System for testing heat dissipation performance of thermal management assembly

Abstract

The utility model provides a system for testing the heat dissipation performance of a heat management assembly. The system comprises a controllable thermostat, a test fixture, a heat production unit, a temperature measurement unit, a power supply and a data processing platform, wherein the test fixture, the heat production unit and the temperature measurement unit are arranged in the controllable thermostat; the power supply and the data processing platform are arranged outside the controllable thermostat; the power supply supplies power to the test system; the test fixture comprises a fixture table used for supporting the thermal management assembly; the heat generation unit is used for generating heat to heat the heat management assembly; the temperature measuring unit is in electric signal connection with the data processing platform and used for measuring the temperature of the heat production unit and the heat management assembly and sending the temperature to the data processing platform; and the data processing platform is used for analyzing the temperature data to obtain a heat dissipation performance index of the heat management assembly. According to the heat dissipation performance testing system, software and hardware are integrated into an integrated testing system, the testing process from front-end power-up, middle-end testing to rear-end data processing is provided, the heat dissipation performance testing efficiency is improved, and therefore the stability and consistency of the heat dissipation performance of heat management assemblies of different manufacturers and batches can be rapidly evaluated.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation performance testing, in particular to a heat dissipation performance testing system for a thermal management component. Background Art

[0002] With the development of electronic technology, the number of high-power electronic devices has increased, and the small size, high integration, and high heat consumption of microsystems and microwave modules have become increasingly prominent. When working at full load, the heat consumption of the equipment is as high as kilowatts. In order to ensure the normal operation of the system, thermal management components are widely used in the thermal management systems of various equipment. Thermal management components can help equipment dissipate heat and reduce the temperature of the equipment. Depending on the specific equipment, different types of thermal management components are designed for heat dissipation, thereby effectively improving the operating efficiency of the equipment and avoiding equipment failures due to excessive operating temperatures. Therefore, the heat dissipation performance of thermal management components is particularly important.

[0003] However, in the related technologies, the test system for the heat dissipation performance of thermal management components still has the following disadvantages: 1. It is unable to test the heat dissipation performance of thermal management components of different heat dissipation types, and its applicability is poor; 2. An integrated test system from front-end power-on, mid-end testing to back-end data processing has not been formed, resulting in non-intuitive test results for heat dissipation performance; 3. The test system structure and test process are complicated, resulting in low test efficiency. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the utility model provides a thermal management component heat dissipation performance testing system to solve at least one of the above-mentioned problems.

[0005] The utility model provides a heat dissipation performance test system for a thermal management component, wherein the test system comprises a controllable constant temperature box, a test fixture, a heat generating unit and a temperature measuring unit arranged in the controllable constant temperature box, and a power supply and a data processing platform arranged outside the controllable constant temperature box; the power supply supplies power to the test system; the test fixture comprises a fixture table for supporting a thermal management component; the heat generating unit is used to generate heat to heat the thermal management component; the temperature measuring unit is electrically connected to the data processing platform and is used to measure the temperature of the heat generating unit and the thermal management component and send the temperature to the data processing platform; the data processing platform is used to analyze temperature data to obtain the heat dissipation performance index of the thermal management component.

[0006] In one embodiment of the utility model, the heat generating unit is a ceramic heating plate, which includes a resistance wire and a shell made of ceramic material. The shell wraps the resistance wire and controls the heating temperature by changing the resistance value of the resistance wire.

[0007] In one embodiment of the utility model, the temperature measuring unit includes an infrared thermal imager and a multi-channel temperature measuring thermocouple; the infrared thermal imager is installed on the side wall of the controllable constant temperature box through an imager support rod, and is used to monitor the overall temperature distribution of the ceramic heating plate and the thermal management component in real time and take real-time images; the multi-channel temperature measuring thermocouple is composed of a plurality of thermocouples and a multi-channel temperature recording device, each thermocouple is connected to the multi-channel temperature recording device, and a plurality of thermocouples are pre-embedded at specific positions of the ceramic heating plate and the thermal management component to simultaneously monitor the temperatures of specific positions of the ceramic heating plate and the thermal management component.

[0008] In one embodiment of the present invention, the test fixture further includes a software test component and a hardware test component, and performs a comprehensive test on the thermal management component in a combination of software and hardware.

[0009] In an embodiment of the present invention, the thermal management component is any one of a flow channel liquid cooling plate and a phase change heat storage plate.

[0010] In one embodiment of the present invention, the test system further includes a liquid cooling source, which is connected to the thermal management component. When the thermal management component is the flow channel liquid cooling plate, the liquid cooling source and the thermal management component form a closed-loop heat dissipation channel.

[0011] In one embodiment of the present invention, the test system is further provided with an external bus integrated cable, an internal integrated interface and a communication interface, the internal integrated interface is connected to an external device, and the communication interface is connected to an upper computer.

[0012] In one embodiment of the utility model, the data processing platform includes a data acquisition unit, a data processing platform, a data export interface and a display screen, the data export interface is used for external applications to call data, and the display screen is used to display the heat dissipation performance index.

[0013] Beneficial effects of the utility model:

[0014] (1) A constant temperature test environment is provided through a controllable constant temperature box to prevent the thermal management component from being disturbed by the external ambient temperature during the heat dissipation performance test, thereby ensuring the accuracy of the temperature of the thermal management component and the heat generating unit collected by the temperature measurement unit;

[0015] (2) Integrate software and hardware into an integrated test system. Through the power supply, heat generating unit, temperature measuring unit and data processing platform, an integrated test process from front-end power-on, mid-end testing to back-end data processing is realized. The test results can be obtained intuitively and the test efficiency of the heat dissipation performance of the thermal management components is improved.

[0016] (3) The test system has a simple structure and is easy to test. It can quickly quantify and evaluate the heat dissipation capacity of thermal management components, thereby quickly evaluating the stability and consistency of the heat dissipation performance of thermal management components from different manufacturers and different batches.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present utility model, and together with the specification, are used to explain the principles of the present utility model. Obviously, the drawings described below are only some embodiments of the present utility model, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0019] Figure 1 It is a block diagram of a thermal management component heat dissipation performance testing system shown in an exemplary embodiment of the utility model. DETAILED DESCRIPTION

[0020] The following describes the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and the features in the embodiments can be combined with each other without conflict. It should also be understood that the terms used in the embodiments of the present invention are intended to describe specific implementation schemes, rather than to limit the scope of protection of the present invention. The test methods for which specific conditions are not specified in the following examples are usually carried out under conventional conditions or under the conditions recommended by the manufacturers.

[0021] See also Figure 1It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no substantial technical significance. Any modification of the structure, change in the proportion relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the utility model without affecting the effects and purposes that can be achieved by the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the utility model. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the utility model without substantial change in the technical content.

[0022] When numerical ranges are given in the embodiments, it should be understood that unless otherwise specified in the present invention, both endpoints of each numerical range and any value between the two endpoints can be selected. Unless otherwise defined, all technical and scientific terms used in the present invention are in accordance with the prior art mastery of those skilled in the art and the description of the present invention, and any method, device and material of the prior art similar or equivalent to the method, device and material in the embodiments of the present invention can also be used to implement the present invention.

[0023] It should be noted that thermal management components are widely used in thermal management systems of various devices to help devices dissipate heat to reduce the temperature of the devices. Different types of thermal management components are designed according to different specific devices and different heat dissipation requirements. If the heat dissipation performance of the thermal management component is not ideal or the thermal management component has a heat dissipation failure, it will affect the operation of the equipment and even cause safety hazards. Therefore, the heat dissipation performance of the thermal management component is particularly important, and it is necessary to test the heat dissipation performance of the thermal management component before leaving the factory. The applicant has found that the current test system for the heat dissipation performance of thermal management components still has the following disadvantages: 1. It is impossible to test the heat dissipation performance of thermal management components of different heat dissipation types, and the applicability is poor; 2. There is no integrated test system from front-end power-on, mid-end testing to back-end data processing, resulting in non-intuitive heat dissipation performance test results; 3. The test system structure and test process are complicated, resulting in low test efficiency.

[0024] Therefore, the present application provides a thermal management component heat dissipation performance testing system, which integrates software and hardware into an integrated testing system, realizes an integrated testing process from front-end power-on, mid-end testing to back-end data processing, can obtain test results intuitively, and also improves the testing efficiency of the heat dissipation performance of the thermal management component. In addition, the testing system has a simple structure and convenient testing. It can quickly quantify and evaluate the heat dissipation capacity of the thermal management component, thereby quickly evaluating the stability and consistency of the heat dissipation performance of thermal management components from different manufacturers and different batches.

[0025] See also Figure 1 , Figure 1 FIG. 1 is a block diagram of a thermal management component heat dissipation performance test system according to an exemplary embodiment of the present invention. Figure 1 As shown, the exemplary thermal management component heat dissipation performance test system at least includes a controllable constant temperature box 101, a test fixture 102, a heat generating unit 103 and a temperature measuring unit 104 arranged in the controllable constant temperature box 101, and a power supply 106 and a data processing platform 107 arranged outside the controllable constant temperature box 101, as described in detail as follows:

[0026] The power supply 106 supplies power to the test system. The power supply 106 can stably and continuously supply power to the test system.

[0027] The test fixture 102 includes a fixture table for supporting the thermal management component 105 .

[0028] It should be noted that a fixing component for fixing the thermal management component 105 is provided on the fixture table, and the fixing component can be adjusted to fix thermal management components 105 of different sizes.

[0029] In one embodiment, the test fixture 102 further includes a software test component and a hardware test component, and performs a comprehensive test on the thermal management component 105 in a combination of software and hardware.

[0030] Among them, the software testing component and the hardware testing component can be combined to provide communication functions and power distribution functions, etc., to distribute power to the heat generating unit 103, the temperature measuring unit 104 and the thermal management component 105, and to realize the communication between the thermal management component 105 and the heat generating unit 103 and the temperature measuring unit 104. The test items can also be configured, that is, the tests of a series of products can be edited, and corresponding test programs are stored for different products.

[0031] In one embodiment, the thermal management component 5 is any one of a flow channel liquid cooling plate and a phase change heat storage plate.

[0032] It should be noted that the flow channel liquid cooling plate uses the flow of liquid to exchange the heat generated by the equipment operation to achieve the heat dissipation of the equipment; the phase change heat storage plate uses the phase change material to absorb the heat generated by the equipment operation during the phase change process to achieve the heat dissipation of the equipment. Since the equivalent specific heat of the phase change material is very large near the phase change temperature, its own temperature after storing energy remains almost unchanged before the phase change is completed, and it has a high heat storage coefficient.

[0033] Specifically, the test system further includes a liquid cooling source 108 , which is connected to the thermal management component 105 . When the thermal management component 105 is a flow channel liquid cooling plate, the liquid cooling source 108 and the thermal management component 105 form a closed-loop heat dissipation channel.

[0034] In this embodiment, the liquid cooling source 108 provides liquid refrigerant, and utilizes the characteristics of the refrigerant having large heat capacity and being able to take away heat from the thermal management component through circulation to transfer heat generated during the operation of the equipment.

[0035] The thermal management component tested by this test system can be a flow channel liquid cooling plate or a phase change heat storage plate. It is suitable for testing the heat dissipation performance of different types of thermal management components and has wide applicability.

[0036] The heat generating unit 103 is used to generate heat to heat the thermal management component.

[0037] Specifically, the heat generating unit 103 is a ceramic heating plate, which includes a resistance wire and a shell made of ceramic material. The shell wraps the resistance wire inside, and the heating temperature is controlled by the change of the resistance value of the resistance wire.

[0038] In this embodiment, after power is turned on, the Joule heat generated when current passes through the resistance wire is used to achieve the purpose of heating, and the ceramic heating plate has high thermal efficiency, its surface is safe and non-charged, and has good insulation performance, which can effectively avoid safety hazards in the test.

[0039] The temperature measuring unit 104 is electrically connected to the data processing platform 107 and is used to measure the temperatures of the heat generating unit 103 and the thermal management component 105 and send the temperatures to the data processing platform 107 .

[0040] Specifically, the temperature measuring unit 104 includes an infrared thermal imager and a multi-channel temperature measuring thermocouple; the infrared thermal imager is installed on the side wall of the controllable constant temperature box 101 through an imager support rod, and is used to monitor the overall temperature distribution of the ceramic heating plate and the thermal management component 105 in real time and take real-time images; the multi-channel temperature measuring thermocouple is composed of multiple thermocouples and a multi-channel temperature recording device, each thermocouple is connected to the multi-channel temperature recording device, and multiple thermocouples are pre-buried at specific positions of the ceramic heating plate and the thermal management component to simultaneously monitor the temperatures of specific positions of the ceramic heating plate and the thermal management component.

[0041] In this embodiment, the infrared thermal imager measures the overall temperature of the ceramic heating plate and the thermal management component 105 by infrared scanning, that is, the temperature of each point of the ceramic heating plate and the thermal management component 105 is gathered in the form of a surface; the multi-channel temperature measuring thermocouple pre-buries multiple thermocouples at specific positions of the ceramic heating plate and the thermal management component 105 to collect temperature signals, and converts the temperature signals into thermoelectric potential signals through a multi-channel temperature recording device, and then converts them into the temperature of specific positions of the ceramic heating plate and the thermal management component 106. The overall temperature and specific position temperature of the ceramic heating plate and the thermal management component 105 are obtained respectively, and the heat dissipation performance of the thermal management component 105 is comprehensively judged by the two temperature data to ensure the accuracy of the test results.

[0042] The data processing platform 107 is used to analyze the temperature data to obtain the heat dissipation performance index of the thermal management component 105 .

[0043] Specifically, the data processing platform 107 includes a data acquisition unit, a data processing platform, a data export interface and a display screen. The data export interface is used for external applications to call data, and the display screen is used to display heat dissipation performance indicators.

[0044] In this embodiment, the data acquisition unit is used to collect the overall temperature and specific position temperature of the ceramic heating plate and the thermal management component 105, and then the data processing platform analyzes the overall temperature and specific position temperature of the ceramic heating plate and the thermal management component 105 respectively to obtain the heat dissipation performance index of the thermal management component 105. After obtaining the test results, the data export interface can be used for external applications to retrieve the test data and results. The data processing platform will also send the test data and results to the front-end display screen to display the test data and results, so as to realize the visualization of the heat dissipation performance index of the thermal management component 105.

[0045] In one embodiment, the test system is further provided with an external bus integrated cable, an internal integrated interface and a communication interface, the internal integrated interface is connected to the external device, and the communication interface is connected to the upper machine position.

[0046] In this embodiment, the external bus integrated cable facilitates the neat arrangement of the wires of the test equipment, the internal integrated interface is connected to different external devices to realize communication and data sharing with the external devices, and the communication interface is connected to the upper machine position to realize real-time monitoring of the test system, program editing and program control, etc., wherein the communication interface can be an RS485 communication interface.

[0047] The above-mentioned thermal management component heat dissipation performance test system (1) provides a constant temperature test environment through a controllable constant temperature box, thereby preventing the thermal management component from being disturbed by the external ambient temperature during the heat dissipation performance test, and ensuring the accuracy of the temperature of the thermal management component and the heat generating unit collected by the temperature measuring unit; (2) integrates software and hardware into an integrated test system, and realizes an integrated test process from front-end power-on, mid-end testing to back-end data processing through a power supply, a heat generating unit, a temperature measuring unit and a data processing platform, which can intuitively obtain test results and improve the test efficiency of the heat dissipation performance of the thermal management component; (3) The test system has a simple structure and convenient testing. It can quickly quantify and evaluate the heat dissipation capacity of the thermal management component, thereby quickly evaluating the stability and consistency of the heat dissipation performance of thermal management components from different manufacturers and different batches.

[0048] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by a person with ordinary knowledge in the relevant technical field without departing from the spirit and technical ideas disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A thermal management component heat dissipation performance test system, characterized in that: The test system includes a controllable constant temperature box, a test fixture, a heat generating unit and a temperature measuring unit arranged in the controllable constant temperature box, and a power supply and a data processing platform arranged outside the controllable constant temperature box; The power supply supplies power to the test system; The test fixture comprises a fixture table for supporting the thermal management component; The heat generating unit is used to generate heat to heat the thermal management component; The temperature measuring unit is electrically connected to the data processing platform and is used to measure the temperature of the heat generating unit and the thermal management component and send the temperature to the data processing platform; The data processing platform is used to analyze temperature data to obtain the heat dissipation performance index of the thermal management component.

2. The thermal management component heat dissipation performance testing system according to claim 1, characterized in that: The heat generating unit is a ceramic heating plate, which includes a resistance wire and a shell made of ceramic material. The shell wraps the resistance wire, and the heating temperature is controlled by the change of the resistance value of the resistance wire.

3. The thermal management component heat dissipation performance testing system according to claim 2, characterized in that: The temperature measurement unit includes an infrared thermal imager and a multi-channel temperature measurement thermocouple; The infrared thermal imager is mounted on the side wall of the controllable constant temperature box through an imager support rod, and is used to monitor the overall temperature distribution of the ceramic heating plate and the thermal management component in real time and to take real-time images; The multi-channel temperature measuring thermocouple is composed of multiple thermocouples and a multi-channel temperature recording device. Each thermocouple is connected to the multi-channel temperature recording device. Multiple thermocouples are pre-buried at specific positions of the ceramic heating plate and the thermal management component to simultaneously monitor the temperatures of specific positions of the ceramic heating plate and the thermal management component.

4. The thermal management component heat dissipation performance testing system according to claim 1, characterized in that: The thermal management component is any one of a flow channel liquid cooling plate and a phase change heat storage plate.

5. The thermal management component heat dissipation performance testing system according to claim 4, characterized in that: The test system further includes a liquid cooling source, which is connected to the thermal management component. When the thermal management component is the flow channel liquid cooling plate, the liquid cooling source and the thermal management component form a closed-loop heat dissipation channel.

6. The thermal management component heat dissipation performance testing system according to claim 1, characterized in that: The test system is also provided with an external bus integrated cable, an internal integrated interface and a communication interface. The internal integrated interface is connected to an external device, and the communication interface is connected to an upper machine position.

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