting edge 4 is a right angle, that is, the liquid-conducting edge 23 and the connecting edge 4 are respectively the right angle sides of the right angle, at this time, the liquid in the connecting area is only affected by gravity in this area, and the liquid will directly slide down along the right angle side to avoid the gathering of the liquid, thereby helping to reduce the amount of liquid carried by the latch 3.

[0060] In an optional embodiment, refer to Figure 3 , the angle formed by one liquid-conducting edge 23 and the connecting edge 4 is a right angle, and the angle formed by the other liquid-conducting edge 23 and the connecting edge 4 is not a right angle, that is, one of the two liquid-conducting edges 23 is a right angle edge and the other is an inclined edge; in another optional embodiment, refer to the back Figure 5 The angles formed by the two liquid-conducting edges 23 and the connecting edge 4 are both right angles.

[0061] Furthermore, the length of the connecting edge 4 is 5.0 mm to 7.2 mm. When the length of the connecting edge 4 is within the above range, on the one hand, it indicates that the connection between the latch 3 and the inserting rod 2 has a certain stability, avoiding adverse effects on the fixing effect of the latch 3 on the silicon wafer 7, and on the other hand, when the length is within the above range, the amount of liquid in the connecting area between the latch 3 and the inserting rod 2 is reduced, thereby helping to reduce the amount of liquid in the latch 3 and improve the photoelectric conversion efficiency of the solar cell.

[0062] Furthermore, the cross section of the latch tooth includes structures such as triangle, quadrilateral, pentagon, and hexagon. When the cross section of the latch tooth is a triangle, the two waistlines of the triangle are respectively connected to the liquid guide edge 23. At this time, the liquid of the latch tooth 3 has a better sliding effect, and the amount of liquid carried by the latch tooth 3 is lower. This is because the cross section of the latch tooth is a triangle, so the area of ​​the latch tooth 3 is small, the amount of liquid carried is low, and the liquid at the top of the latch tooth 3 can slide along the waistline of the triangle to the area where the connecting edge 4 is located, the sliding speed is high, and the sliding effect is better. In addition, the triangular structure has a small contact area with the silicon wafer 7, which not only reduces the amount of liquid carried by the latch tooth 3, but also reduces the contact area between the silicon wafer 7 and the latch tooth 3 when the silicon wafer 7 is wet processed, so that the liquid can fully act on the silicon wafer 7, avoiding the problem of insufficient reaction in the contact area between the silicon wafer 7 and the latch tooth 3, which affects the photoelectric conversion efficiency of the solar cell.

[0063] like Figure 2As shown, when the structure of the latch tooth 3 is a quadrangular pyramid, the cross-section of the latch tooth 3 is a triangle, and the bottom surface is a diamond structure. The four corners of the diamond structure on the bottom surface are respectively connected to the edge line of the insert rod 2. This is because during the entire process, the silicon wafer is inevitably tilted. When the silicon wafer is tilted, the contact area with the latch tooth 3 will increase. The four corners of the diamond structure are connected to the edge line of the insert rod 2, so that the contact area between the silicon wafer and the latch tooth 3 is smaller, thereby greatly reducing the phenomenon of silicon wafer carrying liquid.

[0064] Furthermore, if Fig.10 As shown, a slot 5 for clamping a silicon wafer 7 is formed between adjacent teeth 3, and the slot spacing of the slot 5 gradually increases in the direction away from the inserting rod 2 (i.e. Fig.10 The slot spacing of the middle card slot 5 gradually increases downward), and the maximum slot spacing of the card slot 5 is 5mm to 6mm. Since the slot spacing of the card teeth 3 gradually increases in the direction away from the insert rod 2, the contact surface between the card teeth 3 and the silicon wafer 7 is small, thereby reducing the contact amount between the liquid on the card teeth 3 and the silicon wafer 7, and reducing the probability of side reactions between the liquid and the silicon wafer 7. In addition, the maximum spacing of the card slot 5 is set to 5mm to 6mm. On the one hand, the spacing of the card slot 5 within this range is small, reducing the amount of liquid in the card slot 5. On the other hand, this spacing also helps to improve the stability of the silicon wafer 7 in the card slot 5, and can also effectively reduce the contact area between the card teeth 3 and the silicon wafer 7, avoiding the liquid on the card teeth 3 directly acting on the silicon wafer 7.

[0065] For further information, see Figure 1 The insert rod 2 includes: a bottom rod 21, which is arranged at the bottom of the side plate 1; and a side rod 22, which includes a first side rod 221 and a second side rod 222 arranged opposite to each other, and the first side rod 221 and the second side rod 222 are arranged near the left and right edges of the side plate 1 respectively, and the position of the bottom rod 21 corresponds to between the first side rod 221 and the second side rod 222. When the insert rod 2 includes the bottom rod 21 and the first side rod 221 and the second side rod 222 arranged opposite to each other, and the structures of the bottom rod 21, the first side rod 221 and the second side rod 222 are designed, so that the silicon wafer 7 can be stably placed in the silicon wafer carrier, not only can the teeth 3 of the first side rod 221 and the second side rod 222 have a limiting effect on the two sides of the silicon wafer 7, but the bottom rod 21 also has a limiting effect on the bottom of the silicon wafer 7, thereby ensuring the stability of the silicon wafer 7 in the silicon wafer carrier, which is beneficial to the processing process of the wet process.

[0066] In a second aspect, the present application discloses a silicon wafer wet processing device, such as Fig.11 As shown, the processing device includes:

[0067] Reaction tank 6;

[0068] Silicon wafer carrier: including the silicon wafer carrier of the first aspect, the silicon wafer carrier is used to place the silicon wafer 7 in the reaction tank 6 when the silicon wafer 7 is wet processed;

[0069] Lifting mechanism: The lifting mechanism is located above the reaction tank 6 and is used to lift the silicon wafer carrier according to a lifting angle. The lifting angle is the angle between the width direction of the silicon wafer carrier and the tank liquid plane of the reaction tank 6. The lifting angle is 10° to 40°.

[0070] In the processing device provided by the embodiment of the present application, when the silicon wafer 7 is in the wet processing state, the silicon wafer carrier is placed in the reaction tank 6 by the lifting mechanism, and the lifting mechanism lifts the silicon wafer carrier according to the lifting angle, which is the angle between the width direction of the silicon wafer carrier and the tank liquid plane of the reaction tank, that is, the angle between the X direction in the figure and the tank liquid plane (the filling part in the figure), and the lifting angle is 10° to 40°. In other words, when the lifting mechanism lifts the silicon wafer carrier according to the above angle, not only the liquid in the slot 5 between the adjacent teeth 3 can be dropped, but also because the angle between the extension line of the connecting edge 4 and the liquid guide edge 23 is 30° to 100°, the liquid in the area where the connecting edge 4 is located is more likely to drop from the connecting edge 4 area, thereby increasing the rate of liquid dropout and reducing the amount of liquid carried by the teeth 3 and the insert rod 2.

[0071] The lifting angle is the angle between the width direction of the silicon wafer carrier and the tank liquid plane of the reaction tank 6, that is, when the lifting mechanism lifts the silicon wafer carrier according to the lifting angle, the distance between the silicon wafer 7 on the silicon wafer carrier and the tank liquid plane in the length direction is the same, while the distance between the silicon wafer 7 and the tank liquid plane in the width direction gradually changes, so the tilt direction of the silicon wafer carrier includes clockwise tilting or counterclockwise tilting. When tilting clockwise, the distance between the silicon wafer 7 and the tank liquid plane gradually decreases along the width of any silicon wafer 7 from left to right; when tilting counterclockwise, the distance between the silicon wafer 7 and the tank liquid plane gradually increases along the width of any silicon wafer 7 from left to right.

[0072] It should be noted that when the silicon wafer carrier is lifted at the lifting angle, it can only be used to lift the silicon wafer carrier out of the liquid, and when the silicon wafer carrier is placed in the liquid, it can be lifted horizontally, that is, the width direction of the silicon wafer carrier is parallel to the tank liquid plane. This processing method ensures the stability of the silicon wafer during wet processing.

[0073] Furthermore, the angle between the extension line of the connecting edge 4 and the liquid-conducting edge 23 is greater than or equal to 30° and less than 90°. Fig.11As shown, when the angle between one connecting edge 4 and the liquid-conducting edge 23 is greater than or equal to 30° and less than 90°, and the angle between the other connecting edge 4 and the liquid-conducting edge 23 is greater than or equal to 90° and less than or equal to 100°, the teeth 3 on the side rod 22 are set at an angle greater than or equal to 30° and less than 90° toward the direction of the tank liquid plane, and when rotating, the teeth 3 at the bottom of the silicon wafer 7 (i.e., the teeth 3 on the bottom rod 21) are used as a reference to rotate the teeth 3 at the bottom of the silicon wafer 7 at an angle greater than or equal to 30° and less than 90° toward the direction of the tank liquid plane. Specifically, the bottom latch tooth 3 in the figure is arranged in a clockwise direction, so when pulling, it rotates in a clockwise direction, so that the liquid on the liquid-conducting edge 23 with a smaller angle has a better sliding effect, and during the rotation process, part of the liquid on the other liquid-conducting edge 23 slides down one side of the latch tooth 3, and the other part of the liquid slides down along the liquid-conducting edge 23, reducing the accumulation of liquid in the area with a larger angle, thereby reducing the amount of liquid carried by the latch tooth 3 to a greater extent.

[0074] Furthermore, the lifting mechanism includes an electrically connected grasping component and a driving component, the driving component is used to drive the grasping component, and the grasping component is used to lift the silicon wafer carrier along the lifting angle. Among them, the grasping component is a manipulator, which directly acts on the silicon wafer carrier to perform operations such as lifting it. The driving component is a motor, and under the drive of the motor, the grasping component has a lifting angle, and the silicon wafer carrier is lifted according to the lifting angle, thereby reducing the amount of liquid carried by the clamping teeth 3.

[0075] The above is a detailed introduction to a silicon wafer carrier and a silicon wafer wet processing device disclosed in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand a silicon wafer carrier and a silicon wafer wet processing device: At the same time, for general technical personnel in this field, according to the ideas of the present utility model, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present utility model.

Claims

1. A silicon wafer carrier, characterized in that: The silicon wafer carrier comprises: Two side panels arranged opposite to each other; A plurality of inserting rods, any of which is arranged between the two side plates; A plurality of latch teeth, which are arranged on the inserting rod at intervals along the axial direction of the inserting rod; The latch tooth has a latch tooth section perpendicular to the axial direction of the insert rod, the insert rod has an insert rod section perpendicular to the axial direction of the insert rod, the position where the latch tooth section is connected to the insert rod section is defined as a connecting edge, the side of the insert rod section adjacent to the connecting edge is a liquid guiding edge, and the angle between the extension line of the connecting edge and the liquid guiding edge is 30° to 100°.

2. The silicon wafer carrier according to claim 1, characterized in that: The cross section of the insert rod is a polygon formed by connecting a plurality of line segments end to end.

3. The silicon wafer carrier according to claim 2, characterized in that: In the cross section of the insert rod, the angle between at least one of the liquid-conducting edges and the connecting edge is a right angle.

4. The silicon wafer carrier according to claim 1, characterized in that: The length of the connecting edge is 5.0 mm to 7.2 mm.

5. The silicon wafer carrier according to claim 1, characterized in that: The cross section of the latch tooth is a triangle, and two waistlines of the triangle are respectively connected to the liquid-conducting edges.

6. The silicon wafer carrier according to claim 5, characterized in that: A clamping groove for clamping a silicon wafer is formed between adjacent clamping teeth, and the groove spacing of the clamping groove gradually increases in a direction away from the inserting rod, and the maximum groove spacing of the clamping groove is 5mm to 6mm.

7. The silicon wafer carrier according to any one of claims 1 to 6, characterized in that: The insert rod comprises: A bottom bar, the bottom bar being arranged at the bottom of the side plate; The side rods include a first side rod and a second side rod that are arranged opposite to each other. The first side rod and the second side rod are respectively arranged close to the left and right edges of the side plate. The position of the bottom rod corresponds to between the first side rod and the second side rod.

8. A silicon wafer wet processing device, characterized in that: The processing device comprises: Reaction tank; Silicon wafer carrier: comprising the silicon wafer carrier according to any one of claims 1 to 7, wherein the silicon wafer carrier is used to be placed in the reaction tank when the silicon wafer is being wet processed; Lifting mechanism: The lifting mechanism is located above the reaction tank, and is used to lift the silicon wafer carrier at a lifting angle. The lifting angle is the angle between the width direction of the silicon wafer carrier and the tank liquid plane of the reaction tank, and the lifting angle is 10° to 40°.

9. The processing device according to claim 8, characterized in that: The angle between the extension line of the connecting edge and the liquid-conducting edge is greater than or equal to 30° and less than 90°.

10. The processing device according to any one of claims 8 to 9, characterized in that: The lifting mechanism includes a grasping component and a driving component that are electrically connected, wherein the driving component is used to drive the grasping component, and the grasping component is used to lift the silicon wafer carrier along the lifting angle.

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