Surface-mounted connector pad

Abstract

The utility model relates to the technical field of PCBs (printed circuit boards), and particularly provides a surface-mounted connector bonding pad, which comprises a rectangular bonding pad provided with a plurality of plated-through holes; the plurality of plated-through holes are connected with an internal copper layer of the PCB; the rectangular bonding pad is provided with a plurality of solder mask layers corresponding to the plated-through holes, and the plated-through holes are formed in the centers of the corresponding solder mask layers; in the rectangular bonding pad, the area except the solder mask layer is a steel mesh layer. According to the utility model, under the condition that the cost is not obviously increased, the problem that the surface-mounted bonding pad is easy to fall off is solved, the problem that the connector falls off due to plugging stress and the like of the connector is reduced, the rejection rate of a printed circuit board is reduced, and the production and manufacturing cost of the board card is further reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of servers, and in particular relates to a surface mount connector pad. Background Art

[0002] With the continuous expansion of the application scope of cloud computing, the emergence of online shopping, online approval, and online banking payment, many businesses in people's work and life are showing an information-based development trend. The computing performance requirements for network servers are getting higher and higher, and the concept of cloud computing has also emerged, and the new concepts of government cloud, health cloud, and tax cloud have been initially formed. All of these are inseparable from servers.

[0003] Various types of connectors are indispensable in server hardware design, and connectors are required for interconnection between various boards. There are three main types of commonly used connectors. The first type is a crimping connector, which uses a stamping method to press the connector pins into the package holes in the PCB during assembly. The second type is a plug-in connector, which inserts the pins into the metallized holes of the PCB board, and then uses wave soldering to solder the connector to the single board. The third type is a surface-mount connector, which connects the connector pins to the pads on the surface of the circuit board during assembly, and the connector pins and the pads on the circuit board are soldered together by reflow soldering. The first two types of connector assembly methods, because they penetrate the circuit board longitudinally and are embedded on the single board, the pads and the single board will be more firmly combined, the pads are not easy to fall off, and the stressed pins of the connector are not easy to detach. In the third assembly method, the pads are only located on the surface of the circuit board, and the pads and connector pins are connected by solder. The pads and the circuit board substrate are connected by the bonding force of the material, and the bonding force is small and cannot withstand a large separation force. The stress on the connector during plugging and unplugging can easily cause the pad to fall off the circuit board. If the pad falls off, the circuit board must be scrapped and replaced with a new one.

[0004] There are two existing solutions to improve the pad peeling of surface mount connectors. One is to improve the material of the circuit board to increase the bonding strength between the circuit board substrate and the surface copper foil, thereby improving the adhesion between the surface pad and the circuit board. The other solution is to use a large surface copper foil to connect with the pad on the surface during design, thereby increasing the contact area to improve the bonding strength between the pad and the circuit board.

[0005] The first method of improving the circuit board material has limited effect on improving the adhesion of the pad, because the pad size is relatively small, and the increase in adhesion per unit area has little benefit in improving the adhesion of the pad, and will also increase the cost of the circuit board. Not only that, it will also have an adverse effect on signal quality.

[0006] Another method of using large-area copper foil to improve the bonding strength of the pad can improve the adhesion of the pad, but large-area copper foil will also cause waste of space on the circuit board, resulting in insufficient wiring space on the circuit board. The problem of insufficient wiring space needs to be solved by increasing the number of layers or size of the circuit board. The increase in the number of layers and size of the circuit board will increase additional costs. In addition, in some cases where the structure space is small, the size of the circuit board is also relatively small, which cannot be solved by this method. Utility Model Content

[0007] In view of the above-mentioned deficiencies in the prior art, the utility model provides a surface mount connector pad to solve the above-mentioned technical problems.

[0008] The utility model provides a surface mount connector pad, comprising:

[0009] A rectangular pad, wherein a plurality of metallized holes are provided in the rectangular pad; the plurality of metallized holes are all connected to the inner copper layer of the PCB board;

[0010] The rectangular pad is provided with a solder resist layer corresponding to the plurality of metallized holes, and the metallized holes are located at the center of the corresponding solder resist layer;

[0011] In the rectangular pad, the area outside the solder resist layer is a steel mesh layer.

[0012] In an optional embodiment, the solder resist layer is within a square area, and the sizes of the plurality of solder resist layers are the same.

[0013] In an optional embodiment, the PCB includes a four-layer board, which is a first layer, a second layer, a third layer and a fourth layer in sequence, wherein the first layer is a TOP layer and the fourth layer is a Bottom layer.

[0014] In an optional embodiment, the rectangular pad is on the first layer of the PCB board, and a copper layer is laid on the second layer of the PCB board, and the size of the copper layer is the same as the size of the rectangular pad.

[0015] In an optional embodiment, the rectangular pad is on the fourth layer of the PCB board, and a copper layer is laid on the third layer of the PCB board, and the size of the copper layer is the same as the size of the rectangular pad.

[0016] In an optional embodiment, the steel mesh layer is connected to the surface mount connector via a solder paste layer.

[0017] In an optional embodiment, the surface mount connector is a vertical surface mount rectangular connector.

[0018] In an optional embodiment, a square solder resist layer is provided at each of the four corners of the rectangular pad.

[0019] In an optional embodiment, a solder resist bridge is provided between adjacent square solder resist layers, and the solder resist bridge and the solder resist layer form a closed area, and the closed area is a steel mesh layer.

[0020] In an optional embodiment, the closed area is a rectangular area.

[0021] The beneficial effect of the present invention is that the surface-mount connector pad provided by the present invention can solve the problem of the surface-mount pad being easy to fall off without significantly increasing the cost, reduce the problem of connector falling off due to plugging and unplugging stress, etc., reduce the scrap rate of printed circuit boards, and thus reduce the production cost of boards.

[0022] In addition, the utility model has a reliable design principle, a simple structure and a very broad application prospect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a schematic diagram of the PCB package of the surface mount connector.

[0025] Figure 2 The figure is a plan view of a surface mount connector pad according to an embodiment of the utility model.

[0026] Figure 3 It is a longitudinal cross-sectional schematic diagram of a surface mount connector pad according to an embodiment of the utility model.

[0027] Figure 4 It is another plan view of the surface mount connector pad of one embodiment of the utility model.

[0028] Among them, 1. Fixed Pin; 2. Signal Pin; 3. Solder Mask Layer; 4. Metallized Hole; 5. Steel Mesh Layer; 6. PCB Board; 7. Copper Layer; 8. Welding Layer; 9. Solder Mask Bridge. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0031] Commonly used 4-pin surface mount connector PCB packaging structure such as Figure 1 As shown, it includes two fixed Pin 1 and two signal Pin 2.

[0032] Please refer to Figure 2 and Figure 3 , surface mount connector pads include:

[0033] A rectangular pad is provided with a plurality of metallized holes 4; the plurality of metallized holes 4 are all connected to the internal copper layer 7 of the PCB board 6; the rectangular pad is provided with a solder resist layer 3 corresponding to the plurality of metallized holes 4, and the metallized holes 4 are located at the center of the corresponding solder resist layer 3; in the rectangular pad, the area outside the solder resist layer 3 is a steel mesh layer 5. The solder resist layer 3 and the steel mesh layer 5 are contained in the welding layer 8.

[0034] By changing the two fixed pins, the bonding force between the pad and the PCB is increased, thereby preventing the connector from being stressed and falling off. That is, the fixed pin is replaced by the metallized hole 4, and the metallized hole 4 is connected to the inner copper layer 7, and the copper layer 7 does not affect the surface wiring area of ​​the PCB board 6. And by connecting with the internal copper layer 7, the pad borrows the bonding force of the PCB board 6 layer, which can effectively prevent the pad from falling off.

[0035] Take a 4-layer PCB board 6 as an example, which includes 4 layers, and the 4 layers are the first layer, the second layer, the third layer and the fourth layer in sequence, wherein the first layer is the TOP layer and the fourth layer is the Bottom layer. If the rectangular pad is on the first layer of the PCB board 6, the second layer of the PCB board 6 is paved with a copper layer 7, and the size of the copper layer 7 is the same as the size of the rectangular pad. If the rectangular pad is on the fourth layer of the PCB board 6, the third layer of the PCB board 6 is paved with a copper layer 7, and the size of the copper layer 7 is the same as the size of the rectangular pad. That is, the board layer where the copper layer 7 is deployed is adjacent to the layer where the pad is located, thereby reducing the number of board layers through which the hole passes.

[0036] The steel mesh layer 5 is connected to the surface mount connector through the solder paste layer. The surface mount connector is a vertical surface mount rectangular connector. The vertical surface mount rectangular connector has the advantages of small size and space saving.

[0037] In order to effectively utilize the area of ​​the pad, a square solder resist layer 3 with metallized holes 4 is provided at the four corners of the rectangular pad, and two sides of the square solder resist layer 3 overlap with two sides of the rectangular pad. In this way, effective utilization of the area is achieved. The four solder resist layers 3 have the same size.

[0038] A solder resist bridge 9 is provided between adjacent square solder resist layers 3, and the solder resist bridge 9 and the solder resist layer 3 enclose a closed area, and the closed area is the steel mesh layer 5. The closed area is a rectangular area. The solder resist bridge 9 is provided to block the solder paste, so as to prevent the solder paste from overflowing, which may adversely affect the subsequent test of the PCB board 6.

[0039] Although the present invention is described in detail by referring to the accompanying drawings and in combination with the preferred embodiments, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, a person skilled in the art may make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions shall be within the scope of the present invention. Any person skilled in the art who is familiar with the present technical field may easily think of changes or substitutions within the technical scope disclosed in the present invention, and these shall be within the scope of protection of the present invention.

Claims

1. A surface mount connector pad, characterized in that: include: A rectangular pad, wherein a plurality of metallized holes are provided in the rectangular pad; the plurality of metallized holes are all connected to the inner copper layer of the PCB board; The rectangular pad is provided with a solder resist layer corresponding to the plurality of metallized holes, and the metallized holes are located at the center of the corresponding solder resist layer; In the rectangular pad, the area outside the solder resist layer is a steel mesh layer.

2. The surface mount connector pad according to claim 1, characterized in that: The solder resist layers are within a square area, and the sizes of the multiple solder resist layers are the same.

3. The surface mount connector pad according to claim 1, characterized in that: The PCB includes 4 layers, which are the first layer, the second layer, the third layer and the fourth layer in sequence, wherein the first layer is the TOP layer and the fourth layer is the Bottom layer.

4. The surface mount connector pad according to claim 3, characterized in that: The rectangular pad is on the first layer of the PCB board, and a copper layer is laid on the second layer of the PCB board. The size of the copper layer is the same as that of the rectangular pad.

5. The surface mount connector pad according to claim 3, characterized in that: The rectangular pad is on the fourth layer of the PCB board, and a copper layer is laid on the third layer of the PCB board. The size of the copper layer is the same as that of the rectangular pad.

6. The surface mount connector pad according to claim 1, characterized in that: The steel mesh layer is connected to the surface mount connector through a solder paste layer.

7. The surface mount connector pad according to claim 6, characterized in that: The surface mount connector is a vertical surface mount rectangular connector.

8. The surface mount connector pad according to claim 1, characterized in that: A square solder resist layer is provided at each of the four corners of the rectangular pad.

9. The surface mount connector pad according to claim 8, characterized in that: A solder resist bridge is arranged between adjacent square solder resist layers, and the solder resist bridge and the solder resist layer form a closed area, which is a steel mesh layer.

10. The surface mount connector pad according to claim 9, characterized in that: The closed area is a rectangular area.

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