Silicon wafer taking mechanism and silicon wafer taking device

Abstract

The utility model provides a silicon wafer taking mechanism and a silicon wafer taking device.The silicon wafer taking mechanism comprises a mounting support, at least two conveying belts, a suction cup assembly and at least two adsorption units, the at least two conveying belts are arranged on the mounting support, and the adsorption units are located on the sides of the corresponding conveying belts and extend in the conveying direction of the conveying belts; the suction cup assemblies are located between the two adjacent conveying belts, and the suction force of the suction cup assemblies is larger than that of the suction units. The suction cup assembly is configured to upwards suck the silicon wafers jacked to the preset height in the material box, so that the silicon wafers are sucked out of the material box upwards and then attached to the conveying belt, and the adsorption unit is used for adsorbing the silicon wafers attached to the conveying belt to the conveying belt; the conveying belt is used for conveying silicon wafers. According to the silicon wafer taking mechanism, the silicon wafers are taken out from the material box, the silicon wafers to be sucked in the material box can be sucked to the conveying belt without being jacked to the guide inclined planes of the limiting columns, and the silicon wafers located below the silicon wafers can be prevented from being taken out of the material box when the silicon wafers on the topmost layer are sucked.

Description

Technical Field

[0001] The present application relates to the field of battery production, and in particular to a silicon wafer taking mechanism and a silicon wafer taking device. Background Art

[0002] Before silicon wafers are made into battery cells, they first need to be taken out of the material box and then transported to the subsequent processing station for processing.

[0003] like Figure 1 As shown, a conventional material box 100 includes a bottom plate 101 and a plurality of limiting columns 102 arranged on the bottom plate 101. The bottom plate 101 is provided with a lifting hole. The plurality of limiting columns 102 together form a storage space for stacking silicon wafers. The top of each limiting column is provided with an outward-expanding guide slope 103.

[0004] The material picking mechanism 300 is located above the material box 100, and the lifting mechanism located below the material box 100 first lifts the silicon wafers in the material box 100 upward through the lifting holes, so that the top silicon wafer 200 is lifted to a predetermined height. Then, the material picking mechanism 300 sucks the top silicon wafer 200 out of the material box and transports the silicon wafers to both sides.

[0005] The existing material taking mechanism 300 has a relatively small adsorption force. Figure 1 As shown, the topmost silicon wafer 200 must be lifted to the guiding slope 103 of the limiting pillars, and the material taking mechanism 300 can then suck the silicon wafer 200. The resulting problem is that the adjacent silicon wafers below the topmost silicon wafer 200 may also be lifted to the guiding slope 103. Since there is no limiting by the limiting pillars 102 around the adjacent silicon wafers at the guiding slope 103, the lifting action may cause the adjacent silicon wafers to move to the edge and be exposed on one side of the topmost silicon wafer 200, and the adjacent silicon wafers will also be sucked by the material taking mechanism 300, and may eventually leave the material box with the topmost silicon wafer 200 and fall out of the material box, causing damage. Utility Model Content

[0006] In order to solve the above technical problems, the present application provides a silicon wafer taking mechanism, which adopts the following technical solutions:

[0007] A silicon wafer picking mechanism comprises a mounting bracket, at least two conveyor belts, a suction cup assembly and at least two suction units, wherein:

[0008] At least two conveyor belts are arranged in parallel on the mounting bracket, and the lower conveying surfaces of the conveyor belts are located on the same plane;

[0009] The adsorption unit is arranged on the mounting bracket and is located at the side of the corresponding conveyor belt, and the adsorption unit extends along the conveying direction of the conveyor belt;

[0010] The suction cup assembly is installed on the mounting bracket and is located between two adjacent conveyor belts. The lower conveying surface of the conveyor belt is lower than the adsorption surface of the suction cup assembly. The adsorption force of the suction cup assembly is greater than the adsorption force of the adsorption unit.

[0011] The suction cup assembly is configured to suck up the silicon wafer at the top layer in the material box and lifted to a predetermined height, so that the silicon wafer is sucked out of the material box and abuts against the lower conveying surface of the conveyor belt. The suction unit is used to suck the silicon wafer abutting against the lower conveying surface of the conveyor belt onto the lower conveying surface of the conveyor belt.

[0012] The conveyor belt is used to transport the silicon wafer adsorbed by the adsorption unit.

[0013] The silicon wafer picking mechanism provided in the present application sucks the silicon wafer lifted to a predetermined high position in the material box by a suction cup assembly arranged between two adjacent conveyor belts, so that the silicon wafer leaves the material box and abuts against the lower conveying surface of the conveyor belt. Subsequently, the silicon wafer is sucked onto the lower conveying surface of the conveyor belt by a suction unit, so that the conveyor belt conveys the silicon wafer away from the material box.

[0014] Since the suction cup assembly has a large suction force, the silicon wafer to be sucked in the material box does not need to be lifted to the guide slope of the limit column, and the suction cup assembly can suck the silicon wafer. In this way, it can prevent the silicon wafer located below from being pulled out when the top silicon wafer is sucked, causing damage.

[0015] In some embodiments, after the silicon wafer is adsorbed onto the lower conveying surface of the conveyor belt by the adsorption unit, the suction cup assembly is configured to stop adsorbing the silicon wafer.

[0016] Since the suction cup assembly has a large adsorption force, after the silicon wafer is adsorbed by the adsorption unit on the lower conveying surface of the conveyor belt, the suction cup assembly stops sucking the silicon wafer, which can reduce the conveying resistance of the suction cup assembly to the silicon wafer and ensure the smooth conveying of the silicon wafer by the conveyor belt.

[0017] In some embodiments, at least three conveyor belts are provided, and a suction cup assembly is provided between each adjacent conveyor belt.

[0018] By setting up more than three conveyor belts and providing suction cup assemblies between adjacent conveyor belts, the silicon wafers can be more firmly and stably adsorbed on the conveyor belts, preventing the silicon wafers from falling from the conveyor belts due to uneven force.

[0019] In some embodiments, at least three conveyor belts are provided, and there are two adsorption units, and the two adsorption units are respectively located on the inner sides of the two outer conveyor belts.

[0020] By setting up more than three conveyor belts and setting adsorption units on the inner sides of the two outer conveyor belts, silicon wafers can be stably adsorbed on the conveyor belts to prevent the silicon wafers from falling during the process of conveying silicon wafers on the conveyor belts.

[0021] In some embodiments, the adsorption unit includes a base and a flow guide member, the base is installed close to the corresponding conveyor belt and is at least used to support the lower conveying surface of the conveyor belt, an air cavity is formed between the flow guide member and the base, an air flow guide part connected to the air cavity is formed between the flow guide member and the base, and an air supply port is provided on the flow guide member, compressed gas enters the air cavity through the air supply port, and then flows out from the air flow guide part through the air cavity to non-contactly adsorb the silicon wafer on the lower conveying surface of the conveyor belt based on the negative pressure generated by the Bernoulli effect.

[0022] The adsorption unit is configured so that it can form a negative pressure based on the Bernoulli effect to keep the silicon wafer on the conveying surface of the conveyor belt in a non-contact manner. Since the adsorption force of the adsorption unit is distributed along the conveying direction of the conveyor belt, the adsorption force is generated around the conveyor belt along the conveying direction instead of being concentrated between the conveyor belts. Therefore, it is not easy to cause deformation of the silicon wafer during adsorption. At the same time, the base can support the conveying surface of the conveyor belt, thereby improving the stability of the conveying of the conveyor belt.

[0023] In some embodiments, the suction cup assembly includes at least two Bernoulli suction cups spaced apart along the conveying direction of the conveyor belt.

[0024] By arranging at least two Bernoulli suction cups at intervals along the conveying direction of the conveyor belt, the negative pressure generated by the at least two Bernoulli suction cups can hold the silicon wafer on the conveying surface of the conveyor belt in a non-contact manner, thereby improving the force uniformity of the silicon wafer when it is adsorbed onto the conveying surface of the conveyor belt and ensuring that the silicon wafer is stably adsorbed.

[0025] In some embodiments, the silicon wafer picking mechanism also includes a driving mechanism for driving a plurality of conveyor belts for synchronous transportation, the driving mechanism includes a rotating shaft driving member, a rotating shaft, and a conveyor belt wheel group arranged in a one-to-one correspondence with the conveyor belts, wherein: the rotating shaft is rotatably connected to the mounting bracket, and is transmission-connected to the rotating shaft driving member, the rotating shaft driving member is used to drive the rotating shaft to rotate; the conveyor belt wheel group includes a driving wheel and a plurality of driven wheels, wherein the driving wheel is fixedly mounted on the rotating shaft, and the plurality of driven wheels are rotatably connected to the mounting bracket; each conveyor belt is respectively mounted on the corresponding conveyor belt wheel group, and the rotating shaft driving member drives the rotating shaft to rotate to drive each conveyor belt for synchronous transportation.

[0026] By setting up the driving mechanism, the driving mechanism can realize synchronous driving of all conveyor belts, further improving the conveying stability of silicon wafers.

[0027] In some embodiments, the conveyor belt wheel set further includes a tensioning wheel, which is located between the driving wheel and one of the driven wheels, or between two driven wheels. The conveyor belt is wound around the tensioning wheel, and the tensioning wheel is used to tension the conveyor belt.

[0028] By setting a tensioning wheel, the conveyor belt is tensioned to prevent the conveyor belt from becoming loose and causing silicon wafers to fall.

[0029] The present application also provides a silicon wafer retrieval device, which includes a material box supporting platform, a lifting mechanism and the silicon wafer retrieval mechanism described in any of the above items, wherein: the material box supporting platform is used to carry the material box, and a lifting channel is provided on the material box supporting platform which passes through the material box supporting platform from top to bottom, the material box includes a bottom plate and a plurality of limiting columns arranged on the bottom plate, the bottom plate is provided with a lifting hole which passes through the lifting channel, the plurality of limiting columns enclose a storage space for stacking silicon wafers, and the top of each limiting column is provided with an outward-expanding guiding inclined surface; the silicon wafer retrieval mechanism is arranged above the material box supporting platform, and the lifting mechanism is arranged below the material box supporting platform; the lifting mechanism is configured to lift the silicon wafers located in the material box through the lifting hole and the lifting channel in sequence, so that the silicon wafer located at the top layer is lifted to a predetermined high position, and the predetermined high position is located below the guiding inclined surface; the silicon wafer retrieval mechanism is used to absorb the silicon wafer located at the predetermined high position and transport the silicon wafer.

[0030] Through the cooperation of the material box supporting platform, the lifting mechanism and the silicon wafer taking mechanism, the silicon wafer taking device can take out the silicon wafers in the material box one by one, and can prevent the silicon wafers located below the top silicon wafer from being brought out and damaged when the top silicon wafer is sucked.

[0031] In some embodiments, the lifting mechanism includes a lifting drive unit and a lifting plate, wherein the lifting plate is connected to the driving end of the lifting drive unit. When the lifting drive unit drives the lifting plate to rise, the lifting plate passes through the lifting channel and the lifting hole in sequence to lift the silicon wafer in the material box.

[0032] By setting up the lifting mechanism, the lifting mechanism can pass through the lifting channel on the supporting platform and the lifting hole at the bottom of the material box in sequence, lift the silicon wafer in the material box, and keep the lifted silicon wafer level, finally ensuring that the silicon wafer lifted to a predetermined high position is stably adsorbed by the suction cup assembly to the conveying surface of the conveyor belt. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of the process of a conventional material taking mechanism taking silicon wafers from a material box;

[0034] Figure 2 It is a structural schematic diagram of the silicon wafer taking mechanism in the embodiment of the present application at a first viewing angle;

[0035] Figure 3 Schematic diagram of the structure of the silicon wafer taking mechanism in the embodiment of the present application at a second viewing angle;

[0036] Figure 4 Schematic diagram of the structure of the silicon wafer taking mechanism in the embodiment of the present application at a third viewing angle;

[0037] Figure 5 Schematic diagram of the process of the silicon wafer taking mechanism in the embodiment of the present application sucking silicon wafers from the material box;

[0038] Figure 6 It is a schematic structural diagram of a silicon wafer taking device in an embodiment of the present application at one viewing angle;

[0039] Figure 7 is a schematic structural diagram of the silicon wafer fetching device in the embodiment of the present application from another viewing angle;

[0040] Figures 1 to 7 Included:

[0041] Silicon wafer taking mechanism 10:

[0042] Mounting bracket 1, conveyor belt 2, suction cup assembly 3, suction unit 4, driving mechanism 5, rotating shaft driving member 51, rotating shaft 52, driving wheel 53, driven wheel 54, tensioning wheel 55, driving motor 511, driving gear 512, driven gear 513;

[0043] Lifting mechanism 20:

[0044] The jacking driving unit 21 and the jacking plate 22 are lifted. DETAILED DESCRIPTION

[0045] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0046] like Figures 2 to 5 As shown, the silicon wafer picking mechanism 10 in the embodiment of the present application includes a mounting bracket 1, at least two conveyor belts 2, a suction cup assembly 3 and at least two suction units 4, wherein:

[0047] At least two conveyor belts 2 are arranged in parallel on the mounting bracket 1, and the lower conveying surfaces of the conveyor belts 2 are located on the same plane.

[0048] The adsorption unit 4 is disposed on the mounting bracket 1 and is located at the side of the corresponding conveyor belt 2 . The adsorption unit 4 extends along the conveying direction of the conveyor belt 2 (eg, the X-axis direction in the figure).

[0049] The suction cup assembly 3 is installed on the mounting bracket 1 and is located between two adjacent conveyor belts 2 . The lower conveying surface of the conveyor belt 2 is lower than the adsorption surface of the suction cup assembly 3 . The adsorption force of the suction cup assembly 3 is greater than the adsorption force of the adsorption unit 4 .

[0050] The suction cup assembly 3 is configured to suck up the silicon wafer 200 at the top layer in the material box 100 and lift it to a predetermined height, so that the silicon wafer 200 is sucked upward out of the material box 100 and then abuts against the lower conveying surface of the conveyor belt 2. The adsorption unit 4 is used to adsorb the silicon wafer 200 abutting against the lower conveying surface of the conveyor belt 2 on the lower conveying surface of the conveyor belt 2.

[0051] The conveyor belt 2 is used to convey the silicon wafer 200 adsorbed by the adsorption unit.

[0052] The optional process of the silicon wafer taking mechanism 10 in the embodiment of the present application is as follows:

[0053] Open the suction cup assembly 3 and control the lifting mechanism to lift the silicon wafer in the material box upward. Figure 5 As shown, due to the strong adsorption force of the suction cup assembly 3, when the top silicon wafer 200 in the material box 100 is lifted to a predetermined height A (the predetermined height A is lower than the guiding inclined surface 103 of the limiting column 102 of the material box 100), the suction cup assembly 3 can suck the top silicon wafer 200 out of the material box 100 and make the silicon wafer 200 stick to the lower conveying surface of the conveyor belt 2.

[0054] After the topmost silicon wafer 200 sucked up by the suction cup assembly 3 is attached to the lower conveying surface of the conveyor belt 2 , it is held on the lower conveying surface of the conveyor belt 2 by the suction of the suction unit 4 .

[0055] Then, each conveyor belt 2 is controlled to convey the silicon wafer 200 to the side of the material box 100 .

[0056] It can be seen that the silicon wafer picking mechanism 10 in the embodiment of the present application has a large suction force due to the suction cup assembly 3 arranged between two adjacent conveyor belts 2. Therefore, during the wafer picking process, the topmost silicon wafer 200 to be sucked in the material box 100 does not need to be lifted to the guide slope 103 of the limit column 102, and can be sucked out of the material box 100 by the suction cup assembly 3 and abutted against the lower conveying surface of the conveyor belt 2. In this way, it can be prevented that when the topmost silicon wafer 200 is sucked, the silicon wafers located below it are taken out of the material box 100 and damaged.

[0057] Optionally, after the silicon wafer 200 is adsorbed on the lower conveying surface of the conveyor belt 2 by the adsorption unit 4, the suction cup assembly 3 is closed, the suction cup assembly 3 immediately stops adsorbing the silicon wafer 200, and the adsorption unit 4 is started. The silicon wafer 200 is only maintained on the lower conveying surface of the conveyor belt 2 under the adsorption of the adsorption unit 4. The adsorption force of the adsorption unit 4 is relatively small. In this way, the conveying resistance of the suction cup assembly 3 to the silicon wafer 200 can be reduced, ensuring that the conveyor belt 2 can smoothly convey the silicon wafer 200.

[0058] Optionally, the conveyor belt 2 is provided with at least three belts, for example Figures 2 to 4The silicon wafer taking mechanism 10 of the embodiment is provided with three conveyor belts 2. A suction cup assembly 3 is provided between each adjacent conveyor belt 2.

[0059] By setting more than three conveyor belts 2 and providing suction cup assemblies 3 between adjacent conveyor belts 2, the silicon wafer 200 can be more firmly and stably adsorbed on the conveyor belt 2, preventing the silicon wafer 200 from falling from the conveyor belt 2 due to uneven force.

[0060] Optionally, in the case where the silicon wafer taking mechanism 10 is provided with three or more conveyor belts 2, two adsorption units 4 are provided, and the two adsorption units 4 are respectively located at the inner sides of the two outer conveyor belts 2. In this way, it can be ensured that the silicon wafer 200 can be more stably adsorbed on the conveyor belt 2 during the conveying process, and the silicon wafer 200 will not fall during the conveying process.

[0061] Optionally, the adsorption unit 4 includes a base and a flow guide, the base is installed close to the corresponding conveyor belt 2 and is at least used to support the lower conveying surface of the conveyor belt 2. An air cavity is formed between the flow guide and the base, an air flow guide part connected to the air cavity is formed between the flow guide and the base, and an air supply port is provided on the flow guide, and compressed gas enters the air cavity through the air supply port, and then flows out of the air flow guide part through the air cavity to non-contactly adsorb the silicon wafer on the lower conveying surface of the conveyor belt 2 based on the negative pressure generated by the Bernoulli effect.

[0062] By configuring the adsorption unit 4, the adsorption unit 4 can form a negative pressure based on the Bernoulli effect to keep the silicon wafer 200 on the conveying surface of the conveyor belt 2 in a non-contact manner. Since the adsorption force of the adsorption unit 4 is distributed along the conveying direction of the conveyor belt 2, the adsorption force is generated around the conveyor belt 2 along the conveying direction, rather than concentrated between the conveyor belts 2. Therefore, it is not easy to cause the silicon wafer 200 to deform during adsorption. At the same time, the base can support the conveying surface of the conveyor belt 2, thereby improving the stability of the conveying of the conveyor belt 2.

[0063] like Figure 2 As shown, optionally, the suction cup assembly 3 includes at least two (eg, two in the figure) Bernoulli suction cups spaced apart along the conveying direction of the conveyor belt 2 .

[0064] By configuring the suction cup assembly 3 to include at least two Bernoulli suction cups spaced apart along the conveying direction of the conveyor belt 2, the negative pressure generated by the suction cup assembly 3 holds the silicon wafer 200 on the conveying surface of the conveyor belt 2 in a non-contact manner, thereby improving the force uniformity of the silicon wafer 200 when it is adsorbed onto the conveying surface of the conveyor belt 2, and ensuring that the silicon wafer 200 is stably adsorbed onto the conveyor belt 2.

[0065] like Figures 2 to 4As shown, optionally, the silicon wafer picking mechanism 10 in the embodiment of the present application also includes a driving mechanism 5 for driving a plurality of conveyor belts 2 for synchronous conveying, the driving mechanism 5 includes a rotating shaft driving member 51, a rotating shaft 52, and a conveyor belt wheel group arranged one by one corresponding to the conveyor belt 2, wherein: the rotating shaft 52 is rotatably connected to the mounting bracket 1, and is in transmission connection with the rotating shaft driving member 51, and the rotating shaft driving member 51 is used to drive the rotating shaft 52 to rotate. The conveyor belt wheel group includes a driving wheel 53 and a plurality of driven wheels 54, wherein the driving wheel 53 is fixedly mounted on the rotating shaft 52, and the plurality of driven wheels 54 are rotatably connected to the mounting bracket 1. Each conveyor belt 2 is respectively mounted on the corresponding conveyor belt wheel group, and the rotating shaft driving member 51 drives the rotating shaft 52 to rotate, so as to drive each conveyor belt 2 for synchronous conveying.

[0066] Optionally, the conveyor belt wheel assembly also includes a tensioning wheel 55, which is located between the driving wheel 53 and one of the driven wheels 54, or between two driven wheels 54. The conveyor belt 2 is wrapped around the tensioning wheel 55, and the tensioning wheel 55 is used to tension the conveyor belt 2, thereby ensuring that the conveyor belt 2 is in a taut state and preventing the conveyor belt 2 from becoming loose and causing the silicon wafer 200 to fall.

[0067] like Figure 3 As shown, optionally, the rotating shaft driving member 51 includes a driving motor 511, a driving gear 512, a driven gear 513 and a belt (not shown in the figure), wherein the driving motor 511 is mounted on the bracket 1, the driving gear 512 is connected to the output shaft of the driving motor 511, the driven gear 513 is fixedly sleeved on the end of the rotating shaft 52, and the belt is sleeved on the driving gear 512 and the driven gear 513. When the driving motor 511 drives the driving gear 512 to rotate, the driving gear 512 drives the rotating shaft 52 to rotate synchronously through the belt and the driven gear 513.

[0068] The present application also provides a silicon wafer taking device, such as Figure 6 to Figure 7 As shown, the silicon wafer fetching device includes a material box carrying platform (not shown in the figure), a lifting mechanism 20 and a silicon wafer fetching mechanism 10 provided in any of the above embodiments, wherein:

[0069] The material box support platform is used to support the material box 100, and a lifting channel that runs through the material box support platform from top to bottom is provided on the material box support platform. The material box 100 includes a bottom plate 101 and a plurality of limiting columns 102 provided on the bottom plate 101. A lifting hole that runs through the lifting channel is provided on the bottom plate 101, and a plurality of limiting columns 102 are combined to form a material storage space for stacking silicon wafers, and a guide slope 103 that expands outward is provided on the top of each limiting column 102, that is, the material box 100 is a conventional material box mentioned in the above embodiment.

[0070] The silicon wafer taking mechanism 10 is arranged above the material box bearing platform, and the lifting mechanism 20 is arranged below the material box bearing platform. The lifting mechanism 20 is configured to lift the silicon wafers in the material box 100 through the lifting holes and the lifting channels in sequence, so that the silicon wafer 200 at the top layer is lifted to a predetermined high position A, and the predetermined high position A is located below the guide slope 103. The silicon wafer taking mechanism 10 is used to suck the silicon wafer 200 at the predetermined high position and transport the silicon wafer 200.

[0071] Through the cooperation of the material box support platform, the lifting mechanism 20 and the silicon wafer taking mechanism 10, the silicon wafer taking device in the embodiment of the present application can take out the silicon wafers in the material box 100 one by one, and can prevent the silicon wafers located below the top silicon wafer from being brought out and damaged when the top silicon wafer is sucked.

[0072] Optionally, the lifting mechanism 20 includes a lifting drive unit 21 and a lifting plate 22, wherein the lifting plate 22 is connected to the driving end of the lifting drive unit 21, and when the lifting drive unit 21 drives the lifting plate 22 to rise, the lifting plate 22 sequentially passes through the lifting channel and the lifting hole to lift the silicon wafer in the material box 100. The lifting drive unit 21 can be a cylinder.

[0073] By setting the lifting mechanism 20, the lifting mechanism 20 can pass through the lifting channel on the supporting platform and the lifting hole at the bottom of the material box 100 in sequence, lift the silicon wafer in the material box 100, and keep the lifted silicon wafer level, finally ensuring that the silicon wafer lifted to a predetermined high position is stably adsorbed by the suction cup assembly 3 to the conveying surface of the conveyor belt 2.

[0074] The above description of the present application is sufficiently detailed and has certain particularities. Those skilled in the art should understand that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, not by the above description in the embodiments. Moreover, the embodiments mentioned in the present application are not limited to being implemented individually, and some embodiments can also be implemented in combination.

Claims

1. A silicon wafer taking mechanism, characterized in that: The silicon wafer picking mechanism comprises a mounting bracket, at least two conveyor belts, a suction cup assembly and at least two suction units, wherein: At least two conveyor belts are arranged in parallel on the mounting bracket, and the lower conveying surfaces of the conveyor belts are located on the same plane; The adsorption unit is arranged on the mounting bracket and is located at the side of the corresponding conveyor belt, and the adsorption unit extends along the conveying direction of the conveyor belt; The suction cup assembly is mounted on the mounting bracket and is located between two adjacent conveyor belts, the lower conveying surface of the conveyor belt is lower than the adsorption surface of the suction cup assembly, and the adsorption force of the suction cup assembly is greater than the adsorption force of the adsorption unit; The suction cup assembly is configured to suck up the silicon wafer at the top layer in the material box and lifted to a predetermined height, so that the silicon wafer is sucked out of the material box and then abuts against the lower conveying surface of the conveyor belt, and the suction unit is used to suck the silicon wafer abutting against the lower conveying surface of the conveyor belt onto the lower conveying surface of the conveyor belt; The conveyor belt is used to convey the silicon wafer adsorbed by the adsorption unit.

2. The silicon wafer taking mechanism according to claim 1, characterized in that: After the silicon wafer is adsorbed on the lower conveying surface of the conveyor belt by the adsorption unit, the suction cup assembly is configured to stop adsorbing the silicon wafer.

3. The silicon wafer taking mechanism according to claim 1, characterized in that: The conveyor belts are at least three, and a suction cup assembly is provided between each adjacent conveyor belt.

4. The silicon wafer taking mechanism according to claim 1, characterized in that: The conveyor belts are at least three, and the adsorption units are two, and the two adsorption units are respectively located at the inner sides of the two outer conveyor belts.

5. The silicon wafer taking mechanism according to claim 1, characterized in that: The adsorption unit includes a base and a guide member, the base is installed close to the corresponding conveyor belt and is at least used to support the lower conveying surface of the conveyor belt, an air cavity is formed between the guide member and the base, an air flow guide part connected to the air cavity is formed between the guide member and the base, and an air supply port is provided on the guide member, compressed gas enters the air cavity through the air supply port, and then flows out from the air flow guide part through the air cavity to non-contactly adsorb the silicon wafer on the lower conveying surface of the conveyor belt based on the negative pressure generated by the Bernoulli effect.

6. The silicon wafer taking mechanism according to claim 1, characterized in that: The suction cup assembly includes at least two Bernoulli suction cups arranged at intervals along the conveying direction of the conveyor belt.

7. The silicon wafer taking mechanism according to claim 1, characterized in that: The silicon wafer taking mechanism further comprises a driving mechanism for driving a plurality of the conveyor belts to convey synchronously, wherein the driving mechanism comprises a rotating shaft driving member, a rotating shaft and a conveyor belt wheel set arranged one by one corresponding to the conveyor belts, wherein: The rotating shaft is rotatably connected to the mounting bracket and is drivingly connected to the rotating shaft driving member, and the rotating shaft driving member is used to drive the rotating shaft to rotate; The conveyor belt wheel group includes a driving wheel and a plurality of driven wheels, wherein the driving wheel is fixedly mounted on the rotating shaft, and the plurality of driven wheels are rotatably connected to the mounting bracket; Each of the conveyor belts is respectively mounted on the corresponding conveyor belt wheel set, and the rotating shaft driving member drives the rotating shaft to rotate to drive each of the conveyor belts to convey synchronously.

8. The silicon wafer taking mechanism according to claim 7, characterized in that: The conveyor belt wheel set also includes a tensioning wheel, which is located between the driving wheel and one of the driven wheels, or between two driven wheels. The conveyor belt is wound around the tensioning wheel, and the tensioning wheel is used to tension the conveyor belt.

9. A silicon wafer taking device, characterized in that: The silicon wafer taking device comprises a material box carrying platform, a lifting mechanism and a silicon wafer taking mechanism according to any one of claims 1 to 8, wherein: The material box supporting platform is used to support the material box, and a lifting channel that passes through the material box supporting platform from top to bottom is arranged on the material box supporting platform, the material box includes a bottom plate and a plurality of limiting columns arranged on the bottom plate, and a lifting hole that passes through the lifting channel is arranged on the bottom plate, and a plurality of limiting columns enclose a material storage space for stacking silicon wafers, and a top of each limiting column is provided with an outward-expanding guiding inclined surface; The silicon wafer taking mechanism is arranged above the material box carrying platform, and the lifting mechanism is arranged below the material box carrying platform; The lifting mechanism is configured to lift the silicon wafers in the material box through the lifting hole and the lifting channel in sequence, so that the silicon wafer at the top layer is lifted to a predetermined high position, and the predetermined high position is located below the guide inclined surface; The silicon wafer taking mechanism is used to suck the silicon wafer located at the predetermined high position and transport the silicon wafer.

10. The silicon wafer taking device according to claim 9, characterized in that: The lifting mechanism includes a lifting drive unit and a lifting plate, wherein the lifting plate is connected to the driving end of the lifting drive unit. When the lifting drive unit drives the lifting plate to rise, the lifting plate passes through the lifting hole and the lifting channel in sequence to lift the silicon wafer in the material box.

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