Anti-fragmentation quartz window and ultraviolet light curing equipment

Abstract

The utility model provides an anti-fragmentation quartz window and an ultraviolet light curing device. The anti-fragmentation quartz window comprises a quartz window body and a base. The quartz window body is arranged between an ultraviolet light source and a semiconductor sample to be cured. The base is arranged on an ultraviolet curing cavity for accommodating the semiconductor sample and is used for supporting and fixing the quartz window body from the lower part and the periphery, a back gouging groove is formed in the edge position, aligned to the lower edge of the quartz window body, of the base, and the back gouging groove is used for gouging the semiconductor sample. And a supporting pad for supporting the lower edge of the quartz window body is arranged in the back gouging groove in a non-fixed manner.

Description

Technical Field

[0001] The utility model relates to the technical field of thin film deposition, in particular to an anti-fragmentation quartz window and an ultraviolet light curing device. Background Art

[0002] In UV curing equipment, UV light is usually transmitted to the wafer surface through a quartz window. Therefore, the quartz window must not only transmit light but also be sealed. The quartz window is installed on a metal base. Since the metal base will deform when the temperature changes, the left corner of the quartz window will be subjected to the stress generated by the deformation of the metal base, and will break along the corner.

[0003] In the prior art, in order to prevent the base from generating stress on the left corner of the quartz window, the base is subjected to a root cleaning process. However, since the right side of the root cleaning groove has a contact point with the quartz window, as the metal base deforms, stress is generated at the contact point on the quartz window, causing the quartz window to break.

[0004] In order to overcome the above-mentioned defects of the prior art, the art is in urgent need of an anti-fragmentation quartz window technology for supporting the quartz window to solve the problem of the quartz window body being fractured due to deformation of the metal base. Utility Model Content

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects in the prior art, the utility model provides an anti-fragmentation quartz window and an ultraviolet light curing device for supporting the quartz window to solve the problem of the quartz window body being fractured due to deformation of the metal base.

[0007] Specifically, the anti-fragmentation quartz window provided according to the first aspect of the utility model includes: a quartz window body, arranged between an ultraviolet light source and a semiconductor sample to be cured; and a base, arranged on an ultraviolet curing chamber accommodating the semiconductor sample, for supporting and fixing the quartz window body from below and all around, wherein the base is provided with a root cleaning groove at an edge position aligned with the lower edge of the quartz window body, and a support pad for supporting the lower edge of the quartz window body is non-fixedly arranged in the root cleaning groove.

[0008] Furthermore, in some embodiments of the present invention, the base is made of metal, and there is a first thermal expansion deformation between the high temperature condition when the ultraviolet light source is turned on and the low temperature condition when the ultraviolet light source is turned off. The support pad is made of hard PTFE material, which expands synchronously with the base under the high temperature condition and contracts synchronously with the base under the low temperature condition to support the lower edge of the quartz window body.

[0009] Furthermore, in some embodiments of the present invention, the first depth of the root cleaning groove under the low temperature condition is 0.5 mm-2 mm, and the difference between the first depth of the root cleaning groove under the low temperature condition and the first thickness of the support pad under the low temperature condition is not greater than the fracture stress threshold of the quartz window body. The difference between the second depth of the root cleaning groove under the high temperature condition and the second thickness of the support pad under the high temperature condition is also not greater than the fracture stress threshold of the quartz window body, wherein the second depth is equal to the sum of the first depth and the first thermal expansion deformation, and the second thickness is equal to the sum of the first thickness and the second thermal expansion deformation of the support pad between the high temperature condition and the low temperature condition.

[0010] Furthermore, in some embodiments of the present invention, a chamfer is provided on the lower edge of the quartz window body.

[0011] In addition, the UV curing equipment provided according to the second aspect of the utility model includes: a UV light source for providing UV light; a UV curing chamber, arranged below the UV light source, for accommodating semiconductor samples to be cured; and the anti-shattering quartz window as described in the first aspect of the utility model, wherein the anti-shattering quartz window is arranged on the UV curing chamber, for sealing the UV curing chamber and allowing the UV light provided by the UV light source to enter the UV curing chamber to perform UV curing on the semiconductor samples therein.

[0012] Furthermore, in some embodiments of the present invention, the UV curing device also includes: a first reflective element, surrounding the top of the UV light source, for reflecting the UV light output upward by the UV light source to the anti-shattering quartz window to perform UV curing on the semiconductor sample below it.

[0013] Furthermore, in some embodiments of the present invention, the first reflective element is a parabolic mirror, and the ultraviolet light source is arranged at the focal position of the parabolic mirror, so that the parabolic mirror can vertically reflect the ultraviolet light output upward by the ultraviolet light source to the anti-shattering quartz window to perform ultraviolet light curing on the semiconductor sample thereunder.

[0014] Furthermore, in some embodiments of the present invention, the UV curing device also includes: a second reflective element, disposed between the UV light source and the anti-shatter quartz window, for reflecting the UV light output laterally from the UV light source to the anti-shatter quartz window to perform UV curing on the semiconductor sample thereunder.

[0015] Furthermore, in some embodiments of the present invention, the UV curing device further comprises: a heat dissipation element contacting the base of the anti-shattering quartz window to limit its actual temperature to below a preset temperature of the high temperature working condition.

[0016] Furthermore, in some embodiments of the present invention, the UV curing chamber is also connected to a vacuum pump for evacuating the interior of the UV curing chamber to a vacuum state before the UV light curing is performed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0018] Figure 1 A schematic structural diagram of an ultraviolet curing device provided according to some embodiments of the utility model is shown.

[0019] Figure 2 A schematic structural diagram of an anti-fragmentation quartz window provided according to some embodiments of the utility model is shown.

[0020] Reference numerals:

[0021] 10. UV light source

[0022] 11 UV curing chamber

[0023] 12 Quartz window body

[0024] 13 Base

[0025] 131 Root cleaning groove

[0026] 132 Support pad

[0027] 14. First reflective element

[0028] 15 Second reflective element DETAILED DESCRIPTION

[0029] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and functions of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to this implementation. On the contrary, the purpose of introducing the utility model in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present utility model. In order to provide an in-depth understanding of the present utility model, the following description will include many specific details. The present utility model can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present utility model, some specific details will be omitted in the description.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0032] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as the second component, region, layer and / or part without departing from some embodiments of the present invention.

[0033] As mentioned above, in the prior art, in order to prevent the base from generating stress on the left corner of the quartz window, the base is subjected to a root cleaning process. However, since the right side of the root cleaning groove has a contact point with the quartz window, as the metal base is deformed, stress is generated on the quartz window at the contact point, causing the quartz window to break.

[0034] In order to overcome the above-mentioned defects in the prior art, the utility model provides an anti-fragmentation quartz window and an ultraviolet light curing device for supporting the quartz window to solve the problem of the quartz window body being fractured due to deformation of the metal base.

[0035] In some non-limiting embodiments, the anti-shattering quartz window provided in the first aspect of the present invention can be configured in the ultraviolet light curing device provided in the second aspect of the present invention.

[0036] First, please refer to Figure 1 , Figure 1 The invention shows an ultraviolet curing device provided according to some embodiments of the invention.

[0037] like Figure 1 As shown, the UV curing device includes a UV light source 10, a UV curing chamber 11, an anti-shattering quartz window and a heat dissipation element. The UV light source 10 is used to provide UV light. The UV curing chamber 11 is arranged below the UV light source 10 and is used to accommodate the semiconductor sample to be cured. Here, the UV curing chamber 11 can also be connected to a vacuum pump, which is used to evacuate the inside of the UV curing chamber 11 to a vacuum state before UV curing. The anti-shattering quartz window is arranged on the UV curing chamber 11, which is used to seal the UV curing chamber 11 and allow the UV light provided by the UV light source 10 to enter the UV curing chamber 11 to perform UV curing on the semiconductor sample therein. The heat dissipation element contacts the base 13 of the anti-shattering quartz window to limit its actual temperature to below the preset temperature of the high temperature condition.

[0038] In addition, the UV curing device further includes a first reflective element 14 and a second reflective element 15. The first reflective element 14 surrounds the upper portion of the UV light source 10. It is used to reflect the UV light outputted upward by the UV light source 10 to the anti-shattering quartz window, so as to UV-curing the semiconductor sample thereunder. The second reflective element 15 is disposed between the UV light source 10 and the anti-shattering quartz window, and is used to reflect the UV light outputted laterally by the UV light source 10 to the anti-shattering quartz window, so as to UV-curing the semiconductor sample thereunder.

[0039] Preferably, the first reflective element 14 may be a parabolic mirror, and the ultraviolet light source 10 is disposed at the focal position of the parabolic mirror so that the parabolic mirror can vertically reflect the ultraviolet light outputted upward by the ultraviolet light source 10 to the anti-shattering quartz window to perform ultraviolet light curing on the semiconductor sample thereunder.

[0040] Please refer to Figure 2 , Figure 2 A schematic structural diagram of an anti-fragmentation quartz window provided according to some embodiments of the utility model is shown.

[0041] like Figure 2As shown, the first aspect of the utility model comprises a quartz window body 12 and a base 13. The quartz window body 12 is disposed between the ultraviolet light source 10 and the semiconductor sample to be cured. The base 13 is disposed on the ultraviolet curing chamber 11 containing the semiconductor sample, and is used to support and fix the quartz window body 12 from below and around. Here, the lower edge of the quartz window body 12 may be chamfered to prevent the deformation of the base 13 from causing stress on the lower edge of the quartz window body 12.

[0042] Furthermore, in some embodiments of the present invention, the base 13 is provided with a root cleaning groove 131 at an edge position aligned with the lower edge of the quartz window body 12 , and a support pad 132 for supporting the lower edge of the quartz window body 12 is non-fixedly provided in the root cleaning groove 131 .

[0043] Further, in some embodiments of the present invention, the base 13 is made of metal material, and there is a first thermal expansion deformation between the high temperature condition when the ultraviolet light source 10 is turned on and the low temperature condition when the ultraviolet light source 10 is turned off. Here, the support pad 132 is made of hard PTFE material, which expands synchronously with the base 13 under high temperature conditions and contracts synchronously with the base 13 under low temperature conditions to support the lower edge of the quartz window body 12. In this way, using the existing hard PTFE sealing pad material as the support pad 132 can achieve a good supporting effect while sealing.

[0044] Further, in some embodiments of the present invention, the first depth of the root cleaning groove 131 under low temperature conditions is 0.5 mm-2 mm, and the difference between the first depth of the root cleaning groove 131 and the first thickness of the support pad 132 under low temperature conditions is not greater than the fracture stress threshold of the quartz window body 12. Correspondingly, the difference between the second depth of the root cleaning groove 131 under high temperature conditions and the second thickness of the support pad 132 under high temperature conditions is also not greater than the fracture stress threshold of the quartz window body 12. The second depth is equal to the sum of the first depth and the first thermal expansion deformation, and the second thickness is equal to the sum of the first thickness and the second thermal expansion deformation of the support pad 132 between high temperature conditions and low temperature conditions.

[0045] In summary, the anti-fragmentation quartz window and ultraviolet light curing equipment provided by the utility model can be used to support the quartz window to solve the problem of the quartz window body being fractured due to deformation of the metal base.

[0046] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0047] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A shatter-resistant quartz window, characterized in that: include: The quartz window body is arranged between the ultraviolet light source and the semiconductor sample to be cured; as well as The base is arranged on the ultraviolet curing chamber accommodating the semiconductor sample, and is used to support and fix the quartz window body from the bottom and all around, wherein the base is provided with a root cleaning groove at the edge position aligned with the lower edge of the quartz window body, and a support pad for supporting the lower edge of the quartz window body is non-fixedly arranged in the root cleaning groove.

2. The anti-fragmentation quartz window according to claim 1, characterized in that: The base is made of metal, and has a first thermal expansion deformation between a high temperature condition when the ultraviolet light source is turned on and a low temperature condition when the ultraviolet light source is turned off, wherein: The support pad is made of hard PTFE material, which expands synchronously with the base under the high temperature working condition and contracts synchronously with the base under the low temperature working condition to support the lower edge of the quartz window body.

3. The anti-fragmentation quartz window according to claim 2, characterized in that: The first depth of the root cleaning groove under the low temperature condition is 0.5 mm-2 mm, and the difference between the first depth of the root cleaning groove and the first thickness of the support pad under the low temperature condition is not greater than the fracture stress threshold of the quartz window body, and The difference between the second depth of the root cleaning groove under the high temperature condition and the second thickness of the support pad under the high temperature condition is also not greater than the fracture stress threshold of the quartz window body, wherein the second depth is equal to the sum of the first depth and the first thermal expansion deformation, and the second thickness is equal to the sum of the first thickness and the second thermal expansion deformation of the support pad between the high temperature condition and the low temperature condition.

4. The anti-fragmentation quartz window according to claim 1, characterized in that: The lower edge of the quartz window body is provided with a chamfer.

5. A UV curing device, characterized in that: include: An ultraviolet light source, used for providing ultraviolet light; A UV curing chamber, disposed below the UV light source, for accommodating semiconductor samples to be cured; as well as The anti-shattering quartz window according to any one of claims 1 to 4, wherein the anti-shattering quartz window is arranged on the UV curing chamber to seal the UV curing chamber and allow the UV light provided by the UV light source to enter the UV curing chamber to perform UV light curing on the semiconductor sample therein.

6. The UV curing device according to claim 5, characterized in that: Also includes: The first reflective element surrounds the upper portion of the ultraviolet light source and is used to reflect the ultraviolet light output upward by the ultraviolet light source to the anti-fragmentation quartz window so as to perform ultraviolet light curing on the semiconductor sample below the window.

7. The UV curing device according to claim 6, characterized in that: The first reflective element is a parabolic mirror, and the ultraviolet light source is arranged at the focal position of the parabolic mirror, so that the parabolic mirror can vertically reflect the ultraviolet light output upward by the ultraviolet light source to the anti-fragmentation quartz window, so as to perform ultraviolet light curing on the semiconductor sample thereunder.

8. The ultraviolet light curing device according to claim 5, characterized in that: Also includes: The second reflective element is disposed between the ultraviolet light source and the anti-shattering quartz window, and is used to reflect the ultraviolet light outputted laterally by the ultraviolet light source to the anti-shattering quartz window, so as to perform ultraviolet light curing on the semiconductor sample thereunder.

9. The ultraviolet curing device according to claim 5, characterized in that: Also includes: A heat dissipation element contacts the base of the anti-shatter quartz window to limit its actual temperature to below a preset temperature under high temperature conditions.

10. The ultraviolet curing device according to claim 5, characterized in that: The UV curing chamber is also connected to a vacuum pump for evacuating the interior of the UV curing chamber to a vacuum state before the UV curing is performed.

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