Photovoltaic module junction box and photovoltaic system

Abstract

The utility model relates to a photovoltaic module junction box and a photovoltaic system. The photovoltaic module junction box comprises a junction box and a first heat dissipation box, the junction box is provided with a first radiating fin and a diode packaging structure; the first heat dissipation box is provided with a second heat dissipation sheet; the first radiating fin is connected with the diode packaging structure, and the diode packaging structure is connected with the photovoltaic module and is connected with the second radiating fin through a bus bar of the photovoltaic module. When the diode packaging structure works, heat of the diode packaging structure not only can be dissipated through the first cooling fins of the diode packaging structure, but also can be transmitted to the second cooling fins in the first cooling box through the bus bars of the photovoltaic module, so that the diode packaging structure can be dissipated through the plurality of cooling channels; and the heat dissipation efficiency of the photovoltaic module junction box is improved.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic module junction boxes, and in particular to photovoltaic module junction boxes and photovoltaic systems. Background Art

[0002] In order to avoid the loss of power generation efficiency and component safety risks caused by the hot spot effect in photovoltaic modules, one or more bypass diodes are usually set in the photovoltaic junction box. At present, the typical photovoltaic junction box is a glue-filled junction box, and the diode is usually a module diode. However, when the module diode is working in the forward direction, because its heat sink is distributed at the proximal and distal ends of the diode chip, the distal chip can only receive a small part of the heat, resulting in the difficulty of heat dissipation of the diode chip during operation, and the heat dissipation efficiency of the entire junction box is low. Utility Model Content

[0003] Based on this, it is necessary to provide a photovoltaic module junction box and a photovoltaic system to address the problem of low heat dissipation efficiency of existing junction boxes.

[0004] In a first aspect, the present application provides a photovoltaic module junction box, comprising a junction box and a first heat dissipation box; the junction box is provided with a first heat sink and a diode packaging structure; the first heat dissipation box is provided with a second heat sink; the first heat sink is connected to the diode packaging structure, the diode packaging structure is connected to the bus bar of the photovoltaic module, and is connected to the second heat sink through the bus bar of the photovoltaic module.

[0005] In one embodiment, the junction box further comprises a first polarity terminal, the first polarity terminal being electrically connected to the diode package structure, used to connect a load, and electrically connected to a bus bar of the photovoltaic module;

[0006] The first heat sink box also includes a second polarity terminal, the second polarity terminal is used to connect a load and is electrically connected to the photovoltaic component via the second heat sink; the first polarity terminal and the second polarity terminal have opposite polarities.

[0007] In one of the embodiments, a second heat dissipation box is further included. The second heat dissipation box includes a third heat sink. The third heat sink is used to connect the photovoltaic component and is connected to the diode packaging structure through a bus bar of the photovoltaic component.

[0008] In one embodiment, the first heat sink further comprises a second polarity terminal, the second polarity terminal is used to connect a load and is electrically connected to a bus bar of the photovoltaic module via the second heat sink;

[0009] The second heat sink also includes a third polarity terminal for connecting a load and electrically connected to a bus bar of the photovoltaic module via the third heat sink; the third polarity terminal and the second polarity terminal have opposite polarities.

[0010] In one embodiment, the second heat sink and the third heat sink are both provided with through holes, so that the bus bar of the photovoltaic module passes through the through holes to be electrically connected to the third polarity terminal.

[0011] In one embodiment, the first heat sink, the second heat sink and the third heat sink all include copper sheets.

[0012] In one of the embodiments, the diode packaging structure includes any one of a surface mount diode packaging structure, an axial diode packaging structure, and a module diode packaging structure.

[0013] In one of the embodiments, the diode packaging structure includes N semiconductor chips, each of which is connected in series or in parallel; N is a positive integer.

[0014] In one of the embodiments, the semiconductor chip includes any one of a Schottky planar chip, a Schottky trench chip and a MOSFET chip.

[0015] In a second aspect, the present application further provides a photovoltaic system, comprising a photovoltaic component and the photovoltaic component junction box as described above, wherein the photovoltaic component is connected to the photovoltaic component junction box.

[0016] The photovoltaic module junction box and photovoltaic system described above, the photovoltaic module junction box includes a junction box and a first heat sink; the junction box is provided with a first heat sink and a diode packaging structure; the first heat sink is provided with a second heat sink; the first heat sink is connected to the diode packaging structure, the diode packaging structure is connected to the photovoltaic module, and is connected to the second heat sink through the bus bar of the photovoltaic module. When the diode packaging structure is working, its heat can not only be dissipated through its own first heat sink, but also can be transferred to the second heat sink in the first heat sink through the bus bar of the photovoltaic module, so the diode packaging structure can dissipate heat through multiple heat dissipation channels, thereby improving the heat dissipation efficiency of the photovoltaic module junction box. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is one of the structural schematic diagrams of a photovoltaic module junction box in one embodiment;

[0019] Figure 2 It is a schematic diagram of the structure of a junction box and a first heat dissipation box in one embodiment;

[0020] Figure 3 This is a second structural schematic diagram of a photovoltaic module junction box in an embodiment;

[0021] Figure 4 It is a schematic diagram of the structure of a first heat dissipation box and a second heat dissipation box in one embodiment;

[0022] Figure 5 is a schematic diagram of the structure of the second heat sink and the third heat sink in one embodiment;

[0023] Figure 6 FIG. 4 is a schematic diagram of the structure of a photovoltaic system in one embodiment.

[0024] Description of Figure Numbers:

[0025] Photovoltaic system: 10; photovoltaic module junction box: 100; junction box: 110; first heat sink: 111; diode packaging structure: 112; first polarity terminal: 113; first heat sink: 120; second heat sink: 121; second polarity terminal: 122; second heat sink: 130; third heat sink: 131; third polarity terminal: 132; through hole: 140; photovoltaic module: 200; bus bar: 210. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0029] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] In one embodiment, the present application provides a photovoltaic module junction box 100, see the attached Figure 1 , attached Figure 1 One of the structural schematic diagrams of the photovoltaic module junction box 100 in this embodiment is shown. The photovoltaic module junction box 100 in this embodiment includes a junction box 110 and a first heat dissipation box 120; the junction box 110 is provided with a first heat sink 111 and a diode packaging structure 112; the first heat dissipation box 120 is provided with a second heat sink 121; the first heat sink 111 is connected to the diode packaging structure 112, the diode packaging structure 112 is connected to the bus bar 210 of the photovoltaic module 200, and is connected to the second heat sink 121 through the bus bar 210 of the photovoltaic module 200.

[0031] The first heat sink 111 and the second heat sink 121 may be any structure capable of conducting heat away from the diode packaging structure 112 , such as an aluminum sheet, a copper sheet, etc.

[0032] The diode packaging structure 112 refers to a structure that packages a number of diode chips. The diode packaging structure 112 in this embodiment is only provided in the junction box 110, and is mainly used to provide bypass protection for the photovoltaic module to prevent the hot spot effect and ensure the safety and efficiency of the entire photovoltaic system. The number of diode chips packaged in the diode packaging structure 112 can be flexibly set based on the number of battery strings in the photovoltaic module in actual applications, specifically considering the voltage that the diode chip can withstand, and the connection relationship between multiple diode chips can be flexibly set, such as series connection or parallel connection. Exemplarily, six battery strings are provided in the photovoltaic module, and three diode chips are correspondingly packaged in the diode packaging structure 112, and the three diode chips are connected in series, but it is not limited to this.

[0033] In addition, in this embodiment, the packaging method of the diode packaging structure 112 is not set, and the diode packaging method in this embodiment can be any method, as long as the stable implementation of the bypass protection function of the diode packaging structure 112 is ensured. Exemplarily, it can be a surface mount packaging, an axial packaging or a module packaging, etc., but is not limited thereto.

[0034] The diode chip may be any semiconductor chip capable of realizing the unidirectional conduction function of a diode. For example, it may be a Schottky planar chip, a Schottky trench chip, or a MOS structure, etc., but is not limited thereto.

[0035] In this embodiment, when the diode packaging structure 112 is working, its heat can not only be dissipated through its own first heat sink 111, but also the heat can be transferred to the second heat sink 121 in the first heat dissipation box 120 through the bus bar of the photovoltaic module. Therefore, the diode packaging structure 112 can dissipate heat through multiple heat dissipation channels, thereby improving the heat dissipation efficiency of the photovoltaic module junction box 100.

[0036] It is understandable that the diode packaging structure 112 in the junction box 110 is connected to the bus bar of the photovoltaic module, and the photovoltaic module can also transmit electric energy to the photovoltaic module junction box 100 through the bus bar, and then transmit the electric energy to the load through the photovoltaic module junction box 100. At this time, polarity terminals for connecting the load can be set in the junction box 110 and the first heat dissipation box 120. In one embodiment, refer to the attached Figure 2 , attached Figure 2A schematic diagram of the structures of the junction box 110 and the first heat dissipation box 120 is shown. The junction box 110 also includes a first polarity terminal 113, which is electrically connected to the diode packaging structure 112 and is used to connect the load and is electrically connected to the bus bar of the photovoltaic module; the first heat dissipation box 120 also includes a second polarity terminal 122, and the second polarity terminal is used to connect the load and is electrically connected to the photovoltaic module via the second heat sink 121; the polarities of the first polarity terminal 113 and the second polarity terminal 122 are opposite.

[0037] The first polarity terminal 113 and the second polarity terminal 122 can be a positive terminal and a negative terminal respectively. At this time, the first heat sink 111 and the second heat sink 121 can be made of conductive materials, and the first heat sink 120 can also be used as a conductive structure to transmit electrical energy to the load.

[0038] The structure of the photovoltaic module junction box 100 in this embodiment is similar to the structure of the traditional two-part junction box 110. The difference is that the diode packaging structure 112 is not provided in the first heat dissipation box 120 in this embodiment. The diode packaging structure 112 is only provided in the junction box 110. The photovoltaic module can establish an electrical connection with the load through the junction box 110 and the first heat dissipation box 120. At the same time, a second heat sink 121 is provided in the first heat dissipation box 120, which can provide a heat dissipation channel for the diode packaging structure 112, thereby increasing the heat dissipation efficiency of the photovoltaic module junction box 100.

[0039] In one embodiment, see the attached Figure 3 , attached Figure 3 The second structural schematic diagram of the photovoltaic module junction box 100 in this embodiment is shown. In this embodiment, the photovoltaic module junction box 100 also includes a second heat dissipation box 130, and the second heat dissipation box 130 includes a third heat sink 131, and the third heat sink 131 is used to connect the photovoltaic module and is connected to the diode packaging structure 112 through the bus bar of the photovoltaic module.

[0040] Similar to the first heat dissipation box 120, the third heat sink 131 in the second heat dissipation box 130 can provide another heat dissipation channel for the diode package structure 112 through the bus bar of the photovoltaic module, thereby further improving the heat dissipation efficiency of the photovoltaic module junction box 100. Therefore, the second heat sink 121 can also be any structure that can conduct heat away from the diode package structure 112, such as an aluminum sheet, a copper sheet, etc.

[0041] In one embodiment, see the attached Figure 4 , attached Figure 4The schematic diagram of the structure of the first heat dissipation box 120 and the second heat dissipation box 130 is shown. The first heat dissipation box 120 also includes a second polarity terminal 122, the second polarity end is used to connect the load, and is electrically connected to the bus bar of the photovoltaic module through the second heat sink 121; the second heat dissipation box 130 also includes a third polarity terminal 132, which is used to connect the load and is electrically connected to the bus bar of the photovoltaic module through the third heat sink 131; the third polarity terminal 132 and the second polarity terminal 122 have opposite polarities.

[0042] The second polarity terminal 122 and the third polarity terminal 132 can be the positive terminal and the negative terminal, respectively, for transmitting the electrical energy of the photovoltaic module to the load. The photovoltaic module junction box 100 in this embodiment is similar in structure to the traditional three-part junction box 110, but the difference is that the diode package structure 112 in this embodiment is integrated in the junction box 110, and the first heat dissipation box 120 and the second heat dissipation box 130 are not provided with the diode package structure 112, which is only used to provide a heat dissipation channel for the diode package structure 112 and establish an electrical transmission channel between the load and the photovoltaic module, which can further increase the heat dissipation efficiency of the diode package structure 112.

[0043] It is understandable that in order to reasonably utilize the space of the first heat dissipation box 120 and the second heat dissipation box 130 and reduce the overall volume of the photovoltaic module junction box 100, the positional relationship between the second heat dissipation fin 121 and the second polarity terminal 122, the third heat dissipation fin 131 and the third polarity terminal 132, and the structure of the second heat dissipation fin 121 and the third heat dissipation fin 131 can be reasonably set. Figure 5 , attached Figure 5 A schematic structural diagram of the second heat sink 121 and the third heat sink 131 is shown. In this embodiment, the second heat sink 121 and the third heat sink 131 are both provided with a through hole 140 so that the bus bar of the photovoltaic module passes through the through hole 140 to be electrically connected to the third polarity terminal 132.

[0044] In this embodiment, the second heat sink 121 is arranged above the second polarity terminal 122, so a through hole 140 is set in the second heat sink 121, so that the bus bar can pass through the through hole 140 and be electrically connected to the second polarity terminal 122 below the second heat sink 121; the third heat sink 131 is arranged above the third polarity terminal 132, and the bus bar can pass through the through hole 140 of the third heat sink 131 and be electrically connected to the third polarity terminal 132 below the third heat sink 131, thereby providing a smaller photovoltaic module junction box 100.

[0045] In one embodiment, the first heat sink, the second heat sink and the third heat sink all include copper sheets. Compared with general heat sinks, copper has better conductivity and heat dissipation. Therefore, in this embodiment, the first heat sink, the second heat sink and the third heat sink are made of copper sheets, which can further improve the heat dissipation efficiency of the photovoltaic module junction box.

[0046] In one embodiment, the diode package structure includes any one of a chip diode package structure, an axial diode package structure, and a module diode package structure.

[0047] It is understandable that the specific packaging method of the diode packaging structure needs to comprehensively consider the structure of the photovoltaic module connected to it, such as electrical performance requirements, thermal management requirements, mechanical stability requirements, etc. For example, the diode packaged in the chip is suitable for low to medium current and voltage applications due to its small package; the larger volume of the axially packaged diode helps to dissipate heat and can be used in applications with higher heat dissipation requirements; the module diode is designed for high current and high voltage applications and can provide strong electrical performance. Therefore, in practical applications, a variety of packaging methods can be combined for flexible selection to improve the performance of the photovoltaic module junction box.

[0048] In one embodiment, the diode package structure includes N semiconductor chips, each semiconductor chip is connected in series or in parallel; N is a positive integer.

[0049] The semiconductor chip in this embodiment can be understood as a diode chip, which mainly performs the function of bypass protection for photovoltaic modules. When some photovoltaic panels generate less current due to shadows or other obstructions, these chips prevent the occurrence of hot spot effects by providing alternative current paths, thereby protecting the entire photovoltaic system from potential damage. The number of semiconductor chips can be reasonably selected according to the number of battery strings in the photovoltaic module and the performance of the semiconductor chip. The reverse withstand voltage and heat resistance of the semiconductor chip are important considerations when selecting. These parameters determine the reliability and stability of the semiconductor chip under extreme conditions, thereby affecting the long-term operation of the entire photovoltaic system. Normally, one semiconductor chip can protect multiple parallel battery strings. According to actual needs, if there are more battery strings, the number of semiconductor chips may need to be increased to ensure that each string of batteries is effectively protected.

[0050] In one embodiment, the semiconductor chip includes any one of a Schottky planar chip, a Schottky trench chip, and a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) chip.

[0051] Among them, the Schottky planar chip is formed by the contact between metal and semiconductor material (such as silicon). Its planar chip form means that this contact is flat on the chip surface, which has a lower forward voltage drop and a faster switching speed. Therefore, the Schottky planar chip is suitable for applications with fast response and efficient response; the Schottky trench chip has a groove pattern etched on the semiconductor surface, which increases the effective contact area of ​​the device and can provide a wider safe operating range. Therefore, the Schottky trench chip can work stably at a higher ambient temperature; the MOSFET chip is a device for amplifying or switching electronic signals. It controls the flow of current by building a gate on a silicon wafer. It has high input impedance and low on-resistance and is suitable for applications with high-speed switching and high-efficiency management. In this embodiment, any of the Schottky planar chip, Schottky trench chip and MOSFET chip can be selected for packaging according to actual needs.

[0052] In one embodiment, a three-part photovoltaic module junction box is proposed, including a junction box, a first heat dissipation box and a second heat dissipation box. A first copper sheet and a diode package structure encapsulating three semiconductor chips are integrated in the junction box, and the three semiconductor chips are connected in series. The first copper sheet is connected to the diode package structure to provide a first heat dissipation channel; the first heat dissipation box is provided with a second copper sheet and a negative terminal, and the second copper sheet is connected to the diode package structure through a bus bar of the photovoltaic module to provide a second heat dissipation channel for the diode package structure, and at the same time, a negative electrical connection channel is provided for the photovoltaic module to be connected to the load; the second heat dissipation box is provided with a third copper sheet and a positive terminal, and the third copper sheet is connected to the diode package structure through a bus bar of the photovoltaic module to provide a third heat dissipation channel for the diode package structure, and at the same time, a positive electrical connection channel is provided for the photovoltaic module to be connected to the load.

[0053] The first copper sheet in this embodiment is equivalent to the first heat sink in the above embodiment, the second copper sheet in this embodiment is equivalent to the second heat sink in the above embodiment, the third copper sheet in this embodiment is equivalent to the third heat sink in the above embodiment, the negative terminal in this embodiment is equivalent to the second polarity terminal in the above embodiment, and the positive terminal in this embodiment is equivalent to the third polarity terminal in the above embodiment, so the corresponding functions and connection relationships are the same and will not be repeated here.

[0054] Different from the above-mentioned embodiment, the photovoltaic module junction box in this embodiment can also be a two-part type, wherein the junction box provides a first heat dissipation channel for the diode packaging structure and also provides a positive (or negative) electrical connection channel for the photovoltaic module, and the corresponding first heat dissipation box provides a second heat dissipation channel for the diode packaging structure and also provides a negative (or positive) electrical connection channel for the photovoltaic module. Specifically, the two-part photovoltaic module junction box includes a junction box and a first heat dissipation box, the junction box includes a positive terminal, a first copper sheet and a diode packaging structure, the first copper sheet is connected to the diode packaging structure to provide a first heat dissipation channel, and at the same time, a positive electrical connection channel between the load and the photovoltaic module is established through the positive terminal; the first heat dissipation box includes a second copper sheet and a negative terminal, the second copper sheet is connected to the diode packaging structure through the bus bar of the photovoltaic module to provide a second heat dissipation channel for the diode packaging structure, the negative terminal should be connected to the load, and the second copper sheet is connected to the bus bar of the photovoltaic module to provide a negative electrical connection channel between the photovoltaic module and the load.

[0055] The first copper sheet in this embodiment is equivalent to the first heat sink in the above embodiment, the second copper sheet in this embodiment is equivalent to the second heat sink in the above embodiment, the negative terminal in this embodiment is equivalent to the second polarity terminal in the above embodiment, and the positive terminal in this embodiment is equivalent to the first polarity terminal in the above embodiment. Therefore, the corresponding functions and connection relationships are the same and will not be repeated here.

[0056] In one embodiment, the present application also provides a photovoltaic system 10, see the attached Figure 6 , attached Figure 6 The schematic diagram of the structure of the photovoltaic system 10 in this embodiment is shown. The photovoltaic system 10 in this embodiment includes a photovoltaic module 200 and a photovoltaic module junction box 100 in any of the above embodiments. The photovoltaic module 200 is connected to the photovoltaic module junction box 100.

[0057] It can be understood that the photovoltaic system 10 in this embodiment includes the photovoltaic module junction box 100 in any of the above embodiments. When the photovoltaic module junction box 100 has further technical effects compared with the prior art, the photovoltaic system 10 in this embodiment also has further technical effects accordingly.

[0058] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the application. It should be noted that, for a person of ordinary skill in the art, several variations and improvements may be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A photovoltaic module junction box, characterized in that: It includes a junction box and a first heat dissipation box; the junction box is provided with a first heat sink and a diode packaging structure; the first heat dissipation box is provided with a second heat sink; the first heat sink is connected to the diode packaging structure, the diode packaging structure is connected to the bus bar of the photovoltaic component, and is connected to the second heat sink through the bus bar of the photovoltaic component.

2. The photovoltaic module junction box according to claim 1, characterized in that: The junction box further comprises a first polarity terminal, which is electrically connected to the diode packaging structure, used to connect a load, and is electrically connected to a bus bar of the photovoltaic module; The first heat sink box also includes a second polarity terminal, the second polarity terminal is used to connect a load and is electrically connected to the photovoltaic component via the second heat sink; the first polarity terminal and the second polarity terminal have opposite polarities.

3. The photovoltaic module junction box according to claim 1, characterized in that: It also includes a second heat dissipation box, which includes a third heat sink. The third heat sink is used to connect the photovoltaic component and is connected to the diode packaging structure through the bus bar of the photovoltaic component.

4. The photovoltaic module junction box according to claim 3, characterized in that: The first heat sink box further comprises a second polarity terminal, the second polarity terminal is used to connect a load and is electrically connected to a bus bar of the photovoltaic module via the second heat sink; The second heat sink also includes a third polarity terminal for connecting a load and electrically connected to a bus bar of the photovoltaic module via the third heat sink; the third polarity terminal and the second polarity terminal have opposite polarities.

5. The photovoltaic module junction box according to claim 4, characterized in that: The second heat sink and the third heat sink are both provided with through holes, so that the bus bar of the photovoltaic module passes through the through holes to be electrically connected to the third polarity terminal.

6. The photovoltaic module junction box according to claim 3, characterized in that: The first heat sink, the second heat sink and the third heat sink all include copper sheets.

7. The photovoltaic module junction box according to claim 1, characterized in that: The diode packaging structure includes any one of a chip diode packaging structure, an axial diode packaging structure and a module diode packaging structure.

8. The photovoltaic module junction box according to claim 1, characterized in that: The diode packaging structure includes N semiconductor chips, each of which is connected in series or in parallel; N is a positive integer.

9. The photovoltaic module junction box according to claim 8, characterized in that: The semiconductor chip includes any one of a Schottky planar chip, a Schottky trench chip and a MOSFET chip.

10. A photovoltaic system, characterized in that: The invention comprises a photovoltaic component and a photovoltaic component junction box according to any one of claims 1 to 9, wherein the photovoltaic component is connected to the photovoltaic component junction box.

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