Sucking disc suitable for silicon wafer transmission and transmission device
By designing a suction cup including a pad plate and a negative pressure mechanism, the problem of the suction cup contact process surface during silicon wafer transmission is solved, contactless adsorption is achieved, the surface of the silicon wafer is protected and the transmission efficiency is improved.
Patent Information
- Application Number
- CN202421616441.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-07-10
AI Technical Summary
During the transmission of silicon wafers, existing suction cups are difficult to avoid contacting the process surface of the silicon wafer, resulting in pollution and damage.
A suction cup including a top plate, a middle plate and a bottom plate is designed. A pad plate is provided on the top plate to support the edges of the silicon wafer, and communicate with the adsorption cavity through the adsorption port, and contactless adsorption is achieved in conjunction with a negative pressure mechanism.
It effectively avoids the process surface of the suction cup contacting the silicon wafer, realizes contactless adsorption of the silicon wafer, protects the surface of the silicon wafer, and improves the safety and efficiency of the transmission process.
Smart Images
Figure CN222785277U_ABST
Abstract
Description
Technical Field
[0001] The utility model specifically relates to a sucker suitable for silicon wafer transmission and a silicon wafer transmission device comprising the sucker. Background Art
[0002] During the processing of solar cells, due to process problems, the front and back of the silicon wafer need to avoid contact with anything to prevent the process surface (the front and back of the silicon wafer) from being contaminated and damaged, thereby affecting the conversion efficiency and appearance of the final finished cell. Existing suction cups are basically used to absorb the front or back of the silicon wafer and will inevitably contact the process surface of the silicon wafer. Utility Model Content
[0003] In view of this, in order to solve the problems of the prior art, the utility model provides an improved suction cup to avoid contacting the process surface of the silicon wafer during the transmission process of the silicon wafer.
[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0005] A suction cup suitable for silicon wafer transmission comprises a top plate, a middle plate and a bottom plate in sequence, wherein the top plate, the middle plate and the bottom plate form an adsorption cavity, wherein a pad for supporting the edge (edge) of the silicon wafer is arranged on the top plate, and an adsorption port is opened on the top plate corresponding to the pad, wherein the adsorption port runs through the thickness direction of the top plate and is connected to the adsorption cavity, wherein the adsorption cavity has an exhaust port, and the exhaust port is connected to a negative pressure mechanism.
[0006] According to some preferred implementation aspects of the utility model, the pad has an inclined surface, which is inclined from bottom to top toward the edge of the silicon wafer, and the edge (edge) of the silicon wafer is supported on the inclined surface. The edge of the silicon wafer is supported by the inclined surface to avoid contact with the process surface of the silicon wafer.
[0007] According to some preferred implementation aspects of the utility model, the angle between the inclined surface of the pad and the plane where the top plate is located is 5-45°.
[0008] Preferably, the angle between the inclined surface of the pad and the plane where the top plate is located is 5-15°.
[0009] According to some preferred implementation aspects of the utility model, the extension direction of each pad is the same as the extension direction of the corresponding adsorption port. The adsorption port is opened on the inner side of the corresponding silicon wafer to adsorb the silicon wafer.
[0010] According to some preferred implementation aspects of the utility model, the length of each adsorption port is greater than one third of the length of each pad. Traditional small hole adsorption has a small flow rate and a small adsorption force, and can only be effectively adsorbed after being attached to the silicon wafer. The adsorption port of the present application is set with a long waist-shaped hole, which has a large vacuum flow rate and a large adsorption force, and can achieve contactless adsorption.
[0011] According to some preferred implementation aspects of the utility model, the center position of each pad and the center position of the corresponding adsorption port are located on the same straight line. The pads correspond to the adsorption ports to support and adsorb the four edges of the silicon wafer.
[0012] According to some preferred implementation aspects of the utility model, four pads and corresponding four suction ports are symmetrically arranged on the top plate, and the four pads are located on four sides of the same square. The four connecting lines formed by the center positions of the four pads and their corresponding suction ports are overlapped or perpendicular.
[0013] According to some preferred implementation aspects of the utility model, the size of the adsorption chamber is larger than the corresponding enclosure size of the plurality of pads to better stabilize the pressure.
[0014] The utility model also provides a transmission device suitable for silicon wafers, comprising the suction cup as described above.
[0015] Compared with the prior art, the utility model is advantageous in that the suction cup of the utility model prevents the suction cup from contacting the process surface of the silicon wafer by providing a pad for supporting the edge of the silicon wafer, and at the same time combines the adsorption chamber and the exhaust port connected to the negative pressure mechanism to effectively perform contactless adsorption on the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the suction cup in the preferred embodiment of the utility model;
[0018] Figure 2 This is a perspective structural diagram of a suction cup in a preferred embodiment of the utility model;
[0019] Figure 3 This is a schematic diagram of the cross-sectional structure of the suction cup in the preferred embodiment of the utility model;
[0020] Among them: suction cup-1, top plate-2, middle plate-3, bottom plate-4, adsorption chamber-5, pad-6, adsorption port-7, exhaust port-8, inclined surface-9. DETAILED DESCRIPTION
[0021] In order to enable those skilled in the art to better understand the technical solution of the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solution in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.
[0022] like Figure 1-3 As shown, the silicon wafer transfer device of this embodiment includes a suction cup 1. The suction cup 1 includes a top plate 2, a middle plate 3 and a bottom plate 4 in sequence. The middle plate 3 is a hollow design. The top plate 2, the middle plate 3 and the bottom plate 4 form an adsorption chamber 5. A pad 6 for supporting the edge (edge) of the silicon wafer is provided on the top plate 2. A suction port 7 is provided on the top plate 2 corresponding to the pad 6. The suction port 7 runs through the thickness direction of the top plate 2 and is connected to the adsorption chamber 5. The adsorption chamber 5 has an air suction port 8, which is connected to the negative pressure mechanism to quickly suck away the air around the bottom of the silicon wafer, so that a pressure difference is generated below the silicon wafer that is lower than the atmospheric pressure above the silicon wafer, thereby realizing vacuum adsorption of the silicon wafer.
[0023] Four pads 6 and corresponding four suction ports 7 are symmetrically arranged on the top plate, and the four pads 6 are located on the four sides of the same square, and the square is larger than the size of the silicon wafer to support the silicon wafer. The four connecting lines formed by the center positions of the four pads 6 and their corresponding suction ports 7 are overlapped or perpendicular.
[0024] The size of the adsorption chamber 5 is larger than the corresponding enclosure size of the plurality of pads 6. The enlarged vacuum chamber can stabilize the fluctuation of the vacuum, so that it is not affected by various fluctuation factors and the vacuum adsorption force is insufficient, thereby avoiding the problems of falling and falling of the silicon wafer during the process of the suction cup 1 carrying the silicon wafer.
[0025] The center position of each pad 6 and the center position of its corresponding suction port 7 are located on the same straight line. The pads 6 correspond to the suction ports 7 to support and suction the four edges of the silicon wafer.
[0026] The backing plate 6 has an inclined surface 9, which is inclined from bottom to top toward the edge of the silicon wafer, and the edge (edge) of the silicon wafer is supported on the inclined surface 9. The edge of the silicon wafer is supported by the inclined surface 9 to avoid contact with the process surface of the silicon wafer. The angle between the inclined surface 9 of the backing plate 6 and the plane where the top plate 2 is located is 5-45°, preferably 5-15°.
[0027] The extension direction of each pad 6 is the same as the extension direction of the corresponding adsorption port 7. The adsorption port 7 is opened on the inner side of the corresponding silicon wafer to adsorb the silicon wafer. The length of each adsorption port 7 is greater than one-third of the length of each pad 6. Traditional small hole adsorption has a small flow rate and a small adsorption force, and it needs to be attached to the silicon wafer for effective adsorption. The adsorption port 7 of the long waist-shaped hole in this embodiment is set, the vacuum flow rate is large, the adsorption force is large, and contactless adsorption can be achieved.
[0028] In the suction cup 1 of the utility model, the edges around the bottom of the silicon wafer contact the wedge-shaped pad 6 as support points, and the front and back sides of the entire silicon wafer do not contact any objects. At the same time, there is a large vacuum chamber inside the suction cup 1 to stabilize the voltage, ensuring that the silicon wafer can still be adsorbed when the vacuum is broken, and the silicon wafer is kept from falling when the silicon wafer is moved.
[0029] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with this technology to understand the content of the utility model and implement it accordingly. They cannot be used to limit the protection scope of the utility model. All equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.
Claims
1. A suction cup suitable for silicon wafer transmission, characterized in that: It includes a top plate, a middle plate and a bottom plate in sequence, wherein the top plate, the middle plate and the bottom plate form an adsorption cavity, the top plate is provided with a pad for supporting the edge of the silicon wafer, the top plate is provided with an adsorption port corresponding to the pad, the adsorption port runs through the thickness direction of the top plate and is connected to the adsorption cavity, the middle plate is provided with an exhaust port, and the exhaust port is connected to the negative pressure mechanism.
2. The suction cup according to claim 1, characterized in that The pad has an inclined surface, which is inclined from bottom to top toward the edge of the silicon wafer, and the edge of the silicon wafer is supported on the inclined surface.
3. The suction cup according to claim 2, characterized in that The angle between the inclined surface of the pad and the plane where the top plate is located is 5-45°.
4. The suction cup according to claim 3, characterized in that The angle between the inclined surface of the pad and the plane where the top plate is located is 5-15°.
5. The suction cup according to claim 1, characterized in that The extending direction of each pad is the same as the extending direction of the corresponding adsorption port.
6. The suction cup according to claim 1, characterized in that The length of each adsorption port is greater than one third of the length of each pad.
7. The suction cup according to claim 1, characterized in that The center position of each pad and the center position of the corresponding adsorption port are located on the same straight line.
8. The suction cup according to claim 1, characterized in that Four pads and corresponding four adsorption ports are symmetrically arranged on the top plate, and the four pads are located on four sides of the same square.
9. The suction cup according to claim 1 or 8, characterized in that: The size of the adsorption cavity is larger than the corresponding enclosure size of the plurality of pads.
10. A transmission device suitable for silicon wafers, characterized in that: Comprising the suction cup as described in any one of claims 1-9.