Chip packaging structure with double-sided efficient heat dissipation

Abstract

The utility model discloses a double-sided efficient heat dissipation chip packaging structure, which belongs to the technical field of chip packaging and comprises a substrate, an upper heat dissipation plate and a lower heat dissipation plate, the substrate is provided with a mounting groove for mounting a chip main body, the upper heat dissipation plate is positioned on the upper side surface of the substrate and is attached to the chip main body, and the lower heat dissipation plate is positioned on the lower side surface of the substrate and is attached to the chip main body. The chip main body is connected with the circuit mainboard through a conductive connecting piece, and the conductive connecting piece can support the substrate to enable the lower heat dissipation plate to be kept suspended.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a chip packaging structure with double-sided efficient heat dissipation. Background Art

[0002] In order to improve the heat dissipation effect of the chip, a Chinese patent document with publication number CN216389336U discloses a chip packaging structure with double-sided efficient heat dissipation, which utilizes a conductive connector, a lower heat dissipation cover, and solder paste welded between the lower heat dissipation cover and the PCB mainboard to conduct heat to the PCB mainboard, thereby achieving double-sided heat dissipation of the chip. However, since the heat will be transferred to the PCB mainboard, it is easy to affect other components on the PCB mainboard. In order to solve the above problem, the utility model provides a chip packaging structure with double-sided efficient heat dissipation. Utility Model Content

[0003] In view of the above-mentioned technical deficiencies, the purpose of the utility model is to provide a chip packaging structure with double-sided efficient heat dissipation, which supports the chip body through conductive connectors and support blocks, so that the lower heat sink can be kept suspended and heat can be dissipated directly through the lower heat sink, thereby preventing heat from being transferred to the PCB mainboard and affecting other components on the PCB mainboard.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions: The utility model provides a chip packaging structure with high efficiency heat dissipation on both sides, including:

[0005] A substrate, wherein a mounting groove for mounting a chip body is provided on the substrate;

[0006] An upper heat sink, which is located on the upper side of the substrate and is bonded to the chip body;

[0007] A lower heat sink is located on the lower side of the substrate and is bonded to the chip body;

[0008] The chip body is connected to the circuit main board through a conductive connector, and the conductive connector can support the substrate so that the lower heat dissipation plate remains suspended.

[0009] Preferably, a plurality of support blocks are fixedly connected to the lower side surface of the lower heat dissipation plate, and the support blocks are connected to the circuit main board.

[0010] Preferably, the conductive connecting member is a PIN pin, and the PIN pin is connected to the circuit main board.

[0011] Preferably, the outer end of the conductive connector extends in a direction away from the chip body and penetrates the substrate to be connected to the circuit main board.

[0012] Preferably, the upper side surface of the upper heat dissipation plate and the lower side surface of the lower heat dissipation plate are both provided with a plurality of protrusions.

[0013] Preferably, the plurality of protrusions on the upper heat dissipation plate are parallel to each other, and the plurality of protrusions on the lower heat dissipation plate are also parallel to each other.

[0014] Preferably, the support block is in the shape of a cone that is thin at the top and thick at the bottom.

[0015] Preferably, thermal conductive glue is filled between the chip body and the upper heat sink and the lower heat sink.

[0016] The beneficial effects of the utility model are:

[0017] 1. An upper heat sink and a lower heat sink are respectively provided on the upper and lower sides of the substrate, and the lower heat sink is kept suspended by a conductive connector and a support block, so that heat can be dissipated from both sides, thereby improving the heat dissipation effect;

[0018] 2. Protrusions are provided on the upper side of the upper heat sink and the lower side of the lower heat sink, which can increase the contact area between the upper heat sink and the lower heat sink and the air, thereby further improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0021] Figure 2 It is a cross-sectional view of the utility model.

[0022] Figure 3 It is an exploded view of the substrate and the upper heat dissipation plate of the utility model.

[0023] Figure 4 A schematic diagram of the structure of the support block.

[0024] Description of reference numerals:

[0025] 1. Substrate, 2. Chip body, 3. Upper heat sink, 4. Lower heat sink, 5. Circuit board, 6. Conductive connector, 7. Support block. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] Embodiment 1:

[0028] like Figures 1 to 3 As shown, the utility model provides a chip packaging structure with double-sided efficient heat dissipation, including a substrate 1, a chip body 2 is installed in a mounting groove opened on the substrate 1, an upper heat sink 3 is provided on the upper side of the substrate 1, and a lower heat sink 4 is provided on the lower side, and the upper heat sink 3 and the lower heat sink 4 are both in contact with the chip body 2, the substrate 1, the upper heat sink 3 and the lower heat sink 4 can cooperate with each other to package the chip body 2 and protect the chip body 2, and at the same time, the upper heat sink 3 and the lower heat sink 4 cooperate with each other to achieve double-sided heat dissipation and improve the heat dissipation effect of the chip, and the chip body 2 and the upper heat sink 3 and the lower heat sink 4 are filled with thermal conductive adhesive, which can not only connect the chip body 2 with the upper heat sink 3 and the lower heat sink 4, but also fill the gap between the chip body 2 and the upper heat sink 3 and the lower heat sink 4, so that the heat generated by the chip body 2 can be better transferred to the upper heat sink 3 and the lower heat sink 4.

[0029] The chip body 2 is interconnected with the circuit main board 5 through a conductive connector 6, which can be a PIN needle. The conductive connector 6 can play a supporting role while realizing electrical transmission, so that the lower heat sink 4 remains suspended and in contact with the air, and the heat is directly dissipated into the air, avoiding the heat being transferred to the circuit main board 5, thereby affecting the operation of other components on the circuit main board 5.

[0030] The outer end of the conductive connector 6 extends in a direction away from the chip body 2 and folds downward to penetrate the substrate 1 and connect with the circuit main board 5. The conductive connector 6 adopts the above-mentioned form, which can increase the area of ​​the lower heat sink 4, making the area of ​​the lower heat sink 4 larger than the surface of the chip body 2, so that the lower heat sink 4 can protect the chip body 2, and at the same time increase the contact area between the lower heat sink 4 and the air, so that the heat dissipation effect of the lower heat sink 4 is better.

[0031] Embodiment 2:

[0032] like Figure 2 and Figure 4As shown, further, in order to improve the stability of the chip body 2 installed on the circuit main board 5, a plurality of support blocks 7 are fixedly installed on the lower heat sink 4, and the support blocks 7 can be welded together with the circuit main board 5 through solder paste, which can play the role of auxiliary support, thereby sharing the force received by the conductive connector 6;

[0033] In order to reduce the obstruction of the support block 7 to the air flow below the lower heat sink 4 and at the same time enable the support block 7 to provide stable support, the support block 7 is configured to be a cone with a thin top and a thick bottom.

[0034] Embodiment three:

[0035] like Figure 1 and Figure 2 As shown, further, in order to improve the heat dissipation effect of the lower heat sink 4 and the upper heat sink 3, a plurality of protrusions are arranged on the upper side surface of the upper heat sink 3 and the lower side surface of the lower heat sink 4. The arrangement of the protrusions can increase the contact surface between the lower heat sink 4 and the upper heat sink 3 and the air, thereby improving the heat dissipation effect. The protrusions are parallel to each other, so that the air can flow better between the protrusions, and then can better take away the heat.

[0036] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A chip packaging structure with high efficiency heat dissipation on both sides, characterized in that: include: A substrate (1), wherein a mounting groove for mounting a chip body (2) is provided on the substrate (1); An upper heat dissipation plate (3), the upper heat dissipation plate (3) being located on the upper side of the substrate (1) and being bonded to the chip body (2); A lower heat dissipation plate (4), the lower heat dissipation plate (4) being located on the lower side of the substrate (1) and being bonded to the chip body (2); The chip body (2) is connected to the circuit main board (5) via a conductive connector (6), and the conductive connector (6) is capable of supporting the substrate (1) so that the lower heat sink (4) remains suspended; A plurality of support blocks (7) are fixedly connected to the lower side surface of the lower heat dissipation plate (4), and the support blocks (7) and the circuit main board (5) are connected to each other; The support block (7) is in the shape of a cone that is thin at the top and thick at the bottom.

2. A chip packaging structure with high efficiency double-sided heat dissipation as claimed in claim 1, characterized in that: The conductive connecting member (6) is a PIN pin, and the PIN pin is connected to the circuit main board (5).

3. A chip packaging structure with high efficiency double-sided heat dissipation as claimed in claim 2, characterized in that: The outer end of the conductive connecting member (6) extends in a direction away from the chip body (2) and penetrates the substrate (1) to be connected to the circuit main board (5).

4. The chip packaging structure with double-sided efficient heat dissipation as claimed in claim 1, characterized in that: The upper side surface of the upper heat dissipation plate (3) and the lower side surface of the lower heat dissipation plate (4) are both provided with a plurality of protrusions.

5. A chip packaging structure with high efficiency double-sided heat dissipation as claimed in claim 4, characterized in that: The multiple protrusions located on the upper heat dissipation plate (3) are parallel to each other, and the multiple protrusions located on the lower heat dissipation plate (4) are also parallel to each other.

6. The chip packaging structure with double-sided efficient heat dissipation as claimed in claim 1, characterized in that: Thermally conductive glue is filled between the chip body (2) and the upper heat sink (3) and the lower heat sink (4).

Images