Silicon wafer turnover device and silicon wafer production system
By designing a silicon wafer flip device including mounting components, flip structure and compaction structure, the problems of shaking and changing posture during the flip process are solved, and the stable flip of the silicon wafer and the smooth progress of subsequent processing are achieved.
Patent Information
- Application Number
- CN202421575181.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-04
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-07-04
AI Technical Summary
During the automated production of silicon wafers, the silicon wafers are prone to shake during the flip process, resulting in a change in placement posture and affecting subsequent processing.
A silicon wafer flip device is designed, including mounting components, flip structures and multiple compression structures. The flip structure realizes the flip of the silicon wafer through the rotating shaft and the flipped parts, while the pressing structure clamps the silicon wafer during the flip process, limiting its movement.
Through this device, the silicon wafer remains stable during the flip process, avoiding shaking and posture changes, ensuring the smooth progress of subsequent processing, and improving the yield of the silicon wafer.
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Figure CN222785272U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of solar cell production, and in particular to a silicon wafer flipping device and a silicon wafer production system. Background Art
[0002] In the related art, the automated production process of silicon wafers usually requires processing both sides of a single silicon wafer separately. Therefore, after processing one side of the silicon wafer, the silicon wafer needs to be turned over so as to process the other side of the silicon wafer.
[0003] In order to facilitate the placement of the silicon wafer in the silicon wafer flipping device for flipping, the silicon wafer usually has a certain amount of movement space in the placement space of the flipping device. The silicon wafer will shake in the placement space when the silicon wafer flipping device flips, and when the silicon wafer is unloaded from the silicon wafer flipping device to the transport device, the placement posture of the silicon wafer on the transport device will change, thereby affecting the subsequent processing of the silicon wafer. Utility Model Content
[0004] The embodiments of the present application disclose a silicon wafer flipping device and a silicon wafer production system, which are used for stable flipping of silicon wafers to prevent the posture of the silicon wafer from changing in a transportation device after being flipped over.
[0005] In order to achieve the above objectives, in a first aspect, the present application discloses a silicon wafer flipping device, comprising:
[0006] A mounting component, wherein a first driving member is provided on the mounting component;
[0007] A flipping structure, the flipping structure comprises a rotating shaft and a flipping component, the rotating shaft is connected to a first driving member, the flipping component is arranged on the outer circumference of the rotating shaft, the flipping component forms a plurality of placement spaces in the circumferential direction of the rotating shaft, each of the placement spaces is used to clamp a silicon wafer, and the first driving member is configured to drive the rotating shaft to rotate so that the rotating shaft drives the flipping component to rotate to realize the flipping of the silicon wafer; and
[0008] A plurality of clamping structures are provided on the flipping component, and each of the clamping structures is respectively arranged adjacent to the corresponding placement space, and the clamping structures are configured to clamp the silicon wafer to limit the movement of the silicon wafer in the placement space.
[0009] As an optional embodiment, each of the clamping structures includes a pressure plate and a torsion spring, the pressure plate having a connecting end and a clamping end connected to each other, the connecting end being rotatably connected to the flipping component, the clamping end being arranged adjacent to the placement space, the torsion spring being arranged at the connecting end, and the torsion spring being configured to provide a force so that the clamping end clamps the silicon wafer.
[0010] As an optional embodiment, the end face of the clamping end is a smooth curved surface, the flip component is provided with an axial hole, the connecting end is provided with a shaft portion, the shaft portion is rotatably connected to the axial hole, the torsion spring is sleeved on the shaft portion, and the torsion spring abuts against the flip component.
[0011] As an optional embodiment, the silicon wafer flipping device also includes a pushing structure, which includes a pushing rod and a power assembly, the pushing rod is connected to the clamping end, the power assembly is arranged on the mounting component, and the power assembly is used to drive the pushing rod to move so that the pushing rod drives the clamping end to move away from or closer to the silicon wafer.
[0012] As an optional embodiment, a through guide hole is provided on the flip component, and the push rod includes a first rod portion and a second rod portion, the first rod portion is slidably arranged in the guide hole, one end of the first rod portion is connected to the clamping end, and the second rod portion is connected to the other end of the first rod portion;
[0013] The power assembly includes a second driving member and a pushing plate, wherein the pushing plate is connected to the second driving member and is arranged corresponding to the second rod portion, and the second driving member is used to drive the pushing plate to move in the direction of the second rod portion so that the pushing plate pushes the second rod portion to move, so that the first rod portion drives the clamping end to move away from or closer to the silicon wafer.
[0014] As an optional implementation, there are multiple push rods, and each push rod is connected to the corresponding pressing end;
[0015] The power components include two, and the two power components are symmetrically arranged along the center of the rotating shaft.
[0016] As an optional embodiment, a plurality of clamping grooves arranged around the rotating shaft are opened on the flip component, and each of the clamping grooves passes through the flip component along one end away from the axial direction of the rotating shaft, and each of the clamping grooves forms a corresponding placement space.
[0017] As an optional embodiment, there are two flipping parts, the two flipping parts are arranged at intervals along the axial direction of the rotating shaft, each clamping structure is located between the two flipping parts, and the two sides of the same clamping structure are rotatably connected to the two flipping parts.
[0018] As an optional implementation, the placement space is provided with a sensor, and the sensor is used to detect the clamping state of the silicon wafer in the placement space.
[0019] In the second aspect, the present application discloses a silicon wafer production system, including a transportation device and the silicon wafer flipping device described above, the transportation device including a first transportation structure and a second transportation structure, the first transportation structure, the silicon wafer flipping device, and the second transportation structure are arranged in sequence along the transportation direction of the transportation device, the first transportation structure is used to transport the silicon wafer to the silicon wafer flipping device, and the second transportation structure is used to transport the silicon wafer after being flipped by the silicon wafer flipping device.
[0020] Compared with the prior art, the beneficial effects of this application are:
[0021] The silicon wafer flipping device and the silicon wafer flipping device in the silicon wafer production system disclosed in the present application include a mounting component, a flipping structure and a plurality of clamping structures. A first driving component is provided on the mounting component, the flipping structure includes a rotating shaft and a flipping component, the flipping component has a plurality of placement spaces, and a plurality of clamping structures are provided corresponding to each placement space. When the first driving component drives the rotating shaft to flip the flipping component, the clamping structure actively provides a clamping force to the silicon wafer located in the placement space of the flipping component, so that the silicon wafer can be kept in a stable state when being flipped by the flipping structure, avoiding shaking, falling, etc. The silicon wafer flipping device disclosed in the present application is conducive to maintaining the stability of the silicon wafer during the flipping process, avoiding the change of the placement posture of the silicon wafer compared to before the flipping when the silicon wafer is re-placed on the transport device, and thus facilitating the subsequent silicon wafer processing.
[0022] In addition, since the clamping structure firmly clamps the silicon wafer when the silicon wafer is flipped, the clamping structure can also prevent the silicon wafer from falling off the flipping structure or shaking and bumping on the flipping structure when flipping, thereby avoiding damage to the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0024] Figure 1 This is a schematic diagram of the structure of the silicon wafer production system disclosed in this application;
[0025] Figure 2 This is a schematic diagram of the structure of the silicon wafer flipping device disclosed in this application;
[0026] Figure 3 A schematic diagram of the structure of the flip component disclosed in the embodiment of the present application;
[0027] Figure 4 It is a structural schematic diagram of the pressing structure and the pushing structure disclosed in the embodiment of the present application;
[0028] Figure 5 It is a front view of the silicon wafer flipping device disclosed in the present application;
[0029] Figure 6 This is a schematic diagram of the structure of the power assembly disclosed in the embodiment of the present application.
[0030] Description of reference numerals:
[0031] 100. Silicon wafer production system; 101. Silicon wafer flipping device; 1. Mounting component; 11. First driving member; 12. Power assembly; 121. Second driving member; 122. Pushing plate; 123. Rod; 2. Flipping structure; 21. Rotating shaft; 22. Flipping component; 22a. Placement space; 22b. Shaft hole; 22c. Guide hole; 221. Clamping groove; 3. Clamping structure; 31. Pressing plate; 32. Torsion spring; 311. Clamping end; 312. Connecting end; 312a. Shaft; 4. Pushing structure; 41. Pushing rod; 41a. First rod; 41b. Second rod; 102. First transport structure; 103. Second transport structure. DETAILED DESCRIPTION
[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0033] In this application, the directions or positional relationships indicated by the terms "inside" and "middle" are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe this application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.
[0034] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.
[0035] In addition, the terms "installed", "set", "provided with", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0036] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.
[0037] In the related art, the silicon wafer usually needs to process both sides of a single silicon wafer separately during the automated production process. Therefore, after processing one side of the silicon wafer, the silicon wafer needs to be flipped over so as to process the other side of the silicon wafer. In order to facilitate the placement of the silicon wafer in the silicon wafer flipping device to flip the surface orientation, the silicon wafer usually has a certain amount of activity space in the placement space of the flipping device. The silicon wafer will shake in the placement space when the silicon wafer flipping device flips over. When the silicon wafer is unloaded from the silicon wafer flipping device to the transport device, the placement posture of the silicon wafer on the transport device will change, thereby affecting the subsequent processing of the silicon wafer. Moreover, when the silicon wafer shakes in the placement space of the flipping device, it may collide with the side wall of the placement space or other structures of the silicon wafer flipping device, causing damage to the silicon wafer.
[0038] Based on this, the present application discloses a silicon wafer flipping device and a silicon wafer production system, wherein the silicon wafer flipping device includes a mounting component, a flipping structure and a plurality of clamping structures. A first driving member is provided on the mounting component, the flipping structure includes a rotating shaft and a flipping component, the flipping component has a plurality of placement spaces for placement, and a plurality of clamping structures are arranged corresponding to each placement space. When the first driving member drives the rotating shaft to flip the flipping component, the clamping structure actively provides a clamping force to the silicon wafer located in the placement space of the flipping component, so that the silicon wafer can be kept in a stable state when it is flipped by the flipping structure, avoiding shaking, falling, etc. In this way, the silicon wafer can be prevented from shaking in the placement space when the flipping component is flipped, which is conducive to avoiding the change of the placement posture of the silicon wafer. Therefore, after the silicon wafer is flipped by the silicon wafer flipping device, the posture of the silicon wafer can be roughly consistent with that before flipping, which is conducive to the processing of the silicon wafer in other subsequent processing steps. Further, the shaking of the silicon wafer in the placement space is reduced when the silicon wafer is flipped, so that the silicon wafer is effectively less likely to collide with the components of the flipping component in the placement space, which is conducive to improving the yield rate of silicon wafer production.
[0039] The structure of the silicon wafer production system and the silicon wafer flipping device of the present application will be described in detail below in conjunction with the accompanying drawings.
[0040] See also Figure 1 The silicon wafer production system 100 disclosed in the present application includes a transport device and a silicon wafer flipping device 101, wherein the transport device includes a first transport structure 102 and a second transport structure 103, the first transport structure 102, the silicon wafer flipping device 101, and the second transport structure 103 are sequentially arranged along the transport direction of the transport device, the first transport structure 102 is used to transport the silicon wafer to the silicon wafer flipping device 101, and the second transport structure 103 is used to transport the silicon wafer flipped by the silicon wafer flipping device 101. In this way, the silicon wafer production system 100 disclosed in the present application can transport the silicon wafer after preliminary processing to the silicon wafer flipping device 101 through the first transport structure 102 for flipping, and then transport the flipped silicon wafer to other processing steps for processing through the second transport structure 103, so that both sides of the surface of a single silicon wafer can be processed.
[0041] Optionally, the above-mentioned transport device may be, but is not limited to, a conveying device such as a belt or a sprocket, and this application does not make any specific limitation here. In addition, the transport direction may refer to Figure 1 As shown in the X direction, this direction is only an example for facilitating understanding of the solution and does not limit the scope of this embodiment.
[0042] The technical solution of the silicon wafer transportation device disclosed in the present application will be further described below in combination with the embodiments and drawings.
[0043] See also Figure 2 The present application discloses a silicon wafer flipping device 101, comprising a mounting component 1, a flipping structure 2 and a plurality of clamping structures 3. A first driving member 11 is provided on the mounting component 1, and the flipping structure 2 comprises a rotating shaft 21 and a flipping component 22. The rotating shaft 21 is connected to the first driving member 11, and the flipping component 22 is arranged on the outer periphery of the rotating shaft 21. The flipping component 22 forms a plurality of placement spaces 22a on the circumference of the rotating shaft 21, and each placement space 22a is used to clamp the silicon wafer, respectively. The first driving member 11 is configured to drive the rotating shaft 21 to rotate, so that the rotating shaft 21 drives the flipping component 22 to rotate to realize the flipping of the silicon wafer. In addition, each clamping structure 3 is provided on the flipping component 22, and each clamping structure 3 is respectively arranged adjacent to the corresponding placement space 22a, and the clamping structure 3 is configured to clamp the silicon wafer to limit the movement of the silicon wafer in the placement space 22a.
[0044] In other words, the placement space 22a of the flip component 22 in the flip structure 2 can be used to place a silicon wafer, and when the first driving member 11 drives the rotating shaft 21 to rotate, the flip component 22 rotates along with the rotating shaft 21, thereby realizing the flipping of the silicon wafer. During the flipping process, the clamping structure corresponding to the placement space 22a actively provides a pressing force to the silicon wafer in the placement space 22a to prevent the silicon wafer from shaking in the placement space 22a.
[0045] By using the silicon wafer flipping device of the present application and the setting of the clamping structure 3, on the one hand, the silicon wafer can maintain a relatively stable state during the flipping process, effectively preventing the displacement of the silicon wafer during the flipping process, avoiding the silicon wafer from bumping or changing the placement posture due to the displacement of the silicon wafer in the placement space 22a, effectively reducing the situation where the silicon wafer yield rate decreases or the transportation posture changes due to bumping, which is beneficial to the subsequent processing of silicon wafer products. On the other hand, since the flipping component 22 is provided with multiple placement spaces 22a, and the clamping structure 3 is correspondingly provided at each of the multiple placement spaces 22a, the flipping structure 2 can flip multiple silicon wafers at the same time, which is beneficial to improving production efficiency.
[0046] It is understandable that the first driving member 11 may be, but is not limited to, a power device such as a motor, a cylinder, and a hydraulic device, and the present application does not make any specific limitation thereto.
[0047] Optionally, the mounting component may include but is not limited to a mounting seat, a mounting plate, a mounting bracket and other components.
[0048] like Figure 2 As shown, in some embodiments, there are two flipping parts 22, and the two flipping parts 22 are spaced apart along the axial direction of the rotating shaft 21, and each of the clamping structures 3 is located between the two flipping parts 22, and the two sides of the same clamping structure 3 are rotatably connected to the two flipping parts 22. In other words, when the silicon wafer is placed in the placement spaces 22a of the two flipping parts 22, the two placement spaces 22a can support the two ends of the same silicon wafer, and the clamping structure 3 located between the two flipping parts 22 can abut against the middle of the silicon wafer, so that when the silicon wafer is clamped, the side walls of the two placement spaces 22a and the clamping end 311 can form a three-point clamping for the silicon wafer, which is conducive to the stable clamping of the silicon wafer.
[0049] In some embodiments, the placement space 22a is provided with a sensor (not shown), and the sensor is used to detect the clamping state of the silicon wafer in the placement space 22a. That is, when the transport device transports the silicon wafer to the flipping device, and when the silicon wafer is transported into the placement space 22a, the sensor can detect the clamping state of the silicon wafer in the placement space 22a, that is, detect whether the silicon wafer is in the placement space 22a. Exemplarily, when the sensor detects that the silicon wafer is completely in the placement space 22a, that is, when the silicon wafer is stably placed in the placement space 22a, the sensor can send a signal, so that the first driving member 11 can be started according to the signal to drive the rotating shaft 21 to rotate, so that the flipping member 22 flips the silicon wafer. It can be seen that by setting a sensor in the placement space 22a, the clamping state of the silicon wafer in the placement space 22a can be detected in real time, effectively improving the accuracy of the silicon wafer flipping.
[0050] It is understandable that the above-mentioned sensor may be but is not limited to an infrared sensor, an ultrasonic sensor, etc., and this application does not make any specific limitation here.
[0051] In actual settings, see Figure 3 , the flipping member 22 may be a circular flipping plate, and the rotating shaft 21 is connected to the middle of the circular flipping plate, so that the flipping plate can evenly rotate the silicon wafer in the placement space 22a when rotating. Therefore, in some embodiments, a plurality of clamping grooves 221 arranged around the rotating shaft 21 are provided on the flipping member 22, and each clamping groove 221 penetrates the flipping member 22 along one end of the axis direction away from the rotating shaft 21, and each clamping groove 221 forms a corresponding placement space 22a. It can be understood that a plurality of clamping grooves 221 are provided on the flipping member 22 around the rotating shaft 21 to form the placement space 22a, and by providing the clamping grooves 221, each clamping groove 221 penetrates the flipping member 22 along one end of the axis direction away from the rotating shaft 21, which is conducive to leaving sufficient placement space 22a for placing silicon wafers. On the one hand, it can facilitate the placement of silicon wafers in the placement space, and on the other hand, it can also help prevent the silicon wafer from falling from the placement space 22a before being clamped. It can be understood that in other embodiments, the flipping member can also be a flip block.
[0052] As can be seen from the foregoing, if there are two flip components 22, when the flip component 22 is a flip plate, the centers of the two flip plates are arranged correspondingly, and the rotating shaft 21 can be simultaneously arranged through the centers of the two flip plates, thereby realizing the simultaneous rotation of the two flip plates.
[0053] See also Figure 4In some embodiments, each clamping structure 3 includes a pressing plate 31 and a torsion spring 32. The pressing plate 31 has a connecting end 312 and a clamping end 311 connected to each other. The connecting end 312 is rotatably connected to the flip component 22. The clamping end 311 is disposed adjacent to the placement space 22a. The torsion spring 32 is disposed at the connecting end 312. The torsion spring 32 is configured to provide a force to enable the clamping end 311 to clamp the silicon wafer. It is understood that when the clamping structure 3 clamps the silicon wafer, the pressing plate 31 mainly contacts and clamps the silicon wafer to limit the movement of the silicon wafer in the placement space 22a.
[0054] Specifically, when the pressing plate 31 is configured to press the silicon wafer, the torsion spring 32 can provide a force so that the pressing plate 31 maintains the pressing state on the silicon wafer. In this way, the silicon wafer can be subjected to the pressing force from the pressing end 311 of the pressing plate 31 in the placement space 22a, so that the silicon wafer remains in a clamped state. That is, when a side wall of the placement space 22a and the pressing end 311 abut against the silicon wafer, a certain pressing force is exerted on the silicon wafer, so that the silicon wafer cannot shake in the placement space 22a, which is conducive to the silicon wafer maintaining a stable state relative to the flip component 22 when flipping.
[0055] Considering that silicon wafers are relatively fragile items, in some embodiments, the end face of the clamping end 311 is a smooth curved surface, the flip component 22 is provided with an axial hole 22b, the connecting end 312 is provided with an axis portion 312a, the axis portion 312a is rotatably connected to the axis hole 22b, the torsion spring 32 is sleeved on the axis portion 312a, and the torsion spring 32 abuts against the flip component 22. It can be understood that by setting the end face of the clamping end 311 to a smooth curved surface, such as an arc surface, a spherical surface, a hemispherical surface, etc., the end face of the clamping end 311 has a relatively smooth contact surface when in contact with the silicon wafer, which is conducive to preventing the silicon wafer from being scratched by the protruding edges and corners when being clamped by the clamping end 311, thereby avoiding damage to the silicon wafer. Of course, in other embodiments, the axis portion 312a can also be provided on the flip component 22, and then the axis hole 22b can be provided on the connecting end 312, as long as the pressing plate 31 can be rotated relative to the flip component 22.
[0056] In another embodiment, a flexible member (not shown) is further provided at the end surface of the pressing end 311. By utilizing the relatively soft characteristics of the flexible member, the flexible member is used as the contact surface between the pressing end 311 and the silicon wafer, which is conducive to the silicon wafer having a relatively soft contact with the pressing end 311 when being pressed by the pressing end 311, further avoiding damage to the silicon wafer when being pressed.
[0057] The flexible member may be, but is not limited to, silicone, foam, etc., and this application does not make any specific limitation here.
[0058] Please also read Figures 2 to 4In some embodiments, the silicon wafer flipping device 101 further includes a pushing structure 4, the pushing structure 4 includes a pushing rod 41 and a power assembly 12, the pushing rod 41 is connected to the clamping end 311, the power assembly 12 is disposed on the mounting component 1, and the power assembly 12 is used to drive the pushing rod 41 to move, so that the pushed rod 41 drives the clamping end 311 to move away from or close to the silicon wafer. Since the connecting end 312 of the pressing plate 31 is rotatably connected to the flipping component 22, the pressing plate 31 can rotate toward the silicon wafer located in the placement space 22a or away from the silicon wafer when rotating relative to the flipping component 22. It can be seen that when the power assembly 12 drives the pushing rod 41 to drive the clamping end 311 to move so that the clamping end 311 is away from or close to the silicon wafer, the pressing plate 31 can rotate relative to the flipping component 22. In this way, when the clamping end 311 is away from the silicon wafer, the pressure plate 31 is in an un-clamped state, and the silicon wafer can be removed from the placement space 22a. When the clamping end 311 is close to the silicon wafer, the clamping end 311 clamps the silicon wafer to prevent the silicon wafer from shaking, so that the silicon wafer can be flipped in a stable posture along with the flipping component 22.
[0059] See Figures 4 to 6 In some embodiments, a through guide hole 22c is provided on the flip component 22, and the push rod 41 includes a first rod portion 41a and a second rod portion 41b. The first rod portion 41a can be slidably arranged in the guide hole 22c, one end of the first rod portion 41a is connected to the clamping end 311, and the second rod portion 41b is connected to the other end of the first rod portion 41a. Optionally, the first rod portion 41a and the second rod portion 41b of the push rod 41 can be the same rod portion, the first rod portion 41a is used to make the clamping end 311 extend out of the guide hole 22c, and the second rod portion 41b is used to further extend toward the side where the power assembly 12 is located, so that the power assembly 12 can easily drive the second rod portion 41b to move, thereby facilitating the first rod portion 41a to slide in the guide hole 22c. In this way, the pressing end 311 slides in the guide hole 22c along with the first rod portion 41a, thereby guiding the sliding of the pressing end 311, which is conducive to the conversion of the pressing plate 31 from the pressing state to the non-pressing state or from the non-pressing state to the pressing state. Of course, in other embodiments, the first rod portion 41a and the second rod portion 41b can also be different rods, as long as the two remain connected.
[0060] Furthermore, if Figure 5As shown, the power assembly 12 includes a second driving member 121 and a push plate 122. The push plate 122 is connected to the second driving member 121, and the push plate 122 is arranged corresponding to the second rod portion 41b. The second driving member 121 is used to drive the push plate 122 to move in the direction of the second rod portion 41b, so that the push plate 122 pushes the second rod portion 41b to move, so that the first rod portion 41a drives the clamping end 311 to move away from or close to the silicon wafer. In the actual setting, the push plate 122 is connected to the second driving member 121 through the rod 123. The second driving member 121 can drive the push plate 122 to move through the rod 123, so that the push plate 122 pushes the second rod portion 41b to move. It can be seen that when the push plate 122 pushes the second rod portion 41b, the pressing plate 31 can switch between the clamping state and the non-clamping state.
[0061] For example, the power assembly 12 changes the clamping state of the clamping plate 31. When the transport device transports the silicon wafer to the flipping component 22, the power assembly 12 can make the clamping end 311 of the clamping plate 31 away from the placement space 22a, so that the transport device can transport the silicon wafer into the placement space 22a. Then the power assembly 12 can push the second rod 41b again through the push plate 122. Driven by the second rod 41b, the first rod 41a can slide in the guide hole 22c, so that the clamping end 311 slides toward the silicon wafer, so that the clamping end 311 can clamp the silicon wafer, which is helpful to prevent the silicon wafer from shaking in the placement space 22a.
[0062] The second driving member 121 may be, but is not limited to, a power device such as a motor, a cylinder, and a hydraulic device, and the present application does not make specific limitations here. The second driving member 121 may be electrically connected to the aforementioned sensor disposed in the placement space 22a, so that when the sensor detects that the silicon wafer is located in the placement space 22a, the second driving member 121 may drive the push plate 122 to push the second rod portion 41b, so that the first rod portion 41a slides in the guide hole 22c, so that the pressing end 311 moves toward the silicon wafer, so that the pressing plate 31 presses the silicon wafer.
[0063] See also Figure 6In some embodiments, there are multiple push rods 41, each of which is connected to a corresponding clamping end 311. The power assembly 12 includes two, and the two power assemblies 12 are symmetrically arranged along the center of the rotating shaft 21. Specifically, the clamping ends 311 of the pressing plates 31 of the multiple clamping structures 3 are all provided with push rods 41 in a one-to-one correspondence. When the silicon wafer is placed in the placement space 22a, one of the two power assemblies 12 can push the second rod portion 41b, so that the clamping end 311 moves toward the silicon wafer, so that the pressing plate 31 clamps the silicon wafer, and then the flipping component 22 flips, so that the placement space 22a flips to another power assembly 12, and the power assembly 12 can push the second rod portion 41b again, so that the clamping end 311 moves away from the silicon wafer, so that the pressing plate 31 releases the silicon wafer. It can be seen that the two power assemblies 12 are used to control the pressing plates 31 respectively, so that the silicon wafer is placed in the placement space 22a for flipping and the silicon wafer is taken out of the placement space 22a, and then transported to other processing procedures by the transportation device.
[0064] The following is a brief description of the flipping process of the silicon wafer by the silicon wafer flipping device of the present application:
[0065] When the silicon wafer is transported from the first transport structure 102 to the silicon wafer flipping device 101, the opening of the placement space 22a of the flipping component 22 faces the transport plane of the first transport structure 102, so that the silicon wafer is transported to the placement space 22a. When the sensor located in the placement space 22a detects that the silicon wafer is located in the placement space 22a, the sensor can transmit a signal to the controller of the silicon wafer flipping device 101, and then the controller sends a control signal to the second driving member 121. The second driving member 121 can drive the pushing plate 122 to push the second rod portion 41b, so that the first rod portion 41a slides in the guide hole 22c of the flipping component 22, so that the pressing end 311 of the pressing plate 31 moves toward the silicon wafer, and then the pressing end 311 of the pressing plate 31 can press the silicon wafer.
[0066] Then the first driving member 11 drives the rotating shaft 21 to rotate, and the flipping member 22 flips under the drive of the rotating shaft 21 and flips to the transportation plane where the opening of the placement space 22a faces the second transportation structure 103. At this time, the second driving member 121 drives the pushing plate 122 to push the second rod 41b again, so that the pressing end 311 of the pressing plate 31 moves away from the silicon wafer, and the pressing plate 31 releases the silicon wafer, and the silicon wafer can be transported away from the placement space 22a under the drive of the second transportation structure 103.
[0067] In this way, the flipping of the silicon wafer is completed, and the flipped silicon wafer can be transported to the next production process through the second transport structure 103 .
[0068] The silicon wafer flipping device and silicon wafer production system disclosed in the embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the silicon wafer flipping device and silicon wafer production system of the present application and their core ideas; at the same time, for general technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.
Claims
1. A silicon wafer flipping device, characterized in that: The silicon wafer flipping device comprises: A mounting component, wherein a first driving member is provided on the mounting component; A flipping structure, the flipping structure comprising a rotating shaft and a flipping component, the rotating shaft is connected to the first driving member, the flipping component is arranged on the outer circumference of the rotating shaft, the flipping component forms a plurality of placement spaces in the circumferential direction of the rotating shaft, each of the placement spaces is used to clamp a silicon wafer, and the first driving member is configured to drive the rotating shaft to rotate so that the rotating shaft drives the flipping component to rotate to realize the flipping of the silicon wafer; and A plurality of clamping structures are provided on the flipping component, and each of the clamping structures is respectively arranged adjacent to the corresponding placement space, and the clamping structures are configured to clamp the silicon wafer to limit the movement of the silicon wafer in the placement space.
2. The silicon wafer flipping device according to claim 1, characterized in that: Each of the clamping structures includes a pressure plate and a torsion spring, the pressure plate has a connecting end and a clamping end connected to each other, the connecting end can be rotatably connected to the flip component, the clamping end is arranged adjacent to the placement space, the torsion spring is arranged at the connecting end, and the torsion spring is configured to provide a force so that the clamping end presses the silicon wafer.
3. The silicon wafer flipping device according to claim 2, characterized in that: The end surface of the clamping end is a smooth curved surface, the flip component is provided with an axial hole, the connecting end is provided with a shaft portion, the shaft portion is rotatably connected to the axial hole, the torsion spring is sleeved on the shaft portion, and the torsion spring abuts against the flip component.
4. The silicon wafer flipping device according to claim 2, characterized in that: The silicon wafer flipping device also includes a pushing structure, which includes a pushing rod and a power component. The pushing rod is connected to the clamping end, and the power component is arranged on the mounting component. The power component is used to drive the pushing rod to move so that the pushing rod drives the clamping end to move away from or close to the silicon wafer.
5. The silicon wafer flipping device according to claim 4, characterized in that: The flip component is provided with a through guide hole, the push rod includes a first rod portion and a second rod portion, the first rod portion can be slidably inserted into the guide hole, one end of the first rod portion is connected to the clamping end, and the second rod portion is connected to the other end of the first rod portion; The power assembly includes a second driving member and a pushing plate, wherein the pushing plate is connected to the second driving member and is arranged corresponding to the second rod portion, and the second driving member is used to drive the pushing plate to move in the direction of the second rod portion so that the pushing plate pushes the second rod portion to move, so that the first rod portion drives the clamping end to move away from or closer to the silicon wafer.
6. The silicon wafer flipping device according to claim 4, characterized in that: There are multiple push rods, each of which is connected to the corresponding pressing end; The power components include two, and the two power components are symmetrically arranged along the center of the rotating shaft.
7. The silicon wafer flipping device according to any one of claims 1 to 6, characterized in that: The flip component is provided with a plurality of clamping grooves arranged around the rotating shaft, each of the clamping grooves penetrates the flip component along one end in the axial direction away from the rotating shaft, and each of the clamping grooves forms a corresponding placement space.
8. The silicon wafer flipping device according to claim 7, characterized in that: There are two flipping parts, which are spaced apart along the axial direction of the rotating shaft. Each clamping structure is located between the two flipping parts, and the two sides of the same clamping structure are rotatably connected to the two flipping parts.
9. The silicon wafer flipping device according to any one of claims 1 to 6, characterized in that: The placement space is provided with a sensor, and the sensor is used to detect the clamping state of the silicon wafer in the placement space.
10. A silicon wafer production system, characterized in that: It comprises a transport device and a silicon wafer flipping device as described in any one of claims 1 to 9, wherein the transport device comprises a first transport structure and a second transport structure, the first transport structure, the silicon wafer flipping device, and the second transport structure are arranged in sequence along the transport direction of the transport device, the first transport structure is used to transport the silicon wafer to the silicon wafer flipping device, and the second transport structure is used to transport the silicon wafer after being flipped by the silicon wafer flipping device.