Multi-size wafer positioning machine table

Abstract

The embodiment of the utility model provides a multi-size wafer positioning machine, and relates to the technical field of wafer positioning. The multi-size wafer positioning machine table comprises a positioning table, a first positioning mechanism, a lifting table and a second positioning mechanism. A receding groove is formed in the positioning table in a penetrating mode. The first positioning mechanism is arranged on the positioning table and used for positioning the first wafer. The lifting table is arranged below the positioning table and can ascend and descend relative to the positioning table. The second positioning mechanism is arranged on the lifting table, the second positioning mechanism penetrates through the avoiding groove and protrudes out of the positioning table to position the second wafer under the condition that the lifting table ascends, the second positioning mechanism is located on the inner circumference of the first positioning mechanism, and the diameter of the first wafer is larger than that of the second wafer. The multi-size wafer positioning machine table can be suitable for positioning wafers with different diameter sizes, and is wide in application range.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer positioning, in particular to a multi-size wafer positioning machine. Background Art

[0002] Silicon carbide (SiC), as an emerging third-generation semiconductor core material, has excellent properties such as wide bandgap, high critical breakdown electric field strength, high electron mobility, good radiation resistance and chemical stability. This makes it an important substrate wafer material with wide applications, showing good application prospects in the fields of aviation devices, new energy vehicles, rail transportation and household appliances.

[0003] At present, the positioning mechanism of silicon carbide wafers can generally only position wafers of a specific size. Different positioning mechanisms are required for positioning wafers of different sizes, and the scope of application is small. Utility Model Content

[0004] The utility model aims to provide a multi-size wafer positioning machine, which can be used to position wafers with different diameters and has a wide application range.

[0005] The embodiment of the utility model is achieved as follows:

[0006] In a first aspect, the utility model provides a multi-size wafer positioning machine, comprising:

[0007] A positioning platform, wherein the positioning platform is provided with a avoiding groove;

[0008] A first positioning mechanism, which is disposed on the positioning platform and is used to position the first wafer;

[0009] a lifting platform, the lifting platform being arranged below the positioning platform and being able to be lifted and lowered relative to the positioning platform; and,

[0010] The second positioning mechanism is arranged on the lifting platform. When the lifting platform rises, the second positioning mechanism passes through the avoidance groove and protrudes from the positioning platform to position the second chip. The second positioning mechanism is located at the inner periphery of the first positioning mechanism, and the diameter of the first chip is larger than the diameter of the second chip.

[0011] Further, in an optional embodiment, there are multiple first positioning mechanisms, and the multiple first positioning mechanisms are arranged in a circular array;

[0012] There are a plurality of the second positioning mechanisms, and the plurality of the second positioning mechanisms are arranged in a circular array;

[0013] The circle where the plurality of second positioning mechanisms are located is concentric with the circle where the plurality of first positioning mechanisms are located, and the circle where the plurality of second positioning mechanisms are located is located inside the circle where the plurality of first positioning mechanisms are located.

[0014] Further, in an optional embodiment, there are a plurality of the avoidance grooves, and the plurality of the avoidance grooves are arranged in a circular array;

[0015] The plurality of the second positioning mechanisms can pass through the plurality of the avoidance grooves in a one-to-one correspondence.

[0016] Further, in an optional embodiment, each of the first positioning mechanisms includes a first fixing plate, a first elastic member and a first positioning column;

[0017] The first fixing plate is fixedly connected to the positioning platform;

[0018] The first elastic member is connected between the first fixing plate and the first positioning column;

[0019] The first positioning column is movably disposed on the positioning platform.

[0020] Further, in an optional embodiment, a first slide groove is provided on the positioning platform;

[0021] The first slide groove extends along the radial direction of the circle where the plurality of first positioning mechanisms are located;

[0022] The first positioning column is slidably matched with the first sliding groove.

[0023] Further, in an optional embodiment, each of the second positioning mechanisms includes a second fixing plate, a second elastic member and a second positioning column;

[0024] The second fixing plate is fixedly connected to the lifting platform;

[0025] The second elastic member is connected between the second fixing plate and the second positioning column;

[0026] The second positioning column is movably disposed on the lifting platform.

[0027] Further, in an optional embodiment, a second slide slot is provided on the lifting platform;

[0028] The second slide groove extends along the radial direction of the circle where the plurality of second positioning mechanisms are located;

[0029] The second positioning column is slidably matched with the second sliding groove.

[0030] Further, in an optional embodiment, there are a plurality of the avoidance grooves, and the plurality of the avoidance grooves are arranged in a circular array;

[0031] The plurality of avoidance grooves all extend along the radial direction of the circle where they are located;

[0032] The second fixing plates, the second elastic members and the second positioning columns of the plurality of second positioning mechanisms may pass through the plurality of avoidance grooves in a one-to-one correspondence, and the second positioning columns may slide along the second sliding grooves in the avoidance grooves.

[0033] Furthermore, in an optional embodiment, a driving device is also included;

[0034] The driving device is in driving connection with the lifting platform and is used for driving the lifting platform to rise and fall relative to the positioning platform.

[0035] Further, in an optional embodiment, the positioning platform and the lifting platform are both circular.

[0036] The beneficial effects of the multi-size chip positioning machine provided by the embodiment of the utility model include: when the multi-size chip positioning machine provided by the embodiment of the utility model is positioning the chip, the lifting platform descends to the bottom of the positioning platform, and the first positioning mechanism can be used to position the first chip; the lifting platform rises, so that the second positioning mechanism passes through the avoidance groove and protrudes from the positioning platform, and the second positioning mechanism can be used to position the second chip. Since the second positioning mechanism is located at the inner periphery of the first positioning mechanism, the diameter of the first chip is larger than the diameter of the second chip. Therefore, the multi-size chip positioning machine can be used for positioning chips of different diameters and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 A schematic diagram of the overall side view structure of a multi-size wafer positioning machine provided by an optional embodiment of the utility model;

[0039] Figure 2 A schematic diagram of a top view of a multi-size wafer positioning machine provided in an optional embodiment of the utility model;

[0040] Figure 3 A schematic structural diagram of a lifting platform of a multi-size wafer positioning machine provided in an optional embodiment of the utility model;

[0041] Figure 4A schematic diagram of the sliding cooperation structure between the first positioning column and the first sliding groove of the first positioning mechanism of the multi-size wafer positioning machine provided by an optional embodiment of the utility model;

[0042] Figure 5 A schematic diagram of the sliding cooperation structure between the second positioning column and the second slide groove of the second positioning mechanism of the multi-size wafer positioning machine provided in an optional embodiment of the utility model.

[0043] icon:

[0044] 10-Multi-size wafer positioning machine;

[0045] 100-positioning platform; 110-avoidance groove; 120-first slide groove;

[0046] 200 - first positioning mechanism; 210 - first fixing plate; 220 - first elastic member; 230 - first positioning column;

[0047] 300-lifting platform; 310-second chute;

[0048] 400 - second positioning mechanism; 410 - second fixing plate; 420 - second elastic member; 430 - second positioning column;

[0049] 500-Driver. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0051] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0052] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0053] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0054] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0055] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] As described in the background technology: the positioning mechanism of silicon carbide wafers can generally only position wafers of a specific size, and different positioning mechanisms are required for positioning wafers of different sizes, which has a small scope of application. In order to meet the positioning requirements of wafers of various diameters, the embodiment of the utility model provides a multi-size wafer positioning machine, which can be used to position wafers of different diameters, and has a wide scope of application.

[0057] See also Figure 1 to Figure 3The multi-size chip positioning machine 10 provided in the embodiment of the utility model includes: a positioning platform 100, a first positioning mechanism 200, a lifting platform 300 and a second positioning mechanism 400. Among them, a avoidance groove 110 is provided through the positioning platform 100. The first positioning mechanism 200 is arranged on the positioning platform 100, and is used to position the first chip. The lifting platform 300 is arranged below the positioning platform 100 and can be raised and lowered relative to the positioning platform 100. The second positioning mechanism 400 is arranged on the lifting platform 300. When the lifting platform 300 rises, the second positioning mechanism 400 passes through the avoidance groove 110 and protrudes from the positioning platform 100 to position the second chip, wherein the second positioning mechanism 400 is located at the inner periphery of the first positioning mechanism 200, and the diameter of the first chip is greater than the diameter of the second chip.

[0058] When the multi-size wafer positioning machine 10 provided by the embodiment of the utility model positions the wafer, the lifting platform 300 descends to the bottom of the positioning platform 100, and the first positioning mechanism 200 can be used to position the first wafer; the lifting platform 300 rises, so that the second positioning mechanism 400 passes through the avoidance groove 110 and protrudes out of the positioning platform 100, and at this time the second positioning mechanism 400 can be used to position the second wafer, and because the second positioning mechanism 400 is located on the inner periphery of the first positioning mechanism 200, the diameter of the first wafer is greater than the diameter of the second wafer, and therefore, the multi-size wafer positioning machine 10 can be used to position wafers of different diameters and has a wide range of applications.

[0059] It should be noted that the diameter of the first wafer is greater than the diameter of the second wafer. Optionally, the first wafer is an 8-inch wafer and the second wafer is a 6-inch wafer. Of course, in other embodiments, the diameters of the first wafer and the second wafer can also be set accordingly according to actual needs.

[0060] In an optional embodiment, there are multiple first positioning mechanisms 200, and the multiple first positioning mechanisms 200 are arranged in a circular array. There are multiple second positioning mechanisms 400, and the multiple second positioning mechanisms 400 are arranged in a circular array. The circle where the multiple second positioning mechanisms 400 are located is concentric with the circle where the multiple first positioning mechanisms 200 are located, and the circle where the multiple second positioning mechanisms 400 are located is located inside the circle where the multiple first positioning mechanisms 200 are located. Optionally, the number of first positioning mechanisms 200 is the same as the number of second positioning mechanisms 400.

[0061] It should be noted that the multiple first positioning mechanisms 200 are arranged in a circular array, and it can be considered that the multiple first positioning mechanisms 200 jointly form an outer ring positioning mechanism. When the lifting platform 300 descends to the bottom of the positioning platform 100, the first chip can be positioned in the area surrounded by the outer ring positioning mechanism. The multiple second positioning mechanisms 400 are arranged in a circular array, and it can be considered that the multiple second positioning mechanisms 400 jointly form an inner ring positioning mechanism. When the lifting platform 300 rises so that the second positioning mechanisms 400 pass through the avoidance groove 110 and protrude from the positioning platform 100, the second chip can be positioned in the area surrounded by the inner ring positioning mechanism. The circles where the outer ring positioning mechanism and the inner ring positioning mechanism are located are concentric circles.

[0062] In this way, the first positioning mechanism 200 and the second positioning mechanism 400 can be switched by lifting the lifting platform 300, thereby switching the positioning of the first wafer and the second wafer, which has a wider application range and is very convenient for switching the positioning of wafers of different diameters.

[0063] In an optional embodiment, there are a plurality of avoidance grooves 110 , and the plurality of avoidance grooves 110 are arranged in a circular array. The plurality of second positioning mechanisms 400 may pass through the plurality of avoidance grooves 110 in a one-to-one correspondence.

[0064] It should be noted that, optionally, the number of the avoidance grooves 110 is the same as the number of the second positioning mechanisms 400. The circle where the multiple avoidance grooves 110 are located is concentric with the circle where the multiple second positioning mechanisms 400 are located and the circle where the multiple first positioning mechanisms 200 are located. In this way, it is convenient for the multiple second positioning mechanisms 400 to pass through the multiple avoidance grooves 110 in a one-to-one correspondence.

[0065] See also Figure 2 and Figure 4 In an optional embodiment, each first positioning mechanism 200 includes a first fixing plate 210, a first elastic member 220 and a first positioning column 230. The first fixing plate 210 is fixedly connected to the positioning platform 100. The first elastic member 220 is connected between the first fixing plate 210 and the first positioning column 230. The first positioning column 230 is movably disposed on the positioning platform 100.

[0066] In this way, when it is necessary to position the first chip in the area surrounded by multiple first positioning mechanisms 200, the outer periphery of the first chip is supported by multiple first positioning columns 230, and the multiple first positioning columns 230 move relative to the positioning platform 100 and compress the first elastic member 220 accordingly. Each first positioning column 230 compresses the corresponding first elastic member 220 between the first positioning column 230 and the first fixed plate 210. At this time, under the action of the elastic restoring force of the first elastic member 220, the first positioning column 230 clamps the first chip in the area surrounded by multiple first positioning columns 230, thereby making the positioning of the first chip more accurate and less likely to fall out.

[0067] In an optional embodiment, a first slide groove 120 is provided on the positioning platform 100. The first slide groove 120 extends radially along the circle where the plurality of first positioning mechanisms 200 are located. The first positioning column 230 is slidably matched with the first slide groove 120.

[0068] By providing the first slide groove 120 , when the first wafer is positioned, the first positioning column 230 can slide along the first slide groove 120 under the support of the first wafer, so that the first positioning column 230 moves more smoothly relative to the positioning platform 100 , which is more conducive to the positioning of the first wafer.

[0069] See also Figure 2 and Figure 5 In an optional embodiment, each second positioning mechanism 400 includes a second fixing plate 410, a second elastic member 420 and a second positioning column 430. The second fixing plate 410 is fixedly connected to the lifting platform 300. The second elastic member 420 is connected between the second fixing plate 410 and the second positioning column 430. The second positioning column 430 is movably disposed on the lifting platform 300.

[0070] In this way, when the second wafer needs to be positioned in the area surrounded by the plurality of second positioning mechanisms 400, the lifting platform 300 rises, and at this time the first positioning mechanism 200 does not perform positioning, and the second positioning mechanism 400 performs the positioning. The outer periphery of the second wafer is held against the plurality of second positioning posts 430, and the plurality of second positioning posts 430 move relative to the lifting platform 300 and compress the second elastic member 420 accordingly, and each second positioning post 430 compresses the corresponding second elastic member 420 between the second positioning post 430 and the second fixing plate 410. At this time, under the elastic restoring force of the second elastic member 420, the second positioning post 430 clamps the second wafer in the area surrounded by the plurality of second positioning posts 430, so that the second wafer is positioned more accurately and is not easy to fall out.

[0071] In an optional embodiment, a second slide groove 310 is provided on the lifting platform 300. The second slide groove 310 extends radially along the circle where the plurality of second positioning mechanisms 400 are located. The second positioning column 430 is slidably matched with the second slide groove 310.

[0072] By providing the second slide groove 310, when the second wafer is fixed, the second positioning column 430 can slide along the second slide groove 310 under the support of the second wafer, so that the second positioning column 430 moves more smoothly relative to the lifting platform 300, which is more conducive to the positioning of the second wafer.

[0073] In an optional embodiment, there are multiple avoidance grooves 110, and the multiple avoidance grooves 110 are arranged in a circular array. The multiple avoidance grooves 110 extend radially along the circle in which they are located. The second fixing plates 410, the second elastic members 420, and the second positioning columns 430 of the multiple second positioning mechanisms 400 can pass through the multiple avoidance grooves 110 one by one, and the second positioning columns 430 can slide along the second slide grooves 310 in the avoidance grooves 110.

[0074] By extending the plurality of avoidance grooves 110 radially along the circle in which they are located, the second fixing plate 410, the second elastic member 420 and the second positioning column 430 can pass through the plurality of avoidance grooves 110 one by one, and the second positioning column 430 can slide along the second slide groove 310 in the avoidance groove 110 when positioning the second chip. In this way, the length setting of the avoidance groove 110 needs to ensure that it has a sufficient length to ensure the sliding stroke of the second positioning column 430.

[0075] Please continue reading Figure 1 In an optional embodiment, the multi-size wafer positioning machine 10 further includes a driving device 500. The driving device 500 is in transmission connection with the lifting platform 300, and is used to drive the lifting platform 300 to rise and fall relative to the positioning platform 100. Optionally, the driving device 500 can be a driving motor. The driving device 500 can drive the lifting platform 300 to rise or fall as required, which is convenient for control.

[0076] Please continue reading Figure 1 to Figure 3 In an optional embodiment, the positioning platform 100 and the lifting platform 300 are both circular. Optionally, the positioning platform 100, the lifting platform 300, the circle where the plurality of avoidance grooves 110 are located, the circle where the plurality of second positioning mechanisms 400 are located, and the circle where the plurality of first positioning mechanisms 200 are located are all concentric circles. In this way, the position of the lifting platform 300 relative to the positioning platform 100 can be effectively ensured to be accurate, and the first positioning mechanism 200 and the second positioning mechanism 400 can respectively position the first wafer and the second wafer.

[0077] To summarize, when the multi-size chip positioning machine 10 provided in the embodiment of the utility model positions the chip, the lifting platform 300 descends to the bottom of the positioning platform 100, and the first positioning mechanism 200 can be used to position the first chip; the lifting platform 300 rises, so that the second positioning mechanism 400 passes through the avoidance groove 110 and protrudes out of the positioning platform 100. At this time, the second positioning mechanism 400 can be used to position the second chip. Since the second positioning mechanism 400 is located on the inner periphery of the first positioning mechanism 200, the diameter of the first chip is larger than the diameter of the second chip. Therefore, the multi-size chip positioning machine 10 can be used for positioning chips of different diameters and has a wide range of applications.

[0078] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A multi-size wafer positioning machine, characterized in that: include: A positioning platform (100), wherein a avoiding groove (110) is provided through the positioning platform (100); A first positioning mechanism (200), the first positioning mechanism (200) being arranged on the positioning platform (100) and being used for positioning the first wafer; A lifting platform (300), the lifting platform (300) is arranged below the positioning platform (100) and can be lifted and lowered relative to the positioning platform (100); as well as, A second positioning mechanism (400), wherein the second positioning mechanism (400) is arranged on the lifting platform (300), and when the lifting platform (300) is raised, the second positioning mechanism (400) passes through the avoidance groove (110) and protrudes from the positioning platform (100) to position the second chip, wherein the second positioning mechanism (400) is located on the inner periphery of the first positioning mechanism (200), and the diameter of the first chip is greater than the diameter of the second chip.

2. The multi-size wafer positioning machine according to claim 1, characterized in that: There are a plurality of the first positioning mechanisms (200), and the plurality of the first positioning mechanisms (200) are arranged in a circular array; There are a plurality of the second positioning mechanisms (400), and the plurality of the second positioning mechanisms (400) are arranged in a circular array; The circle where the plurality of second positioning mechanisms (400) are located is concentric with the circle where the plurality of first positioning mechanisms (200) are located, and the circle where the plurality of second positioning mechanisms (400) are located is located inside the circle where the plurality of first positioning mechanisms (200) are located.

3. The multi-size wafer positioning machine according to claim 2, characterized in that: There are a plurality of the avoidance grooves (110), and the plurality of the avoidance grooves (110) are arranged in a circular array; The plurality of the second positioning mechanisms (400) can pass through the plurality of the avoidance grooves (110) in a one-to-one correspondence.

4. The multi-size wafer positioning machine according to claim 2, characterized in that: Each of the first positioning mechanisms (200) comprises a first fixing plate (210), a first elastic member (220) and a first positioning column (230); The first fixing plate (210) is fixedly connected to the positioning platform (100); The first elastic member (220) is connected between the first fixing plate (210) and the first positioning column (230); The first positioning column (230) is movably disposed on the positioning platform (100).

5. The multi-size wafer positioning machine according to claim 4, characterized in that: The positioning platform (100) is provided with a first sliding groove (120); The first sliding groove (120) extends radially along a circle where the plurality of first positioning mechanisms (200) are located; The first positioning column (230) is slidably matched with the first sliding groove (120).

6. The multi-size wafer positioning machine according to claim 2, characterized in that: Each of the second positioning mechanisms (400) comprises a second fixing plate (410), a second elastic member (420) and a second positioning column (430); The second fixing plate (410) is fixedly connected to the lifting platform (300); The second elastic member (420) is connected between the second fixing plate (410) and the second positioning column (430); The second positioning column (430) is movably disposed on the lifting platform (300).

7. The multi-size wafer positioning machine according to claim 6, characterized in that: The lifting platform (300) is provided with a second slide groove (310); The second slide groove (310) extends radially along a circle where the plurality of second positioning mechanisms (400) are located; The second positioning column (430) is slidably matched with the second sliding groove (310).

8. The multi-size wafer positioning machine according to claim 7, characterized in that: There are a plurality of the avoidance grooves (110), and the plurality of the avoidance grooves (110) are arranged in a circular array; The plurality of avoidance grooves (110) all extend along the radial direction of the circle where they are located; The second fixing plates (410), the second elastic members (420) and the second positioning columns (430) of the plurality of second positioning mechanisms (400) can pass through the plurality of avoidance grooves (110) in a one-to-one correspondence, and the second positioning columns (430) can slide along the second sliding grooves (310) in the avoidance grooves (110).

9. The multi-size wafer positioning machine according to any one of claims 1 to 8, characterized in that: Also includes a driving device (500); The driving device (500) is drivingly connected to the lifting platform (300) and is used to drive the lifting platform (300) to rise and fall relative to the positioning platform (100).

10. The multi-size wafer positioning machine according to any one of claims 1 to 8, characterized in that: The positioning platform (100) and the lifting platform (300) are both circular.

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